CN116723900A - 涂敷处理装置、涂敷处理方法和计算机存储介质 - Google Patents

涂敷处理装置、涂敷处理方法和计算机存储介质 Download PDF

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Publication number
CN116723900A
CN116723900A CN202280008832.0A CN202280008832A CN116723900A CN 116723900 A CN116723900 A CN 116723900A CN 202280008832 A CN202280008832 A CN 202280008832A CN 116723900 A CN116723900 A CN 116723900A
Authority
CN
China
Prior art keywords
coating liquid
substrate
speed
supply nozzle
coating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202280008832.0A
Other languages
English (en)
Chinese (zh)
Inventor
稻叶翔吾
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Electron Ltd
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Publication of CN116723900A publication Critical patent/CN116723900A/zh
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
    • B05C11/10—Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0448—Apparatus for applying a liquid, a resin, an ink or the like
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
    • B05C11/02—Apparatus for spreading or distributing liquids or other fluent materials already applied to a surface ; Controlling means therefor; Control of the thickness of a coating by spreading or distributing liquids or other fluent materials already applied to the coated surface
    • B05C11/08—Spreading liquid or other fluent material by manipulating the work, e.g. tilting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
    • B05C11/10—Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material
    • B05C11/1002—Means for controlling supply, i.e. flow or pressure, of liquid or other fluent material to the applying apparatus, e.g. valves
    • B05C11/1015—Means for controlling supply, i.e. flow or pressure, of liquid or other fluent material to the applying apparatus, e.g. valves responsive to a conditions of ambient medium or target, e.g. humidity, temperature ; responsive to position or movement of the coating head relative to the target
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
    • B05C11/10—Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material
    • B05C11/1002—Means for controlling supply, i.e. flow or pressure, of liquid or other fluent material to the applying apparatus, e.g. valves
    • B05C11/1015—Means for controlling supply, i.e. flow or pressure, of liquid or other fluent material to the applying apparatus, e.g. valves responsive to a conditions of ambient medium or target, e.g. humidity, temperature ; responsive to position or movement of the coating head relative to the target
    • B05C11/1023—Means for controlling supply, i.e. flow or pressure, of liquid or other fluent material to the applying apparatus, e.g. valves responsive to a conditions of ambient medium or target, e.g. humidity, temperature ; responsive to position or movement of the coating head relative to the target responsive to velocity of target, e.g. to web advancement rate
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D1/00—Processes for applying liquids or other fluent materials
    • B05D1/26—Processes for applying liquids or other fluent materials performed by applying the liquid or other fluent material from an outlet device in contact with, or almost in contact with, the surface
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D1/00—Processes for applying liquids or other fluent materials
    • B05D1/40—Distributing applied liquids or other fluent materials by members moving relatively to surface
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P76/00—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
    • B05C5/02—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
    • B05C5/0204—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work for applying liquid or other fluent material to the edges of essentially flat articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
    • B05C5/02—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
    • B05C5/0208—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work for applying liquid or other fluent material to separate articles
    • B05C5/0212—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work for applying liquid or other fluent material to separate articles only at particular parts of the articles
    • B05C5/0216—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work for applying liquid or other fluent material to separate articles only at particular parts of the articles by relative movement of article and outlet according to a predetermined path
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/78—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using vacuum or suction, e.g. Bernoulli chucks

Landscapes

  • Coating Apparatus (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
CN202280008832.0A 2021-01-12 2022-01-04 涂敷处理装置、涂敷处理方法和计算机存储介质 Pending CN116723900A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2021-003100 2021-01-12
JP2021003100 2021-01-12
PCT/JP2022/000015 WO2022153887A1 (ja) 2021-01-12 2022-01-04 塗布処理装置、塗布処理方法及びコンピュータ記憶媒体

Publications (1)

Publication Number Publication Date
CN116723900A true CN116723900A (zh) 2023-09-08

