CN117677468A

CN117677468A - Cutting device and method for manufacturing cut product

Info

Publication number: CN117677468A
Application number: CN202280051271.2A
Authority: CN
Inventors: 坂本真二
Original assignee: Towa Corp
Current assignee: Towa Corp
Priority date: 2021-10-12
Filing date: 2022-06-03
Publication date: 2024-03-08
Also published as: WO2023062866A1; TW202315711A; KR20240027135A; TWI822312B; JP7121846B1; JP2023057627A

Abstract

The cutting device is configured to cut the object to be cut by a blade. The cutting device includes an imaging unit and a control unit. The imaging unit is configured to image a partial region of the trimming plate while moving relative to the trimming plate. The control unit is configured to: the imaging unit is controlled to sequentially image the plurality of first areas of the trimming plate, and based on the imaging result obtained by the imaging unit, it is determined whether or not a cutting line is present in each of the plurality of first areas. Two first regions adjacent to each other among the plurality of first regions are separated from each other by the second region. The control unit determines whether or not it is necessary to determine whether or not there is a cutting line in the second region based on whether or not there is a cutting line in each of the plurality of first regions.

Description

Cutting device and method for manufacturing cut product

Technical Field

The present invention relates to a cutting device and a method for manufacturing a cut product.

Background

Japanese patent laid-open publication No. 2017-168775 (patent document 1) discloses a cutting device. In this cutting device, for example, the spindle rotation speed at the time of trimming the cutting insert is different from the spindle rotation speed at the time of machining the workpiece. An alignment groove is formed in a trimming plate at a spindle rotation speed at the time of machining a workpiece in consideration of the influence of warpage of a cutting insert at the time of machining the workpiece. The alignment groove is used to perform alignment of the cutting insert (spindle). This eliminates the influence of positional deviation caused by warpage of the cutting insert when processing the workpiece, and therefore enables alignment of the cutting position to be performed with high accuracy (see patent document 1).

Patent document 1: japanese patent laid-open publication No. 2017-168775

In the cutting device disclosed in patent document 1, an alignment groove formed in a dressing plate (address board) is imaged by an imaging unit. However, a technique of detecting a trimmable area in a trimming plate is not disclosed in patent document 1.

Disclosure of Invention

The present invention has been made to solve the above-described problems, and an object of the present invention is to provide a cutting device capable of effectively detecting a trimmable area in a trimming plate and a method for manufacturing a cut product using the cutting device.

The cutting device according to one aspect of the present invention is configured to cut an object to be cut with a blade. The trimming of the blade is performed by using a trimming plate. The cutting device includes an imaging unit and a control unit. The imaging unit is configured to image a partial region of the dressing plate while moving relative to the dressing plate. The control unit is configured to: the imaging unit is controlled to sequentially image the plurality of first areas of the trimming plate, and based on the imaging result obtained by the imaging unit, whether or not a cutting line is present in each of the plurality of first areas is determined. Two first regions adjacent to each other among the plurality of first regions are separated from each other by the second region. The control unit determines whether or not it is necessary to determine whether or not a cutting line is present in the second region based on whether or not a cutting line is present in each of the plurality of first regions.

A method for producing a cut product according to another aspect of the present invention is a method for producing a cut product using the above-described cutting device, the method including: a step of trimming the blade in a region of the trimming plate where the control unit determines that the dicing line is not present; and cutting the object by the trimmed blade.

Effects of the invention

According to the present invention, a cutting device capable of effectively detecting a trimmable area in a trimming plate and a method of manufacturing a cut product using the cutting device can be provided.

Drawings

Fig. 1 is a plan view schematically showing a cutting device.

Fig. 2 is a view schematically showing a plane of the holding member.

Fig. 3 is a side view schematically showing the spindle portion.

Fig. 4 is a diagram schematically showing a hardware configuration of a computer.

Fig. 5 is a diagram schematically showing a plane of one example of a finishing plate used after finishing a plurality of times.

Fig. 6 is a diagram for explaining each detection region.

Fig. 7 is a schematic diagram of a software configuration for implementing automatic detection of unused areas.

Fig. 8 is a diagram schematically showing one example of a finishing plate in which no unused area exists.

Fig. 9 is a diagram schematically showing one example of a finishing plate having an unused area above.

Fig. 10 is a diagram schematically showing one example of a finishing plate in which an unused area exists in an area including more than half of the upper side.

Fig. 11 is a diagram schematically showing one example of a finishing plate in which an unused area exists below.

Fig. 12 is a diagram schematically showing one example of a finishing plate in which unused areas exist above and below, respectively.

Fig. 13 is a diagram schematically showing one example of a new finishing plate.

Fig. 14 is a flowchart showing a preparation procedure of trimming of the blade.

Fig. 15 is a flowchart showing the process performed in step S130 of fig. 14.

Fig. 16 is a flowchart showing the processing performed in step S220 of fig. 15.

Fig. 17 is a flowchart showing the processing performed in step S355 of fig. 16.

Description of the reference numerals

A cutting device 1, a substrate supply section 3, a positioning section 4, a rail section 4a, a cutting table 5, a holding member 5A1, a holding member main body section 5a2, a finishing board holding section 5B, a rotating mechanism 5c, a moving mechanism 5D first position confirmation camera 5D, a first cleaner 5e, a spindle section 6, a blade 6a, a second position confirmation camera 6B, a rotating shaft 6c, a first flange 6D, a second flange 6e, a fastening member 6F, a conveying section 7, a second cleaner 7a, a finishing board 8, a inspection table 11, a first optical inspection camera 12, a second optical inspection camera 13, a positioning section 14, a picking up section 15, a tray for 15a good product, a tray for 15B bad product, a 20 monitor, a 50 computer 51 acquisition section 52 judgment section, a 53 determination section, a 54 camera control section, a control section 55 spindle section and the like, a control section 56 monitor control section 70 control section 72CPU 74RAM, 76ROM, 80 storage section 81 control program 90 input/output I/F, 95 a receiving section A1D, a inspection module B1D, a inspection module D23D 1D, a inspection module D1D 32D 2, a inspection section D1D 2, a inspection section D3D 1D 32D 2, and a cutting line D1.

