TW202233736A - 熱硬化性樹脂組成物的製造方法、熱硬化性樹脂組成物及電子零件裝置 - Google Patents
熱硬化性樹脂組成物的製造方法、熱硬化性樹脂組成物及電子零件裝置 Download PDFInfo
- Publication number
- TW202233736A TW202233736A TW111100604A TW111100604A TW202233736A TW 202233736 A TW202233736 A TW 202233736A TW 111100604 A TW111100604 A TW 111100604A TW 111100604 A TW111100604 A TW 111100604A TW 202233736 A TW202233736 A TW 202233736A
- Authority
- TW
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- Prior art keywords
- thermosetting resin
- kneading
- resin composition
- temperature
- mass
- Prior art date
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29B—PREPARATION OR PRETREATMENT OF THE MATERIAL TO BE SHAPED; MAKING GRANULES OR PREFORMS; RECOVERY OF PLASTICS OR OTHER CONSTITUENTS OF WASTE MATERIAL CONTAINING PLASTICS
- B29B7/00—Mixing; Kneading
- B29B7/80—Component parts, details or accessories; Auxiliary operations
- B29B7/88—Adding charges, i.e. additives
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
- C08K3/013—Fillers, pigments or reinforcing additives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L101/00—Compositions of unspecified macromolecular compounds
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
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- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Polymers & Plastics (AREA)
- Engineering & Computer Science (AREA)
- Medicinal Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Physics & Mathematics (AREA)
- Mechanical Engineering (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Processes Of Treating Macromolecular Substances (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2021002289 | 2021-01-08 | ||
JP2021-002289 | 2021-01-08 |
Publications (1)
Publication Number | Publication Date |
---|---|
TW202233736A true TW202233736A (zh) | 2022-09-01 |
Family
ID=82357730
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW111100604A TW202233736A (zh) | 2021-01-08 | 2022-01-06 | 熱硬化性樹脂組成物的製造方法、熱硬化性樹脂組成物及電子零件裝置 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JPWO2022149594A1 (ja) |
CN (1) | CN116724393A (ja) |
TW (1) | TW202233736A (ja) |
WO (1) | WO2022149594A1 (ja) |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0716946B2 (ja) * | 1989-05-26 | 1995-03-01 | 松下電工株式会社 | エポキシ樹脂成形材料の製造方法 |
JPH0853532A (ja) * | 1994-08-10 | 1996-02-27 | Arakawa Chem Ind Co Ltd | エポキシ樹脂、その製造方法およびエポキシ樹脂組成物 |
JP3430150B2 (ja) * | 2000-12-18 | 2003-07-28 | 日東電工株式会社 | 光半導体素子封止用エポキシ樹脂組成物の製造方法 |
JP2003160642A (ja) * | 2001-11-27 | 2003-06-03 | Matsushita Electric Works Ltd | 半導体封止用エポキシ樹脂組成物及び半導体装置 |
JP4837243B2 (ja) * | 2003-05-20 | 2011-12-14 | 日本化薬株式会社 | エポキシ樹脂組成物及びその硬化物 |
JP4950010B2 (ja) * | 2007-11-27 | 2012-06-13 | パナソニック株式会社 | 半導体封止用エポキシ樹脂組成物の製造方法および半導体装置の製造方法 |
JP4966221B2 (ja) * | 2008-02-26 | 2012-07-04 | パナソニック株式会社 | 先塗布アンダーフィル封止方法 |
CN111621152A (zh) * | 2019-02-28 | 2020-09-04 | 京瓷株式会社 | 元件密封用成型材料组合物及电子部件装置 |
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2022
- 2022-01-06 CN CN202280008716.9A patent/CN116724393A/zh active Pending
- 2022-01-06 JP JP2022574070A patent/JPWO2022149594A1/ja active Pending
- 2022-01-06 TW TW111100604A patent/TW202233736A/zh unknown
- 2022-01-06 WO PCT/JP2022/000210 patent/WO2022149594A1/ja active Application Filing
Also Published As
Publication number | Publication date |
---|---|
CN116724393A (zh) | 2023-09-08 |
WO2022149594A1 (ja) | 2022-07-14 |
JPWO2022149594A1 (ja) | 2022-07-14 |
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