CN117476445A - 一种soc膜层制备方法 - Google Patents

一种soc膜层制备方法 Download PDF

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CN117476445A
CN117476445A CN202311437991.5A CN202311437991A CN117476445A CN 117476445 A CN117476445 A CN 117476445A CN 202311437991 A CN202311437991 A CN 202311437991A CN 117476445 A CN117476445 A CN 117476445A
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CN117476445B (zh
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段轶飞
张鉴伟
王云
余镭
李铮
陈维恕
何丹丹
黄师侨
陈梓铭
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Quatec Guangzhou New Materials Co ltd
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H01L21/033Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising inorganic layers
    • H01L21/0332Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising inorganic layers characterised by their composition, e.g. multilayer masks, materials
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B05SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05DPROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D1/00Processes for applying liquids or other fluent materials
    • B05D1/002Processes for applying liquids or other fluent materials the substrate being rotated
    • B05D1/005Spin coating
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B05SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05DPROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D3/00Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
    • B05D3/02Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by baking
    • B05D3/0254After-treatment
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H01L21/033Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising inorganic layers
    • H01L21/0334Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising inorganic layers characterised by their size, orientation, disposition, behaviour, shape, in horizontal or vertical plane
    • H01L21/0337Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising inorganic layers characterised by their size, orientation, disposition, behaviour, shape, in horizontal or vertical plane characterised by the process involved to create the mask, e.g. lift-off masks, sidewalls, or to modify the mask, e.g. pre-treatment, post-treatment

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Abstract

本发明涉及SOC膜层制备方法,包括:S1、将浓盐酸和去离子水配置成稀酸盐;S2、将苯胺与稀盐酸混合,在室温和氮气环境下搅拌10‑60mi n,加入18%的甲醛溶液,在氮气环境下反应3h获得MDA溶液;S3、滴加氢氧化钾溶液使MDA析出沉淀获得MDA混合物粉末;S4、将MDA混合物粉末与马来酸酐混合,加入二甲基酰胺、对甲苯磺酸和聚烯化抑制剂,在氮气环境下搅拌5mi n,加入甲苯搅拌均匀;S5、将温度升至110℃‑130℃,反应12h,用分水管将蒸出的水分排出;S6、反应完毕后倒入去离子水中沉淀,待上层有机层清澈后过滤出下层水层中沉淀固体;S7、将过滤出的沉淀固体与环己酮配置成旋涂溶液;S8、在旋涂机上旋涂烘烤固化形成SOC膜层。本发明的SOC膜层制备方法步骤简单,操作安全。

Description

一种SOC膜层制备方法
技术领域
本发明属于半导体技术领域,具体涉及一种SOC膜层制备方法。
背景技术
SOC(旋涂碳)是用于芯片光刻的硬掩模材料,可应用于多重光刻技术。在刻蚀工艺中具有高选择比的性质,用它作为硬掩模材料来进行刻蚀可以在硅片上刻蚀出宽深比高达1:60及以上的缝。
目前SOC的制备方法使用原料多,步骤繁琐,并且在制备过程中,会有甲醛苯胺等有害物质大量挥发,对生产人员安全造成严重威胁。因此,研究一种生产工艺简单、安全的SOC制备工艺是行业亟需解决的问题。
发明内容
本发明的目的在于解决上述问题,提供一种SOC膜层制备方法。
为实现上述目的,本发明提供一种SOC膜层制备方法,
包括:
S1、将浓盐酸和去离子水配置成稀酸盐;
S2、将苯胺与稀盐酸混合,在室温和氮气环境下搅拌10-60min,加入18%的甲醛溶液,在氮气环境下反应3h获得MDA溶液;
S3、滴加氢氧化钾溶液使MDA析出沉淀,过滤沉淀,氮气环境下去除水分获得MDA混合物粉末;
S4、将MDA混合物粉末与马来酸酐混合,加入二甲基甲酰胺、对甲苯磺酸和聚烯化抑制剂,在氮气环境下搅拌5min,加入甲苯搅拌均匀;
S5、将温度升至110℃-130℃,反应12h,用分水管将蒸出的水分排出;
S6、反应完毕后倒入去离子水中沉淀,待上层有机层清澈后过滤出下层水层中沉淀固体;
S7、将过滤出的沉淀固体与环己酮配置成旋涂溶液;
S8、在旋涂机上旋涂烘烤固化形成SOC膜层。
优选地,所述MDA混合物包括4,4-MDA,2,2-MDA和2,4-MDA。
优选地,所述沉淀固体与所述环己酮的质量比为1:4。
优选地,所述S8中,烘干固化包括:
烘烤温度140℃-180℃烘烤40-120秒;
固化温度200℃-400℃烘烤时间60-120秒。
附图说明
图1示意性表示根据本发明获得的MDA混合的FT-I R图谱示图;
图2示意性表示根据本发明获得的SOC膜层的FT-I R图谱示图。
具体实施方式
为了更清楚地说明本发明实施方式或现有技术中的技术方案,下面将对实施方式中所需要使用的附图作简单地介绍。显而易见地,下面描述中的附图仅仅是本发明的一些实施方式,对于本领域普通技术人员而言,在不付出创造性劳动的前提下,还可以根据这些附图获得其他的附图。
下面结合附图和具体实施方式对本发明作详细地描述,实施方式不能在此一一赘述,但本发明的实施方式并不因此限定于以下实施方式。
本发明提供一种一种SOC制备方法,包括:S1、将浓盐酸和去离子水配置成稀酸盐,用于抑制甲醛和苯胺的胺基反应;S2、将苯胺与稀盐酸混合,在室温24℃和氮气环境下搅拌10-60min,加入18%的甲醛溶液,在氮气环境下反应3h获得MDA溶液;S3、滴加氢氧化钾溶液使MDA析出沉淀,过滤沉淀,在本实施方式中,利用布氏漏斗抽滤实现过滤沉淀,氮气环境下去除水分获得MDA混合物粉末;S4、将MDA混合物粉末与马来酸酐混合,加入二甲基甲酰胺、对甲苯磺酸和聚烯化抑制剂(例如:2,6-二叔丁基-对甲酚),在氮气环境下搅拌5min,加入甲苯搅拌均匀;S5、将温度升至110℃-130℃,反应12h,用分水管将蒸出的水分排出;S6、反应完毕后倒入去离子水中沉淀,待上层有机层清澈后过滤出下层水层中沉淀固体;S7、将过滤出的沉淀固体与环己酮配置成旋涂溶液;S8、在旋涂机上旋涂烘烤固化形成SOC膜层。如果不按上述条件的会出现产率下降或者MDA被氧化的问题。
根据本发明的一种实施方式,其中MDA混合物包括4,4-MDA,2,2-MDA和2,4-MDA,沉淀固体与所述环己酮的质量比为1:4。所述S8中,烘干固化包括:烘烤温度140℃-180℃烘烤40-120秒;固化温度200℃-400℃烘烤时间60-120秒。
本发明的SOC制备方法,获得MDA(二氨基二苯甲烷)混合物的方法温和,不会使甲醛苯胺等有害物质大量挥发,降低生产人员受到的安全威胁,同时本发明的方法步骤简单,使用的原料容易获得并且种类少。
以下给出具体实施例对本发明的SOC制备方法进行说明:
将20m l浓盐酸和180m l去离子水配置成稀盐酸,将25g苯胺与稀盐酸混合,在室温和氮气环境下搅拌30分钟,之后缓慢加入45g18%的甲醛溶液,氮气环境下反应3h后获得MDA溶液,之后再滴加氢氧化钾溶液使MDA析出沉淀,过滤沉淀,氮气环境下除去水分后获得MDA混合物。
取30gMDA混合物和20g马来酸酐混合,加入300ml二甲基甲酰胺、4g对甲苯磺酸、1g聚烯化抑制剂,氮气环境下搅拌5分钟,用分水管将蒸出的水分排出,反应完毕后倒入3L以上去离子水中沉淀,待上层有机层清澈后过滤出下层水层中沉淀的固体,低温除去水分和有机溶液后,与环己酮按照质量比1:4配置成溶液,在旋涂机上旋涂烘烤固化形成SOC膜层。其中烘烤分两步,先140℃-180℃烘烤40-120秒,再200℃-400℃烘烤时间60-120秒。
本发明的SOC制备方法,步骤简单,操作安全。
以上所述仅为本发明的一个实施方式而已,并不用于限制本发明,对于本领域的技术人员来说,本发明可以有各种更改和变化。凡在本发明的精神和原则之内,所作的任何修改、等同替换、改进等,均应包含在本发明的保护范围之内。