Detailed Description

Hereinafter, an embodiment (hereinafter also referred to as "the present embodiment") according to an aspect of the present invention will be described in detail with reference to the accompanying drawings. In addition, the same or corresponding portions in the drawings are denoted by the same reference numerals and the description thereof is not repeated. In addition, the drawings schematically depict the objects appropriately omitted or exaggerated for ease of understanding.

[1. Constitution ]

1-1. Integral Structure of cutting device

Fig. 1 is a plan view schematically showing a cutting device 1 according to the present embodiment. The cutting device 1 is configured to: the package substrate (object to be cut) is cut, and the package substrate is singulated into a plurality of electronic components (package members). In the package substrate, the substrate or the lead frame on which the semiconductor chip is mounted is sealed with a resin.

As an example of the package substrate, a BGA (Ball Grid Array) package substrate, an LGA (Land Grid Array) package substrate, a CSP (Chip Size Package ) package substrate, an LED (Light Emitting Diode ) package substrate, a QFN (Quad Flat No-lead) package substrate can be cited.

In this example, the package substrate P1 is used as a cutting object, and the package substrate P1 is singulated into a plurality of electronic components S1 by the cutting device 1. Hereinafter, the resin-sealed surface of the package substrate P1 is referred to as a molding surface, and the surface opposite to the molding surface is referred to as a ball/pin surface.

As shown in fig. 1, the cutting device 1 includes a cutting module A1 and an inspection storage module B1 as constituent elements. The cutting module A1 is configured to cut the package substrate P1 to manufacture a plurality of electronic components S1 (cut products). The inspection and storage module B1 is configured to inspect each of the plurality of manufactured electronic components S1 and then store the electronic components S1 in a tray. In the cutting device 1, each component is removable and replaceable with respect to other components.

The cutting module A1 mainly includes a substrate supply section 3, a positioning section 4, a cutting table 5, a spindle section 6, and a conveying section 7.

The substrate supply unit 3 pushes out the package substrates P1 one by one from the magazine M1 accommodating the plurality of package substrates P1, thereby supplying the package substrates P1 one by one to the positioning unit 4. At this time, the package substrate P1 is configured such that the ball/pin faces upward.

The positioning unit 4 positions the package substrate P1 pushed out from the substrate supply unit 3 by disposing the package substrate P1 on the rail portion 4 a. Then, the positioning unit 4 conveys the positioned package substrate P1 to the cutting table 5.

The cutting stage 5 holds the package substrate P to be cut. In this example, the cutting device 1 having a double-cutting-stage structure with two cutting stages 5 is illustrated. The cutting table 5 includes a holding member 5a, a rotating mechanism 5b, and a moving mechanism 5c.

Fig. 2 is a schematic diagram schematically showing a plane of the holding member 5 a. The holding member 5a holds the package substrate P1 by sucking the package substrate P1 conveyed by the positioning portion 4 from below.

As shown in fig. 2, the holding member 5a includes a holding member main body portion 5a1 and a finishing plate holding portion 5a2. The holding member main body portion 5a1 has a rectangular shape in a plan view, and is configured to suck the package substrate P1 from below. A trimming plate holding portion 5a2 is integrally formed on a side surface of the holding member main body portion 5a 1. The trimming plate holding portion 5a2 has a rectangular shape in plan view, and is configured to suck the trimming plate 8 from below.

The dressing plate 8 is used for dressing of the blade 6a (described later). Dressing refers to an operation of removing the binding material covering the abrasive grains and protruding the abrasive grains in the blade 6 a. That is, trimming refers to the sharpening of the blade 6a to eliminate clogging of the blade 6 a. Trimming of the blade 6a is performed by the blade 6a forming a cutting line on the trimming plate 8. For example, the package substrate P1 is cut by the trimmed blade 6 a. The trimming of the blade 6a will be described in detail later.

Referring again to fig. 1, the rotation mechanism 5b is capable of rotating the holding member 5a around the θ1 direction in the drawing. The moving mechanism 5c can move the holding member 5a along the Y axis in the drawing.

The spindle portion 6 cuts the package substrate P1 to singulate the package substrate P1 into a plurality of electronic components S1. In this example, a cutting device 1 of a double spindle structure having two spindle portions 6 is illustrated. The spindle portion 6 is movable along the X-axis and the Z-axis in the drawing. The cutting device 1 may have a single spindle structure having one spindle portion 6.

Fig. 3 is a side view schematically showing the spindle portion 6. As shown in fig. 3, the spindle portion 6 includes a blade 6a, a rotation shaft 6c, a first flange 6d, a second flange 6e, and a fastening member 6f.

The blade 6a cuts the package substrate P1 by rotating at a high speed, thereby singulating the package substrate P1 into a plurality of electronic components S1. The blade 6a is attached to the rotation shaft 6c in a state sandwiched by one flange (first flange) 6d and the other flange (second flange) 6 e. The first flange 6d and the second flange 6e are fixed to the rotation shaft 6c by a fastening member 6f such as a nut. The first flange 6d is also called an inner flange and the second flange 6e is also called an outer flange.

The spindle portion 6 is provided with a cutting water nozzle for spraying cutting water to the blade 6a rotating at a high speed, a cooling water nozzle for spraying cooling water, a cleaning water nozzle for spraying cleaning water for cleaning chips and the like (none of which is shown), and the like.

