CN117809981A - 电子部件 - Google Patents
电子部件 Download PDFInfo
- Publication number
- CN117809981A CN117809981A CN202311263308.0A CN202311263308A CN117809981A CN 117809981 A CN117809981 A CN 117809981A CN 202311263308 A CN202311263308 A CN 202311263308A CN 117809981 A CN117809981 A CN 117809981A
- Authority
- CN
- China
- Prior art keywords
- internal electrode
- electrode
- main surface
- electronic component
- axis direction
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004020 conductor Substances 0.000 claims abstract description 88
- 239000003990 capacitor Substances 0.000 claims abstract description 68
- 238000003475 lamination Methods 0.000 description 6
- 230000004048 modification Effects 0.000 description 6
- 238000012986 modification Methods 0.000 description 6
- 230000000052 comparative effect Effects 0.000 description 5
- 238000010586 diagram Methods 0.000 description 5
- 229910000679 solder Inorganic materials 0.000 description 4
- 239000000758 substrate Substances 0.000 description 4
- 239000000919 ceramic Substances 0.000 description 3
- 238000007689 inspection Methods 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 239000003989 dielectric material Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/005—Electrodes
- H01G4/012—Form of non-self-supporting electrodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/38—Multiple capacitors, i.e. structural combinations of fixed capacitors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/005—Electrodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/228—Terminals
- H01G4/232—Terminals electrically connecting two or more layers of a stacked or rolled capacitor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/30—Stacked capacitors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G2/00—Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
- H01G2/02—Mountings
- H01G2/06—Mountings specially adapted for mounting on a printed-circuit support
- H01G2/065—Mountings specially adapted for mounting on a printed-circuit support for surface mounting, e.g. chip capacitors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/228—Terminals
- H01G4/232—Terminals electrically connecting two or more layers of a stacked or rolled capacitor
- H01G4/2325—Terminals electrically connecting two or more layers of a stacked or rolled capacitor characterised by the material of the terminals
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Ceramic Capacitors (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2022158448A JP2024052016A (ja) | 2022-09-30 | 2022-09-30 | 電子部品 |
| JP2022-158448 | 2022-09-30 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN117809981A true CN117809981A (zh) | 2024-04-02 |
Family
ID=90423986
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202311263308.0A Pending CN117809981A (zh) | 2022-09-30 | 2023-09-27 | 电子部件 |
Country Status (3)
| Country | Link |
|---|---|
| US (1) | US20240112860A1 (https=) |
| JP (1) | JP2024052016A (https=) |
| CN (1) | CN117809981A (https=) |
Family Cites Families (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3309813B2 (ja) * | 1998-10-06 | 2002-07-29 | 株式会社村田製作所 | 積層コンデンサ |
| AU2001271139A1 (en) * | 2000-07-06 | 2002-01-14 | Phycomp Holding B.V. | Ceramic multilayer capacitor array |
| JP2004095680A (ja) * | 2002-08-29 | 2004-03-25 | Kyocera Corp | 積層セラミックコンデンサ |
| JP2004336014A (ja) * | 2003-04-16 | 2004-11-25 | Taiyo Yuden Co Ltd | 積層セラミックコンデンサ,積層セラミックコンデンサの実装構造及びコンデンサモジュール |
| JP2005064245A (ja) * | 2003-08-12 | 2005-03-10 | Murata Mfg Co Ltd | 積層セラミックコンデンサ及びその短絡検出方法 |
| JP2006086359A (ja) * | 2004-09-16 | 2006-03-30 | Taiyo Yuden Co Ltd | 積層セラミックコンデンサ |
| US7092236B2 (en) * | 2005-01-20 | 2006-08-15 | Samsung Electro-Mechanics Co., Ltd. | Multilayer chip capacitor |
| JP4276649B2 (ja) * | 2005-09-27 | 2009-06-10 | Tdk株式会社 | 貫通型積層コンデンサアレイ及び貫通型積層コンデンサアレイの実装構造 |
| US7961453B2 (en) * | 2007-01-09 | 2011-06-14 | Samsung Electro-Mechanics Co., Ltd. | Multilayer chip capacitor |
| JP4502006B2 (ja) * | 2007-12-28 | 2010-07-14 | Tdk株式会社 | 貫通型積層コンデンサアレイ |
| US9460855B2 (en) * | 2013-10-01 | 2016-10-04 | Samsung Electro-Mechanics Co., Ltd. | Multilayer ceramic capacitor and board having the same |
| KR101580395B1 (ko) * | 2014-05-08 | 2015-12-23 | 삼성전기주식회사 | 적층 칩 전자부품 및 그 실장 기판 |
| KR102037268B1 (ko) * | 2014-10-15 | 2019-10-29 | 삼성전기주식회사 | 적층 세라믹 커패시터 및 그 실장 기판 |
| KR102450593B1 (ko) * | 2016-04-27 | 2022-10-07 | 삼성전기주식회사 | 커패시터 부품 |
| KR101843269B1 (ko) * | 2016-07-13 | 2018-03-28 | 삼성전기주식회사 | 적층형 커패시터 및 그 실장 기판 |
| US12148575B2 (en) * | 2019-04-25 | 2024-11-19 | KYOCERA AVX Components Corporation | Integrated component including a capacitor and discrete varistor |
-
2022
- 2022-09-30 JP JP2022158448A patent/JP2024052016A/ja active Pending
-
2023
- 2023-09-12 US US18/465,613 patent/US20240112860A1/en active Pending
- 2023-09-27 CN CN202311263308.0A patent/CN117809981A/zh active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| US20240112860A1 (en) | 2024-04-04 |
| JP2024052016A (ja) | 2024-04-11 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination |