JP7724668B2 - 基板載置機構、検査装置、および検査方法 - Google Patents

基板載置機構、検査装置、および検査方法

Info

Publication number
JP7724668B2
JP7724668B2 JP2021155287A JP2021155287A JP7724668B2 JP 7724668 B2 JP7724668 B2 JP 7724668B2 JP 2021155287 A JP2021155287 A JP 2021155287A JP 2021155287 A JP2021155287 A JP 2021155287A JP 7724668 B2 JP7724668 B2 JP 7724668B2
Authority
JP
Japan
Prior art keywords
temperature
electronic device
temperature controller
heating
under test
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2021155287A
Other languages
English (en)
Japanese (ja)
Other versions
JP2023046600A (ja
JP2023046600A5 (https=
Inventor
繁 河西
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Electron Ltd
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Priority to JP2021155287A priority Critical patent/JP7724668B2/ja
Priority to KR1020247011980A priority patent/KR20240053003A/ko
Priority to PCT/JP2022/034025 priority patent/WO2023047999A1/ja
Priority to CN202280062354.1A priority patent/CN117941047A/zh
Priority to TW111134887A priority patent/TW202331870A/zh
Publication of JP2023046600A publication Critical patent/JP2023046600A/ja
Publication of JP2023046600A5 publication Critical patent/JP2023046600A5/ja
Application granted granted Critical
Publication of JP7724668B2 publication Critical patent/JP7724668B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0602—Temperature monitoring
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0431—Apparatus for thermal treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/34—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H10P72/3411—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7624—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices

Landscapes

  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Tests Of Electronic Circuits (AREA)
JP2021155287A 2021-09-24 2021-09-24 基板載置機構、検査装置、および検査方法 Active JP7724668B2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2021155287A JP7724668B2 (ja) 2021-09-24 2021-09-24 基板載置機構、検査装置、および検査方法
KR1020247011980A KR20240053003A (ko) 2021-09-24 2022-09-12 기판 탑재 기구, 검사 장치, 및 검사 방법
PCT/JP2022/034025 WO2023047999A1 (ja) 2021-09-24 2022-09-12 基板載置機構、検査装置、および検査方法
CN202280062354.1A CN117941047A (zh) 2021-09-24 2022-09-12 基片载置机构、检查装置和检查方法
TW111134887A TW202331870A (zh) 2021-09-24 2022-09-15 基板載置機構、檢查裝置、及檢查方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2021155287A JP7724668B2 (ja) 2021-09-24 2021-09-24 基板載置機構、検査装置、および検査方法

Publications (3)

Publication Number Publication Date
JP2023046600A JP2023046600A (ja) 2023-04-05
JP2023046600A5 JP2023046600A5 (https=) 2024-07-02
JP7724668B2 true JP7724668B2 (ja) 2025-08-18

Family

ID=85720644

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2021155287A Active JP7724668B2 (ja) 2021-09-24 2021-09-24 基板載置機構、検査装置、および検査方法

Country Status (5)

Country Link
JP (1) JP7724668B2 (https=)
KR (1) KR20240053003A (https=)
CN (1) CN117941047A (https=)
TW (1) TW202331870A (https=)
WO (1) WO2023047999A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2025102474A (ja) * 2023-12-26 2025-07-08 東京エレクトロン株式会社 基板支持台の温度調整方法及び検査装置

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001210683A (ja) 2000-01-25 2001-08-03 Tokyo Seimitsu Co Ltd プローバのチャック機構
JP2002500432A (ja) 1997-12-31 2002-01-08 テンプトロニック コーポレイション ワークピースチャック用温度制御システム
JP2004186492A (ja) 2002-12-04 2004-07-02 Sumitomo Heavy Ind Ltd チャック温度制御方式
JP2006147612A (ja) 2004-11-16 2006-06-08 Seiko Epson Corp 半導体試験装置及び半導体装置の試験方法
JP2007142301A (ja) 2005-11-22 2007-06-07 Tokyo Seimitsu Co Ltd プローバ

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7300310B2 (ja) 2019-05-20 2023-06-29 東京エレクトロン株式会社 載置台の温度調整方法、検査装置及び載置台

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002500432A (ja) 1997-12-31 2002-01-08 テンプトロニック コーポレイション ワークピースチャック用温度制御システム
JP2001210683A (ja) 2000-01-25 2001-08-03 Tokyo Seimitsu Co Ltd プローバのチャック機構
JP2004186492A (ja) 2002-12-04 2004-07-02 Sumitomo Heavy Ind Ltd チャック温度制御方式
JP2006147612A (ja) 2004-11-16 2006-06-08 Seiko Epson Corp 半導体試験装置及び半導体装置の試験方法
JP2007142301A (ja) 2005-11-22 2007-06-07 Tokyo Seimitsu Co Ltd プローバ

Also Published As

Publication number Publication date
WO2023047999A1 (ja) 2023-03-30
JP2023046600A (ja) 2023-04-05
TW202331870A (zh) 2023-08-01
KR20240053003A (ko) 2024-04-23
CN117941047A (zh) 2024-04-26

Similar Documents

Publication Publication Date Title
CN111788666B (zh) 检查装置
JP6994313B2 (ja) 載置台及び電子デバイス検査装置
JP7300310B2 (ja) 載置台の温度調整方法、検査装置及び載置台
JP7304722B2 (ja) 温度制御装置、温度制御方法、および検査装置
JP2001210683A (ja) プローバのチャック機構
US11828794B2 (en) Placement table, testing device, and testing method
JP7724668B2 (ja) 基板載置機構、検査装置、および検査方法
CN113325286A (zh) 加热源的寿命估计系统、寿命估计方法以及检查装置
KR102623795B1 (ko) 탑재대의 온도 조정 방법 및 검사 장치
JP2016003965A (ja) 湿度センサ検査装置
KR20250130649A (ko) 검사 시스템 및 온도 제어 방법
JP2005347612A (ja) ウェハトレイ及びウェハバーンインユニット、それを用いたウェハレベルバーンイン装置並びに半導体ウェハの温度制御方法
US12356508B2 (en) Heater temperature control method, heater, and placement stand
JP2545648B2 (ja) プローバ
JP7345320B2 (ja) 検査装置及びプローブカードの温度調整方法
TWI917459B (zh) 載置台、檢查裝置及檢查方法
JP3608998B2 (ja) 回路装置、パッケージ部材、回路試験方法および装置
JP4936705B2 (ja) プローバ
JP5151170B2 (ja) 温度試験装置およびその温度調整方法
KR20250065669A (ko) 측온용 기판의 교정 방법, 기판 측온 시스템 및 측온용 기판
JP2022032473A (ja) 検査方法及び検査装置
JP2006173505A (ja) 半導体ウェーハ、その加熱制御方法、およびバーンイン装置

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20240624

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20240624

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20250408

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20250514

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20250708

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20250805

R150 Certificate of patent or registration of utility model

Ref document number: 7724668

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150