CN117747510A - Anti-breaking inserting piece equipment for large-size silicon wafer - Google Patents
Anti-breaking inserting piece equipment for large-size silicon wafer Download PDFInfo
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- CN117747510A CN117747510A CN202311779794.1A CN202311779794A CN117747510A CN 117747510 A CN117747510 A CN 117747510A CN 202311779794 A CN202311779794 A CN 202311779794A CN 117747510 A CN117747510 A CN 117747510A
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- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title claims abstract description 68
- 229910052710 silicon Inorganic materials 0.000 title claims abstract description 65
- 239000010703 silicon Substances 0.000 title claims abstract description 65
- 235000012431 wafers Nutrition 0.000 claims abstract description 69
- 238000010030 laminating Methods 0.000 claims abstract description 28
- 238000005452 bending Methods 0.000 claims description 2
- 239000013078 crystal Substances 0.000 abstract description 22
- 229910021419 crystalline silicon Inorganic materials 0.000 description 24
- 238000000034 method Methods 0.000 description 8
- 238000009434 installation Methods 0.000 description 4
- 239000000463 material Substances 0.000 description 3
- 230000005540 biological transmission Effects 0.000 description 2
- 238000005336 cracking Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000012634 fragment Substances 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 150000003376 silicon Chemical class 0.000 description 1
- 230000035882 stress Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 230000001360 synchronised effect Effects 0.000 description 1
- 230000008646 thermal stress Effects 0.000 description 1
Classifications
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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- Crystals, And After-Treatments Of Crystals (AREA)
Abstract
The invention discloses anti-breaking inserting piece equipment for large-size silicon wafers, which comprises an operation main body and a silicon wafer clamp; the silicon wafer clamp comprises a lifting seat, wherein the top of the lifting seat is fixedly connected with a lifting plate for stacking and placing silicon wafers, a shaft lever is rotationally arranged around the lifting plate, and the top end of the shaft lever is connected with a laminating rod; the shaft rod is connected with the non-center part of the attaching rod, the bottom end of the attaching rod is connected with a gear, the lower surface of the lifting plate is provided with a sliding rail, the sliding rail is in sliding connection with a rack meshed with the gear, and the lower surface of the lifting plate is rotationally connected with a driving tooth meshed with the rack; the invention adopts the laminating rod with a rotatable structure, and the space area surrounded by the laminating rod can be scaled up and down in equal proportion, so that the crystal silicon wafer can be placed quickly after the area is increased, the laminating rod not only plays a limiting shielding role on the crystal silicon wafer, but also can play a correcting role, thereby effectively reducing the phenomenon that the crystal silicon wafer is broken due to the action of external force or improper operation.
Description
Technical Field
The invention relates to the technical field of silicon wafer inserting sheets, in particular to an anti-breaking inserting sheet device for large-size silicon wafers.
Background
In order to reduce the cost, the crystal silicon wafer is developed in an increasingly thinner direction, the capability of the battery piece for preventing mechanical damage is reduced, and hidden cracks are more easily generated. Because of the characteristics of the crystal structure of the crystalline silicon, the crystalline silicon is very easy to crack, and in the process flow of crystalline silicon production, a plurality of links possibly cause hidden cracking of the battery piece, and the root cause of the hidden cracking can be summarized as mechanical stress or thermal stress on the silicon piece.
In the complex production process of crystalline silicon and the mutual transmission among various processes, fragments and hidden cracks are very easy to generate, particularly in the process of inserting crystalline silicon chips, the selected crystalline silicon chips are generally uniformly placed in a silicon chip box by workers, the existing silicon chip box is of an integrated structure, the outer surface of the crystalline silicon chip is generally basically attached to the inner wall of the silicon chip box for improving the grabbing precision of a subsequent sucking disc, and then when the workers load the crystalline silicon chips into the silicon chip box, the crystalline silicon chips are easily broken due to the action of external force or improper operation.
Disclosure of Invention
In order to achieve the above purpose, the invention is realized by the following technical scheme:
the invention provides anti-breaking inserting piece equipment for large-size silicon wafers, which comprises an operation main body and a silicon wafer clamp arranged on the operation main body;
the silicon wafer clamp comprises a lifting seat, wherein the top of the lifting seat is fixedly connected with a lifting plate for stacking and placing silicon wafers, a shaft lever is rotationally arranged around the lifting plate, and the top end of the shaft lever is connected with a laminating rod;
wherein, the axostylus axostyle is connected with laminating pole non-center department, and the bottom of laminating pole is connected with the gear, and the lower surface of lifter plate is equipped with the slide rail, and slide rail sliding connection has the rack with gear engagement, and the lifter plate lower surface rotates to be connected with the driving tooth with rack engagement.
