CN117897788A - 层叠部件的排列方法及使用该排列方法的层叠陶瓷电子部件的制造方法 - Google Patents

层叠部件的排列方法及使用该排列方法的层叠陶瓷电子部件的制造方法 Download PDF

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Publication number
CN117897788A
CN117897788A CN202280058480.XA CN202280058480A CN117897788A CN 117897788 A CN117897788 A CN 117897788A CN 202280058480 A CN202280058480 A CN 202280058480A CN 117897788 A CN117897788 A CN 117897788A
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CN
China
Prior art keywords
laminated
green body
arranging
magnetic field
magnet
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Pending
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CN202280058480.XA
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English (en)
Chinese (zh)
Inventor
佐藤恒
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kyocera Corp
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Kyocera Corp
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Publication date
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Publication of CN117897788A publication Critical patent/CN117897788A/zh
Pending legal-status Critical Current

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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01GCAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00Fixed capacitors; Processes of their manufacture
    • H01G4/30Stacked capacitors
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01GCAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G13/00Apparatus specially adapted for manufacturing capacitors; Processes specially adapted for manufacturing capacitors not provided for in groups H01G4/00 - H01G11/00

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  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
CN202280058480.XA 2021-08-30 2022-08-04 层叠部件的排列方法及使用该排列方法的层叠陶瓷电子部件的制造方法 Pending CN117897788A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2021-140375 2021-08-30
JP2021140375 2021-08-30
PCT/JP2022/030008 WO2023032591A1 (ja) 2021-08-30 2022-08-04 積層部品の整列方法およびその整列方法を用いた積層セラミック電子部品の製造方法

Publications (1)

Publication Number Publication Date
CN117897788A true CN117897788A (zh) 2024-04-16

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN202280058480.XA Pending CN117897788A (zh) 2021-08-30 2022-08-04 层叠部件的排列方法及使用该排列方法的层叠陶瓷电子部件的制造方法

Country Status (4)

Country Link
US (1) US12580131B2 (https=)
JP (1) JP7711201B2 (https=)
CN (1) CN117897788A (https=)
WO (1) WO2023032591A1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2024209803A1 (ja) * 2023-04-03 2024-10-10 株式会社村田製作所 電子部品姿勢制御装置
JPWO2025009300A1 (https=) * 2023-07-04 2025-01-09

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3430854B2 (ja) * 1997-04-09 2003-07-28 株式会社村田製作所 電子部品の整列装置及び整列方法
JP3653630B2 (ja) * 2001-06-25 2005-06-02 Tdk株式会社 チップ部品の向き整列方法
JP2003069285A (ja) * 2001-08-24 2003-03-07 Rohm Co Ltd チップ型電子部品の方向揃え方法及びその装置
JP3931631B2 (ja) * 2001-11-06 2007-06-20 株式会社村田製作所 電子部品チップの取扱方法および電子部品チップの整列装置
JP2005217136A (ja) * 2004-01-29 2005-08-11 Tdk Corp 積層電子部品の整列方法及び装置
KR101058697B1 (ko) * 2010-12-21 2011-08-22 삼성전기주식회사 적층 세라믹 커패시터의 회로 기판 실장 구조, 실장 방법과 이를 위한 회로 기판의 랜드 패턴, 수평 방향으로 테이핑한 적층 세라믹 커패시터의 포장체 및 수평 방향 정렬방법
JP5418795B2 (ja) * 2012-02-22 2014-02-19 株式会社村田製作所 電子部品搬送装置
JP6926461B2 (ja) * 2016-12-15 2021-08-25 株式会社村田製作所 電子部品の搬送整列装置
JP7116470B2 (ja) * 2018-03-27 2022-08-10 太陽誘電株式会社 チップ部品の整列方法
JP6798528B2 (ja) * 2018-05-28 2020-12-09 株式会社村田製作所 チップ部品の整列方法
JP7319792B2 (ja) * 2019-03-01 2023-08-02 太陽誘電株式会社 セラミックチップ部品の処理方法、積層セラミック電子部品の製造方法及び積層セラミック電子部品包装体の製造方法
JP7307570B2 (ja) * 2019-03-22 2023-07-12 太陽誘電株式会社 セラミックチップ部品の処理方法

Also Published As

Publication number Publication date
WO2023032591A1 (ja) 2023-03-09
JP7711201B2 (ja) 2025-07-22
US12580131B2 (en) 2026-03-17
JPWO2023032591A1 (https=) 2023-03-09
US20250022659A1 (en) 2025-01-16

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