CN117059559A - Chip bonding fixture - Google Patents
Chip bonding fixture Download PDFInfo
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- CN117059559A CN117059559A CN202311045181.5A CN202311045181A CN117059559A CN 117059559 A CN117059559 A CN 117059559A CN 202311045181 A CN202311045181 A CN 202311045181A CN 117059559 A CN117059559 A CN 117059559A
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- base
- plate
- chip
- fixedly arranged
- connecting shaft
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- 230000001681 protective effect Effects 0.000 claims description 11
- 230000005540 biological transmission Effects 0.000 claims description 7
- 241000276425 Xiphophorus maculatus Species 0.000 claims description 2
- 230000000149 penetrating effect Effects 0.000 claims description 2
- 239000000758 substrate Substances 0.000 abstract description 8
- 238000005299 abrasion Methods 0.000 abstract description 2
- 230000000694 effects Effects 0.000 description 8
- 238000005516 engineering process Methods 0.000 description 6
- 244000309464 bull Species 0.000 description 3
- 239000002184 metal Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 230000004075 alteration Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 230000004807 localization Effects 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 230000001360 synchronised effect Effects 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/60—Attaching or detaching leads or other conductive members, to be used for carrying current to or from the device in operation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/60—Attaching or detaching leads or other conductive members, to be used for carrying current to or from the device in operation
- H01L2021/60007—Attaching or detaching leads or other conductive members, to be used for carrying current to or from the device in operation involving a soldering or an alloying process
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Robotics (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Manipulator (AREA)
Abstract
The invention discloses a chip bonding clamp, and relates to the technical field of chip processing equipment; the invention comprises a base, wherein the base is rectangular plate-shaped, a groove is formed in the base, a circular bottom plate is fixedly arranged at the bottom of the groove, and a positioning plate is fixedly arranged at one end of the upper surface of the base; according to the invention, the first connecting shaft drives the first rotating shaft to rotate through the two first bevel gears which are meshed, when the first rotating shaft rotates, the first rotating shaft drives the second gear to drive the first gear to rotate, when the first gear rotates, the pushing block is pushed to move along the arc-shaped groove, when the pushing block moves, the pushing plate is pulled to move, the clamping plate at the top end is driven to contact with a chip abutted against the positioning plate when the pushing plate moves, three sides of a substrate of the chip can be simultaneously positioned through the operation, the stability and the stability of chip clamping are ensured, and the hard contact of the clamp to the chip clamping is reduced by the cooperation of the rubber pad, so that the abrasion degree to the chip is reduced.
Description
Technical Field
The invention relates to the technical field of chip processing equipment, in particular to a chip bonding clamp.
Background
Wire bonding is a main technology for first-stage assembly of integrated circuits, is a key technology for rapidly developing electronic components, is a technology for fusing a thin metal wire by using heat, pressure or ultrasonic waves and the like as energy so as to connect the metal wire with a substrate bonding pad, is a technology for wire bonding, and is a technology for clamping and positioning a chip through a clamp to ensure the stability and the yield of wire bonding, and is generally used for bonding by a bonding machine for large industrial technology, but is generally used for manual bonding for some self-service merchants for small maintenance, and has the following problems for clamps for the manually bonded chip:
1. the clamp has single effect and poor clamping effect, meanwhile, when the bonded chip is taken down, the ejector component is not arranged, the chip is attached to the bottom surface of the clamp, so that the chip is basically taken down in a sliding way during the taking down, and a certain friction damage is easy to generate;
2. meanwhile, when the existing clamp base for manual bonding is placed on a workbench, the friction force at the bottom is small, the stability is guaranteed by increasing the friction force with a tabletop by self gravity, the stability effect is poor, shaking easily occurs when a follow-up worker slightly touches the clamp during bonding of chips on the clamp, and the bonding effect is affected.
In view of the above, the inventors propose a die bonding jig for solving the above problems.
