CN117677733A - 用于沉积银分散层的银电解质 - Google Patents

用于沉积银分散层的银电解质 Download PDF

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Publication number
CN117677733A
CN117677733A CN202280051010.0A CN202280051010A CN117677733A CN 117677733 A CN117677733 A CN 117677733A CN 202280051010 A CN202280051010 A CN 202280051010A CN 117677733 A CN117677733 A CN 117677733A
Authority
CN
China
Prior art keywords
electrolyte
silver
graphite
amount
electrolyte according
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202280051010.0A
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English (en)
Chinese (zh)
Inventor
U·曼兹
A·彼得斯
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Umicore Galvanotechnik GmbH
Original Assignee
Umicore Galvanotechnik GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Umicore Galvanotechnik GmbH filed Critical Umicore Galvanotechnik GmbH
Publication of CN117677733A publication Critical patent/CN117677733A/zh
Pending legal-status Critical Current

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Classifications

    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00Electroplating: Baths therefor
    • C25D3/02Electroplating: Baths therefor from solutions
    • C25D3/46Electroplating: Baths therefor from solutions of silver
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00Electroplating characterised by the article coated
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00Electroplating characterised by the article coated
    • C25D7/06Wires; Strips; Foils
    • C25D7/0614Strips or foils

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
CN202280051010.0A 2021-07-21 2022-07-20 用于沉积银分散层的银电解质 Pending CN117677733A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE102021118820.2 2021-07-21
DE102021118820.2A DE102021118820A1 (de) 2021-07-21 2021-07-21 Silber-Elektrolyt
PCT/EP2022/070294 WO2023001868A1 (fr) 2021-07-21 2022-07-20 Électrolyte à base d'argent pour le dépôt de couches de dispersion d'argent

Publications (1)

Publication Number Publication Date
CN117677733A true CN117677733A (zh) 2024-03-08

Family

ID=82939917

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202280051010.0A Pending CN117677733A (zh) 2021-07-21 2022-07-20 用于沉积银分散层的银电解质

Country Status (5)

Country Link
EP (1) EP4146848B1 (fr)
KR (1) KR20240031423A (fr)
CN (1) CN117677733A (fr)
DE (1) DE102021118820A1 (fr)
WO (1) WO2023001868A1 (fr)

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1228887B (de) 1961-10-26 1966-11-17 Riedel & Co Verfahren zum galvanischen Abscheiden von Silber-Antimon- oder Silber-Wismut-Legierungen hoher Haerte
DE2543082C3 (de) 1975-09-26 1979-06-28 Siemens Ag, 1000 Berlin Und 8000 Muenchen Cyanidischer Silberelektrolyt und Verfahren zur galvanischen Abscheidung von Silber-Graphit-Dispersionsüberzügen und seine Anwendung
DE4010346A1 (de) 1990-03-28 1991-10-02 Siemens Ag Verfahren zum aufbringen von silber-graphit-dispersionsueberzuegen
CN1692182A (zh) * 2002-11-28 2005-11-02 新光电气工业株式会社 银电镀液
DE10346206A1 (de) 2003-10-06 2005-04-28 Bosch Gmbh Robert Kontaktoberflächen für elektrische Kontakte
DE102008030988B4 (de) 2008-06-27 2010-04-01 Siemens Aktiengesellschaft Bauteil mit einer Schicht, in die CNT (Carbon Nanotubes) eingebaut sind und Verfahren zu dessen Herstellung
DE102015102453A1 (de) 2015-02-20 2016-08-25 Heraeus Deutschland GmbH & Co. KG Bandförmiges Substrat zur Herstellung von Chipkartenmodulen, Chipkartenmodul, elektronische Einrichtung mit einem derartigen Chipkartenmodul und Verfahren zur Herstellung eines Substrates
CN105297095A (zh) 2015-12-14 2016-02-03 南昌航空大学 一种纯银层/银石墨复合层的功能性镀层及制备方法
DE102018005352A1 (de) 2018-07-05 2020-01-09 Dr.-Ing. Max Schlötter GmbH & Co KG Silberelektrolyt zur Abscheidung von Dispersions-Silberschichten und Kontaktoberflächen mit Dispersions-Silberschichten

Also Published As

Publication number Publication date
DE102021118820A1 (de) 2023-01-26
KR20240031423A (ko) 2024-03-07
EP4146848A1 (fr) 2023-03-15
WO2023001868A1 (fr) 2023-01-26
EP4146848B1 (fr) 2024-04-10

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