CN1178066C - 老化试验插座 - Google Patents

老化试验插座 Download PDF

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Publication number
CN1178066C
CN1178066C CNB998006726A CN99800672A CN1178066C CN 1178066 C CN1178066 C CN 1178066C CN B998006726 A CNB998006726 A CN B998006726A CN 99800672 A CN99800672 A CN 99800672A CN 1178066 C CN1178066 C CN 1178066C
Authority
CN
China
Prior art keywords
socket
terminal
assembly
contact
limit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CNB998006726A
Other languages
English (en)
Chinese (zh)
Other versions
CN1266492A (zh
Inventor
山本勇
中野智宏
金重祥
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Molex LLC
Original Assignee
Molex LLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Molex LLC filed Critical Molex LLC
Publication of CN1266492A publication Critical patent/CN1266492A/zh
Application granted granted Critical
Publication of CN1178066C publication Critical patent/CN1178066C/zh
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Classifications

    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02General constructional details
    • G01R1/04Housings; Supporting members; Arrangements of terminals
    • G01R1/0408Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • G01R1/0433Sockets for IC's or transistors
    • G01R1/0483Sockets for un-leaded IC's having matrix type contact fields, e.g. BGA or PGA devices; Sockets for unpackaged, naked chips
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/26Testing of individual semiconductor devices
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02General constructional details
    • G01R1/06Measuring leads; Measuring probes
    • G01R1/067Measuring probes
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Power Engineering (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Connecting Device With Holders (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
CNB998006726A 1998-04-01 1999-03-31 老化试验插座 Expired - Fee Related CN1178066C (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP105894/1998 1998-04-01
JP10105894A JP3020030B2 (ja) 1998-04-01 1998-04-01 バーンインソケット

Publications (2)

Publication Number Publication Date
CN1266492A CN1266492A (zh) 2000-09-13
CN1178066C true CN1178066C (zh) 2004-12-01

Family

ID=14419623

Family Applications (2)

Application Number Title Priority Date Filing Date
CNB998006726A Expired - Fee Related CN1178066C (zh) 1998-04-01 1999-03-31 老化试验插座
CNB998006718A Expired - Fee Related CN1178065C (zh) 1998-04-01 1999-03-31 老化试验插座

Family Applications After (1)

Application Number Title Priority Date Filing Date
CNB998006718A Expired - Fee Related CN1178065C (zh) 1998-04-01 1999-03-31 老化试验插座

Country Status (6)

Country Link
JP (1) JP3020030B2 (ko)
KR (2) KR100581237B1 (ko)
CN (2) CN1178066C (ko)
MY (2) MY124410A (ko)
TW (2) TW411060U (ko)
WO (2) WO1999050676A1 (ko)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6283780B1 (en) 1998-04-01 2001-09-04 Molex Incorporated Test socket lattice
US6267603B1 (en) 1998-04-01 2001-07-31 Molex Incorporated Burn-in test socket
JP2002164135A (ja) * 2000-11-26 2002-06-07 Isao Kimoto ソケット
JP3789789B2 (ja) * 2001-08-31 2006-06-28 株式会社エンプラス 電気部品用ソケット
JP4368132B2 (ja) * 2003-04-25 2009-11-18 株式会社エンプラス 電気部品用ソケット
KR100898409B1 (ko) 2007-07-05 2009-05-21 주식회사 오킨스전자 리드프레임 방식 칩 패키지용 번인 소켓
KR101090303B1 (ko) * 2009-06-12 2011-12-07 (주)브이알인사이트 반도체 검증용 fpga 보드의 뱅크구조
JP5836112B2 (ja) * 2011-12-28 2015-12-24 株式会社エンプラス 電気部品用ソケット
US8888503B2 (en) * 2011-12-28 2014-11-18 Enplas Corporation Socket for electric parts
KR101485779B1 (ko) * 2013-06-28 2015-01-26 황동원 반도체 소자 테스트용 소켓장치
KR101931623B1 (ko) * 2016-12-20 2018-12-21 주식회사 오킨스전자 래치 고정 락커를 포함하는 소켓
CN109342773A (zh) * 2018-08-17 2019-02-15 北方电子研究院安徽有限公司 一种金属管壳老化板夹具
SG11202104077RA (en) * 2019-01-31 2021-05-28 Yamaichi Electronics Co Ltd Socket for inspection
KR102606908B1 (ko) * 2020-12-23 2023-11-24 (주)마이크로컨텍솔루션 반도체 칩 테스트 소켓

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3245747B2 (ja) * 1991-09-18 2002-01-15 日本テキサス・インスツルメンツ株式会社 ソケット
JPH0677467B2 (ja) * 1992-12-25 1994-09-28 山一電機株式会社 Icソケット
JP3259109B2 (ja) * 1993-02-08 2002-02-25 日本テキサス・インスツルメンツ株式会社 ソケット
JP2667633B2 (ja) * 1994-02-24 1997-10-27 山一電機株式会社 Icソケットにおけるic保持装置
JPH0888063A (ja) * 1994-09-16 1996-04-02 Yamaichi Electron Co Ltd Icソケットの接触構造
JPH09162332A (ja) * 1995-12-13 1997-06-20 Toshiba Chem Corp Bgaのicテスト用ソケット
JP3714642B2 (ja) * 1996-07-30 2005-11-09 株式会社エンプラス 電気的接続装置

Also Published As

Publication number Publication date
CN1178065C (zh) 2004-12-01
WO1999050676A1 (en) 1999-10-07
JP3020030B2 (ja) 2000-03-15
JPH11297443A (ja) 1999-10-29
TW399814U (en) 2000-07-21
KR20010013206A (ko) 2001-02-26
KR100581237B1 (ko) 2006-05-22
CN1266492A (zh) 2000-09-13
KR100581240B1 (ko) 2006-05-22
CN1266491A (zh) 2000-09-13
MY124410A (en) 2006-06-30
WO1999050677A1 (en) 1999-10-07
TW411060U (en) 2000-11-01
KR20010013205A (ko) 2001-02-26
MY123246A (en) 2006-05-31

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C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant
C19 Lapse of patent right due to non-payment of the annual fee
CF01 Termination of patent right due to non-payment of annual fee