JPWO2023175661A1 - - Google Patents

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Publication number
JPWO2023175661A1
JPWO2023175661A1 JP2023512208A JP2023512208A JPWO2023175661A1 JP WO2023175661 A1 JPWO2023175661 A1 JP WO2023175661A1 JP 2023512208 A JP2023512208 A JP 2023512208A JP 2023512208 A JP2023512208 A JP 2023512208A JP WO2023175661 A1 JPWO2023175661 A1 JP WO2023175661A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2023512208A
Other languages
Japanese (ja)
Other versions
JP7471513B2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2023175661A1 publication Critical patent/JPWO2023175661A1/ja
Priority to JP2024062447A priority Critical patent/JP7796794B2/ja
Application granted granted Critical
Publication of JP7471513B2 publication Critical patent/JP7471513B2/ja
Priority to JP2025108667A priority patent/JP2025126302A/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N25/00—Investigating or analyzing materials by the use of thermal means
    • G01N25/72—Investigating presence of flaws
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0602—Temperature monitoring
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N25/00—Investigating or analyzing materials by the use of thermal means
    • G01N25/18—Investigating or analyzing materials by the use of thermal means by investigating thermal conductivity
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0604—Process monitoring, e.g. flow or thickness monitoring
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0616—Monitoring of warpages, curvatures, damages, defects or the like
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/72—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using electrostatic chucks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/72—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using electrostatic chucks
    • H10P72/722—Details of electrostatic chucks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32917—Plasma diagnostics
    • H01J37/32935—Monitoring and controlling tubes by information coming from the object and/or discharge

Landscapes

  • General Health & Medical Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Immunology (AREA)
  • Physics & Mathematics (AREA)
  • Pathology (AREA)
  • Drying Of Semiconductors (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Investigating Or Analyzing Materials Using Thermal Means (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
JP2023512208A 2022-03-14 2022-03-14 診断装置、半導体製造装置システム、半導体装置製造システムおよび診断方法 Active JP7471513B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2024062447A JP7796794B2 (ja) 2022-03-14 2024-04-09 診断装置、半導体装置製造システムおよび診断方法
JP2025108667A JP2025126302A (ja) 2022-03-14 2025-06-27 診断装置、半導体製造装置システム、半導体装置製造システムおよび診断方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2022/011254 WO2023175661A1 (ja) 2022-03-14 2022-03-14 診断装置、半導体製造装置システム、半導体装置製造システムおよび診断方法

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2024062447A Division JP7796794B2 (ja) 2022-03-14 2024-04-09 診断装置、半導体装置製造システムおよび診断方法

Publications (2)

Publication Number Publication Date
JPWO2023175661A1 true JPWO2023175661A1 (https=) 2023-09-21
JP7471513B2 JP7471513B2 (ja) 2024-04-19

Family

ID=88022812

Family Applications (3)

Application Number Title Priority Date Filing Date
JP2023512208A Active JP7471513B2 (ja) 2022-03-14 2022-03-14 診断装置、半導体製造装置システム、半導体装置製造システムおよび診断方法
JP2024062447A Active JP7796794B2 (ja) 2022-03-14 2024-04-09 診断装置、半導体装置製造システムおよび診断方法
JP2025108667A Pending JP2025126302A (ja) 2022-03-14 2025-06-27 診断装置、半導体製造装置システム、半導体装置製造システムおよび診断方法

Family Applications After (2)

Application Number Title Priority Date Filing Date
JP2024062447A Active JP7796794B2 (ja) 2022-03-14 2024-04-09 診断装置、半導体装置製造システムおよび診断方法
JP2025108667A Pending JP2025126302A (ja) 2022-03-14 2025-06-27 診断装置、半導体製造装置システム、半導体装置製造システムおよび診断方法

Country Status (6)

Country Link
US (1) US20240321608A1 (https=)
JP (3) JP7471513B2 (https=)
KR (1) KR20230135558A (https=)
CN (1) CN117063065A (https=)
TW (2) TWI849766B (https=)
WO (1) WO2023175661A1 (https=)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20100045316A1 (en) * 2008-02-29 2010-02-25 Lam Research Corporation Method for inspecting electrostatic chucks with kelvin probe analysis
US20180047607A1 (en) * 2014-02-12 2018-02-15 Applied Materials, Inc. Apparatus and method for measurement of the thermal performance of an electrostatic wafer chuck
WO2021255784A1 (ja) * 2020-06-15 2021-12-23 株式会社日立ハイテク 装置診断装置、装置診断方法、プラズマ処理装置および半導体装置製造システム

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08141861A (ja) * 1994-11-14 1996-06-04 Fujitsu Ltd 真空チャック装置
JP3556549B2 (ja) * 1999-12-10 2004-08-18 シャープ株式会社 シート抵抗測定器および電子部品製造方法
JP3897344B2 (ja) * 2002-08-23 2007-03-22 株式会社オングストロームテクノロジーズ チャッキング状態検出方法及びプラズマ処理装置
WO2010026893A1 (ja) * 2008-09-04 2010-03-11 株式会社クリエイティブ テクノロジー 静電チャック装置及び基板の吸着状態判別方法
CN103779165B (zh) * 2012-10-19 2016-08-31 北京北方微电子基地设备工艺研究中心有限责任公司 等离子体设备及工件位置检测方法
JP6222656B2 (ja) * 2013-07-25 2017-11-01 株式会社クリエイティブテクノロジー センサ一体型吸着チャック及び処理装置
JP6418791B2 (ja) 2014-05-29 2018-11-07 株式会社日立製作所 冷却装置の異常検知システム
KR101809654B1 (ko) * 2014-06-03 2017-12-18 에이피시스템 주식회사 기판 처리 장치 및 그 작동 방법
JP6316703B2 (ja) * 2014-08-19 2018-04-25 東京エレクトロン株式会社 基板処理装置および基板処理方法
KR102581356B1 (ko) * 2016-08-30 2023-09-21 삼성전자주식회사 기판 처리 장치의 이상 진단 방법 및 이를 수행하기 위한 장치
SG11202001500VA (en) * 2017-08-22 2020-03-30 Shinkawa Kk Mounting apparatus and temperature measurement method
CN111699544B (zh) * 2018-02-14 2024-03-22 东京毅力科创株式会社 基板处理装置、基板处理方法以及存储介质
JP7137943B2 (ja) * 2018-03-20 2022-09-15 株式会社日立ハイテク 探索装置、探索方法及びプラズマ処理装置

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20100045316A1 (en) * 2008-02-29 2010-02-25 Lam Research Corporation Method for inspecting electrostatic chucks with kelvin probe analysis
US20180047607A1 (en) * 2014-02-12 2018-02-15 Applied Materials, Inc. Apparatus and method for measurement of the thermal performance of an electrostatic wafer chuck
WO2021255784A1 (ja) * 2020-06-15 2021-12-23 株式会社日立ハイテク 装置診断装置、装置診断方法、プラズマ処理装置および半導体装置製造システム

Also Published As

Publication number Publication date
KR20230135558A (ko) 2023-09-25
CN117063065A (zh) 2023-11-14
WO2023175661A1 (ja) 2023-09-21
TW202401001A (zh) 2024-01-01
TW202436868A (zh) 2024-09-16
JP2024088752A (ja) 2024-07-02
TWI849766B (zh) 2024-07-21
US20240321608A1 (en) 2024-09-26
JP2025126302A (ja) 2025-08-28
JP7471513B2 (ja) 2024-04-19
JP7796794B2 (ja) 2026-01-09

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