Disclosure of Invention
The clamping device aims to solve the problems that the clamping effect is single, an ejection mechanism is not provided, and the stability of a clamp base is poor; the invention aims to provide a chip bonding clamp.
In order to solve the technical problems, the invention adopts the following technical scheme: the utility model provides a chip bonding anchor clamps, includes the base, the base is the platy of rectangle, the inside recess of seting up of base, the fixed bottom plate that is circular shape that is equipped with in recess bottom, wherein one end of base upper surface is fixed to be equipped with the locating plate, offsets chip one end and locating plate at first, can drive three grip block and move towards the chip afterwards, carry out the centre gripping location to the chip, the base upper surface keeps away from the one end that the locating plate located all seting up with the communicating spout of recess, be close to three inside spout slides and is equipped with the push pedal that is the L type, the vertical one end of push pedal slides and inserts in establishing the spout, the vertical one end of push pedal just is located base outer wall one end is fixed to be equipped with the grip block, the grip block is equipped with the rubber pad towards locating plate one side installation, the bottom plate and three be equipped with drive assembly between the grip block, the inside middle of base is equipped with ejecting subassembly, wherein both sides that the base outer wall is relative are equipped with the long board, the long board lower surface is equipped with locating assembly.
Preferably, the drive assembly includes first gear, first gear rotates and sets up in bottom plate center department, be located the bottom plate central point on the first gear and seted up three circular distribution's arc groove, three the arc groove is corresponding with three spouts respectively, arc inslot activity is equipped with the ejector pad, run through on the bottom plate and set up three movable grooves relative with the arc groove, ejector pad horizontal one end activity is inserted and is established in the movable groove, is located ejector pad top fixed connection in the arc groove is on the ejector pad, the bottom plate upper surface is close to first gear and is fixed and be equipped with first pivot, fixed being equipped with in the first pivot with the second gear that first gear meshing set up.
Preferably, one side of the outer wall of the base adjacent to the two long plates is close to the first rotating shaft and provided with a first connecting shaft, one end of the first connecting shaft located in the groove is connected with a first bevel gear arranged between the first rotating shaft and the first rotating shaft through two meshing, the outer wall of the base is close to the first rotating shaft and provided with a first rotating wheel, a connecting assembly is arranged between the first rotating wheel and the first connecting shaft and comprises a protective cover, the protective cover is fixedly arranged on the outer wall of the base and is close to the first connecting shaft, one end of the first connecting shaft located on the outer wall of the base is rotatably arranged in the protective cover, one end of the first connecting shaft located in the protective cover is fixedly provided with a worm wheel, a worm is arranged on the worm wheel in a meshing mode, and the upper end and the lower end of the worm are rotatably arranged in the protective cover, and the output end of the first rotating wheel is fixedly arranged on the worm.
Preferably, the ejecting subassembly includes four ejector pins that are rectangular distribution, the ejector pin upper end runs through the base, four ejector pin bottom is fixed the fixed plate jointly, fixed plate middle extreme screw thread inserts and is equipped with two symmetrical distribution's adjusting bolt, the adjusting bolt top rotates and sets up at base inner wall upper surface, two adjusting bolt bottom is fixed and is equipped with the second pivot, two second pivot bottom is the common transmission cover is equipped with first belt, the same one side of base outer wall and first connecting axle is close to the second pivot and is equipped with the second connecting axle, the second connecting axle is located the second conical gear connection that sets up through two meshing between base inner wall one end and the second pivot, the base outside is equipped with the motor near the second connecting axle, the coaxial fixed connection of output of motor is on the second connecting axle.
