KR20240053003A - 기판 탑재 기구, 검사 장치, 및 검사 방법 - Google Patents

기판 탑재 기구, 검사 장치, 및 검사 방법 Download PDF

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Publication number
KR20240053003A
KR20240053003A KR1020247011980A KR20247011980A KR20240053003A KR 20240053003 A KR20240053003 A KR 20240053003A KR 1020247011980 A KR1020247011980 A KR 1020247011980A KR 20247011980 A KR20247011980 A KR 20247011980A KR 20240053003 A KR20240053003 A KR 20240053003A
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KR
South Korea
Prior art keywords
temperature
electronic device
heating
temperature controller
inspection
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
KR1020247011980A
Other languages
English (en)
Korean (ko)
Inventor
시게루 가사이
Original Assignee
도쿄엘렉트론가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 도쿄엘렉트론가부시키가이샤 filed Critical 도쿄엘렉트론가부시키가이샤
Publication of KR20240053003A publication Critical patent/KR20240053003A/ko
Ceased legal-status Critical Current

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Classifications

    • H01L21/67248—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0602—Temperature monitoring
    • H01L21/67017—
    • H01L21/67098—
    • H01L21/67778—
    • H01L21/68785—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0431—Apparatus for thermal treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/34—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H10P72/3411—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7624—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices

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  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Tests Of Electronic Circuits (AREA)
KR1020247011980A 2021-09-24 2022-09-12 기판 탑재 기구, 검사 장치, 및 검사 방법 Ceased KR20240053003A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JPJP-P-2021-155287 2021-09-24
JP2021155287A JP7724668B2 (ja) 2021-09-24 2021-09-24 基板載置機構、検査装置、および検査方法
PCT/JP2022/034025 WO2023047999A1 (ja) 2021-09-24 2022-09-12 基板載置機構、検査装置、および検査方法

Publications (1)

Publication Number Publication Date
KR20240053003A true KR20240053003A (ko) 2024-04-23

Family

ID=85720644

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020247011980A Ceased KR20240053003A (ko) 2021-09-24 2022-09-12 기판 탑재 기구, 검사 장치, 및 검사 방법

Country Status (5)

Country Link
JP (1) JP7724668B2 (https=)
KR (1) KR20240053003A (https=)
CN (1) CN117941047A (https=)
TW (1) TW202331870A (https=)
WO (1) WO2023047999A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2025102474A (ja) * 2023-12-26 2025-07-08 東京エレクトロン株式会社 基板支持台の温度調整方法及び検査装置

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2020191332A (ja) 2019-05-20 2020-11-26 東京エレクトロン株式会社 載置台の温度調整方法、検査装置及び載置台

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6415858B1 (en) 1997-12-31 2002-07-09 Temptronic Corporation Temperature control system for a workpiece chuck
JP2001210683A (ja) 2000-01-25 2001-08-03 Tokyo Seimitsu Co Ltd プローバのチャック機構
JP4121361B2 (ja) 2002-12-04 2008-07-23 住友重機械工業株式会社 チャック温度制御方式
JP4613589B2 (ja) 2004-11-16 2011-01-19 セイコーエプソン株式会社 半導体試験装置
JP4911954B2 (ja) 2005-11-22 2012-04-04 株式会社東京精密 プローバ

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2020191332A (ja) 2019-05-20 2020-11-26 東京エレクトロン株式会社 載置台の温度調整方法、検査装置及び載置台

Also Published As

Publication number Publication date
WO2023047999A1 (ja) 2023-03-30
JP2023046600A (ja) 2023-04-05
TW202331870A (zh) 2023-08-01
JP7724668B2 (ja) 2025-08-18
CN117941047A (zh) 2024-04-26

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