CN211376607U - Inserting piece device for large-size silicon wafer - Google Patents

Abstract

The utility model discloses an inserted sheet device for jumbo size silicon chip, it includes first transmission device, is equipped with the device of placing, the rotary sucker of silicon chip, piece basket, be provided with the vertical male vertical slot of up opening of silicon chip that can supply on the rotary sucker on the piece basket, place the silicon chip in the device and remove to first transmission device piece by piece, the silicon chip on the first transmission device of rotary sucker absorption and drive the silicon chip rotatory, when the silicon chip is rotatory to vertical state, in it is by the slot of vertical inserted piece basket, vertical inserted sheet, silicon chip middle part can not down bend and warp to the condition of having avoided two adjacent silicon chip stickings takes place, has still avoided the breakage that leads to because of warping in the middle of the silicon chip.

Description

Inserting piece device for large-size silicon wafer

Technical Field

The utility model relates to a silicon chip processing field especially relates to an inserted sheet device for jumbo size silicon chip.

Background

The silicon rod is cut into a silicon wafer, and the cut silicon wafer is subjected to degumming, inserting, cleaning and inspection to produce qualified silicon wafers. In the current sheet inserting process, the adopted mode is horizontal sheet inserting, the sheet inserting device comprises a transmission device 10, a cartridge clip 30 provided with a silicon sheet 20 and a sheet basket 40 to be provided with the silicon sheet are respectively arranged at two sides of the transmission device 10, the slot level of the sheet basket faces the transmission device, the plug slot is transversely arranged, the silicon sheet in the cartridge clip is separated by water pressure and moved to the transmission device, then another sheet is inserted into the slot of the sheet basket along with the transmission of the transmission device (as shown in figure 1), a silicon sheet is inserted, the sheet basket rises for a certain distance, so that the next slot faces the transmission device until the slots of the sheet basket are all inserted with the silicon sheet, and thus, the silicon sheets in the sheet basket are transversely arranged.

Above-mentioned horizontal inserted sheet mode is adapted to small-size silicon chip, because inserted sheet in-process silicon chip surface carries water, thereby make silicon chip weight increase, and the silicon chip all is horizontal setting again, so the silicon chip middle part can be down crooked and warp, thereby two adjacent silicon chips from top to bottom bond very easily together, take place the bonding promptly, so, not only can lead to the bonding position of the silicon chip that has washd to appear the watermark dirty, and along with the silicon chip size increase, the piece thickness attenuation, the silicon chip itself warp further increase, thereby make the bonding between two adjacent silicon chips from top to bottom take place more easily, and warp too big still lead to the silicon chip breakage easily moreover.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide an inserted sheet device and inserted sheet method for jumbo size silicon chip, it can avoid jumbo size silicon chip to glue piece, breakage at the inserted sheet in-process.

In order to achieve the above object, the utility model adopts the following technical scheme:

the utility model provides an inserted sheet device for jumbo size silicon chip, its includes first transmission device, is equipped with the device of placeeing of silicon chip, place the silicon chip in the device and can move to on the first transmission device, inserted sheet device still includes

The rotary sucker can adsorb the silicon wafer on the first conveying device and drive the silicon wafer to rotate;

the wafer basket is provided with a vertical slot which is provided with an upward opening and can be used for vertically inserting the silicon wafer on the rotary sucker.

The placing device and the rotary sucker are respectively arranged at two ends of the first transmission device, the first transmission device drives the silicon wafer to move towards the direction of the rotary sucker, and the wafer basket is arranged below the rotary sucker.

The inserting piece device further comprises a second transmission device arranged below the rotary sucker, the piece basket is arranged on the second transmission device, and after a silicon chip is inserted into one slot of the piece basket, the second transmission device drives the piece basket to move, so that adjacent empty slots move to corresponding positions to allow the next silicon chip to be vertically inserted.