Further, the driving teeth are in threaded connection with a positioning rod for locking the driving teeth.
Further, the operation main body comprises a machine tool, a working cavity is formed in the machine tool, a lifting table is fixedly connected to the bottom of the inner wall of the working cavity, an intermittent motor is fixedly connected to the output end of the lifting table, an electric sucking disc is fixedly connected to the circumferential outer surface of the intermittent motor through a connecting plate, and a through hole communicated with the inside of the working cavity is formed in the top of the machine tool;
the lifting seat is arranged in the working cavity at a position corresponding to the through hole, and the top of the attaching rod penetrates through the through hole and extends to the outside.
Further, the anti-breaking inserting piece equipment further comprises a silicon wafer flower basket assembly, the silicon wafer flower basket assembly comprises an electric rail, the bottom of the electric rail is fixedly connected with the top of the machine tool, an electromagnetic block is connected to the outer surface of the electric rail in a sliding mode, and a flower basket piece is magnetically connected to the lower portion of the electromagnetic block.
Further, the fixed intercommunication organic frame in lathe top, the inside rotation of machine frame is connected with the actuating lever, actuating lever circumference surface closely laminates there is the conveyer belt, fixed surface is connected with the bent plate on the machine frame, work cavity inner wall bottom fixedly connected with and conveyer belt inner wall support frame of laminating mutually, the basket of flowers spare is located the space that machine frame and work cavity enclose.
Further, the basket of flowers spare includes the upper shield, upper shield top fixedly connected with and electromagnetic block surface magnetic force connection's magnetic force piece, the upper shield bottom is through screw thread group demountable installation have well dead lever, well dead lever bottom is through screw thread group demountable installation have down the fishplate bar, upper shield and the inside square hole of all having seted up of fishplate bar down, square hole inner wall sliding connection has the movable plate, the space that upper shield and fishplate bar down enclose is provided with the slot board that is connected with the movable plate surface.
Further, the external surface of the upper connecting plate and the external surface of the lower connecting plate are fixedly connected with a powerful spring through an ear block, the powerful spring is connected with the external surface of the movable plate, one side of the movable plate, which is close to the powerful spring, adopts an inclined plane design, the upper connecting plate and the lower connecting plate are slidably connected with an adjusting plate which is attached to the inclined plane of the movable plate through an adjusting hole formed in the upper connecting plate and the lower connecting plate, and an adjusting rod which is in threaded connection with the inner part of the adjusting plate is rotatably connected in the middle fixing rod.
Further, the side of the slot plate is provided with a horn mouth and a socket respectively, and the horn mouth and the socket are communicated with each other.
Compared with the prior art, the technical scheme provided by the invention has the following beneficial effects:
according to the invention, the top end of the shaft lever is connected with the non-center part of the bottom end of the laminating rod, so that when the shaft lever rotates clockwise around the inside of the lifting plate, the laminating rod deflects outwards compared with the initial position, the space surrounded by the laminating rod is increased, and compared with the traditional silicon wafer box which is of an integrated structure, the laminating rod of the invention adopts a rotatable structure, the space area surrounded by the laminating rod can be scaled up and down in equal proportion, after the area is increased, the quick placement of crystal silicon wafers is facilitated, the laminating rod has a limiting shielding effect on the crystal silicon wafers, and also has a correcting effect, so that the phenomenon that the crystal silicon wafers are broken due to external force or improper operation is effectively reduced.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below. It is evident that the drawings in the following description are only some embodiments of the present invention and that other drawings may be obtained from these drawings without inventive effort for a person of ordinary skill in the art.