Claims (4)

1.一种SOC膜层制备方法,包括:
S1、将浓盐酸和去离子水配置成稀酸盐;
S2、将苯胺与稀盐酸混合,在室温和氮气环境下搅拌10-60min,加入18%的甲醛溶液,在氮气环境下反应3h获得MDA溶液;
S3、滴加氢氧化钾溶液使MDA析出沉淀,过滤沉淀,氮气环境下去除水分获得MDA混合物粉末;
S4、将MDA混合物粉末与马来酸酐混合,加入二甲基甲酰胺、对甲苯磺酸和聚烯化抑制剂,在氮气环境下搅拌5min,加入甲苯搅拌均匀;
S5、将温度升至110℃-130℃,反应12h,用分水管将蒸出的水分排出;
S6、反应完毕后倒入去离子水中沉淀,待上层有机层清澈后过滤出下层水层中沉淀固体;
S7、将过滤出的沉淀固体与环己酮配置成旋涂溶液;
S8、在旋涂机上旋涂烘烤固化形成SOC膜层。
2.根据权利要求1所述的SOC膜层制备方法,其特征在于,所述MDA混合物包括4,4-MDA,2,2-MDA和2,4-MDA。
3.根据权利要求1所述的SOC膜层制备方法,其特征在于,所述沉淀固体与所述环己酮的质量比为1:4。
4.根据权利要求1所述的SOC膜层制备方法,其特征在于,所述S8中,烘干固化包括:
烘烤温度140℃-180℃烘烤40-120秒;
固化温度200℃-400℃烘烤时间60-120秒。
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Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101007767A (zh) * 2007-01-30 2007-08-01 浙江大学 4,4'-二氨基二苯甲烷的直接制备方法
US20130040060A1 (en) * 2011-08-12 2013-02-14 Air Products And Chemicals, Inc. Liquid Methylenedianiline Compositions
CN106986777A (zh) * 2017-05-15 2017-07-28 江苏清泉化学股份有限公司 利用微反应器制备4,4’‑二氨基二苯甲烷衍生物的方法
CN110499023A (zh) * 2019-08-16 2019-11-26 王芳 一种高强度的MoS2-聚酰亚胺-氰酸酯复合隔热材料及其制法

Patent Citations (4)

* Cited by examiner, † Cited by third party
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CN101007767A (zh) * 2007-01-30 2007-08-01 浙江大学 4,4'-二氨基二苯甲烷的直接制备方法
US20130040060A1 (en) * 2011-08-12 2013-02-14 Air Products And Chemicals, Inc. Liquid Methylenedianiline Compositions
CN106986777A (zh) * 2017-05-15 2017-07-28 江苏清泉化学股份有限公司 利用微反应器制备4,4’‑二氨基二苯甲烷衍生物的方法
CN110499023A (zh) * 2019-08-16 2019-11-26 王芳 一种高强度的MoS2-聚酰亚胺-氰酸酯复合隔热材料及其制法

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