Preferably, the locating component comprises a transverse plate, the transverse plate is fixedly arranged on the side wall of the base and is located above the long plate, a rectangular groove is formed in the lower surface of the transverse plate, two symmetrically distributed sliding blocks are slidably arranged in the groove, a top plate is hinged between the lower surface of the sliding block and the long plate respectively, two threaded opposite double-headed screws are rotatably arranged in the groove, two sliding blocks in the groove are respectively inserted into two ends of the double-headed screws in a threaded mode, two same one ends of the double-headed screws are fixedly provided with rotating rods, the rotating rods are far away from the double-headed screws, a second belt is sleeved on one end of each rotating rod in a common transmission mode, a sucker is arranged on the lower surface of the long plate, an anti-slip pad is fixedly arranged on the lower surface of the base, one rotating rod is close to the second belt and fixedly arranged with a second rotating wheel, limiting rods are fixedly arranged at two ends of the upper surface of the fixed plate, the outer wall of the base is close to the limiting rods and are fixedly provided with limiting blocks, and the top ends of the limiting rods are movably inserted into the limiting blocks.
Compared with the prior art, the invention has the beneficial effects that:
1. according to the invention, the first connecting shaft drives the first rotating shaft to rotate through the two first bevel gears which are meshed, when the first rotating shaft rotates, the first rotating shaft drives the second gear to drive the first gear to rotate, when the first gear rotates, the pushing block is pushed to move along the arc-shaped groove, when the pushing block moves, the pushing plate is pulled to move, the clamping plate at the top end is driven to contact with a chip abutted against the positioning plate when the pushing plate moves, three sides of a substrate of the chip can be simultaneously positioned through the operation, the stability and the stability of chip clamping are ensured, and the hard contact of the clamp to the chip clamping is reduced by the cooperation of the rubber pad, so that the abrasion degree to the chip is reduced;
2. according to the invention, the two second rotating shafts are in transmission connection through the first belt, so that the two second rotating shafts synchronously rotate, and the second rotating shafts drive the driving fixing plate to move upwards when rotating so that the ejector rods fixedly arranged at four corners of the fixing plate move upwards, and the ejector rods push the chip substrate to move upwards, so that a gap is formed between the bottom of the chip and the base, the chip is convenient for a worker to take down, and certain friction damage is easy to generate when the chip is taken down when the chip is attached to the bottom surface of the clamp;
3. according to the invention, the rotating rod drives the double-end screw rod to rotate, so that the sliding blocks which are inserted into the two ends of the double-end screw rod in a threaded manner move oppositely, the sliding blocks push the top plate which is hinged with the support to move downwards, the long plate pushes the sucker to move downwards and prop against the tabletop, the sucker is fixedly arranged on the tabletop, and the friction between the lower surface of the base and the tabletop is increased by matching with the anti-slip pad fixedly arranged on the lower surface of the base, so that the base is stably and fixedly arranged on the tabletop, the base is prevented from being offset when being slightly touched, and the stability of manual bonding of staff is improved.
Drawings
In order to more clearly illustrate the embodiments of the invention or the technical solutions in the prior art, the drawings that are required in the embodiments or the description of the prior art will be briefly described, it being obvious that the drawings in the following description are only some embodiments of the invention, and that other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
FIG. 1 is a schematic diagram of the overall structure of the present invention.
Fig. 2 is a schematic view of the internal structure of the base of the present invention.
Fig. 3 is an enlarged schematic view of the structure of fig. 2 a according to the present invention.
Fig. 4 is a schematic view of the top plate structure of the present invention.
Fig. 5 is an enlarged schematic view of the structure of fig. 4 a according to the present invention.
FIG. 6 is a schematic view of the cross plate structure of the present invention.
FIG. 7 is a schematic view of the internal structure of the cross plate of the present invention.
Fig. 8 is an enlarged schematic view of the structure of fig. 6 a according to the present invention.