Referring again to fig. 1, after the package substrate P1 is suctioned by the cutting stage 5, the package substrate P1 is photographed by the first position confirmation camera 5d, and the position of the package substrate P1 is confirmed. The confirmation using the first position confirmation camera 5d is, for example, confirmation of the position of the mark provided on the package substrate P1. The mark shows, for example, a cutting position of the package substrate P1.

Then, the cutting table 5 moves toward the spindle portion 6 along the Y axis in the drawing. After the cutting stage 5 moves below the spindle 6, the package substrate P1 is cut by relatively moving the cutting stage 5 and the spindle 6. Then, the package substrate P1 is photographed by the second position confirmation camera 6b as necessary, thereby confirming the position of the package substrate P1 and the like. The confirmation using the second position confirmation camera 6b is, for example, confirmation of the cutting position and the cutting width of the package substrate P1. In addition, the second position confirmation camera 6b is used for trimming of the blade 6 a. As will be described in detail later.

After the completion of cutting the package substrate P1, the cutting stage 5 moves in a direction away from the centrifugal shaft portion 6 along the Y axis in the drawing in a state where the singulated electronic components S1 are adsorbed. During this movement, cleaning and drying of the upper surface (ball/pin surface) of the electronic component S1 are performed with the first cleaner 5 e.

The transport unit 7 suctions the electronic component S1 held by the cutting table 5 from above, and transports the electronic component S1 to the inspection table 11 of the inspection storage module B1. During this conveyance, the cleaning and drying of the lower surface (molded surface) of the electronic component S1 are performed by the second cleaner 7 a.

The inspection storage module B1 mainly includes an inspection stage 11, a first optical inspection camera 12, a second optical inspection camera 13, an arrangement portion 14, and an extraction portion 15. In addition, the first optical inspection camera 12 may be provided on the cutting module A1.

The inspection stage 11 holds the electronic component S1 for optical inspection of the electronic component S1. The inspection stage 11 is movable along the X-axis in the drawing. The inspection table 11 can be turned upside down. The inspection stage 11 is provided with a holding member for holding the electronic component S1 by sucking the electronic component S1.

The first optical inspection camera 12 and the second optical inspection camera 13 capture both sides (ball/socket side and molding side) of the electronic component S1. Various inspections of the electronic component S1 are performed based on the image data generated by the first optical inspection camera 12 and the second optical inspection camera 13. The first optical inspection camera 12 and the second optical inspection camera 13 are each disposed near the inspection stage 11 so as to capture an image of the upper side.

The first optical inspection camera 12 photographs the molding surface of the electronic component S1 conveyed to the inspection stage 11 by the conveying section 7. Then, the conveying unit 7 mounts the electronic component S1 on the holding member of the inspection stage 11. After the holding member adsorbs the electronic component S1, the inspection stage 11 is turned upside down. The inspection stage 11 moves upward of the second optical inspection camera 13, and the ball/socket surface of the electronic component S1 is photographed by the second optical inspection camera 13.

The inspected electronic component S1 is arranged in the arrangement unit 14. The arrangement portion 14 is movable along the Y axis in the figure. The inspection stage 11 disposes the inspected electronic component S1 in the disposing section 14.

The extracting unit 15 transfers the electronic component S1 placed in the placement unit 14 to a tray. The electronic component S1 is classified as "good" or "bad" based on the inspection results using the first optical inspection camera 12 and the second optical inspection camera 13. The extracting unit 15 transfers each electronic device S1 to the good tray 15a or the defective tray 15b based on the classification result. That is, the good product is stored in the good product tray 15a, and the defective product is stored in the defective product tray 15b. When the good tray 15a and the bad tray 15b are filled with the electronic component S1, they are replaced with new trays.

The cutting device 1 further comprises a computer 50 and a monitor 20. The monitor 20 is configured to display an image. The monitor 20 is constituted by a display device such as a liquid crystal monitor or an organic EL (Electro Luminescence: electroluminescence) monitor, for example.

The computer 50 controls operations of the respective components of the cutting module A1 and the inspection housing module B1, for example. For example, operations such as the substrate supply section 3, the positioning section 4, the cutting table 5, the spindle section 6, the conveying section 7, the inspection table 11, the first optical inspection camera 12, the second optical inspection camera 13, the arrangement section 14, the extraction section 15, and the monitor 20 are controlled by the computer 50.

<1-2. Hardware Structure of computer >

Fig. 4 is a diagram schematically showing a hardware configuration of the computer 50. As shown in fig. 4, the computer 50 includes an arithmetic unit 70, an input/output (interface) 90, and a storage unit 80, and the respective components are electrically connected via a bus.

The control section 70 includes a CPU (Central Processing Unit ) 72, a RAM (Random Access Memory, random access Memory) 74, a ROM (Read Only Memory) 76, and the like. The control unit 70 is configured to control each component in the computer 50 and each component in the cutting device 1 in response to the information processing.

The input/output I/F90 is configured to communicate with each component included in the cutting device 1 via a signal line. The I/F90 is used to transmit data from the computer 50 to each component in the cutting device 1 and to receive data transmitted from each component in the cutting device 1 to the computer 50. The receiving unit 95 is configured to receive an instruction from a user. The receiving section 95 includes, for example, a part or all of a touch panel, a keyboard, a mouse, and a microphone.

The storage unit 80 is an auxiliary storage device such as a hard disk drive or a solid state drive. The storage unit 80 is configured to store a control program 81, for example. Various operations in the cutting device 1 are realized by the control section 70 executing the control program 81. In the case where the control section 70 executes the control program 81, the control program 81 is expanded into the RAM 74. Accordingly, the control unit 70 controls the respective constituent elements by the CPU72 interpreting and executing the control program 81 developed in the RAM 74.