FIG. 1 is a schematic view of a three-dimensional structure of an embodiment of the present invention;
FIG. 2 is a schematic view of the structure of FIG. 1 with a partial enlargement according to an embodiment of the present invention;
FIG. 3 is a schematic view of a three-dimensional partial cross section of a machine tool according to an embodiment of the present invention;
FIG. 4 is a schematic view of a flower basket according to an embodiment of the present invention;
FIG. 5 is a schematic diagram of the front view of the socket board and the external crystal silicon wafer according to the embodiment of the present invention;
FIG. 6 is a schematic view showing a three-dimensional separation structure of an adjusting plate and a moving plate according to an embodiment of the present invention;
FIG. 7 is a schematic view of a three-dimensional structure of a silicon wafer chuck according to an embodiment of the present invention;
fig. 8 is a schematic structural diagram of a shaft, a fitting rod and a gear according to an embodiment of the present invention.
Reference numerals in the drawings represent respectively: 1. an operation body; 11. a machine tool; 111. a frame; 112. a driving rod; 113. a conveyor belt; 114. a bending plate; 115. a support frame; 12. a working chamber; 13. a lifting table; 14. an intermittent motor; 15. an electric suction cup; 16. a through hole; 2. a silicon wafer clamp; 21. a lifting seat; 22. a lifting plate; 23. a shaft lever; 24. a bonding rod; 25. a gear; 26. a slide rail; 27. a rack; 28. a drive tooth; 29. a positioning rod; 3. a silicon wafer flower basket assembly; 31. an electric track; 32. an electromagnetic block; 33. flower basket pieces; 330. an adjusting plate; 331. an upper connecting plate; 332. a magnetic block; 333. a middle fixing rod; 3331. an adjusting rod; 334. a lower connecting plate; 335. square holes; 336. a moving plate; 337. a slot plate; 3371. a horn mouth; 3372. a socket; 338. a strong spring; 339. and adjusting the hole.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention more clear, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. It will be apparent that the described embodiments are some, but not all, embodiments of the invention. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
The invention is further described below with reference to examples.
Referring to fig. 1 to 8, an anti-breaking insert device for a large-sized silicon wafer according to this embodiment includes:
the operation main body 1, the operation main body 1 comprises a machine tool 11, a working cavity 12 is formed in the machine tool 11, a lifting table 13 is fixedly connected to the bottom of the inner wall of the working cavity 12, an intermittent motor 14 is fixedly connected to the output end of the lifting table 13, an electric sucking disc 15 is fixedly connected to the circumferential outer surface of the intermittent motor 14 through a connecting plate, and a through hole 16 communicated with the inside of the working cavity 12 is formed in the top of the machine tool 11;
the silicon wafer clamp 2 comprises a lifting seat 21, the position of the lifting seat 21 corresponding to the through hole 16 is arranged in the working cavity 12, a lifting plate 22 for stacking and placing silicon wafers is fixedly connected to the top of the lifting seat 21, a shaft lever 23 is rotationally connected to the periphery of the lifting plate 22, a bonding rod 24 is fixedly connected to the top end of the shaft lever 23, and the top of the bonding rod 24 penetrates through the through hole 16 and extends to the outside;
wherein, the top of axostylus axostyle 23 is connected with the bottom non-center department of laminating pole 24, the bottom fixedly connected with gear 25 of laminating pole 24, lifter plate 22 through set up the slide rail 26 sliding connection of its lower surface with gear 25 external surface engaged with rack 27, lifter plate 22 lower surface rotates and is connected with the drive tooth 28 that meshes with rack 27 external surface, and this drive tooth 28 internal thread connection has locating lever 29.
The anti-breaking inserting piece equipment further comprises a silicon wafer flower basket assembly 3, the silicon wafer flower basket assembly 3 comprises an electric rail 31, the bottom of the electric rail 31 is fixedly connected with the top of the machine tool 11, an electromagnetic block 32 is slidably connected to the outer surface of the electric rail 31, and a flower basket piece 33 is magnetically connected to the lower portion of the electromagnetic block 32.
The top of the machine tool 11 is fixedly communicated with the organic frame 111, a driving rod 112 is rotatably connected inside the organic frame 111, a conveying belt 113 is closely attached to the outer circumferential surface of the driving rod 112, a bent plate 114 is fixedly connected to the upper surface of the organic frame 111, a supporting frame 115 attached to the inner wall of the conveying belt 113 is fixedly connected to the bottom of the inner wall of the working cavity 12, and a flower basket 33 is located in a space surrounded by the organic frame 111 and the working cavity 12.
The basket of flowers piece 33 includes the upper shield 331, upper shield 331 top fixedly connected with and electromagnetic piece 32 surface magnetic force connection's magnetic force piece 332, upper shield 331 bottom has well dead lever 333 through screw thread group demountable installation, well dead lever 333 bottom has lower shield 334 through screw thread group demountable installation, square hole 335 has all been seted up to upper shield 331 and lower shield 334 inside, square hole 335 inner wall sliding connection has movable plate 336, the space that upper shield 331 and lower shield 334 enclose is provided with slot board 337 that is connected with the movable plate 336 surface.
The external surfaces of the upper connecting plate 331 and the lower connecting plate 334 are fixedly connected with a powerful spring 338 through lugs, the other end of the powerful spring 338 is connected with the external surface of the movable plate 336, one side of the movable plate 336 close to the powerful spring 338 adopts an inclined plane design, the upper connecting plate 331 and the lower connecting plate 334 are slidably connected with an adjusting plate 330 attached to the inclined plane of the movable plate 336 through an adjusting hole 339 formed in the upper connecting plate 331 and the lower connecting plate 334, and an adjusting rod 3331 in threaded connection with the inside of the adjusting plate 330 is rotatably connected in the middle fixing rod 333.
The slot plate 337 has a flare 3371 and a socket 3372 formed on its side, and the flare 3371 and the socket 3372 are communicated with each other.
The use process of the anti-breaking insert device of this embodiment is as follows:
loading a crystalline silicon wafer:
the application is equipped with silicon chip anchor clamps 2, earlier through the lift seat 21 on the silicon chip anchor clamps 2, upwards lifts up lifter plate 22, axostylus axostyle 23 and laminating pole 24 etc. and breaks away from through-hole 16, then manual anticlockwise rotation drive tooth 28 drives four sets of racks 27 and slides along the slide rail 26 surface that corresponds respectively, drives gear 25, axostylus axostyle 23 and laminating pole 24 synchronous clockwise rotation. Because the top of axostylus axostyle 23 is connected with the non-center department in the bottom of laminating pole 24, so axostylus axostyle 23 is around the inside clockwise rotation of lifter plate 22, and laminating pole 24 compares initial position outwards to shift, and the space that laminating pole 24 encloses increases, compares traditional silicon chip box and is mostly integral type structure (is unfavorable for placing fast of crystal silicon chip), and laminating pole 24 of this application adopts rotatable structure, can "equal proportion shrink" laminating pole 24 enclose space area, after the area increase, the quick placement of crystal silicon chip of being convenient for. Then, the driving teeth 28 are manually rotated clockwise again, the four groups of racks 27 are driven to slide along the outer surfaces of the corresponding sliding rails 26 respectively, the gears 25, the shaft rods 23 and the attaching rods 24 are driven to synchronously rotate anticlockwise, the attaching rods 24 are driven to continuously rotate and slowly approach to the crystal silicon wafers until the attaching rods 24 are close to the outer surfaces of the crystal silicon wafers, the attaching rods 24 play a limiting shielding role and can play a correcting role, so that the phenomenon that the crystal silicon wafers are broken due to external force or improper operation is effectively reduced, and finally the positioning rods 29 are utilized to rotationally lock the driving teeth 28.
And (3) feeding a crystalline silicon wafer:
after the crystalline silicon wafer is placed, the circumferential outer surface of the intermittent motor 14 drives four groups of electric sucking discs 15 to synchronously rotate clockwise through a connecting plate, the intermittent motor 14 and the electric sucking discs 15 are driven to intermittently lift up and down by matching with the lifting table 13, the lifting seat 21 drives the lifting plate 22 and the crystalline silicon wafer to intermittently lift up and down, the electric sucking discs 15 can synchronously grasp and release the crystalline silicon wafer, the released crystalline silicon wafer falls onto the conveying belt 113, the external driving unit drives the driving rod 112 to rotate around the inside of the machine frame 111 to drive the conveying belt 113 to rapidly convey the crystalline silicon wafer forwards, and meanwhile, an electric transmission system on the electric track 31 drives the electromagnetic block 32 and the basket 33 to intermittently move upwards at equal intervals by adopting a PLC (programmable logic controller) until the crystalline silicon wafer is fully inserted into the inserting groove plate 337.