In the figure: 1. a base; 11. a groove; 12. a bottom plate; 13. a first gear; 14. an arc-shaped groove; 15. a pushing block; 16. a movable groove; 17. a push plate; 18. a clamping plate; 181. a rubber pad; 19. a chute; 2. a positioning plate; 21. a first rotating shaft; 22. a second gear; 23. a first connecting shaft; 24. a first bevel gear; 25. a protective cover; 26. a worm wheel; 27. a worm; 28. a first wheel; 3. a push rod; 31. a fixing plate; 32. an adjusting bolt; 33. a second rotating shaft; 34. a first belt; 35. a second connecting shaft; 351. a second bevel gear; 36. a motor; 4. a cross plate; 41. a groove; 42. a double-ended screw; 43. a slide block; 44. a top plate; 45. a long plate; 46. a suction cup; 47. a rotating rod; 48. a second wheel; 49. a second belt; 5. a limit rod; 51. a limiting block; 52. an anti-slip mat.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present invention, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
Examples: as shown in fig. 1-8, the invention provides a chip bonding fixture, which comprises a base 1, the base 1 is rectangular plate-shaped, a groove 11 is formed in the base 1, a circular bottom plate 12 is fixedly arranged at the bottom of the groove 11, a positioning plate 2 is fixedly arranged at one end of the upper surface of the base 1, one end of a chip is propped against the positioning plate 2, then three clamping plates 18 can be driven to move towards the chip to clamp and position the chip, sliding grooves 19 communicated with the groove 11 are formed at one end of the upper surface of the base 1 far away from the positioning plate 2, an L-shaped push plate 17 is slidably arranged in the groove 11 near the three sliding grooves 19, one vertical end of the push plate 17 is slidably inserted into the sliding grooves 19, a clamping plate 18 is fixedly arranged at one end of the vertical end of the push plate 17 and positioned at one end of the outer wall of the base 1, a driving component is arranged between the bottom plate 12 and the three clamping plates 18, an ejection component is arranged at the middle end of the inner part of the base 1, long plates 45 are arranged at two opposite sides of the outer wall of the base 1, and a positioning component is arranged at the lower surface of the long plates 45.
The side of the clamping plate 18 facing the positioning plate 2 is provided with a rubber pad 181.
Through adopting above-mentioned technical scheme, rubber pad 181 reduces the hard contact of anchor clamps to chip centre gripping to reduce the degree of wear to the chip.
The driving assembly comprises a first gear 13, the first gear 13 is rotatably arranged at the center of a bottom plate 12, three arc grooves 14 which are annularly distributed are formed in the first gear 13 and located at the center of the bottom plate 12, the three arc grooves 14 correspond to three sliding grooves 19 respectively, pushing blocks 15 are movably arranged in the arc grooves 14, three movable grooves 16 which are opposite to the arc grooves 14 are formed in the bottom plate 12 in a penetrating mode, one horizontal end of a pushing plate 17 is movably inserted into the movable grooves 16, the top of the pushing blocks 15 located in the arc grooves 14 are fixedly connected to the pushing plate 17, a first rotating shaft 21 is fixedly arranged on the upper surface of the bottom plate 12, close to the first gear 13, and a second gear 22 which is meshed with the first gear 13 is fixedly arranged on the first rotating shaft 21.
Through adopting above-mentioned technical scheme, will drive second gear 22 through first pivot 21 and drive first gear 13 and take place to rotate, when first gear 13 takes place to rotate, will promote ejector pad 15 and remove along arc groove 14, when the ejector pad 17 will be pulled when removing this moment ejector pad 15, will drive the grip block 18 on top to the chip contact that offsets with locating plate 2 when the ejector pad 17 removes, can carry out simultaneous localization to the base plate three side of chip simultaneously through above-mentioned operation, guarantee the stability to the chip centre gripping.
The side of the outer wall of the base 1 adjacent to the two long plates 45 is provided with a first connecting shaft 23 close to the first rotating shaft 21, one end of the first connecting shaft 23 positioned in the groove 11 is connected with the first rotating shaft 21 through two first bevel gears 24 meshed with each other, the outer wall of the base 1 is provided with a first rotating wheel 28 close to the first connecting shaft 23, and a connecting assembly is arranged between the first rotating wheel 28 and the first connecting shaft 23.
Through adopting above-mentioned technical scheme, make things convenient for the staff to drive three grip blocks 18 and fix a position the chip through setting up first runner 28, make things convenient for the staff to operate.