The rotary sucker comprises a rotating shaft capable of rotating around a Z axis, one or more than one interval connected with sucker devices arranged on the circumferential direction of the rotating shaft, wherein one end of each sucker device is connected with a connecting piece arranged on the circumferential direction of the rotating shaft, one or more than one vacuum sucker arranged on the connecting piece, and each sucker device is correspondingly connected with a vacuum generator.

The distance between one end of the first transmission device facing the rotating shaft and the rotating shaft is not less than the length of the connecting piece.

The sucker is arranged on the upper side of the connecting piece, and the rotary sucker rotates anticlockwise; or, the sucking disc set up in the connecting piece downside, rotatory sucking disc clockwise rotation.

All the vacuum chucks on each chuck device are respectively communicated with a vacuum generator through pipelines; or the connecting piece of each sucker device is provided with an internal cavity which is communicated with a vacuum generator through a pipeline, and the sucker on each connecting piece is communicated with the internal cavity of the connecting piece.

The first transmission device is horizontally arranged, and the sheet basket is also horizontally arranged.

The rotating suction cup is also movable relative to the first conveyance means so that the rotating suction cup can be relatively close to or remote from the first conveyance means.

An inserting device for a large-size silicon wafer inserting process comprises the inserting device.

The utility model has the advantages that:

1. through the silicon wafer inserting device, the vertical silicon wafer inserting is realized, and the silicon wafers inserted into the slots of the wafer basket are vertically placed, so that the middle parts of the silicon wafers cannot be bent downwards to deform, thereby not only avoiding the condition that two adjacent silicon wafers are adhered, but also avoiding the breakage caused by the deformation of the middle parts of the silicon wafers;

2. the silicon wafer rotates along with the sucker before being inserted into the wafer basket, and most of water attached to the silicon wafer flows down in the rotating process of the sucker, so that the water on the silicon wafer is not much or even does not exist, and thus, the vertically inserted silicon wafer is further prevented from being stuck and broken due to middle deformation.

Drawings

FIG. 1 is a schematic view of a conventional horizontal tab;

FIG. 2 is a schematic view of one embodiment of the wafer inserting device for large-sized silicon wafers according to the present invention;

FIG. 3 is an enlarged schematic view of the rotary chuck of the insert device according to the present invention when a silicon wafer is adsorbed thereon;

FIG. 4 is an enlarged view of a suction cup device and a rotating shaft of the insert device according to the present invention;

fig. 5 is a schematic view of another embodiment of the insert device of the present invention.

Detailed description of the invention

In order to make the technical solution of the present invention better understood by those skilled in the art, the present invention will be further described in detail with reference to the accompanying drawings.

As shown in figure 2, the utility model discloses an inserted sheet device for jumbo size silicon chip, it includes first transmission device 1, is equipped with putting device 3 of silicon chip 2, place silicon chip 2 in the device 3 and can move to first transmission device 1 piece by piece, the inserted sheet device still includes

The rotary sucker 4 can adsorb the silicon wafer 2 on the first conveying device 1 and drive the silicon wafer 2 to rotate;

the wafer basket 5 is provided with a vertical slot 51 which is opened upwards and can be used for the silicon wafer 2 on the rotary sucker 4 to be vertically inserted.

In this embodiment, preferably, the placing device 3 and the rotating chuck 4 are respectively disposed at two ends of the first transmission device 1, the first transmission device 1 drives the silicon wafer 2 to move toward the rotating chuck 4, and the wafer basket 5 is disposed below the rotating chuck 4.

The inserting device for the large-size silicon wafer 2 further comprises a second transmission device 6 arranged below the rotary sucker 4, the wafer basket 5 is arranged on the second transmission device 6, and after a silicon wafer 2 is inserted into one of the slots 51 of the wafer basket 5, the second transmission device 6 drives the wafer basket 5 to move, so that the adjacent empty slots 51 move to the corresponding positions for the next silicon wafer 2 to be vertically inserted.

