CN116724393A - 热硬化性树脂组合物的制造方法、热硬化性树脂组合物及电子零件装置 - Google Patents
热硬化性树脂组合物的制造方法、热硬化性树脂组合物及电子零件装置 Download PDFInfo
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- CN116724393A CN116724393A CN202280008716.9A CN202280008716A CN116724393A CN 116724393 A CN116724393 A CN 116724393A CN 202280008716 A CN202280008716 A CN 202280008716A CN 116724393 A CN116724393 A CN 116724393A
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- 229910052719 titanium Inorganic materials 0.000 description 1
- IFXORIIYQORRMJ-UHFFFAOYSA-N tribenzylphosphane Chemical compound C=1C=CC=CC=1CP(CC=1C=CC=CC=1)CC1=CC=CC=C1 IFXORIIYQORRMJ-UHFFFAOYSA-N 0.000 description 1
- JXUKBNICSRJFAP-UHFFFAOYSA-N triethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CCO[Si](OCC)(OCC)CCCOCC1CO1 JXUKBNICSRJFAP-UHFFFAOYSA-N 0.000 description 1
- ZYMHKOVQDOFPHH-UHFFFAOYSA-N trimethoxy(oct-1-enyl)silane Chemical compound CCCCCCC=C[Si](OC)(OC)OC ZYMHKOVQDOFPHH-UHFFFAOYSA-N 0.000 description 1
- DQZNLOXENNXVAD-UHFFFAOYSA-N trimethoxy-[2-(7-oxabicyclo[4.1.0]heptan-4-yl)ethyl]silane Chemical compound C1C(CC[Si](OC)(OC)OC)CCC2OC21 DQZNLOXENNXVAD-UHFFFAOYSA-N 0.000 description 1
- BPSIOYPQMFLKFR-UHFFFAOYSA-N trimethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](OC)(OC)CCCOCC1CO1 BPSIOYPQMFLKFR-UHFFFAOYSA-N 0.000 description 1
- YUYCVXFAYWRXLS-UHFFFAOYSA-N trimethoxysilane Chemical compound CO[SiH](OC)OC YUYCVXFAYWRXLS-UHFFFAOYSA-N 0.000 description 1
- DMEUUKUNSVFYAA-UHFFFAOYSA-N trinaphthalen-1-ylphosphane Chemical compound C1=CC=C2C(P(C=3C4=CC=CC=C4C=CC=3)C=3C4=CC=CC=C4C=CC=3)=CC=CC2=C1 DMEUUKUNSVFYAA-UHFFFAOYSA-N 0.000 description 1
- AAAQKTZKLRYKHR-UHFFFAOYSA-N triphenylmethane Chemical compound C1=CC=CC=C1C(C=1C=CC=CC=1)C1=CC=CC=C1 AAAQKTZKLRYKHR-UHFFFAOYSA-N 0.000 description 1
- BIKXLKXABVUSMH-UHFFFAOYSA-N trizinc;diborate Chemical compound [Zn+2].[Zn+2].[Zn+2].[O-]B([O-])[O-].[O-]B([O-])[O-] BIKXLKXABVUSMH-UHFFFAOYSA-N 0.000 description 1
- 229920006337 unsaturated polyester resin Polymers 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
- 229910052845 zircon Inorganic materials 0.000 description 1
- 229910052726 zirconium Inorganic materials 0.000 description 1
- 229910001928 zirconium oxide Inorganic materials 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29B—PREPARATION OR PRETREATMENT OF THE MATERIAL TO BE SHAPED; MAKING GRANULES OR PREFORMS; RECOVERY OF PLASTICS OR OTHER CONSTITUENTS OF WASTE MATERIAL CONTAINING PLASTICS
- B29B7/00—Mixing; Kneading
- B29B7/80—Component parts, details or accessories; Auxiliary operations
- B29B7/88—Adding charges, i.e. additives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
- C08K3/013—Fillers, pigments or reinforcing additives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L101/00—Compositions of unspecified macromolecular compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Polymers & Plastics (AREA)
- Engineering & Computer Science (AREA)
- Medicinal Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Physics & Mathematics (AREA)
- Mechanical Engineering (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Processes Of Treating Macromolecular Substances (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021002289 | 2021-01-08 | ||
| JP2021-002289 | 2021-01-08 | ||
| PCT/JP2022/000210 WO2022149594A1 (ja) | 2021-01-08 | 2022-01-06 | 熱硬化性樹脂組成物の製造方法、熱硬化性樹脂組成物、及び電子部品装置 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN116724393A true CN116724393A (zh) | 2023-09-08 |
Family
ID=82357730
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202280008716.9A Pending CN116724393A (zh) | 2021-01-08 | 2022-01-06 | 热硬化性树脂组合物的制造方法、热硬化性树脂组合物及电子零件装置 |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JPWO2022149594A1 (ja) |
| CN (1) | CN116724393A (ja) |
| TW (1) | TW202233736A (ja) |
| WO (1) | WO2022149594A1 (ja) |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0716946B2 (ja) * | 1989-05-26 | 1995-03-01 | 松下電工株式会社 | エポキシ樹脂成形材料の製造方法 |
| JPH0853532A (ja) * | 1994-08-10 | 1996-02-27 | Arakawa Chem Ind Co Ltd | エポキシ樹脂、その製造方法およびエポキシ樹脂組成物 |
| JP3430150B2 (ja) * | 2000-12-18 | 2003-07-28 | 日東電工株式会社 | 光半導体素子封止用エポキシ樹脂組成物の製造方法 |
| JP2003160642A (ja) * | 2001-11-27 | 2003-06-03 | Matsushita Electric Works Ltd | 半導体封止用エポキシ樹脂組成物及び半導体装置 |
| JP4837243B2 (ja) * | 2003-05-20 | 2011-12-14 | 日本化薬株式会社 | エポキシ樹脂組成物及びその硬化物 |
| JP4950010B2 (ja) * | 2007-11-27 | 2012-06-13 | パナソニック株式会社 | 半導体封止用エポキシ樹脂組成物の製造方法および半導体装置の製造方法 |
| JP4966221B2 (ja) * | 2008-02-26 | 2012-07-04 | パナソニック株式会社 | 先塗布アンダーフィル封止方法 |
| CN111621152A (zh) * | 2019-02-28 | 2020-09-04 | 京瓷株式会社 | 元件密封用成型材料组合物及电子部件装置 |
-
2022
- 2022-01-06 CN CN202280008716.9A patent/CN116724393A/zh active Pending
- 2022-01-06 JP JP2022574070A patent/JPWO2022149594A1/ja active Pending
- 2022-01-06 TW TW111100604A patent/TW202233736A/zh unknown
- 2022-01-06 WO PCT/JP2022/000210 patent/WO2022149594A1/ja active Application Filing
Also Published As
| Publication number | Publication date |
|---|---|
| WO2022149594A1 (ja) | 2022-07-14 |
| TW202233736A (zh) | 2022-09-01 |
| JPWO2022149594A1 (ja) | 2022-07-14 |
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