1-3 software composition related to automatic detection of trimmable areas

As described above, the trimming of the blade 6a is performed in the cutting device 1. In the dressing of the blade 6a, a new dressing plate 8 is not always used. For example, the finishing plate 8 that has been used after finishing a plurality of times is sometimes used in finishing.

Fig. 5 is a diagram schematically showing a plane of one example of the finishing plate 8 used after finishing a plurality of times. As shown in fig. 5, a plurality of cutting lines CL1 have been formed on the finishing plate 8. Each cutting line CL1 is a groove formed by cutting the dressing plate 8 by the blade 6a at the time of dressing. The trimming of the blade 6a needs to be performed in a region (hereinafter also referred to as "unused region") of the trimming plate 8 where the cutting line CL1 is not formed.

In order to perform trimming in the unused area, it is considered that the position of the cutting line CL1 in the trimming plate 8 is visually confirmed by an operator, who manually adjusts the relative position between the blade 6a and the trimming plate 8. However, this method requires a lot of labor and time.

In the cutting device 1, an unused area is automatically detected, and a start position of trimming in the trimming plate 8 is automatically determined based on the detection result. Therefore, according to the cutting device 1, it is not necessary for the operator to manually adjust the relative position between the blade 6a and the trimming plate 8, and thus the trimming of the blade 6a can be effectively performed.

In the cutting device 1, detection of an unused area is performed by using the second position confirmation camera 6b provided on the spindle portion 6. The second position confirmation camera 6b is configured to: a partial region of the dressing plate 8 is photographed while being moved relative to the dressing plate 8. In the cutting device 1, the positional information of the area (detection area) photographed by the second position confirmation camera 6b before the start of trimming in the trimming plate 8 is stored in advance in the storage section 80. In the cutting device 1, for example, the storage unit 80 stores position information of 13 detection areas. In addition, the number of detection areas is not limited thereto. In the cutting device 1, the unused area is detected based on the captured image of the second position confirmation camera 6 b.

Fig. 6 is a diagram for explaining each detection region. As shown in fig. 6, as the detection areas in the finishing plate 8, first detection areas D11 to D13 and second detection areas D21 to D25, D31 to D35 are provided. The positional information of each detection area is stored in the storage section 80.

The first detection areas D11-D13 and the second detection areas D21-D25, D31-D35 are respectively positioned linearly on the diagonal of the finishing plate 8. The first detection region D11 is a detection region located at the lower left in the drawing of the finishing plate 8. The first detection region D12 is a detection region located at the center in the drawing of the finishing plate 8. The first detection region D13 is a detection region located at the upper right in the drawing of the finishing plate 8. When the dressing plate 8 is held in the dressing plate holding portion 5a2, the left-right direction of the dressing plate 8 corresponds to the X-axis direction in fig. 1, and the up-down direction of the dressing plate 8 corresponds to the Y-axis direction in fig. 1. The up-down-left-right direction of the trimming plate 8 is common in this specification.

The first detection regions D11 and D12 adjacent to each other among the first detection regions D11 to D13 are separated from each other with the second detection regions D21 to D25 interposed therebetween. The first detection regions D12 and the first detection regions D13 adjacent to each other among the first detection regions D11 to D13 are separated from each other with the second detection regions D31 to D35 interposed therebetween. The detection regions are arranged so as not to overlap as much as possible. In this example, although the first detection region D12 overlaps with the second detection regions D25, D31, respectively, there is no overlap between the detection regions in other portions.

It is assumed that whether or not the cutting line CL1 is present in each of the detection areas (including the first detection area and the second detection area) sequentially from the detection area (the first detection area D11) at the lower left of the finishing plate 8 toward the detection area (the first detection area D13) at the upper right. If the presence or absence of the cutting line CL1 in each detection area is determined in this order, for example, in the case where the unused area exists only above the finishing plate 8, it takes a long time to detect the unused area.

First, a captured image related to each of the first detection areas D11 to D13 is acquired at the cutting device 1, and whether or not the cutting line CL1 is present in each of the first detection areas D11 to D13 is determined based on the captured image of the first detection area. Then, based on the presence or absence of the cutting line CL1 in each of the first detection regions D11 to D13, it is determined whether or not it is necessary to determine the presence or absence of the cutting line CL1 in the second detection regions D21 to D25, D31 to D35. Therefore, according to the cutting device 1, by first determining whether or not the cutting line CL1 is present in each of the plurality of first detection regions, it is possible to predict which region of the dressing plate 8 the unused region is present in, and it is possible to check in more detail the region where the possibility of the presence of the unused region is high, so that it is possible to efficiently detect the unused region. The following describes the software configuration for realizing such functions.

Fig. 7 is a diagram schematically showing a software configuration for realizing automatic detection of an unused area. Referring to fig. 7, for example, the control program 81 is executed in the computer 50 to realize the respective acquisition unit 51, determination unit 52, determination unit 53, camera control unit 54, control unit 55 such as spindle unit, and monitor control unit 56.

The acquisition unit 51 is configured to acquire, for example, the captured images of the first detection areas D11, D12, and D13 from the second position check camera 6 b. The determination unit 52 determines whether or not the cutting line CL1 is present in each of the first detection regions D11, D12, and D13 based on the captured image acquired by the acquisition unit 51.

When the cutting line CL1 exists in any one of the first detection areas D11, D12, and D13, the determination unit 52 further determines whether or not the direction (orientation) of the cutting line CL1 is correct. In the cutting device 1, the cutting line CL1 extending in the right-left direction of the trimming plate 8 is the cutting line CL1 extending in the correct direction. In the cutting device 1, since the first detection areas D11, D12, and D13 are respectively provided on the diagonal lines of the finishing plate 8, it can be determined whether the direction of the cutting line CL1 is correct.