Inserting piece of crystalline silicon wafer:
in the process of inserting the crystalline silicon wafer, the crystalline silicon wafer is mainly transferred from the silicon wafer clamp 2 (after being selected) to the basket 33, so that the situation that the crystalline silicon wafer is broken in the process of inserting the crystalline silicon wafer is avoided, the loading process of the crystalline silicon wafer is considered, the inserting process of the basket 33 is considered, and the crystalline silicon wafer is indispensible.
For this, this application still is equipped with basket of flowers piece 33, the slot board in current basket of flowers is mostly fixed structure, laminating degree between slot in the slot board and the crystal silicon wafer is all very inseparable moreover, and then the material loading precision requirement to crystal silicon wafer, slot board is high, after long-term material loading, slight deviation all probably leads to crystal silicon wafer to burst, damage the slot board even, for avoiding the above-mentioned condition, this application is divided into two parts with the socket on the slot board 337, and one part is the horn mouth 3371 of material loading, and another part is the socket 3372 of laminating. Initially, by manually rotating the adjusting rod 3331 on the basket 33, the adjusting rod 3331 is driven to rotate around the inside of the middle fixed rod 333, the adjusting plate 330 is driven to slide along the outer circumferential surface of the adjusting rod 3331 in a short distance, the adjusting plate 330 is driven to slide along the inner wall of the adjusting hole 339 in a short distance, meanwhile, the adjusting plate 330 slides towards the thinner side of the inclined plane of the moving plate 336, the moving plate 336 is subject to the elastic force of the powerful spring 338, slides outwards along the inner wall of the square hole 335, the two groups of slot plates 337 are driven to be far away from each other, and the conveyer belt 113 drives the crystal silicon wafer to slide into the bell mouth 3371 rapidly, so that the bell mouth 3371 can avoid collision between the crystal silicon wafer and the slot plates 337. After all the bell mouths 3371 are inserted with crystal silicon wafers, the rotary adjusting rod 3331 is reset again to drive the adjusting rod 3331 to rotate around the inside of the middle fixed rod 333, the adjusting plate 330 is driven to slide along the outer circumferential surface of the adjusting rod 3331 in a short distance, the adjusting plate 330 is driven to slide along the inner wall of the adjusting hole 339 in a short distance, meanwhile, the adjusting plate 330 slides to one thicker side of the inclined plane of the moving plate 336 (the strong spring 338 is pulled to further elastically deform), the moving plate 336 slides inwards along the inner wall of the square hole 335, the two groups of slot plates 337 are driven to approach each other, and then the crystal silicon wafers in the bell mouths 3371 slowly slide into the sockets 3372, so that the fitting of the crystal silicon wafers with inserting sheets is completed.
The above embodiments are only for illustrating the technical solution of the present invention, and are not limiting; although the invention has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical scheme described in the foregoing embodiments can be modified or some technical features thereof can be replaced by equivalents; these modifications or substitutions do not depart from the essence of the corresponding technical solutions from the protection scope of the technical solutions of the embodiments of the present invention.
Claims (8)
1. The anti-breaking inserting piece equipment for the large-size silicon wafer is characterized by comprising an operation main body and a silicon wafer clamp arranged on the operation main body;
the silicon wafer clamp comprises a lifting seat, wherein the top of the lifting seat is fixedly connected with a lifting plate for stacking and placing silicon wafers, a shaft lever is rotationally arranged around the lifting plate, and the top end of the shaft lever is connected with a laminating rod;
wherein, the axostylus axostyle is connected with laminating pole non-center department, and the bottom of laminating pole is connected with the gear, and the lower surface of lifter plate is equipped with the slide rail, and slide rail sliding connection has the rack with gear engagement, and the lifter plate lower surface rotates to be connected with the driving tooth with rack engagement.
2. The anti-breaking tab device of claim 1 wherein the drive teeth are threadably connected with a locating bar for locking the drive teeth.
3. The anti-breaking inserting piece equipment for large-size silicon wafers according to claim 1, wherein the operating main body comprises a machine tool, a working cavity is formed in the machine tool, a lifting table is fixedly connected to the bottom of the inner wall of the working cavity, an intermittent motor is fixedly connected to the output end of the lifting table, an electric sucking disc is fixedly connected to the outer circumferential surface of the intermittent motor through a connecting plate, and a through hole communicated with the inside of the working cavity is formed in the top of the machine tool;
the lifting seat is arranged in the working cavity at a position corresponding to the through hole, and the top of the attaching rod penetrates through the through hole and extends to the outside.
