JPWO2023032591A1 - - Google Patents

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Publication number
JPWO2023032591A1
JPWO2023032591A1 JP2023545387A JP2023545387A JPWO2023032591A1 JP WO2023032591 A1 JPWO2023032591 A1 JP WO2023032591A1 JP 2023545387 A JP2023545387 A JP 2023545387A JP 2023545387 A JP2023545387 A JP 2023545387A JP WO2023032591 A1 JPWO2023032591 A1 JP WO2023032591A1
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JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Application number
JP2023545387A
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Japanese (ja)
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JP7711201B2 (ja
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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/30—Stacked capacitors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G13/00—Apparatus specially adapted for manufacturing capacitors; Processes specially adapted for manufacturing capacitors not provided for in groups H01G4/00 - H01G11/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
JP2023545387A 2021-08-30 2022-08-04 積層部品の整列方法およびその整列方法を用いた積層セラミック電子部品の製造方法 Active JP7711201B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2021140375 2021-08-30
JP2021140375 2021-08-30
PCT/JP2022/030008 WO2023032591A1 (ja) 2021-08-30 2022-08-04 積層部品の整列方法およびその整列方法を用いた積層セラミック電子部品の製造方法

Publications (2)

Publication Number Publication Date
JPWO2023032591A1 true JPWO2023032591A1 (https=) 2023-03-09
JP7711201B2 JP7711201B2 (ja) 2025-07-22

Family

ID=85411004

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023545387A Active JP7711201B2 (ja) 2021-08-30 2022-08-04 積層部品の整列方法およびその整列方法を用いた積層セラミック電子部品の製造方法

Country Status (4)

Country Link
US (1) US12580131B2 (https=)
JP (1) JP7711201B2 (https=)
CN (1) CN117897788A (https=)
WO (1) WO2023032591A1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2024209803A1 (ja) * 2023-04-03 2024-10-10 株式会社村田製作所 電子部品姿勢制御装置
JPWO2025009300A1 (https=) * 2023-07-04 2025-01-09

Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10284355A (ja) * 1997-04-09 1998-10-23 Murata Mfg Co Ltd 電子部品の整列装置及び整列方法
JP2003069285A (ja) * 2001-08-24 2003-03-07 Rohm Co Ltd チップ型電子部品の方向揃え方法及びその装置
JP2003142352A (ja) * 2001-11-06 2003-05-16 Murata Mfg Co Ltd 電子部品チップの取扱方法および電子部品チップの整列装置
JP2012124525A (ja) * 2012-02-22 2012-06-28 Murata Mfg Co Ltd 電子部品搬送装置
JP2012216864A (ja) * 2010-12-21 2012-11-08 Samsung Electro-Mechanics Co Ltd 積層セラミックキャパシタの回路基板実装構造、方法及び回路基板のランドパターン、積層セラミックキャパシタの包装体並びに整列方法
JP2018098413A (ja) * 2016-12-15 2018-06-21 株式会社村田製作所 電子部品の搬送整列装置および電子部品の搬送整列方法
JP2019175902A (ja) * 2018-03-27 2019-10-10 太陽誘電株式会社 チップ部品の整列方法及び磁石
JP2019207904A (ja) * 2018-05-28 2019-12-05 株式会社村田製作所 チップ部品の整列方法
JP2020141085A (ja) * 2019-03-01 2020-09-03 太陽誘電株式会社 セラミックチップ部品の処理方法、積層セラミック電子部品の製造方法及び積層セラミック電子部品包装体の製造方法
JP2020155700A (ja) * 2019-03-22 2020-09-24 太陽誘電株式会社 セラミックチップ部品の処理方法

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3653630B2 (ja) * 2001-06-25 2005-06-02 Ｔｄｋ株式会社 チップ部品の向き整列方法
JP2005217136A (ja) * 2004-01-29 2005-08-11 Tdk Corp 積層電子部品の整列方法及び装置

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10284355A (ja) * 1997-04-09 1998-10-23 Murata Mfg Co Ltd 電子部品の整列装置及び整列方法
JP2003069285A (ja) * 2001-08-24 2003-03-07 Rohm Co Ltd チップ型電子部品の方向揃え方法及びその装置
JP2003142352A (ja) * 2001-11-06 2003-05-16 Murata Mfg Co Ltd 電子部品チップの取扱方法および電子部品チップの整列装置
JP2012216864A (ja) * 2010-12-21 2012-11-08 Samsung Electro-Mechanics Co Ltd 積層セラミックキャパシタの回路基板実装構造、方法及び回路基板のランドパターン、積層セラミックキャパシタの包装体並びに整列方法
JP2012124525A (ja) * 2012-02-22 2012-06-28 Murata Mfg Co Ltd 電子部品搬送装置
JP2018098413A (ja) * 2016-12-15 2018-06-21 株式会社村田製作所 電子部品の搬送整列装置および電子部品の搬送整列方法
JP2019175902A (ja) * 2018-03-27 2019-10-10 太陽誘電株式会社 チップ部品の整列方法及び磁石
JP2019207904A (ja) * 2018-05-28 2019-12-05 株式会社村田製作所 チップ部品の整列方法
JP2020141085A (ja) * 2019-03-01 2020-09-03 太陽誘電株式会社 セラミックチップ部品の処理方法、積層セラミック電子部品の製造方法及び積層セラミック電子部品包装体の製造方法
JP2020155700A (ja) * 2019-03-22 2020-09-24 太陽誘電株式会社 セラミックチップ部品の処理方法

Also Published As

Publication number Publication date
WO2023032591A1 (ja) 2023-03-09
JP7711201B2 (ja) 2025-07-22
US12580131B2 (en) 2026-03-17
US20250022659A1 (en) 2025-01-16
CN117897788A (zh) 2024-04-16

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