It is assumed that the first detection areas D11, D12, and D13 are disposed below, at, and above the center of the finishing plate 8, respectively. In this case, for example, the cutting line CL1 extending in the up-down direction on the left side of the finishing plate 8 cannot be detected. In the cutting device 1, since the first detection areas D11, D12, and D13 are provided on the diagonal lines of the dressing plate 8, respectively, the cutting line CL1 extending in the up-down direction can be detected.

The determination unit 53 instructs the camera control unit 54, the control unit 55 such as the spindle unit, and the monitor control unit 56, respectively, based on the determination result of the determination unit 52. The camera control unit 54, the spindle portion and other control unit 55, and the monitor control unit 56 control the second position confirmation camera 6b, the spindle portion 6 and other and monitor 20, respectively, in accordance with the instructions. The determination by the determining unit 53 in response to the determination mode by the determining unit 52 will be described below.

Fig. 8 is a diagram schematically showing one example of the finishing plate 8 in which no unused area exists. As shown in fig. 8, in the finishing plate 8, cutting lines CL1 are formed in the first detection areas D11, D12, and D13, respectively. In this case, since the unused area does not exist in the finishing plate 8, the determination section 53 determines not to determine whether or not the dicing line CL1 exists in each second detection area. Then, the determining section 53 instructs the monitor control section 56 to display a message prompting replacement of the finishing plate 8 on the monitor 20.

Fig. 9 is a diagram schematically showing one example of the finishing plate 8 having an unused area above. As shown in fig. 9, in the finishing plate 8, the cutting lines CL1 are formed in the first detection regions D11 and D12, respectively, whereas the cutting lines CL1 are not formed in the first detection region D13. In this case, since the unused region exists above the finishing plate 8, the determination section 53 determines whether or not the cutting line CL1 is sequentially determined from the second detection region D31 toward the second detection region D35 (fig. 6).

That is, since it is determined that the dicing lines CL1 are present in the first detection regions D11 and D12 adjacent to each other, the determination section 53 determines whether or not the dicing lines CL1 are present in the second detection regions D21 to D25, and does not determine whether or not. Further, since it is determined that the dicing line CL1 is present in the first detection region D12 and it is determined that the dicing line CL1 is not present in the first detection region D13, the determination unit 53 determines whether or not the dicing line CL1 is present in the second detection regions D31 to D35 sandwiched between the first detection regions D12, D13 adjacent to each other.

Then, the determining unit 53 instructs the spindle portion or other control unit 55 to sequentially move the second position confirmation camera 6b relatively from the second detection region D31 toward the second detection region D35. For example, the control unit 55 such as a spindle unit controls the positions of the cutting table 5 and the spindle unit 6 according to the instruction. The determination section 53 also instructs the camera control section 54 to cause the second position confirmation camera 6b to sequentially capture images from the second detection area D31 to the second detection area D35.

For example, in the case where detection of unused areas is performed sequentially from the second detection area D31 toward the second detection area D35, when an unused area of a sufficient size is detected halfway, detection in the second detection area is ended halfway. Thus, the trimming of the blade 6a can be started earlier. In addition, an unused area of a sufficient size refers to an unused area of a size required for trimming of the blade 6a, for example. For example, in the case where the user can set the number of dicing lines CL1 to be formed in trimming, the size of the unused area required for forming the number of dicing lines CL1 may be the size of the unused area required for trimming.

Fig. 10 is a diagram schematically showing one example of the finishing plate 8 in which an unused area exists in an area including more than half of the upper side. As shown in fig. 10, in the finishing plate 8, the cutting line CL1 is formed in the first detection region D11, and the cutting line CL1 is not formed in each of the first detection regions D12 and D13. In this case, since the unused region exists in the region above the upper half of the finishing plate 8, the determination section 53 determines whether or not the cutting line CL1 is sequentially determined from the second detection region D21 toward the second detection region D25.

That is, since it is determined that the dicing line CL1 is not present in each of the first detection regions D12 and D13 adjacent to each other, the determination section 53 determines whether or not the dicing line CL1 is present in the second detection regions D31 to D35. Further, since it is determined that the dicing line CL1 is present in the first detection region D11 and it is determined that the dicing line CL1 is not present in the first detection region D12, the determination unit 53 determines whether or not the dicing line CL1 is present in the second detection regions D21 to D25 sandwiched between the first detection regions D11, D12 adjacent to each other.

Then, the determining unit 53 instructs the spindle portion or other control unit 55 to sequentially move the second position confirmation camera 6b relatively from the second detection region D21 toward the second detection region D25. For example, the control unit 55 such as a spindle unit controls the positions of the cutting table 5 and the spindle unit 6 according to the instruction. The determination section 53 also instructs the camera control section 54 to cause the second position confirmation camera 6b to sequentially capture images from the second detection area D21 toward the second detection area D25. For example, in the case where detection of unused areas is performed sequentially from the second detection area D21 toward the second detection area D25, when an unused area of a sufficient size is detected halfway, detection in the second detection area is ended halfway.

Fig. 11 is a diagram schematically showing one example of the finishing plate 8 in which an unused area exists below. As shown in fig. 11, in the finishing plate 8, the cutting line CL1 is not formed in the first detection region D11, and the cutting lines CL1 are formed in the first detection regions D12 and D13, respectively. In this case, since the unused region exists below the finishing plate 8, the determination section 53 determines whether or not the cutting line CL1 is sequentially determined from the second detection region D21 toward the second detection region D25.