4. The anti-breakage inserting piece device for large-size silicon wafers according to claim 3, further comprising a silicon wafer basket assembly, wherein the silicon wafer basket assembly comprises an electric rail, the bottom of the electric rail is fixedly connected with the top of a machine tool, an electromagnetic block is slidably connected to the outer surface of the electric rail, and a basket piece is magnetically connected to the lower portion of the electromagnetic block.
5. The anti-breaking inserting piece device for large-size silicon wafers according to claim 4, wherein the top of the machine tool is fixedly communicated with an organic frame, a driving rod is rotatably connected inside the organic frame, the circumferential outer surface of the driving rod is tightly attached to a conveying belt, a bending plate is fixedly connected to the upper surface of the organic frame, a supporting frame attached to the inner wall of the conveying belt is fixedly connected to the bottom of the inner wall of the working cavity, and a flower basket piece is located in a space enclosed by the organic frame and the working cavity.
6. The anti-breaking inserting piece device for large-size silicon wafers according to claim 4, wherein the flower basket piece comprises an upper connecting plate, a magnetic block which is magnetically connected with the outer surface of the electromagnetic block is fixedly connected to the top of the upper connecting plate, a middle fixing rod is detachably mounted at the bottom of the upper connecting plate through a thread group, a lower connecting plate is detachably mounted at the bottom of the middle fixing rod through a thread group, square holes are formed in the upper connecting plate and the lower connecting plate, a movable plate is slidably connected to the inner wall of the square hole, and a space surrounded by the upper connecting plate and the lower connecting plate is provided with an inserting groove plate which is connected with the outer surface of the movable plate.
7. The anti-breaking inserting piece device for large-size silicon wafers according to claim 6, wherein the outer surfaces of the upper connecting plate and the lower connecting plate are fixedly connected with a powerful spring through lugs, the powerful spring is connected with the outer surface of the movable plate, one side of the movable plate, which is close to the powerful spring, adopts an inclined plane design, the upper connecting plate and the lower connecting plate are slidably connected with an adjusting plate which is attached to the inclined plane of the movable plate through adjusting holes formed in the upper connecting plate and the lower connecting plate, and an adjusting rod which is in threaded connection with the inner portion of the adjusting plate is rotatably connected in the middle fixing rod.
8. The anti-breaking insert device for large-size silicon wafers according to claim 6, wherein a flare and a socket are respectively formed on the side of the insert slot plate, and the flare and the socket are mutually communicated.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311779794.1A CN117747510A (en) | 2023-12-22 | 2023-12-22 | Anti-breaking inserting piece equipment for large-size silicon wafer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311779794.1A CN117747510A (en) | 2023-12-22 | 2023-12-22 | Anti-breaking inserting piece equipment for large-size silicon wafer |
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| CN117747510A true CN117747510A (en) | 2024-03-22 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202311779794.1A Pending CN117747510A (en) | 2023-12-22 | 2023-12-22 | Anti-breaking inserting piece equipment for large-size silicon wafer |
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| CN114649253A (en) * | 2020-12-18 | 2022-06-21 | 盛美半导体设备(上海)股份有限公司 | Wafer supporting device |
| CN114864475A (en) * | 2022-04-13 | 2022-08-05 | 智程半导体设备科技(昆山)有限公司 | Silicon chip belt cleaning device with breakage-proof piece function |
| CN115284198A (en) * | 2022-10-08 | 2022-11-04 | 尼尔半导体(山东)有限公司 | Fixing device of semiconductor substrate |
| CN218385156U (en) * | 2022-10-20 | 2023-01-24 | 浙大宁波理工学院 | Automatic solar silicon wafer feeding device |
| CN115571652A (en) * | 2022-11-23 | 2023-01-06 | 龙威微电子装备(龙泉)有限公司 | Silicon wafer conveying mechanism |
| CN116741664A (en) * | 2023-05-26 | 2023-09-12 | 徐州联超光电科技有限公司 | Groove type cleaning machine for cleaning monocrystalline silicon piece |
| CN117059559A (en) * | 2023-08-18 | 2023-11-14 | 安徽积芯微电子科技有限公司 | Chip bonding fixture |
| CN116873508A (en) * | 2023-08-28 | 2023-10-13 | 东莞市鼎力自动化科技有限公司 | Automatic feeding mechanism based on silicon wafer cleaning |
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