Preferably, the first transmission device 1 is horizontally arranged, so as to drive the silicon wafer 2 to horizontally move towards the direction of the rotary chuck 4.

Preferably, the sheet basket 5 is also horizontally arranged, so as to ensure the vertical arrangement of the slot 51.

Preferably, the second transfer device 6 is also arranged horizontally, so as to drive the sheet basket 5 to move horizontally.

Referring to fig. 3 and 4, the rotary suction cup 4 includes a rotating shaft 41 capable of rotating around the Z axis, one or more suction cup devices 42 disposed at intervals along the circumference of the rotating shaft 41, the suction cup device 42 includes a connecting member 421 having one end connected to the circumference of the rotating shaft 41, and one or more vacuum suction cups 422 disposed on the connecting member 421, and each suction cup device 42 is connected to a corresponding vacuum generator (not shown) in communication with the internal cavity. That is, the vacuum cups 422 of one of the cup assemblies 42 are connected to one of the vacuum generators through pipes, and the vacuum cups 422 of the other cup assembly 42 are connected to the other vacuum generator through pipes, and one vacuum generator controls one of the cup assemblies 42.

With the arrangement, the sucking disc devices 42 at different positions can perform different actions according to actual conditions, and specifically, in the working process, the sucking disc devices 42 suck the silicon wafers 2 on the first conveying device 1 under the control of the corresponding vacuum generators; meanwhile, the other suction cup device 42 loosens the adsorption of the silicon wafer 2 under the control of the corresponding vacuum generator, so that the silicon wafer 2 is vertically inserted into the slot 51 of the wafer basket 5; meanwhile, the other parts of the sucker devices 42 keep absorbing the silicon wafer 2 thereon under the control of the corresponding vacuum generators; at this time, the silicon wafer 2 is not held on the chuck device 42, and the pressure in the chuck is always kept at zero pressure or slightly positive pressure under the control of the corresponding vacuum generator.

In addition, by such an arrangement, the states of all the vacuum chucks 422 of each chuck device 42 can be synchronized, so that all the chucks on one connecting member 421 can simultaneously perform the operations of sucking the silicon wafer 2 or separating from the silicon wafer 2, thereby ensuring smooth operation of sucking and separating from each silicon wafer 2.

All the vacuum chucks 422 on each chuck device 42 can be respectively communicated with a vacuum generator through pipelines; or, the connecting piece 421 of each suction cup device 42 is provided with an internal cavity, the internal cavity is communicated with a vacuum generator through a pipeline, and the suction cup on each connecting piece 421 is communicated with the internal cavity of the connecting piece, so that the internal cavity is vacuumized or inflated through the vacuum generator, and the suction cup can adsorb the silicon wafer 2 and loosen the adsorption of the silicon wafer 2.

Preferably, a plurality of vacuum chucks 422 are disposed on each of the connection members 421 at intervals, so as to ensure that the silicon wafer 2 is uniformly stressed during the suction, and the silicon wafer 2 sucked thereon is not damaged when the chuck device 42 rotates. In the present embodiment, six vacuum chucks 422 are disposed on each connecting member 421, and the six vacuum chucks 422 are arranged in 2 rows by 3 columns. In other embodiments, a different number of vacuum cups 422 may be provided for each connection, as desired.

In this embodiment, the connecting member 421 includes a connecting rod 4211 connected to the rotating shaft 41 and a connecting plate 4222 connected to an end of the connecting rod 4211 away from the rotating shaft 41, and the suction cup is connected to the connecting plate 4222. If the connection member 421 takes the form of an internal cavity, the internal cavity is disposed in the connection plate 4222. In other embodiments, the connection 421 can be a direct one-plate state.

The connection mode of the connecting plate 4222, the vacuum chuck 422, the pipeline and the vacuum generator can adopt any known and feasible structure.