That is, since it is determined that the dicing lines CL1 are present in the first detection regions D12 and D13 adjacent to each other, the determination section 53 determines whether or not the dicing lines CL1 are present in the second detection regions D31 to D35, and does not determine. Further, since it is determined that the dicing line CL1 is not present in the first detection region D11 and it is determined that the dicing line CL1 is present in the first detection region D12, the determination unit 53 determines whether or not the dicing line CL1 is present in the second detection regions D21 to D25 sandwiched between the first detection regions D11, D12 adjacent to each other.

Fig. 12 is a diagram schematically showing one example of the finishing plate 8 in which unused areas exist above and below, respectively. As shown in fig. 12, in the finishing plate 8, the dicing lines CL1 are not formed in the first detection regions D11 and D13, respectively, and the dicing lines CL1 are formed in the first detection region D12. In this case, since the unused areas exist above and below the finishing plate 8, respectively, the determination section 53 first determines whether or not the cutting line CL1 is sequentially determined from the second detection area D21 toward the second detection area D25.

Then, the determining unit 53 instructs the spindle portion or other control unit 55 to sequentially move the second position confirmation camera 6b relatively from the second detection region D21 toward the second detection region D25. For example, the control unit 55 such as a spindle unit controls the positions of the cutting table 5 and the spindle unit 6 according to the instruction. The determination section 53 also instructs the camera control section 54 to cause the second position confirmation camera 6b to sequentially capture images from the second detection area D21 toward the second detection area D25.

For example, in the case where detection of unused areas is performed sequentially from the second detection area D21 toward the second detection area D25, when an unused area of a sufficient size is detected halfway, detection in the second detection area is ended halfway. On the other hand, when an unused region of a sufficient size is not detected in the first detection region D11 and the second detection regions D21 to D25, the determination unit 53 determines whether or not the cutting line CL1 is sequentially determined from the second detection region D31 toward the second detection region D35.

Then, the determining unit 53 instructs the spindle portion or other control unit 55 to sequentially move the second position confirmation camera 6b relatively from the second detection region D31 toward the second detection region D35. For example, the control unit 55 such as a spindle unit controls the positions of the cutting table 5 and the spindle unit 6 according to the instruction. The determination section 53 also instructs the camera control section 54 to cause the second position confirmation camera 6b to sequentially capture images from the second detection area D31 toward the second detection area D35. For example, in the case where detection of unused areas is performed sequentially from the second detection area D31 toward the second detection area D35, when an unused area of a sufficient size is detected halfway, detection in the second detection area is ended halfway.

Fig. 13 is a diagram schematically showing one example of the new finishing plate 8. As shown in fig. 13, in the finishing plate 8, the cutting lines CL1 are not formed in the first detection regions D11 to D13, respectively. In this case, since the finishing plate 8 is new, the determination section 53 determines whether or not the cutting line CL1 is present in each second detection region, and does not make a determination. Then, the determining section 53 determines the start position of trimming of the blade 6a as the first detection area D11 of the trimming plate 8.

[2. Operation ]

Fig. 14 is a flowchart showing a preparation procedure of trimming of the blade 6 a. For example, after the number of cutting lines CL1 formed at the time of trimming is set by the user and an instruction to start trimming is issued by the user, the processing shown in this flowchart is executed by the control section 70.

Referring to fig. 14, the control section 70 controls the relative position of the second position confirmation camera 6b so that the second position confirmation camera 6b can take an image of the first detection region D11 (fig. 6) in the finishing plate 8 assembled on the finishing plate holding section 5a 2. For example, the control unit 70 controls the relative position of the second position confirmation camera 6b by controlling the positions of the cutting table 5 and the spindle 6. Then, the control unit 70 controls the second position confirmation camera 6b to capture the first detection area D11 (step S100).

The control section 70 controls the relative position of the second position confirmation camera 6b so that the second position confirmation camera 6b can take a picture of the first detection area D12. The control unit 70 controls the second position confirmation camera 6b to capture the first detection area D12 (step S110). The control section 70 controls the relative position of the second position confirmation camera 6b so that the second position confirmation camera 6b can take a picture of the first detection area D13. The control unit 70 controls the second position confirmation camera 6b to capture the first detection region D13 (step S120).

The control section 70 performs processing based on the imaging results of each of the first detection areas D11, D12, and D13 (step S130). The processing in step S130 is described in detail later. The control section 70 determines whether or not the start position of trimming (dressing) has been determined as a result of the processing in step S130 (step S140).

When it is determined that the trimming start position has been determined (yes in step S140), the control unit 70 controls the spindle portion 6 to start trimming from the determined start position (step S150). On the other hand, if it is determined that the trimming start position is not determined (no in step S140), the control unit 70 controls the monitor 20 to output a message (including a message prompting the user to adjust the direction of the trimming plate 8) prompting the user to replace the trimming plate 8 (step S160).

Fig. 15 is a flowchart showing the process performed in step S130 of fig. 14. Referring to fig. 15, the control section 70 determines whether the cut line CL1 is detected in any one of the first detection regions D11, D12, or D13 (step S200).

If it is determined that the dicing line CL1 is not detected in any of the first detection regions D11, D12, D13 (no in step S200), the process proceeds to step S220. On the other hand, if it is determined that the cutting line CL1 is detected in any of the first detection areas D11, D12, and D13 (yes in step S200), the control unit 70 confirms the photographed image of the camera 6b based on the second position, and determines whether or not the detected direction of the cutting line CL1 is correct (step S210).

If it is determined that the direction of the cutting line CL1 is correct (yes in step S210), the control unit 70 executes the trimming position determination process (step S220). The processing in step S220 is described in detail later. On the other hand, if it is determined that the direction of the cutting line CL1 is incorrect (no in step S210), the control unit 70 determines that a message prompting the user to adjust the direction of the trimming panel 8 is displayed on the monitor 20, and the process shown in the flowchart ends.