The coupling assembling includes protection casing 25, and the fixed setting of protection casing 25 is close to first connecting axle 23 at 1 outer wall of base, and first connecting axle 23 is located 1 outer wall one end rotation setting in protection casing 25, and first connecting axle 23 is located the fixed worm wheel 26 that is equipped with of one end in the protection casing 25, and the meshing is equipped with worm 27 on the worm wheel 26, and the upper and lower extreme of worm 27 all rotates setting in protection casing 25, and first runner 28 output is fixed to be set up on worm 27.
Through adopting above-mentioned technical scheme, through setting up worm wheel 26 and worm 27 and driving, increase the stopping behind the chip centre gripping, increase the result of use of this anchor clamps.
The ejecting subassembly is including four being rectangle distribution ejector pin 3, ejector pin 3 upper end runs through base 1, the fixed plate 31 is fixed jointly to four ejector pin 3 bottoms, fixed plate 31 middle extreme screw thread inserts is equipped with two symmetrical distribution's adjusting bolt 32, adjusting bolt 32 top rotates and sets up at base 1 inner wall upper surface, two adjusting bolt 32 bottoms are fixed to be equipped with second pivot 33, two second pivot 33 bottom common drive cover is equipped with first belt 34, base 1 outer wall is equipped with second connecting axle 35 near second pivot 33 with the same one side of first connecting axle 23, second connecting axle 35 is located base 1 inner wall one end and is connected through the second bevel gear 351 that two meshing set up with second pivot 33.
Through adopting above-mentioned technical scheme, drive second pivot 33 rotates, and two second pivots 33 pass through first belt 34 transmission and connect to make two second pivots 33 synchronous rotation, will drive when the second pivot 33 rotates and drive fixed plate 31 and shift up so that fixed ejector pin 3 that sets up in fixed plate 31 four corners department moves up, ejector pin 3 promotes the chip base plate and shifts up for produce the clearance between chip bottom and base 1, make things convenient for the staff to take off it, produce certain friction damage easily when avoiding chip and anchor clamps bottom surface subsides when taking off.
The outside of the base 1 is provided with a motor 36 near the second connecting shaft 35, and the output end of the motor 36 is coaxially and fixedly connected to the second connecting shaft 35.
Through adopting above-mentioned technical scheme, can provide power to second pivot 33 through setting up motor 36 for second pivot 33 is automatic to be rotated, makes things convenient for the staff to control.
The locating component comprises a transverse plate 4, the transverse plate 4 is fixedly arranged on the side wall of the base 1 and is located above a long plate 45, a rectangular groove 41 is formed in the lower surface of the transverse plate 4, two symmetrically distributed sliding blocks 43 are arranged in the groove 41 in a sliding mode, a top plate 44 is hinged between the lower surfaces of the two sliding blocks 43 and the long plate 45 respectively, two double-end screws 42 with opposite threads are arranged in the groove 41 in a rotating mode, the two sliding blocks 43 in the same groove 41 are inserted into the two ends of the double-end screws 42 respectively in a threaded mode, a rotating rod 47 is fixedly arranged at the same end of the two double-end screws 42, a second belt 49 is sleeved on one end of the two rotating rods 47 away from the double-end screws 42 in a common transmission mode, a sucker 46 is arranged on the lower surface of the long plate 45, and an anti-slip pad 52 is fixedly arranged on the lower surface of the base 1.
Through adopting above-mentioned technical scheme, drive two bull sticks 47 rotate, the bull stick 47 rotates drive double-end screw 42 for the screw thread inserts the slider 43 of establishing at double-end screw 42 both ends and removes in opposite directions, and slider 43 will hold in the palm the roof 44 that articulates the setting and promote longboard 45 to move down, and longboard 45 will promote sucking disc 46 to move down and offset with the desktop, makes sucking disc 46 fixed setting on the desktop, and the fixed frictional force that sets up between slipmat 52 increase base 1 lower surface and desktop of cooperation base 1 lower surface, thereby makes base 1 stable fixed setting on the desktop, avoids base 1 to receive slight touching and just take place the skew, stability when increasing the manual bonding of staff.