The connecting member 421 can be integrally formed with the rotating shaft 41, and can also be connected with the rotating shaft 41 by other methods, for example, a fastening hole is formed on the rotating shaft 41, a buckle in an elastic finger style is arranged at one end of the connecting member 421, and the buckle is fastened into the fastening hole and is reversely fastened on the inner wall of the fastening hole to realize the connection between the connecting member 421 and the rotating shaft 41.

The rotating shaft 41 can be connected with an output shaft of a motor, and the motor controls the rotation and pause of the rotating shaft 41.

The inserting piece device further comprises a support, and the placing device 3, the first transmission device, the second transmission device and the rotary sucker 4 are connected to the large support. The specific structure of the large support is not limited as long as the large support can realize the connection function and can not interfere with the actions of the placing device, the first transmission device, the second transmission device and the rotary sucker 4. Those skilled in the art can design specific stent structures based on the above description.

The placing device 3 provided with the silicon wafer 2 is set as a known cartridge clip, and can also be other known feasible devices; the sheet basket 5 can be a known feasible structure, and is only changed from the original traditional vertical placement into the horizontal placement, so that the slot 51 is also in the vertical placement shape with an upward opening; the silicon chip 2 in the cartridge clip can be moved to the first transmission device 1 one by one through water pressure separation, so the first and second transmission devices 6 can also be any publicly known feasible structures, such as transmission bands and other similar mechanisms, and these are not the key points of the utility model, and therefore are not described in detail herein.

The working principle of the inserting sheet device is as follows:

the silicon wafers 2 in the cartridge clip are separated by water pressure and moved onto the first conveying device 1 piece by piece, the silicon wafers 2 move towards the rotating suction cup 4 along with the conveying of the first conveying device 1, and when one side of the silicon wafers 2, which faces the rotating suction cup 4, extends out of the first conveying device 1 for a certain distance, one suction cup device 42 just rotates to the position below the silicon wafers 2; at this time, the rotary sucker 4 stops rotating temporarily, the vacuum generator sucks the silicon wafer to enable negative air pressure to be generated in the sucker on the sucker device 42, so that the sucker sucks the silicon wafer 2 and drives the silicon wafer 2 to rotate, and when the sucker device 42 rotates to a certain position, the silicon wafer 2 is in a vertical state and is vertically aligned with one empty slot 51 of the wafer basket 5; at this time, the rotation of the rotary chuck 4 is suspended again, the vacuum generator operates to smoothly inflate the chuck of the chuck device 42, so that the negative air pressure in the chuck becomes zero air pressure or slightly positive air pressure, the chuck is separated from the silicon wafer 2, and the silicon wafer 2 is vertically inserted into the corresponding slot 51.

Preferably, after the suction cup device 42 sucks and rotates a silicon wafer 2 on the first transfer device 1, the next silicon wafer 2 on the first transfer device 1 continues to move in the direction of the wafer basket 5, and the next suction cup device 42 also rotates upward, when the next silicon wafer 2 moves to a position where one side of the silicon wafer 2 facing the rotary suction cup 4 extends out of the first transfer device 1 by a certain distance, the next suction cup device 42 also just rotates to a position below the next silicon wafer 2 to suck the silicon wafer 2, so that the plurality of suction cup devices 42 suck the silicon wafers 2 one by one, when the rotary suction cup 4 rotates to a certain angle, the silicon wafer 2 sucked first is vertically aligned with one of the slots 51 of the wafer basket 5, and after the silicon wafer 2 is vertically inserted into the slot 51, the rotary suction cup 4 continues, and the second transfer device 6 moves horizontally to drive the wafer basket 5 to move horizontally; when the rotary sucker 4 rotates to a certain angle, the second adsorbed silicon wafer 2 is vertically aligned with the slot 51 adjacent to the previous slot 51; at this time, the second transfer device 6 stops rotating, and the silicon wafer 2 is inserted into the aligned slot 51.

Since the spin chuck 4 stops rotating when the silicon wafer 2 is being chucked, and the spin chuck 4 stops rotating when the silicon wafer 2 is inserted into the wafer basket 5, in order to reduce the pause time of the spin chuck 4, it is preferable that when the silicon wafer 2 chucked on one of the chuck devices 42 of the spin chuck 4 is inserted into one of the slots 51 of the wafer basket 5, another chuck device 42 at the corresponding position on the spin chuck 4 simultaneously chucked a silicon wafer 2 on the first transfer device 1. That is, the spin chuck 4 is stopped once, and the insertion of the sucked silicon wafer 2 and the sucking of the new silicon wafer 2 can be performed simultaneously, so that the inserting efficiency is greatly improved.

In this embodiment, the vacuum chuck 422 is disposed on the upper side of the connecting member 421, and the rotary chuck 4 rotates counterclockwise; in other embodiments, the vacuum chuck 422 ' may be disposed at the lower side of the connection member 421 ', and the rotating chuck 4 ' rotates clockwise (as shown in fig. 5).

The distance between one end of the first transmission device facing the rotating shaft 41 and the rotating shaft 41 is not less than the length of the connecting piece 421, so that the interference between the rotating sucker 4 and the first transmission device is avoided when the rotating sucker rotates.

In a further embodiment (not shown), the rotating chuck 4 is not only rotatable about the Z-axis, but also movable relative to the first transportation device 1, so that the rotating chuck 4 can be moved relatively close to or away from the first transportation device 1. In this arrangement, the distance between the end of the first transmission device facing the rotating shaft 41 and the rotating shaft 41 is not limited. The rotary suction cup 4 is close to the first transmission device, when two adjacent suction cup devices 42 clamp the first transmission device towards one side of the rotary suction cup 4, one suction cup device 42 adsorbs one silicon wafer 2 on the first transmission device, then the rotary suction cup 4 moves towards one side of the original first transmission device, when the connecting piece 421 rotates and does not interfere with the first transmission device any more, the rotary suction cup 4 rotates, and the adsorbed silicon wafer 2 is vertically inserted into the wafer basket 5.

The utility model also discloses an inserted sheet method of jumbo size silicon chip 2, it includes: the slot 51 of the wafer basket 5 is vertically arranged and is opened upwards, and the silicon wafer 2 is vertically inserted into the slot 51 of the wafer basket 5.

Further, silicon wafers 2 in the placing device 3 move to the first conveying device 1 one by one, the first conveying device 1 drives the silicon wafers 2 to move towards the rotating sucker 4, the rotating sucker 4 adsorbs the silicon wafers 2 on the first conveying device 1 and drives the silicon wafers 2 to rotate, when the silicon wafers 2 are vertically aligned with the empty slots 51 corresponding to the wafer basket 5, the rotating sucker 4 loosens adsorption of the silicon wafers 2, the silicon wafers 2 are vertically inserted into the empty slots 51, and when the rotating sucker 4 adsorbs the silicon wafers 2 and the silicon wafers 2 are inserted into the wafer basket 5, the rotating sucker 4 temporarily stops rotating.

When the silicon wafer 2 sucked on one of the rotary suction cups 4 and the suction cup device 42 is inserted into one of the slots 51 of the wafer basket 5, the other suction cup device 42 corresponding to the position on the rotary suction cup 4 simultaneously sucks a silicon wafer 2 on the first transfer device 1. So, the inserted sheet efficiency has been improved.

Preferably, after a silicon wafer 2 adsorbed by the rotary chuck 4 is inserted into one of the empty slots 51 of the wafer basket 5, the wafer basket 5 is driven by a second transmission device 6 to move, and when the next silicon wafer 2 is in a vertical state along with the rotation of the rotary chuck 4, the adjacent empty slot 51 on the wafer basket 5 also moves to be vertically aligned with the silicon wafer 2 in the vertical state.

