TW202331870A - 基板載置機構、檢查裝置、及檢查方法 - Google Patents

基板載置機構、檢查裝置、及檢查方法 Download PDF

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Publication number
TW202331870A
TW202331870A TW111134887A TW111134887A TW202331870A TW 202331870 A TW202331870 A TW 202331870A TW 111134887 A TW111134887 A TW 111134887A TW 111134887 A TW111134887 A TW 111134887A TW 202331870 A TW202331870 A TW 202331870A
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TW
Taiwan
Prior art keywords
temperature
heating
temperature controller
control
electronic component
Prior art date
Application number
TW111134887A
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English (en)
Chinese (zh)
Inventor
河西繁
Original Assignee
日商東京威力科創股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商東京威力科創股份有限公司 filed Critical 日商東京威力科創股份有限公司
Publication of TW202331870A publication Critical patent/TW202331870A/zh

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0602—Temperature monitoring
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0431—Apparatus for thermal treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/34—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H10P72/3411—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7624—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices

Landscapes

  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Tests Of Electronic Circuits (AREA)
TW111134887A 2021-09-24 2022-09-15 基板載置機構、檢查裝置、及檢查方法 TW202331870A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2021-155287 2021-09-24
JP2021155287A JP7724668B2 (ja) 2021-09-24 2021-09-24 基板載置機構、検査装置、および検査方法

Publications (1)

Publication Number Publication Date
TW202331870A true TW202331870A (zh) 2023-08-01

Family

ID=85720644

Family Applications (1)

Application Number Title Priority Date Filing Date
TW111134887A TW202331870A (zh) 2021-09-24 2022-09-15 基板載置機構、檢查裝置、及檢查方法

Country Status (5)

Country Link
JP (1) JP7724668B2 (https=)
KR (1) KR20240053003A (https=)
CN (1) CN117941047A (https=)
TW (1) TW202331870A (https=)
WO (1) WO2023047999A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2025102474A (ja) * 2023-12-26 2025-07-08 東京エレクトロン株式会社 基板支持台の温度調整方法及び検査装置

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6415858B1 (en) 1997-12-31 2002-07-09 Temptronic Corporation Temperature control system for a workpiece chuck
JP2001210683A (ja) 2000-01-25 2001-08-03 Tokyo Seimitsu Co Ltd プローバのチャック機構
JP4121361B2 (ja) 2002-12-04 2008-07-23 住友重機械工業株式会社 チャック温度制御方式
JP4613589B2 (ja) 2004-11-16 2011-01-19 セイコーエプソン株式会社 半導体試験装置
JP4911954B2 (ja) 2005-11-22 2012-04-04 株式会社東京精密 プローバ
JP7300310B2 (ja) 2019-05-20 2023-06-29 東京エレクトロン株式会社 載置台の温度調整方法、検査装置及び載置台

Also Published As

Publication number Publication date
WO2023047999A1 (ja) 2023-03-30
JP2023046600A (ja) 2023-04-05
KR20240053003A (ko) 2024-04-23
JP7724668B2 (ja) 2025-08-18
CN117941047A (zh) 2024-04-26

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