One of the turning bars 47 is fixedly mounted adjacent to a second belt 49 with a second turning wheel 48.
Through adopting above-mentioned technical scheme, make things convenient for staff's drive bull stick 47 to rotate through setting up second runner 48, the staff of being convenient for controls.
Limiting rods 5 are fixedly arranged at two ends of the upper surface of the fixed plate 31, limiting blocks 51 are fixedly arranged on the outer wall of the base 1, close to the limiting rods 5, and the top ends of the limiting rods 5 are movably inserted into the limiting blocks 51.
By adopting the above technical scheme, through setting up gag lever post 5 for longplate 45 and sucking disc 46 can stably move down.
Working principle: when the chip clamping device is used, a substrate of the chip is placed on the upper surface of the base 1, one end of the substrate is propped against the positioning plate 2, then the first rotating wheel 28 can be rotated, the worm 27 drives the worm wheel 26 to drive the first connecting shaft 23 to rotate, the first connecting shaft 23 drives the first rotating shaft 21 to rotate through the two meshed first bevel gears 24, when the first rotating shaft 21 rotates, the first rotating shaft 21 drives the second gear 22 to drive the first gear 13 to rotate, when the first gear 13 rotates, the pushing block 15 is pushed to move along the arc-shaped groove 14, when the pushing block 15 moves, the pushing plate 17 is pulled to move, the clamping plate 18 at the top end is driven to contact the chip propped against the positioning plate 2 when the pushing plate 17 moves, the three sides of the substrate of the chip can be simultaneously positioned through the operation, the stable stability of the chip clamping is ensured, the hard contact of the clamp to the chip clamping is reduced through the cooperation of the rubber pad 181, the degree of the hard contact of the clamp to the chip is reduced, the worm wheel 26 and the worm 27 is driven when the first gear 13 rotates, the wear of the clamp is increased, and the use effect of the clamp is increased;
through the above clamping device for positioning the chip, a worker can manually bond the clamped chip, when the chip is required to be removed after bonding is completed, the control motor 36 drives the second connecting shaft 35 to rotate, so that the second connecting shaft 35 can rotate through two meshed second bevel gears 351 and the two second rotating shafts 33 are in transmission connection through the first belt 34, the two second rotating shafts 33 synchronously rotate, the second rotating shafts 33 drive the driving fixing plate 31 to move upwards when rotating so that the ejector rods 3 fixedly arranged at four corners of the fixing plate 31 move upwards, the ejector rods 3 push the chip substrate to move upwards, a gap is formed between the bottom of the chip and the base 1, and the chip is convenient to remove by the worker, so that certain friction damage is easy to occur when the chip is removed when the chip is attached to the bottom surface of the clamp;
when the base 1 for the clamp is stably placed, a worker can rotate the second rotating wheel 48, the second rotating wheel 48 is matched with the second belt 49 to drive the two rotating rods 47 to rotate simultaneously, the two rotating rods 47 drive the double-headed screw rods 42 to rotate, the sliding blocks 43 which are inserted into the threads at the two ends of the double-headed screw rods 42 move in opposite directions, the sliding blocks 43 push the long plates 45 to move downwards by the top plates 44 which are hinged, the long plates 45 push the sucking discs 46 to move downwards to prop against the tabletop, the sucking discs 46 are fixedly arranged on the tabletop, the friction between the lower surface of the base 1 and the tabletop is increased by the anti-slip pads 52 which are fixedly arranged on the lower surface of the base 1, so that the base 1 is stably and fixedly arranged on the tabletop, the base 1 is prevented from being offset due to slight touch, and the stability of manual bonding of the worker is improved.
It will be apparent to those skilled in the art that various modifications and variations can be made to the present invention without departing from the spirit or scope of the invention. Thus, it is intended that the present invention also include such modifications and alterations insofar as they come within the scope of the appended claims or the equivalents thereof.