Fig. 16 is a flowchart showing the processing performed in step S220 of fig. 15. Referring to fig. 16, the control unit 70 determines whether or not the dicing line CL1 is formed in the first detection region D11 based on the captured image in the first detection region D11 (step S300).

If it is determined that the dicing line CL1 is formed in the first detection region D11 (yes in step S300), the control unit 70 determines whether or not the dicing line CL1 is formed in the first detection region D12 based on the captured image in the first detection region D12 (step S305). If it is determined that the dicing line CL1 is formed in the first detection region D12 (yes in step S305), the control unit 70 determines whether or not the dicing line CL1 is formed in the first detection region D13 based on the captured image in the first detection region D13 (step S310). If it is determined that the dicing line CL1 is formed in the first detection area D13 (yes in step S310), the control unit 70 determines that a message prompting the user to replace the finishing plate 8 is displayed on the monitor 20 (step S315).

If it is determined in step S310 that the dicing line CL1 is not formed in the first detection region D13 (no in step S310), the control unit 70 detects the dicing line CL1 from the second detection region D31 toward the second detection region D35 (fig. 6) (step S320). That is, the control section 70 detects the unused area from the second detection area D31 toward the second detection area D35. For example, the detection of the unused area ends when an unused area of a desired size is detected. When an unused area having a desired size is detected, the control section 70 determines a start position of trimming in the unused area (step S325).

If it is determined in step S305 that the dicing line CL1 is not formed in the first detection region D12 (no in step S305), the control unit 70 detects an unused region from the second detection region D21 toward the second detection region D25 (step S330). For example, the detection of the unused area ends when an unused area of a desired size is detected. If an unused area having a desired size is detected, the control unit 70 determines a trimming start position in the unused area (step S325).

If it is determined in step S300 that the dicing line CL1 is not formed in the first detection region D11 (no in step S300), the control unit 70 determines whether or not the dicing line CL1 is formed in the first detection region D12 (step S335). If it is determined that the dicing line CL1 is not formed in the first detection region D12 (no in step S335), the control unit 70 determines the first detection region D11 as the trimming start position (step S340).

If it is determined in step S335 that the dicing line CL1 is formed in the first detection region D12 (yes in step S335), the control unit 70 determines whether or not the dicing line CL1 is formed in the first detection region D13 (step S345). If it is determined that the dicing line CL1 is formed in the first detection region D13 (yes in step S345), the control unit 70 detects an unused region from the second detection region D21 toward the second detection region D25 (step S350). For example, the detection of the unused area ends when an unused area of a desired size is detected. When an unused area having a desired size is detected, the control section 70 determines a start position of trimming in the unused area (step S325).

If it is determined in step S345 that the dicing line CL1 is not formed in the first detection region D13 (no in step S345), the control unit 70 executes the detection process of the dicing line CL1 (step S355). That is, the control section 70 executes detection processing of the unused area.

Fig. 17 is a flowchart showing the processing performed in step S355 of fig. 16. Referring to fig. 17, the control unit 70 detects an unused area from the second detection area D21 toward the second detection area D25 (step S400). The control section 70 determines whether or not an unused area having a desired size is detected (step S410). When it is determined that an unused area having a desired size is detected (yes in step S410), the control unit 70 determines a start position of trimming in the unused area (step S420).

On the other hand, if it is determined in step S410 that the unused area of the desired size is not detected (no in step S410), the control unit 70 detects the unused area from the second detection area D31 toward the second detection area D35 (step S430). The control unit 70 determines whether or not an unused area of a desired size is detected (step S440). If it is determined that the unused area of the required size is detected (yes in step S440), the control unit 70 determines the start position of trimming in the unused area (step S420). On the other hand, if it is determined that the unused area of the required size is not detected (no in step S440), the control section 70 determines that a message prompting the user to replace the finishing plate 8 is displayed on the monitor 20, and ends the processing shown in the flowchart.

[3. Characteristics ]

As described above, in the cutting device 1 according to the present embodiment, the control section 70 controls the second position confirmation camera 6b to sequentially photograph the first detection regions D11, D12, and D13, and determines whether or not the cutting line CL1 is present in each of the first detection regions D11, D12, and D13 based on the result of photographing by the second position confirmation camera 6 b. Then, the control section 70 determines whether or not it is necessary to determine whether or not the cutting line CL1 is present in the second detection regions D21 to D25 and D31 to D35 based on the presence or absence of the cutting line CL1 in each of the first detection regions D11, D12 and D13. According to the cutting device 1, first, by determining whether or not the dicing line CL1 exists in each of the plurality of first detection regions, it is predicted at which position of the dressing plate 8 the unused region exists, and the region where the possibility of existence of the unused region is high is checked in more detail, so that the unused region can be effectively detected.

In addition, the cutting device 1 is one example of a "cutting device" according to the present invention. The blade 6a is an example of a "blade" in the present invention, and the package substrate P1 is an example of a "cutting object" in the present invention. The finishing plate 8 is one example of "finishing plate" in the present invention. The second position confirmation camera 6b is one example of the "image pickup section" in the present invention. The control section 70 is one example of a "control section" in the present invention. The first detection regions D11, D12, D13 are one example of "first region" in the present invention, respectively, and the second detection regions D21 to D25, D31 to D35 are one example of "second region" in the present invention, respectively. The monitor 20 is one example of a "display portion" in the present invention. The electronic component S1 is an example of "cut product" in the present invention.

[4 ] other embodiments ]

The idea of the above embodiment is not limited to the above-described embodiment. Next, examples of other embodiments to which the ideas of the above embodiments can be applied are described.

＜4-1＞

In the above embodiment, the respective positions of the cutting table 5 and the spindle portion 6 are controlled to control the relative position between the second position confirmation camera 6b and the finishing plate 8. However, the relative position between the second position confirmation camera 6b and the finishing plate 8 may also be controlled by controlling the position of any one of the cutoff table 5 and the spindle portion 6.

＜4-2＞

In addition, in the above embodiment, the finishing plate 8 is attached to the dedicated finishing plate holding part 5a2. However, the mounting position of the finishing plate 8 is not limited thereto. For example, in trimming the blade 6a, the trimming plate 8 may be attached to the holding member main body portion 5a1. Further, in this case, a dedicated mounting jig may be used to improve the positional accuracy of the finishing plate 8 in the holding member main body portion 5a1.

＜4-3＞

In the above embodiment, the detection of the unused area in the second detection areas D21 to D25 and D31 to D35 is terminated in response to the detection of the unused area of the desired size. However, the detection of the unused area in the second detection areas D21 to D25, D31 to D35 may be ended without responding to the detection of the unused area of the desired size. For example, in detecting the unused area in the second detection areas D21 to D25, the detection of the unused area may be performed in the whole of the second detection areas D21 to D25, not limited to whether or not the unused area of a desired size is detected. In addition, in detecting the unused area in the second detection areas D31 to D35, the detection of the unused area in the whole of the second detection areas D21 to D25 may be performed, not limited to whether or not the unused area of a desired size is detected.

＜4-4＞

In addition, if the dicing line CL1 is not detected in the first detection regions D11 and D13, but only the dicing line CL1 is detected in the first detection region D12 (fig. 12), it may be determined that an abnormality has occurred in the finishing plate 8. In this case, a message prompting the user to replace the finishing plate 8 may be displayed on the monitor 20, for example.

＜4-5＞

In addition, in the above-described embodiment, it is assumed that the number of cutting lines CL1 formed on the finishing plate 8 in finishing is set by the user. However, it is also not necessary to set the number of cutting lines CL1 formed on the finishing plate 8 in finishing by the user. For example, the number of cutting lines CL1 formed on the finishing plate 8 in the finishing may be automatically determined by the computer 50.

In addition, in the above-described embodiment, the cutting device 1 may further include a replacement mechanism that automatically replaces the finishing plate 8 held in the finishing plate holding portion 5a 2. In this case, for example, in step S160 of fig. 14, the control section 70 may send a control signal to the replacement mechanism so that the finishing plate 8 held in the finishing plate holding section 5a2 is replaced. In this way, the dressing plate 8 held by the dressing plate holding portion 5a2 is automatically replaced by the replacement mechanism.

The embodiments of the present invention have been described above by way of example. That is, the detailed description and drawings are disclosed for illustrative purposes. Therefore, the components described in the detailed description and the drawings may include components that are not necessary for solving the problem. Accordingly, these unnecessary components should not be directly regarded as necessary because they are described in the detailed description and drawings.

Moreover, the above-described embodiments are merely examples of the present invention in all respects. The above-described embodiments can be variously modified and changed within the scope of the present invention. That is, in carrying out the present invention, a specific structure may be appropriately adopted according to the embodiment.

Claims

1. A cutting device configured to cut an object to be cut by a blade,

the trimming of the blade is performed by using a trimming plate,

the cutting device includes:

an imaging unit configured to image a partial region of the trimming plate while moving relative to the trimming plate; and

a control unit configured to: controlling the image pickup section to sequentially pick up a plurality of first areas of the finishing plate, and determining whether or not a cutting line is present in each of the plurality of first areas based on the result of the image pickup by the image pickup section,

two first regions adjacent to each other among the plurality of first regions are separated from each other by a second region,

the control section determines whether or not it is necessary to determine whether or not there is a cutting line in the second region based on whether or not there is the cutting line in each of the plurality of first regions.

2. The cutoff device according to claim 1, wherein,

the control unit does not determine whether or not the cutting line is present in the second region when it is determined that the cutting line is present in each of the plurality of first regions.

3. The cutoff device according to claim 1 or 2, wherein,

the control unit does not determine whether or not the cutting line is present in the second region when it is determined that the cutting line is not present in each of the plurality of first regions.

4. A cutting device according to any one of claims 1 to 3, wherein,

the control unit does not determine whether or not the dicing line is present in the second region sandwiched between the two first regions adjacent to each other, when it is determined that the dicing line is present in each of the two first regions adjacent to each other.

5. The cutting device according to any one of claims 1 to 4, wherein,

the control unit does not determine whether or not the dicing line is present in the second region sandwiched between the two first regions adjacent to each other, when it is determined that the dicing line is not present in each of the two first regions adjacent to each other.

6. The cutting device according to any one of claims 1 to 5, wherein,

the control unit determines whether or not the cutting line is present in the second region sandwiched between the two first regions adjacent to each other, when it is determined that the cutting line is present in one of the two first regions adjacent to each other and the cutting line is not present in the other of the two first regions adjacent to each other.

7. The cutoff device according to claim 6, wherein,

ending the determination of whether the cutting line is present in the second region in response to detecting that no region of the prescribed size of the cutting line is present,

the prescribed size is a size required for trimming of the blade.

8. The cutting device according to any one of claims 1 to 7, wherein,

the trimming plate is rectangular in shape in plan view,

each of the plurality of first regions is located on a diagonal of the finishing plate.

9. The cutoff device according to claim 8, wherein,

the cutting device further includes a display portion configured to display an image,

the control section determines whether or not the direction of the cutting line in each of the plurality of first areas is correct, and controls the display section to display a message if it is determined that the direction is incorrect.

10. A method for producing a cut article using the cutting device according to any one of claims 1 to 9,

the method for manufacturing the cut product comprises the following steps:

a step of performing trimming of the blade in a region of the trimming plate where the control section determines that the cutting line is not present; and

and cutting the object by the trimmed blade.