Family

ID=82447582

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202280008832.0A Pending CN116723900A (zh) 2021-01-12 2022-01-04 涂敷处理装置、涂敷处理方法和计算机存储介质

Country Status (6)

Country Link
US (1) US20240050977A1 (enExample)
JP (2) JP7445021B2 (enExample)
KR (1) KR20230130032A (enExample)
CN (1) CN116723900A (enExample)
TW (2) TW202605901A (enExample)
WO (1) WO2022153887A1 (enExample)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2024127644A (ja) * 2023-03-09 2024-09-20 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置および基板処理方法

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013062436A (ja) * 2011-09-14 2013-04-04 Tokyo Electron Ltd 周縁部塗布装置、周縁部塗布方法及び記憶媒体
US20140154890A1 (en) * 2012-12-04 2014-06-05 Tokyo Electron Limited Periphery coating apparatus, periphery coating method and storage medium therefor
JP2016115939A (ja) * 2015-12-11 2016-06-23 東京エレクトロン株式会社 塗布処理方法、コンピュータ記憶媒体及び塗布処理装置
WO2020095598A1 (ja) * 2018-11-07 2020-05-14 株式会社Ｓｃｒｅｅｎホールディングス 基板処理方法および基板処理装置
CN111913357A (zh) * 2019-05-09 2020-11-10 东京毅力科创株式会社 涂敷处理方法、涂敷处理装置和存储介质

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5745964B2 (ja) * 2011-07-22 2015-07-08 ラピスセミコンダクタ株式会社 半導体装置の製造方法及び半導体製造装置
JP6439766B2 (ja) * 2016-09-23 2018-12-19 東京エレクトロン株式会社 塗布、現像方法及び塗布、現像装置
JP6765009B2 (ja) * 2017-05-12 2020-10-07 東京エレクトロン株式会社 基板処理装置、基板処理方法及び記憶媒体
JP6899265B2 (ja) * 2017-06-27 2021-07-07 東京エレクトロン株式会社 塗布処理方法、塗布処理装置及び記憶媒体
WO2019167845A1 (ja) * 2018-02-27 2019-09-06 パナソニックＩｐマネジメント株式会社 管理装置、管理方法及び部品実装システム
JP7202901B2 (ja) * 2019-01-18 2023-01-12 東京エレクトロン株式会社 塗布膜形成方法及び塗布膜形成装置
JP7202960B2 (ja) * 2019-04-16 2023-01-12 東京エレクトロン株式会社 塗布膜形成方法及び塗布膜形成装置
KR102207602B1 (ko) * 2019-05-29 2021-01-26 주식회사 테토스 기판 측면부 배선 형성 방법

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013062436A (ja) * 2011-09-14 2013-04-04 Tokyo Electron Ltd 周縁部塗布装置、周縁部塗布方法及び記憶媒体
US20140154890A1 (en) * 2012-12-04 2014-06-05 Tokyo Electron Limited Periphery coating apparatus, periphery coating method and storage medium therefor
JP2016115939A (ja) * 2015-12-11 2016-06-23 東京エレクトロン株式会社 塗布処理方法、コンピュータ記憶媒体及び塗布処理装置
WO2020095598A1 (ja) * 2018-11-07 2020-05-14 株式会社Ｓｃｒｅｅｎホールディングス 基板処理方法および基板処理装置
CN111913357A (zh) * 2019-05-09 2020-11-10 东京毅力科创株式会社 涂敷处理方法、涂敷处理装置和存储介质

Also Published As

Publication number Publication date
WO2022153887A1 (ja) 2022-07-21
JP2024059806A (ja) 2024-05-01
JP7792448B2 (ja) 2025-12-25
TW202605901A (zh) 2026-02-01
US20240050977A1 (en) 2024-02-15
TWI905353B (zh) 2025-11-21
JP7445021B2 (ja) 2024-03-06
KR20230130032A (ko) 2023-09-11
TW202241228A (zh) 2022-10-16
JPWO2022153887A1 (enExample) 2022-07-21

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