TWI849766B - 診斷裝置、半導體製造裝置系統、半導體裝置製造系統及診斷方法 - Google Patents

診斷裝置、半導體製造裝置系統、半導體裝置製造系統及診斷方法 Download PDF

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Publication number
TWI849766B
TWI849766B TW112106470A TW112106470A TWI849766B TW I849766 B TWI849766 B TW I849766B TW 112106470 A TW112106470 A TW 112106470A TW 112106470 A TW112106470 A TW 112106470A TW I849766 B TWI849766 B TW I849766B
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TW
Taiwan
Prior art keywords
temperature data
change
sample
semiconductor manufacturing
data
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TW112106470A
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English (en)
Chinese (zh)
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TW202401001A (zh
Inventor
趙普社
朝倉涼次
角屋誠浩
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日商日立全球先端科技股份有限公司
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Publication of TW202401001A publication Critical patent/TW202401001A/zh
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0602—Temperature monitoring
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N25/00—Investigating or analyzing materials by the use of thermal means
    • G01N25/18—Investigating or analyzing materials by the use of thermal means by investigating thermal conductivity
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N25/00—Investigating or analyzing materials by the use of thermal means
    • G01N25/72—Investigating presence of flaws
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0604—Process monitoring, e.g. flow or thickness monitoring
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0616—Monitoring of warpages, curvatures, damages, defects or the like
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/72—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using electrostatic chucks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/72—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using electrostatic chucks
    • H10P72/722—Details of electrostatic chucks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32917—Plasma diagnostics
    • H01J37/32935—Monitoring and controlling tubes by information coming from the object and/or discharge

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  • General Health & Medical Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Immunology (AREA)
  • Physics & Mathematics (AREA)
  • Pathology (AREA)
  • Drying Of Semiconductors (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Investigating Or Analyzing Materials Using Thermal Means (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
TW112106470A 2022-03-14 2023-02-22 診斷裝置、半導體製造裝置系統、半導體裝置製造系統及診斷方法 TWI849766B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
PCT/JP2022/011254 WO2023175661A1 (ja) 2022-03-14 2022-03-14 診断装置、半導体製造装置システム、半導体装置製造システムおよび診断方法
WOPCT/JP2022/011254 2022-03-14

Publications (2)

Publication Number Publication Date
TW202401001A TW202401001A (zh) 2024-01-01
TWI849766B true TWI849766B (zh) 2024-07-21

Family

ID=88022812

Family Applications (2)

Application Number Title Priority Date Filing Date
TW112106470A TWI849766B (zh) 2022-03-14 2023-02-22 診斷裝置、半導體製造裝置系統、半導體裝置製造系統及診斷方法
TW113119789A TW202436868A (zh) 2022-03-14 2023-02-22 診斷裝置、半導體製造裝置系統、半導體裝置製造系統及診斷方法

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TW113119789A TW202436868A (zh) 2022-03-14 2023-02-22 診斷裝置、半導體製造裝置系統、半導體裝置製造系統及診斷方法

Country Status (6)

Country Link
US (1) US20240321608A1 (https=)
JP (3) JP7471513B2 (https=)
KR (1) KR20230135558A (https=)
CN (1) CN117063065A (https=)
TW (2) TWI849766B (https=)
WO (1) WO2023175661A1 (https=)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW493061B (en) * 1999-12-10 2002-07-01 Sharp Kk Sheet resistance meter and method of manufacturing electronic components
US20100045316A1 (en) * 2008-02-29 2010-02-25 Lam Research Corporation Method for inspecting electrostatic chucks with kelvin probe analysis
US20180047607A1 (en) * 2014-02-12 2018-02-15 Applied Materials, Inc. Apparatus and method for measurement of the thermal performance of an electrostatic wafer chuck
WO2021255784A1 (ja) * 2020-06-15 2021-12-23 株式会社日立ハイテク 装置診断装置、装置診断方法、プラズマ処理装置および半導体装置製造システム

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08141861A (ja) * 1994-11-14 1996-06-04 Fujitsu Ltd 真空チャック装置
JP3897344B2 (ja) * 2002-08-23 2007-03-22 株式会社オングストロームテクノロジーズ チャッキング状態検出方法及びプラズマ処理装置
WO2010026893A1 (ja) * 2008-09-04 2010-03-11 株式会社クリエイティブ テクノロジー 静電チャック装置及び基板の吸着状態判別方法
CN103779165B (zh) * 2012-10-19 2016-08-31 北京北方微电子基地设备工艺研究中心有限责任公司 等离子体设备及工件位置检测方法
JP6222656B2 (ja) * 2013-07-25 2017-11-01 株式会社クリエイティブテクノロジー センサ一体型吸着チャック及び処理装置
JP6418791B2 (ja) 2014-05-29 2018-11-07 株式会社日立製作所 冷却装置の異常検知システム
KR101809654B1 (ko) * 2014-06-03 2017-12-18 에이피시스템 주식회사 기판 처리 장치 및 그 작동 방법
JP6316703B2 (ja) * 2014-08-19 2018-04-25 東京エレクトロン株式会社 基板処理装置および基板処理方法
KR102581356B1 (ko) * 2016-08-30 2023-09-21 삼성전자주식회사 기판 처리 장치의 이상 진단 방법 및 이를 수행하기 위한 장치
SG11202001500VA (en) * 2017-08-22 2020-03-30 Shinkawa Kk Mounting apparatus and temperature measurement method
CN111699544B (zh) * 2018-02-14 2024-03-22 东京毅力科创株式会社 基板处理装置、基板处理方法以及存储介质
JP7137943B2 (ja) * 2018-03-20 2022-09-15 株式会社日立ハイテク 探索装置、探索方法及びプラズマ処理装置

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW493061B (en) * 1999-12-10 2002-07-01 Sharp Kk Sheet resistance meter and method of manufacturing electronic components
US20100045316A1 (en) * 2008-02-29 2010-02-25 Lam Research Corporation Method for inspecting electrostatic chucks with kelvin probe analysis
US20180047607A1 (en) * 2014-02-12 2018-02-15 Applied Materials, Inc. Apparatus and method for measurement of the thermal performance of an electrostatic wafer chuck
WO2021255784A1 (ja) * 2020-06-15 2021-12-23 株式会社日立ハイテク 装置診断装置、装置診断方法、プラズマ処理装置および半導体装置製造システム

Also Published As

Publication number Publication date
KR20230135558A (ko) 2023-09-25
CN117063065A (zh) 2023-11-14
WO2023175661A1 (ja) 2023-09-21
TW202401001A (zh) 2024-01-01
TW202436868A (zh) 2024-09-16
JP2024088752A (ja) 2024-07-02
US20240321608A1 (en) 2024-09-26
JPWO2023175661A1 (https=) 2023-09-21
JP2025126302A (ja) 2025-08-28
JP7471513B2 (ja) 2024-04-19
JP7796794B2 (ja) 2026-01-09

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