CN117063065A - 诊断装置、半导体制造装置系统、半导体装置制造系统以及诊断方法 - Google Patents

诊断装置、半导体制造装置系统、半导体装置制造系统以及诊断方法 Download PDF

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Publication number
CN117063065A
CN117063065A CN202280005629.8A CN202280005629A CN117063065A CN 117063065 A CN117063065 A CN 117063065A CN 202280005629 A CN202280005629 A CN 202280005629A CN 117063065 A CN117063065 A CN 117063065A
Authority
CN
China
Prior art keywords
temperature data
change
diagnostic device
sample
film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202280005629.8A
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English (en)
Chinese (zh)
Inventor
赵普社
朝仓凉次
角屋诚浩
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi High Tech Corp
Original Assignee
Hitachi High Technologies Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi High Technologies Corp filed Critical Hitachi High Technologies Corp
Publication of CN117063065A publication Critical patent/CN117063065A/zh
Pending legal-status Critical Current

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Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N25/00—Investigating or analyzing materials by the use of thermal means
    • G01N25/72—Investigating presence of flaws
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0602—Temperature monitoring
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N25/00—Investigating or analyzing materials by the use of thermal means
    • G01N25/18—Investigating or analyzing materials by the use of thermal means by investigating thermal conductivity
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0604—Process monitoring, e.g. flow or thickness monitoring
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0616—Monitoring of warpages, curvatures, damages, defects or the like
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/72—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using electrostatic chucks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/72—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using electrostatic chucks
    • H10P72/722—Details of electrostatic chucks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32917—Plasma diagnostics
    • H01J37/32935—Monitoring and controlling tubes by information coming from the object and/or discharge

Landscapes

  • General Health & Medical Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Immunology (AREA)
  • Physics & Mathematics (AREA)
  • Pathology (AREA)
  • Drying Of Semiconductors (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Investigating Or Analyzing Materials Using Thermal Means (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
CN202280005629.8A 2022-03-14 2022-03-14 诊断装置、半导体制造装置系统、半导体装置制造系统以及诊断方法 Pending CN117063065A (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2022/011254 WO2023175661A1 (ja) 2022-03-14 2022-03-14 診断装置、半導体製造装置システム、半導体装置製造システムおよび診断方法

Publications (1)

Publication Number Publication Date
CN117063065A true CN117063065A (zh) 2023-11-14

Family

ID=88022812

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202280005629.8A Pending CN117063065A (zh) 2022-03-14 2022-03-14 诊断装置、半导体制造装置系统、半导体装置制造系统以及诊断方法

Country Status (6)

Country Link
US (1) US20240321608A1 (https=)
JP (3) JP7471513B2 (https=)
KR (1) KR20230135558A (https=)
CN (1) CN117063065A (https=)
TW (2) TWI849766B (https=)
WO (1) WO2023175661A1 (https=)

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08141861A (ja) * 1994-11-14 1996-06-04 Fujitsu Ltd 真空チャック装置
JP3556549B2 (ja) * 1999-12-10 2004-08-18 シャープ株式会社 シート抵抗測定器および電子部品製造方法
JP3897344B2 (ja) * 2002-08-23 2007-03-22 株式会社オングストロームテクノロジーズ チャッキング状態検出方法及びプラズマ処理装置
US8022718B2 (en) * 2008-02-29 2011-09-20 Lam Research Corporation Method for inspecting electrostatic chucks with Kelvin probe analysis
WO2010026893A1 (ja) * 2008-09-04 2010-03-11 株式会社クリエイティブ テクノロジー 静電チャック装置及び基板の吸着状態判別方法
CN103779165B (zh) * 2012-10-19 2016-08-31 北京北方微电子基地设备工艺研究中心有限责任公司 等离子体设备及工件位置检测方法
JP6222656B2 (ja) * 2013-07-25 2017-11-01 株式会社クリエイティブテクノロジー センサ一体型吸着チャック及び処理装置
US9831111B2 (en) * 2014-02-12 2017-11-28 Applied Materials, Inc. Apparatus and method for measurement of the thermal performance of an electrostatic wafer chuck
JP6418791B2 (ja) 2014-05-29 2018-11-07 株式会社日立製作所 冷却装置の異常検知システム
KR101809654B1 (ko) * 2014-06-03 2017-12-18 에이피시스템 주식회사 기판 처리 장치 및 그 작동 방법
JP6316703B2 (ja) * 2014-08-19 2018-04-25 東京エレクトロン株式会社 基板処理装置および基板処理方法
KR102581356B1 (ko) * 2016-08-30 2023-09-21 삼성전자주식회사 기판 처리 장치의 이상 진단 방법 및 이를 수행하기 위한 장치
SG11202001500VA (en) * 2017-08-22 2020-03-30 Shinkawa Kk Mounting apparatus and temperature measurement method
CN111699544B (zh) * 2018-02-14 2024-03-22 东京毅力科创株式会社 基板处理装置、基板处理方法以及存储介质
JP7137943B2 (ja) * 2018-03-20 2022-09-15 株式会社日立ハイテク 探索装置、探索方法及びプラズマ処理装置
JPWO2021255784A1 (https=) * 2020-06-15 2021-12-23

Also Published As

Publication number Publication date
KR20230135558A (ko) 2023-09-25
WO2023175661A1 (ja) 2023-09-21
TW202401001A (zh) 2024-01-01
TW202436868A (zh) 2024-09-16
JP2024088752A (ja) 2024-07-02
TWI849766B (zh) 2024-07-21
US20240321608A1 (en) 2024-09-26
JPWO2023175661A1 (https=) 2023-09-21
JP2025126302A (ja) 2025-08-28
JP7471513B2 (ja) 2024-04-19
JP7796794B2 (ja) 2026-01-09

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