SG11202104077RA - Socket for inspection - Google Patents

Socket for inspection

Info

Publication number
SG11202104077RA
SG11202104077RA SG11202104077RA SG11202104077RA SG11202104077RA SG 11202104077R A SG11202104077R A SG 11202104077RA SG 11202104077R A SG11202104077R A SG 11202104077RA SG 11202104077R A SG11202104077R A SG 11202104077RA SG 11202104077R A SG11202104077R A SG 11202104077RA
Authority
SG
Singapore
Prior art keywords
socket
inspection
Prior art date
Application number
SG11202104077RA
Inventor
Junichi Miyaaki
Original Assignee
Yamaichi Electronics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Yamaichi Electronics Co Ltd filed Critical Yamaichi Electronics Co Ltd
Publication of SG11202104077RA publication Critical patent/SG11202104077RA/en

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G01R31/2887—Features relating to contacting the IC under test, e.g. probe heads; chucks involving moving the probe head or the IC under test; docking stations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/22—Contacts for co-operating by abutting
    • H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted
    • H01R13/2442—Contacts for co-operating by abutting resilient; resiliently-mounted with a single cantilevered beam
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • G01R1/0433—Sockets for IC's or transistors
    • G01R1/0441—Details
    • G01R1/0466—Details concerning contact pieces or mechanical details, e.g. hinges or cams; Shielding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/32—Holders for supporting the complete device in operation, i.e. detachable fixtures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/82—Coupling devices connected with low or zero insertion force
    • H01R12/85—Coupling devices connected with low or zero insertion force contact pressure producing means, contacts activated after insertion of printed circuits or like structures
    • H01R12/88—Coupling devices connected with low or zero insertion force contact pressure producing means, contacts activated after insertion of printed circuits or like structures acting manually by rotating or pivoting connector housing parts
SG11202104077RA 2019-01-31 2019-01-31 Socket for inspection SG11202104077RA (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2019/003405 WO2020157921A1 (en) 2019-01-31 2019-01-31 Socket for inspection

Publications (1)

Publication Number Publication Date
SG11202104077RA true SG11202104077RA (en) 2021-05-28

Family

ID=71842015

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11202104077RA SG11202104077RA (en) 2019-01-31 2019-01-31 Socket for inspection

Country Status (5)

Country Link
US (1) US11415624B2 (en)
JP (1) JP7112004B2 (en)
CN (1) CN111742228B (en)
SG (1) SG11202104077RA (en)
WO (1) WO2020157921A1 (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7112004B2 (en) 2019-01-31 2022-08-03 山一電機株式会社 test socket
CN113764947A (en) * 2020-06-02 2021-12-07 山一电机株式会社 Socket, IC package and method for mounting contact piece to connector shell
US20230083634A1 (en) * 2021-09-14 2023-03-16 Advantest Test Solutions, Inc. Parallel test cell with self actuated sockets

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* Cited by examiner, † Cited by third party
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JPH0945811A (en) 1995-08-01 1997-02-14 Fujitsu Ltd Semiconductor device
KR100187727B1 (en) * 1996-02-29 1999-06-01 윤종용 Contact checking apparatus for handler and ic test system having checker thereof
JPH10312871A (en) * 1997-05-15 1998-11-24 Sony Corp Semiconductor package characteristic measuring socket
JP3966963B2 (en) * 1997-10-03 2007-08-29 株式会社エンプラス Socket for electrical parts
JPH11233709A (en) 1998-02-13 1999-08-27 Hitachi Ltd Semiconductor device, its manufacture and electronic equipment
JP3020030B2 (en) * 1998-04-01 2000-03-15 モレックス インコーポレーテッド Burn-in socket
JP3821970B2 (en) * 1998-11-30 2006-09-13 株式会社エンプラス IC socket and IC socket contact pin
JP4251585B2 (en) * 1998-12-26 2009-04-08 株式会社エンプラス IC socket
JP3576489B2 (en) * 2000-12-26 2004-10-13 山一電機株式会社 Two-point contact type IC socket
US7275938B2 (en) * 2001-06-19 2007-10-02 Molex Incorporated Socket for semiconductor package
JP2003317891A (en) * 2002-04-23 2003-11-07 Yamaichi Electronics Co Ltd Ic receptacle
JP2004055356A (en) * 2002-07-19 2004-02-19 Yamaichi Electronics Co Ltd Ic socket
DE10249205B3 (en) * 2002-10-22 2004-08-05 Siemens Ag Power component arrangement for the mechatronic integration of power components
JP3803099B2 (en) * 2002-12-17 2006-08-02 山一電機株式会社 Socket for semiconductor device
US7053496B2 (en) 2003-06-27 2006-05-30 Intel Corporation Hybrid package with non-insertable and insertable conductive features, complementary receptacle, and methods of fabrication, assembly, and operation therefor
US7460223B2 (en) * 2003-09-19 2008-12-02 Applied Biosystems Inc. Inverted orientation for a microplate
JP2005174670A (en) 2003-12-09 2005-06-30 Yamaichi Electronics Co Ltd Open-top type ic socket
JP4464250B2 (en) * 2004-10-29 2010-05-19 株式会社エンプラス Socket for electrical parts
JP4168346B2 (en) * 2004-12-07 2008-10-22 株式会社アドリンクス Mounting structure of surface mount components
JP4729346B2 (en) * 2005-06-30 2011-07-20 株式会社エンプラス Socket for electrical parts
JP4705462B2 (en) 2005-11-29 2011-06-22 株式会社エンプラス Socket for electrical parts
JP4911495B2 (en) * 2006-05-15 2012-04-04 ルネサスエレクトロニクス株式会社 Socket for semiconductor integrated circuit
US7413458B2 (en) * 2006-07-07 2008-08-19 Enplas Corporation Socket for electrical parts
CN101809829B (en) * 2007-12-03 2012-07-18 山一电机株式会社 Semiconductor package socket
JP4594980B2 (en) 2007-12-27 2010-12-08 山一電機株式会社 Socket for semiconductor device
TW201010187A (en) * 2008-08-18 2010-03-01 Hon Hai Prec Ind Co Ltd Electrical connector
JP6116112B2 (en) * 2011-02-04 2017-04-19 スリーエム イノベイティブ プロパティズ カンパニー IC device socket
SG193040A1 (en) * 2012-02-21 2013-09-30 Test Max Mfg Pte Ltd Test socket with hook-like pin contact edge
JP2017026505A (en) * 2015-07-24 2017-02-02 ルネサスエレクトロニクス株式会社 Method for manufacturing semiconductor device
JP2018092813A (en) * 2016-12-05 2018-06-14 株式会社ネバーグ Probe pin and IC socket
JP7018309B2 (en) * 2017-12-27 2022-02-10 株式会社エンプラス Socket for electrical components
JP6898569B2 (en) * 2018-07-27 2021-07-07 山一電機株式会社 IC socket for semiconductor
US10225932B1 (en) * 2018-08-27 2019-03-05 Tactotek Oy Interfacing arrangement, method for manufacturing an interfacing arrangement, and multilayer structure hosting an interfacing arrangement
JP7112004B2 (en) 2019-01-31 2022-08-03 山一電機株式会社 test socket

Also Published As

Publication number Publication date
US11415624B2 (en) 2022-08-16
JP7112004B2 (en) 2022-08-03
CN111742228B (en) 2023-03-21
US20210148970A1 (en) 2021-05-20
JPWO2020157921A1 (en) 2021-11-18
WO2020157921A1 (en) 2020-08-06
CN111742228A (en) 2020-10-02

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