Claims (10)
1. Chip bonding anchor clamps, including base (1), its characterized in that: the base (1) is rectangular platy, recess (11) have been seted up to base (1) inside, recess (11) bottom is fixed to be equipped with and is circular shape bottom plate (12), wherein one end of base (1) upper surface is fixed to be equipped with locating plate (2), base (1) upper surface keep away from locating plate (2) one end that locates all set up with recess (11) communicating spout (19), recess (11) are inside be close to three spout (19) to slide be equipped with push pedal (17) that are the L type, push pedal (17) vertical one end slides and inserts in spout (19), push pedal (17) vertical one end just is located base (1) outer wall one end and is fixed to be equipped with grip block (18), bottom plate (12) are with three be equipped with drive assembly between grip block (18), base (1) inside middle end is equipped with ejecting subassembly, wherein both sides that base (1) outer wall is relative are equipped with longboard (45), longboard (45) lower surface is equipped with locating assembly.
2. A die bonding jig according to claim 1, wherein a rubber pad (181) is provided on a side of the holding plate (18) facing the positioning plate (2).
3. The die bonding fixture according to claim 1, wherein the driving assembly comprises a first gear (13), the first gear (13) is rotatably arranged at the center of the bottom plate (12), three arc grooves (14) which are annularly distributed are formed in the first gear (13) and located at the center point of the bottom plate (12), three arc grooves (14) are respectively corresponding to three sliding grooves (19), pushing blocks (15) are movably arranged in the arc grooves (14), three movable grooves (16) opposite to the arc grooves (14) are formed in the bottom plate (12) in a penetrating mode, one horizontal end of the pushing plate (17) is movably inserted into the movable grooves (16), the top of the pushing block (15) located in the arc grooves (14) is fixedly connected to the pushing plate (17), a first rotating shaft (21) is fixedly arranged on the upper surface of the bottom plate (12) close to the first gear (13), and a second gear (22) meshed with the first gear (13) is fixedly arranged on the first rotating shaft (21).
4. A die bonding jig according to claim 3, wherein a first connecting shaft (23) is provided on a side of the outer wall of the base (1) adjacent to the two long plates (45) near the first rotating shaft (21), the first connecting shaft (23) is connected with the first rotating shaft (21) through two first bevel gears (24) engaged with each other, a first rotating wheel (28) is provided on the outer wall of the base (1) near the first connecting shaft (23), and a connecting assembly is provided between the first rotating wheel (28) and the first connecting shaft (23).
5. The chip bonding fixture according to claim 4, wherein the connecting assembly comprises a protective cover (25), the protective cover (25) is fixedly arranged on the outer wall of the base (1) and is close to the first connecting shaft (23), one end of the first connecting shaft (23) positioned on the outer wall of the base (1) is rotatably arranged in the protective cover (25), a worm wheel (26) is fixedly arranged at one end of the first connecting shaft (23) positioned in the protective cover (25), a worm (27) is arranged on the worm wheel (26) in a meshing manner, the upper end and the lower end of the worm (27) are rotatably arranged in the protective cover (25), and the output end of the first rotating wheel (28) is fixedly arranged on the worm (27).
6. The chip bonding fixture according to claim 5, wherein the ejector assembly comprises four ejector rods (3) in rectangular distribution, the upper ends of the ejector rods (3) penetrate through the base (1), four ejector rods (3) are fixedly connected with a fixing plate (31) at the bottom, two symmetrically distributed adjusting bolts (32) are inserted into the middle end of the fixing plate (31) in a threaded mode, the top ends of the adjusting bolts (32) are rotatably arranged on the upper surface of the inner wall of the base (1), second rotating shafts (33) are fixedly arranged at the bottoms of the two adjusting bolts (32), a first belt (34) is sleeved on the bottom of the two second rotating shafts (33) in a transmission mode, a second connecting shaft (35) is arranged on the same side of the outer wall of the base (1) close to the second rotating shafts (33), and one end of the second connecting shaft (35) located on the inner wall of the base (1) is connected with the second rotating shafts (33) through two meshed second bevel gears (351).
