CN117222782A - 电接点材料以及使用其的接点、端子及连接器 - Google Patents
电接点材料以及使用其的接点、端子及连接器 Download PDFInfo
- Publication number
- CN117222782A CN117222782A CN202380011159.0A CN202380011159A CN117222782A CN 117222782 A CN117222782 A CN 117222782A CN 202380011159 A CN202380011159 A CN 202380011159A CN 117222782 A CN117222782 A CN 117222782A
- Authority
- CN
- China
- Prior art keywords
- silver
- containing layer
- electrical contact
- contact material
- layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C5/00—Alloys based on noble metals
- C22C5/06—Alloys based on silver
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
- C23C28/02—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings only including layers of metallic material
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
- C23C28/02—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings only including layers of metallic material
- C23C28/021—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings only including layers of metallic material including at least one metal alloy layer
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
- C23C28/02—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings only including layers of metallic material
- C23C28/023—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings only including layers of metallic material only coatings of metal elements only
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C30/00—Coating with metallic material characterised only by the composition of the metallic material, i.e. not characterised by the coating process
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/10—Electroplating with more than one layer of the same or of different metals
- C25D5/12—Electroplating with more than one layer of the same or of different metals at least one layer being of nickel or chromium
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/48—After-treatment of electroplated surfaces
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/48—After-treatment of electroplated surfaces
- C25D5/50—After-treatment of electroplated surfaces by heat-treatment
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/02—Contact members
- H01R13/03—Contact members characterised by the material, e.g. plating, or coating materials
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Mechanical Engineering (AREA)
- Electrochemistry (AREA)
- Contacts (AREA)
- Electroplating Methods And Accessories (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2022-055027 | 2022-03-30 | ||
| JP2022055027 | 2022-03-30 | ||
| PCT/JP2023/009299 WO2023189418A1 (ja) | 2022-03-30 | 2023-03-10 | 電気接点材料、ならびにこれを用いた接点、端子およびコネクタ |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN117222782A true CN117222782A (zh) | 2023-12-12 |
Family
ID=88200786
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202380011159.0A Pending CN117222782A (zh) | 2022-03-30 | 2023-03-10 | 电接点材料以及使用其的接点、端子及连接器 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US12542222B2 (https=) |
| EP (1) | EP4502246A4 (https=) |
| JP (1) | JPWO2023189418A1 (https=) |
| CN (1) | CN117222782A (https=) |
| WO (1) | WO2023189418A1 (https=) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP4502247A4 (en) * | 2022-03-30 | 2026-01-14 | Furukawa Electric Co Ltd | ELECTRICAL CONTACT MATERIAL, AND CONTACT, TERMINAL AND CONNECTOR USING IT |
Family Cites Families (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4920127B1 (https=) * | 1970-06-26 | 1974-05-22 | ||
| JPS545771B2 (https=) * | 1974-02-28 | 1979-03-20 | ||
| JPS524436A (en) * | 1975-06-30 | 1977-01-13 | Nagayasu Kichisuke | Method of producing metal material for plating |
| JPS6372895A (ja) * | 1986-09-17 | 1988-04-02 | Nippon Mining Co Ltd | 電子・電気機器用部品の製造方法 |
| FR2639466B1 (fr) * | 1988-11-22 | 1991-02-15 | Telemecanique | Procede de preparation d'un materiau de contact electrique et procede de fabrication d'un element de contact incorporant un tel materiau |
| JP2915623B2 (ja) * | 1991-06-25 | 1999-07-05 | 古河電気工業株式会社 | 電気接点材料とその製造方法 |
| JP2008169408A (ja) | 2007-01-09 | 2008-07-24 | Auto Network Gijutsu Kenkyusho:Kk | コネクタ用銀めっき端子 |
| JP5387742B2 (ja) * | 2012-04-06 | 2014-01-15 | 株式会社オートネットワーク技術研究所 | めっき部材、コネクタ用めっき端子、めっき部材の製造方法、及びコネクタ用めっき端子の製造方法 |
| JP6085536B2 (ja) * | 2013-08-05 | 2017-02-22 | 株式会社Shカッパープロダクツ | 銅条、めっき付銅条、リードフレーム及びledモジュール |
| JP6079508B2 (ja) * | 2013-08-29 | 2017-02-15 | 株式会社オートネットワーク技術研究所 | めっき部材、コネクタ用めっき端子、めっき部材の製造方法、およびコネクタ用めっき端子の製造方法 |
| JP6611602B2 (ja) | 2015-01-30 | 2019-11-27 | Dowaメタルテック株式会社 | 銀めっき材およびその製造方法 |
| JP6601276B2 (ja) * | 2016-03-08 | 2019-11-06 | 株式会社オートネットワーク技術研究所 | 電気接点およびコネクタ端子対 |
| JP7044227B2 (ja) * | 2018-08-17 | 2022-03-30 | 信越理研シルコート工場株式会社 | 圧延材 |
| JP2020041210A (ja) * | 2018-09-07 | 2020-03-19 | 信越理研シルコート工場株式会社 | 高耐久性銀めっきフープ材 |
| JP2021017646A (ja) * | 2019-07-17 | 2021-02-15 | 信越理研シルコート工場株式会社 | 圧延材 |
-
2023
- 2023-03-10 CN CN202380011159.0A patent/CN117222782A/zh active Pending
- 2023-03-10 JP JP2023537268A patent/JPWO2023189418A1/ja active Pending
- 2023-03-10 US US18/579,877 patent/US12542222B2/en active Active
- 2023-03-10 WO PCT/JP2023/009299 patent/WO2023189418A1/ja not_active Ceased
- 2023-03-10 EP EP23779442.5A patent/EP4502246A4/en active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| US20240321474A1 (en) | 2024-09-26 |
| US12542222B2 (en) | 2026-02-03 |
| WO2023189418A1 (ja) | 2023-10-05 |
| EP4502246A4 (en) | 2026-01-07 |
| JPWO2023189418A1 (https=) | 2023-10-05 |
| EP4502246A1 (en) | 2025-02-05 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination |