CN116981700A - 光固化性组合物及图案形成方法 - Google Patents
光固化性组合物及图案形成方法 Download PDFInfo
- Publication number
- CN116981700A CN116981700A CN202280021336.9A CN202280021336A CN116981700A CN 116981700 A CN116981700 A CN 116981700A CN 202280021336 A CN202280021336 A CN 202280021336A CN 116981700 A CN116981700 A CN 116981700A
- Authority
- CN
- China
- Prior art keywords
- component
- photocurable
- photocurable composition
- meth
- acrylate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F2/00—Processes of polymerisation
- C08F2/46—Polymerisation initiated by wave energy or particle radiation
- C08F2/48—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light
- C08F2/50—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light with sensitising agents
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F22/00—Homopolymers and copolymers of compounds having one or more unsaturated aliphatic radicals each having only one carbon-to-carbon double bond, and at least one being terminated by a carboxyl radical and containing at least one other carboxyl radical in the molecule; Salts, anhydrides, esters, amides, imides or nitriles thereof
- C08F22/10—Esters
- C08F22/12—Esters of phenols or saturated alcohols
- C08F22/24—Esters containing sulfur
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
- B29C59/005—Surface shaping of articles, e.g. embossing; Apparatus therefor characterised by the choice of material
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F2/00—Processes of polymerisation
- C08F2/44—Polymerisation in the presence of compounding ingredients, e.g. plasticisers, dyestuffs, fillers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F2/00—Processes of polymerisation
- C08F2/46—Polymerisation initiated by wave energy or particle radiation
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F2/00—Processes of polymerisation
- C08F2/46—Polymerisation initiated by wave energy or particle radiation
- C08F2/48—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/0002—Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/0047—Photosensitive materials characterised by additives for obtaining a metallic or ceramic pattern, e.g. by firing
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P76/00—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
- B29C59/02—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing
- B29C59/026—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing of layered or coated substantially flat surfaces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
- B29K2081/00—Use of polymers having sulfur, with or without nitrogen, oxygen or carbon only, in the main chain, as moulding material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
- B29K2105/00—Condition, form or state of moulded material or of the material to be shaped
- B29K2105/06—Condition, form or state of moulded material or of the material to be shaped containing reinforcements, fillers or inserts
- B29K2105/16—Fillers
- B29K2105/162—Nanoparticles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
- B29K2509/00—Use of inorganic materials not provided for in groups B29K2503/00 - B29K2507/00, as filler
- B29K2509/02—Ceramics
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/2237—Oxides; Hydroxides of metals of titanium
- C08K2003/2241—Titanium dioxide
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/2244—Oxides; Hydroxides of metals of zirconium
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/002—Physical properties
- C08K2201/003—Additives being defined by their diameter
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Ceramic Engineering (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Polymerisation Methods In General (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021-042612 | 2021-03-16 | ||