The inserting device and the inserting method are used in the inserting process after the silicon wafer 2 is degummed. That is, the processing steps of the silicon wafer 2 include degumming, sheet insertion, cleaning, and the like, and the sheet insertion device and the sheet insertion method are used in the sheet insertion step after the degumming.

The above description of the embodiments is only for the purpose of helping understanding the technical solution of the present invention and the core idea thereof, and it should be noted that, for those skilled in the art, without departing from the principle of the present invention, the present invention can be further modified and modified, and these modifications and modifications also fall into the protection scope of the claims of the present invention.

Claims (11)

1. The utility model provides an inserted sheet device for jumbo size silicon chip, its includes first transmission device which characterized in that: the inserting sheet device also comprises

The rotary sucker can adsorb the silicon wafer on the first conveying device and drive the silicon wafer to rotate;

the wafer basket is provided with a vertical slot which is provided with an upward opening and can be used for vertically inserting the silicon wafer on the rotary sucker.

2. The wafer inserting device for large-size silicon wafers as claimed in claim 1, wherein: the silicon wafer placing device comprises a placing device and a rotating sucker, the placing device is provided with a silicon wafer placing device, the silicon wafers in the placing device can be moved to a first conveying device one by one, the placing device and the rotating sucker are arranged at two ends of the first conveying device respectively, the first conveying device drives the silicon wafers to move towards the rotating sucker, and the wafer basket is arranged below the rotating sucker.

3. The wafer inserting device for large-size silicon wafers as claimed in claim 2, wherein: the silicon wafer conveying device further comprises a second conveying device arranged below the rotary sucker, the wafer basket is arranged on the second conveying device, and after a silicon wafer is inserted into one slot of the wafer basket, the second conveying device drives the wafer basket to move, so that adjacent empty slots move to corresponding positions to enable the next silicon wafer to be vertically inserted.

4. The insert device for large-sized silicon wafers according to claim 1, 2 or 3, wherein: the rotary sucker comprises a rotating shaft capable of rotating around a Z axis, one or more sucker devices arranged at intervals along the circumferential direction of the rotating shaft, each sucker device comprises one end connected with a connecting piece arranged on the circumferential direction of the rotating shaft and one or more vacuum suckers arranged on the connecting piece, and each sucker device is correspondingly connected with a vacuum generator.

5. The wafer inserting device for large-size silicon wafers as claimed in claim 4, wherein: the sucker is arranged on the upper side of the connecting piece, and the rotary sucker rotates anticlockwise; or, the sucking disc set up in the connecting piece downside, rotatory sucking disc clockwise rotation.

6. The wafer inserting device for large-size silicon wafers as claimed in claim 5, wherein: the distance between one end of the first transmission device facing the rotating shaft and the rotating shaft is not less than the length of the connecting piece.

7. The insert device for large-size silicon wafers according to claim 5 or 6, wherein: all the vacuum chucks on each chuck device are respectively communicated with a vacuum generator through pipelines; or the connecting piece of each sucker device is provided with an internal cavity which is communicated with a vacuum generator through a pipeline, and the sucker on each connecting piece is communicated with the internal cavity of the connecting piece.

8. The tab apparatus for large-sized silicon wafers as claimed in claim 1 or 2 or 3 or 5 or 6, wherein: the first transmission device is horizontally arranged, and the sheet basket is also horizontally arranged.

9. The tab apparatus for large-sized silicon wafers as claimed in claim 1 or 2 or 3 or 5 or 6, wherein: the rotating suction cup is also movable relative to the first conveyance means so that the rotating suction cup can be relatively close to or remote from the first conveyance means.

10. The wafer inserting device for large-size silicon wafers as claimed in claim 8, wherein: the rotating suction cup is also movable relative to the first conveyance means so that the rotating suction cup can be relatively close to or remote from the first conveyance means.

11. The utility model provides an inserted sheet device that is used for jumbo size silicon chip inserted sheet process which characterized in that: comprising the tab device of any of claims 1 to 10.

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