7. A die bonding jig according to claim 6, wherein a motor (36) is provided outside the base (1) near the second connecting shaft (35), and an output end of the motor (36) is fixedly connected to the second connecting shaft (35) coaxially.
8. The chip bonding fixture according to claim 1, wherein the positioning assembly comprises a transverse plate (4), the transverse plate (4) is fixedly arranged on the side wall of the base (1) and located above the long plate (45), a rectangular groove (41) is formed in the lower surface of the transverse plate (4), two symmetrically distributed sliding blocks (43) are slidably arranged in the groove (41), top plates (44) are respectively hinged between the lower surfaces of the two sliding blocks (43) and the long plate (45), two double-headed screws (42) with opposite threads are rotatably arranged in the groove (41), two sliding blocks (43) in the same groove (41) are respectively inserted into two ends of the double-headed screws (42), a rotating rod (47) is fixedly arranged at the same end of the double-headed screws (42), a second belt (49) is sleeved on one end of the same rotating rod (47), a sucking disc (46) is arranged on the lower surface of the long plate (45), and an anti-skid pad (52) is fixedly arranged on the lower surface of the base (1).
9. A die bonding jig according to claim 8, wherein one of said rotating bars (47) is fixedly mounted with a second wheel (48) adjacent to a second belt (49).
10. The chip bonding clamp according to claim 8, wherein limiting rods (5) are fixedly arranged at two ends of the upper surface of the fixing plate (31), limiting blocks (51) are fixedly arranged on the outer wall of the base (1) close to the limiting rods (5), and the top ends of the limiting rods (5) are movably inserted into the limiting blocks (51).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311045181.5A CN117059559B (en) | 2023-08-18 | 2023-08-18 | Chip bonding fixture |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311045181.5A CN117059559B (en) | 2023-08-18 | 2023-08-18 | Chip bonding fixture |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN117059559A true CN117059559A (en) | 2023-11-14 |
| CN117059559B CN117059559B (en) | 2024-02-02 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202311045181.5A Active CN117059559B (en) | 2023-08-18 | 2023-08-18 | Chip bonding fixture |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN117059559B (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN216597549U (en) * | 2021-11-10 | 2022-05-24 | 江苏耐普特电子科技有限公司 | Chip circuit board maintenance work platform convenient to it is fixed |
| CN217134347U (en) * | 2021-12-31 | 2022-08-05 | 深圳市深华世纪科技有限公司 | BGA chip plants anchor clamps for ball |
| CN218533584U (en) * | 2022-07-08 | 2023-02-28 | 徐州晓强轮毂科技有限公司 | Fixing mechanism for processing electric vehicle hub |
| CN218827045U (en) * | 2022-11-28 | 2023-04-07 | 无锡市华辰芯光半导体科技有限公司 | Stable laser chip etching anchor clamps of centre gripping |
-
2023
- 2023-08-18 CN CN202311045181.5A patent/CN117059559B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN216597549U (en) * | 2021-11-10 | 2022-05-24 | 江苏耐普特电子科技有限公司 | Chip circuit board maintenance work platform convenient to it is fixed |
| CN217134347U (en) * | 2021-12-31 | 2022-08-05 | 深圳市深华世纪科技有限公司 | BGA chip plants anchor clamps for ball |
| CN218533584U (en) * | 2022-07-08 | 2023-02-28 | 徐州晓强轮毂科技有限公司 | Fixing mechanism for processing electric vehicle hub |
| CN218827045U (en) * | 2022-11-28 | 2023-04-07 | 无锡市华辰芯光半导体科技有限公司 | Stable laser chip etching anchor clamps of centre gripping |
Also Published As
| Publication number | Publication date |
|---|---|
| CN117059559B (en) | 2024-02-02 |
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