| JP2021042612 | 2021-03-16 | ||
| PCT/JP2022/009681 WO2022196408A1 (ja) | 2021-03-16 | 2022-03-07 | 光硬化性組成物及びパターン形成方法 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN116981700A true CN116981700A (zh) | 2023-10-31 |
Family
ID=83320423
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202280021336.9A Pending CN116981700A (zh) | 2021-03-16 | 2022-03-07 | 光固化性组合物及图案形成方法 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US20240166779A1 (https=) |
| EP (1) | EP4310104A4 (https=) |
| JP (1) | JPWO2022196408A1 (https=) |
| CN (1) | CN116981700A (https=) |
| WO (1) | WO2022196408A1 (https=) |
Family Cites Families (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003318313A (ja) * | 2002-04-24 | 2003-11-07 | Toray Ind Inc | セラミックス基板の製造方法 |
| JP4234406B2 (ja) * | 2002-11-29 | 2009-03-04 | 住友精化株式会社 | 光硬化性組成物 |
| JP5196933B2 (ja) * | 2006-09-27 | 2013-05-15 | 富士フイルム株式会社 | 光ナノインプリントリソグラフィ用硬化性組成物およびそれを用いたパターン形成方法 |
| JP2009102550A (ja) * | 2007-10-24 | 2009-05-14 | Mitsubishi Chemicals Corp | 重合性組成物およびその硬化物 |
| JP5463170B2 (ja) * | 2010-03-10 | 2014-04-09 | 富士フイルム株式会社 | 微細パターン製造方法、微細パターン付き基板、微細パターン付き基板を含む光源装置および画像表示装置 |
| JP5696567B2 (ja) * | 2011-03-31 | 2015-04-08 | Jsr株式会社 | ナノインプリント用感放射線性組成物、及びパターン形成方法 |
| JP2013095833A (ja) | 2011-10-31 | 2013-05-20 | Nissan Chem Ind Ltd | 高屈折率インプリント材料 |
| JP5952040B2 (ja) | 2012-03-15 | 2016-07-13 | 東京応化工業株式会社 | 光インプリント用の膜形成組成物及び光学部材の製造方法 |
| US20190233556A1 (en) * | 2016-10-21 | 2019-08-01 | Corning Incorporated | High refractive index polymerizable monomers and applications thereof |
| JP2020132760A (ja) * | 2019-02-19 | 2020-08-31 | オーウエル株式会社 | 光硬化性組成物、硬化物、及びレンズ |
| JP2021031669A (ja) * | 2019-08-28 | 2021-03-01 | 東京応化工業株式会社 | 硬化性インク組成物、硬化物、及びナノコンポジット |
| JP6872813B2 (ja) | 2019-09-12 | 2021-05-19 | 株式会社流機エンジニアリング | トンネル工事用装置およびトンネル工事方法 |
-
2022
- 2022-03-07 EP EP22771162.9A patent/EP4310104A4/en active Pending
- 2022-03-07 CN CN202280021336.9A patent/CN116981700A/zh active Pending
- 2022-03-07 WO PCT/JP2022/009681 patent/WO2022196408A1/ja not_active Ceased
- 2022-03-07 JP JP2023506980A patent/JPWO2022196408A1/ja active Pending
- 2022-03-07 US US18/550,002 patent/US20240166779A1/en active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| EP4310104A4 (en) | 2025-04-23 |
| EP4310104A1 (en) | 2024-01-24 |
| WO2022196408A1 (ja) | 2022-09-22 |
| JPWO2022196408A1 (https=) | 2022-09-22 |
| US20240166779A1 (en) | 2024-05-23 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP5306903B2 (ja) | インプリント用硬化性組成物、これを用いた硬化物およびその製造方法、並びに、液晶表示装置用部材 | |
| JP5846974B2 (ja) | 光インプリント用硬化性組成物、パターン形成方法およびパターン | |
| JP6029558B2 (ja) | 光インプリント用硬化性組成物、パターン形成方法、微細パターン、および半導体デバイスの製造方法 | |
| US20220334475A1 (en) | Photocurable composition and pattern forming method | |
| JP2010000612A (ja) | ナノインプリント用硬化性組成物、パターン形成方法 | |
| JP2009206197A (ja) | ナノインプリント用硬化性組成物、硬化物およびその製造方法 | |
| JP2010013514A (ja) | ナノインプリント用硬化性組成物、これを用いた硬化物、並びに、液晶表示装置用部材 | |
| WO2014050855A1 (ja) | 光インプリント用硬化性組成物、パターン形成方法、微細パターンおよび半導体デバイスの製造方法 | |
| JP2009209337A (ja) | ナノインプリント用硬化性組成物、これを用いた硬化物およびその製造方法、並びに、液晶表示装置用部材 | |
| JP7175092B2 (ja) | 光硬化性組成物及びパターン形成方法 | |
| JP2010070586A (ja) | 硬化性組成物、硬化物およびその製造方法 | |
| US20220347913A1 (en) | Pattern forming method and method of producing curable composition | |
| JP7458909B2 (ja) | 光硬化性組成物及びパターン形成方法 | |
| US12523930B2 (en) | Nanoimprint composition and pattern forming method | |
| WO2023145534A1 (ja) | ナノインプリント用組成物及びパターン形成方法 | |
| CN116981700A (zh) | 光固化性组合物及图案形成方法 | |
| CN117083309A (zh) | 光固化性组合物及图案形成方法 | |
| WO2022230871A1 (ja) | 硬化性組成物及びパターン形成方法 | |
| JP7535931B2 (ja) | 光硬化性組成物及びパターン形成方法 | |
| CN115248529A (zh) | 图案形成方法 | |
| JP2010083970A (ja) | ナノインプリント用硬化性組成物、硬化物およびその製造方法 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination |