CN116477923B - 一种利用陶瓷膜废品制备陶瓷接板的方法及陶瓷接板 - Google Patents
一种利用陶瓷膜废品制备陶瓷接板的方法及陶瓷接板 Download PDFInfo
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- CN116477923B CN116477923B CN202310281878.6A CN202310281878A CN116477923B CN 116477923 B CN116477923 B CN 116477923B CN 202310281878 A CN202310281878 A CN 202310281878A CN 116477923 B CN116477923 B CN 116477923B
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Abstract
本发明为解决现有技术中采用海绵板作为接板时存在使用寿命短、生产成本高、影响陶瓷膜支撑体合格率的问题，提供一种利用陶瓷膜废品制备陶瓷接板的方法及陶瓷接板。该陶瓷接板的组成原料包括陶瓷粉末、烧结助剂、造孔剂、有机粘合剂、糖苷表面活性剂、润滑剂和水等，其中陶瓷粉末由陶瓷膜废品制得，平均粒径5.5~6μm。陶瓷粉末等组成原料经混合、捏合、真空炼泥、挤出、干燥和烧结后，得到陶瓷接板。本发明中利用陶瓷膜废品制备陶瓷接板的方法及陶瓷接板，废弃资源重复利用率为100%，实现了循环经济的目标，降低了生产成本，且陶瓷膜具有较高的强度和较长的使用寿命，满足支撑体坯体的生产要求，提升了陶瓷膜支撑体生产的合格率。
Description
技术领域
本发明涉及陶瓷膜制备技术领域，尤其涉及一种利用陶瓷膜废品制备陶瓷接板的方法及陶瓷接板。
背景技术
陶瓷膜（无机陶瓷膜）是以无机陶瓷材料经特殊工艺制备而形成的膜，其具体包括管式陶瓷膜和平板陶瓷膜。由于陶瓷膜具有分离效率高、效果稳定、化学稳定性好、耐酸碱、耐有机溶剂、耐菌、耐高温、抗污染、机械强度高、再生性能好、分离过程简单、能耗低、操作维护简便、使用寿命长等众多优势，已经成功应用于食品、饮料、植（药）物深加工、生物医药、发酵、精细化工等众多领域，可用于工艺过程中的分离、澄清、纯化、浓缩、除菌、除盐等。
目前，陶瓷膜的制备工艺包括挤出、喷涂和烧结等工序。比如中国发明专利申请公开了一种高通量平板陶瓷膜的制备方法（公开号：CN110368818A，公开日：20191025），并具体公开了先通过挤出成型机中制备成平板状坯体，经干燥、1400～1700℃煅烧，得到平板陶瓷膜支撑体；然后通过喷雾喷嘴形成雾化液滴沉积在平均孔径为1～4μm、厚度为3～5mm的平板陶瓷膜支撑体上形成厚度不超过15μm、呈连续的过渡膜层；最后烧结得到平板陶瓷膜。
在支撑体坯体挤出过程中，需要采取海绵板（由金属支撑架和海绵垫等构成）作为接板。然而，海绵板上支撑体坯体连续挤出后切割效果不佳，存在支撑体坯体藕断丝连的情况，陶瓷膜支撑体合格率也较低。并且，海绵板在长期使用过程中容易发生损坏，使用寿命有限，仅2~3月就需要进行更换，直接造成了陶瓷膜的生产成本一直处于很高的状态。
发明内容
本发明为解决现有技术中采用海绵板作为接板时存在使用寿命短、生产成本高、影响陶瓷膜支撑体合格率的问题，提供一种利用陶瓷膜废品制备陶瓷接板的方法及陶瓷接板，废弃资源重复利用率为100%，实现了循环经济的目标，降低了生产成本，且陶瓷接板具有较高的强度和较长的使用寿命，满足支撑体坯体的生产要求，整体提升烧成后陶瓷膜支撑体合格率。
本发明采用的技术方案是：
一种陶瓷接板，以质量百分比之和为100%计，所述陶瓷接板的组成原料包括：
陶瓷粉末80~90wt％；
烧结助剂1~5wt%；
造孔剂0.5~3wt％；
糖苷表面活性剂1~1.5wt%；
有机粘合剂0.5~3wt%；
润滑剂1~3wt％；
水2～10wt％；
其中，所述陶瓷粉末由陶瓷膜废品制得，平均粒径5.5~6μm。
进一步地，所述烧结助剂为钛白粉、滑石粉、玻璃粉、膨润土、高岭土、氧化锌、氧化铝、氧化钙、氧化镁、氧化锆、氧化钾、磷酸铝中的一种或多种；
和/或，所述造孔剂为碳酸钙、淀粉、石墨、尼龙、尿素、木炭、活性炭中的一种或者多种；
和/或，所述糖苷表面活性剂包括烷基糖苷、醇醚糖苷中的一种或者多种；
和/或，所述有机粘合剂为纤维素、羧甲基纤维素钠、羟甲基纤维素钠、黄原胶、环糊精和聚乙烯醇中的一种或者多种；
和/或，所述润滑剂为甘油、硬脂酸钠、聚乙二醇、液体石蜡、植物油中的一种或者多种。
基于同样的发明构思，本发明还一种利用陶瓷膜废品制备陶瓷接板的方法，所述方法包括以下步骤：
步骤S1，对陶瓷膜废品进行预处理，得到陶瓷粉末；
步骤S2，将所述步骤S1中得到的所述陶瓷粉末按配比与烧结助剂、造孔剂、糖苷表面活性剂和有机粘合剂高速混合，得到干粉料；
步骤S3，将所述步骤S2中得到的所述干粉料按照配比与润滑剂、水捏合、然后真空炼泥，得到泥料；
步骤S4，将所述步骤S3中得到的所述泥料进行挤出成型，得到坯体；
步骤S5，对所述步骤S4中得到的所述坯体进行干燥，得到干燥泥坯；
步骤S6，对所述步骤S5中得到的所述干燥泥坯进行烧结，得到陶瓷接板。
进一步地，所述步骤S1中对陶瓷膜废品进行预处理，得到陶瓷粉末的具体过程包括：
步骤S11，对所述陶瓷膜废品进行粗碎，得到废品碎片；
步骤S12，采用粉碎机对所述步骤S11中得到的所述废品碎片进行破碎，破碎产物过325目筛，筛上物即为废品颗粒；
步骤S13，采用球磨机对所述步骤S12中得到的所述废品颗粒进行研磨，直至研磨产物的平均粒径达到5.5~6μm，得到陶瓷粉粗品；
步骤S14，采用高速混合机对所述步骤S13中得到的所述陶瓷粉粗品进行均化，均化产物过100目筛，筛下物即为所述陶瓷粉末。
进一步地，所述步骤S2中所述陶瓷粉末与所述烧结助剂、所述造孔剂、所述糖苷表面活性剂和所述有机粘合剂高速混合时的时长为20~60min。
进一步地，所述步骤S3中所述干粉料与所述润滑剂、所述水捏合时的时长为30~40min，真空练泥次数1~6次，真空压力-80KPa。
进一步地，所述步骤S4中所述泥料挤出成型时，挤出温度10~50℃，挤出速度0.2~3m/min，挤出压力5~15Mpa。
进一步地，所述步骤S5中所述坯体干燥时，直接采用烘箱干燥，50~100℃，时长2~12h；
或者，所述步骤S5中所述坯体干燥时，先置于微波干燥设备中微波干燥，时长1~10min，然后再置于烘箱中继续干燥，温度50~100℃，时长2~12h。
进一步地，所述步骤S6中所述干燥泥坯烧结时，先于600℃保温120min，然后于1200~1550℃保温120min。
进一步地，所述步骤S6中所述干燥泥坯烧结时，采用梯度升温方式，具体包括：
室温加热至150℃，30min；
150℃加热至250℃，120min；
250℃，保温90min；
250℃加热至600℃，180min；
600℃，保温120min；
600℃加热至950℃，210min；
950℃加热至1200℃，240min；
1200~1550℃，保温120min；
降温。
本发明的有益效果是：
1.本发明提供了一种利用陶瓷膜废品制备陶瓷接板的方法，该方法中以陶瓷膜废品为主要原料加工为陶瓷粉末，然后与烧结助剂、造孔剂、糖苷表面活性剂、粘结剂和润滑剂等混合，挤出后烧结。该方法中以陶瓷膜废品为主要原料，解决了陶瓷膜废品堆积无法处理的问题，废弃资源重复利用率为100%，实现了循环经济的目标，降低了生产成本。并且相比于海绵板，本发明中的方法制备的陶瓷接板具有一定强度和硬度，使得连续支撑体坯体的切断时，支撑体坯体的切断端面光滑、平整，且陶瓷接板在干燥和烧结过程比较稳定、不容易变形，从而使得支撑体坯体藕断丝连的情况以及支撑体坯体开裂、应力残留等缺陷较少，从而保证陶瓷膜支撑体生产的合格率较高。且陶瓷接板的耐久、耐磨性好，使用寿命至少8个月。同时，本发明中的方法制备的陶瓷接板上具有均匀的空隙，孔径适当，有利于支撑体坯体干燥和烧结过程中水分等可挥发物释放，从而整体提升烧成后陶瓷膜支撑体合格率。
2.本发明中的陶瓷接板的强度在45~55Mpa，孔径0.3~0.5μm，能满足陶瓷膜的生产需求，使用寿命长。
附图说明
为了更清楚地说明本申请实施例或现有技术中的技术方案，下面将对实施例或有现技术描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本申请的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的附图。
图1为实施例1中利用陶瓷膜废品制备陶瓷接板的方法的流程图。
图2为实施例5的陶瓷接板盛放支撑体坯体的状态图。
图3为实施例5中的陶瓷接板断面的扫面电镜图。
具体实施方式
在本发明的描述中，需要理解的是，术语“中心”、“纵向”、“横向”、“长度”、“宽度”、“厚度”、“上”、“下”、“前”、“后”、“左”、“右”、“竖直”、“水平”、“顶”、“底”、“内”、“外”、“顺时针”、“逆时针”、“轴向”、“径向”、“周向”等指示的方位或位置关系为基于附图所示的方位或位置关系，仅是为了便于描述本发明和简化描述，而不是指示或暗示所指的装置或元件必须具有特定的方位、以特定的方位构造和操作，因此不能理解为对本发明的限制。
下文的公开提供了许多不同的实施方式或例子用来实现本发明的不同结构。为了简化本发明的公开，下文中对特定例子的部件和设置进行描述。当然，它们仅仅为示例，并且目的不在于限制本发明。
下面结合附图对发明的实施例进行详细说明。
实施例1
本实施例中提供一种利用陶瓷膜废品制备陶瓷接板的方法，其流程如附图1中所示。该方法包括以下步骤：
步骤S1，对陶瓷膜废品进行预处理，得到陶瓷粉末。
具体的，预处理可以包括以下流程：
步骤S11，对陶瓷膜废品进行粗碎，得到废品碎片；
步骤S12，采用粉碎机对步骤S11中得到的废品碎片进行破碎，破碎产物过325目筛，筛上物即为废品颗粒；
步骤S13，采用球磨机对步骤S12中得到的废品颗粒进行研磨，直至研磨产物的平均粒径达到5.5~6μm，得到陶瓷粉粗品；
步骤S14，采用高速混合机对步骤S13中得到的陶瓷粉粗品进行均化，使得颗粒大小均匀且分散，均化产物过100目筛，筛下物即为陶瓷粉末，陶瓷粉末的平均粒径在5.5~6μm。
其中，陶瓷膜废品包括损毁的平板陶瓷膜/陶瓷管膜，平板陶瓷膜/陶瓷管膜的烧结残次品，平板陶瓷膜/陶瓷管膜的支撑体的烧结残次品，损失的陶瓷接板，陶瓷接板烧结残次品等。
本实施例中以陶瓷膜废品为主要原料加工出符合要求的陶瓷粉末，可以解决陶瓷膜废品堆积无法处理的问题，废弃资源重复利用率为100%，实现了循环经济的目标，降低了陶瓷膜的生产成本。相比于海绵板，以陶瓷粉末为主要成分加工的陶瓷接板具有一定强度和硬度。连续支撑体坯体的切断时，支撑体坯体的切断端面光滑、平整，且陶瓷接板在干燥和烧结过程比较稳定、不容易变形，从而使得支撑体坯体藕断丝连的情况以及支撑体坯体开裂、应力残留等缺陷较少，从而保证陶瓷膜支撑体合格率较高。且陶瓷接板的耐久、耐磨性好，使用寿命至少8个月。同时陶瓷接板内部具有均匀的空隙，孔径适当，有利于支撑体坯体干燥和烧结过程中水分等可挥发物释放，从而整体提升烧成后陶瓷膜支撑体合格率。
步骤S2，将步骤S1中得到的陶瓷粉末按配比与烧结助剂、造孔剂、糖苷表面活性剂和有机粘合剂高速混合，得到干粉料。
具体的，高速混合时可以采用高速混合机操作，高速混合时的时长为20~60min，优选30min。
步骤S3，将步骤S2中得到的干粉料按照配比与润滑剂、水捏合、然后真空炼泥，得到泥料。
具体的，以质量百分比之和为100%计，陶瓷接板的各个组成原料用量如下：
陶瓷粉末80~90wt％；烧结助剂1~5wt%；造孔剂0.5~3wt％；糖苷表面活性剂1~1.5wt%；有机粘合剂0.5~3wt%；润滑剂1~3wt％；水2～10wt％。
烧结助剂为钛白粉、滑石粉、玻璃粉、膨润土、高岭土、氧化锌、氧化铝、氧化钙、氧化镁、氧化锆、氧化钾、磷酸铝中的一种或多种；造孔剂为碳酸钙、淀粉、石墨、尼龙、尿素、木炭、活性炭中的一种或者多种；糖苷表面活性剂包括烷基糖苷、醇醚糖苷中的一种或者多种；有机粘合剂为纤维素、羧甲基纤维素钠、羟甲基纤维素钠、黄原胶、环糊精和聚乙烯醇中的一种或者多种；润滑剂为甘油、硬脂酸钠、聚乙二醇、液体石蜡、植物油中的一种或者多种。
具体的，干粉料与润滑剂、水捏合时的时长为30~40min，真空练泥次数1~6次，真空压力-80KPa。
本实施例的方法中，陶瓷接板的组成原料添加了糖苷表面活性剂，其可以促使陶瓷粉末在高温烧结时产生烧结活性，降低烧结开裂风险，保证陶瓷接板的强度和烧结合格率。
步骤S4，将步骤S3中得到的泥料进行挤出成型，得到坯体。
具体的，泥料挤出成型时，挤出温度10~50℃，挤出速度0.2~3m/min，挤出压力5~15Mpa。
比如，在真空挤出机的机头上安装57孔，268mm*5.6mm的模具，泥料挤出后得到266.5mm*6mm的坯体。
步骤S5，对步骤S4中得到的坯体进行干燥，得到干燥泥坯。
具体的，坯体干燥时，直接采用烘箱干燥，50~100℃，时长2~12h。或者，步骤S5中坯体干燥时，先置于微波干燥设备中微波干燥，时长1~10min，然后再置于烘箱中继续干燥，温度50~100℃，时长2~12h。
步骤S6，对步骤S5中得到的干燥泥坯进行烧结，得到陶瓷接板。该陶瓷接板的结构与陶瓷膜支撑体的结构接近。
具体的，干燥泥坯烧结时，采用梯度升温方式，具体包括：室温（比如25℃）加热至150℃，30min（即从室温加热到150℃时用时30min）；150℃加热至250℃，120min；250℃，保温90min；250℃加热至600℃，180min；600℃，保温120min；600℃加热至950℃，210min；950℃加热至1200℃，240min；1200~1550℃，保温120min；降温。
本实施例中采用梯度升温方式，有利于保证陶瓷接板的烧结质量和烧结合格率。另一方面，干燥坯体在加热至600℃时保温120min，在此温度下对陶瓷粉末进行助活，提高陶瓷粉末在高温烧结时的烧结活性，降低烧结开裂风险，保证陶瓷接板的强度和烧结合格率。
实施例2~5
参照实施例1中的制备方法，实施例2~5提供一种陶瓷接板，其组成原料如表1中所示。其中，泥料挤出成型时，挤出温度10℃，挤出速度0.25m/min，挤出压力10Mpa。坯体干燥时，直接采用烘箱干燥，60℃，时长10h。干燥坯体梯度升温时最后1400℃保温120min。
表1 实施例2~5中种陶瓷接板的组成原料
对照例1
对照例1中的组成原料和配比与实施例5中的组成原料和配比相同，两者在得到干燥坯体之前工艺亦相同，区别在于：对照例1中的干燥坯体在烧结时，未采用梯度升温的方式，而是采用10~20℃/min速度直接升温至1400℃，然后保温120min。
对照例2
对照例2的制备过程与实施例5中的制备过程相同，区域在于： 对照例2中没有加糖苷表面活性剂，具体组成原料如下：陶瓷粉末87kg，钛白粉1kg，滑石粉1kg，玻璃缝1kg，纤维素2.4kg，甘油1kg，水5.6kg。
对照例3
对照例3的制备过程与实施例5中的制备过程相同，区别在于： 对照例3中加入的是木质素磺酸钙（阴离子表面活性剂），用量1.2kg， 其余组成原料的用量相同。
分别对实施例2~5和对照例1~3中的陶瓷接板的外观、强度、孔径以及烧结合格率进行检查，检测结果如表2中所示。
表2 实施例2~5和对照例1~3中的陶瓷接板的检测结果
对比实施例2~5和对照例1的检测结果可知，在烧结过程中采用梯度升温的方式有利于改善陶瓷接板的强度和烧结合格率，从而提高陶瓷接板的耐久性，延长使用寿命。并且，在烧结过程中，在600℃保温120min有利于糖苷表面活性剂激发陶瓷粉末的烧结活性。
对比实施例5和对照例1~3的检测结果可知，在未添加糖苷表面活性剂时，陶瓷粉末在高温下的活性较低，致使制备的陶瓷接板的强度和烧结合格率均较低，也即是糖苷表面活性剂能提高陶瓷粉末烧结时的活性。并且，相比于木质素磺酸钙等阴离子表面活性剂，糖苷表面活性剂更改激发陶瓷粉末的烧结活性，以得到强度和烧结合格率均较高的陶瓷接板。
采用实施例5中的陶瓷接板盛放支撑体坯体时，其端部的照片如附图2中所示。图中上层为支撑体坯体，下层为陶瓷接板。从图中可以看出，支撑体坯体的切断端面光滑、平整。采用海绵板盛放支撑体坯体时，由于海绵垫质地较软，在支撑体坯体切割过程中容易造成支撑体坯体藕断丝连的情况，甚至出现支撑体坯体端面开裂、应力残留等缺陷，而这些缺陷会直接影响支撑体坯体的干燥和烧结过程，产生支撑体端部开裂，影响陶瓷膜支撑体合格率。本实施例中的陶瓷接板采用陶瓷粉末等无机材料制成，具有一定强度和硬度。连续支撑体坯体的切断时，支撑体坯体的切断端面光滑、平整，且陶瓷接板在干燥和烧结过程比较稳定、不容易变形，从而使得支撑体坯体藕断丝连的情况以及支撑体坯体开裂、应力残留等缺陷较少，从而保证陶瓷膜支撑体生产的合格率较高。
实施例5中陶瓷接板的断面的扫面结果如附图3中所示。从图中可以看出，陶瓷接板上分布有大小均匀的连通的孔洞，该孔洞可作为支撑体坯体干燥和烧结时，水分等可挥发物质的释放通道，从而保证支撑体的烧结质量。
Claims (6)
1.一种陶瓷接板，其特征在于，以质量百分比之和为100%计，所述陶瓷接板的组成原料包括：
陶瓷粉末85~90wt％；
烧结助剂1~5wt%；
造孔剂0.5~3wt％；
糖苷表面活性剂1~1.5wt%；
有机粘合剂0.5~3wt%；
润滑剂1~3wt％；
水2～10wt％；
其中，所述陶瓷粉末由陶瓷膜废品制得，平均粒径5.5~6μm；
利用陶瓷膜废品制备陶瓷接板的方法，包括以下步骤：
步骤S1，对陶瓷膜废品进行预处理，得到陶瓷粉末；
步骤S2，将所述步骤S1中得到的所述陶瓷粉末按配比与烧结助剂、造孔剂、糖苷表面活性剂和有机粘合剂高速混合，得到干粉料；
步骤S3，将所述步骤S2中得到的所述干粉料按照配比与润滑剂、水捏合、然后真空炼泥，得到泥料；
步骤S4，将所述步骤S3中得到的所述泥料进行挤出成型，得到坯体；
步骤S5，对所述步骤S4中得到的所述坯体进行干燥，得到干燥泥坯；
步骤S6，对所述步骤S5中得到的所述干燥泥坯进行烧结，得到陶瓷接板；
所述步骤S1中对陶瓷膜废品进行预处理，得到陶瓷粉末的具体过程包括：
步骤S11，对所述陶瓷膜废品进行粗碎，得到废品碎片；
步骤S12，采用粉碎机对所述步骤S11中得到的所述废品碎片进行破碎，破碎产物过325目筛，筛上物即为废品颗粒；
步骤S13，采用球磨机对所述步骤S12中得到的所述废品颗粒进行研磨，直至研磨产物的平均粒径达到5.5~6μm，得到陶瓷粉粗品；
步骤S14，采用高速混合机对所述步骤S13中得到的所述陶瓷粉粗品进行均化，均化产物过100目筛，筛下物即为所述陶瓷粉末；
所述步骤S6中所述干燥泥坯烧结时，采用梯度升温方式，具体包括：
室温加热至150℃，30min；
150℃加热至250℃，120min；
250℃，保温90min；
250℃加热至600℃，180min；
600℃，保温120min；
600℃加热至950℃，210min；
950℃加热至1200℃，240min；
1200~1550℃，保温120min；
降温。
2.根据权利要求1所述的陶瓷接板，其特征在于，所述烧结助剂为钛白粉、滑石粉、玻璃粉、膨润土、高岭土、氧化锌、氧化铝、氧化钙、氧化镁、氧化锆、氧化钾、磷酸铝中的一种或多种；
所述造孔剂为碳酸钙、淀粉、石墨、尼龙、尿素、木炭、活性炭中的一种或者多种；
所述糖苷表面活性剂包括烷基糖苷、醇醚糖苷中的一种或者多种；
所述有机粘合剂为纤维素、羧甲基纤维素钠、羟甲基纤维素钠、黄原胶、环糊精和聚乙烯醇中的一种或者多种；
所述润滑剂为甘油、硬脂酸钠、聚乙二醇、液体石蜡、植物油中的一种或者多种。
3.根据权利要求1所述的陶瓷接板，其特征在于，所述步骤S2中所述陶瓷粉末与所述烧结助剂、所述造孔剂、所述糖苷表面活性剂和所述有机粘合剂高速混合时的时长为20~60min。
4.根据权利要求1所述的陶瓷接板，其特征在于，所述步骤S3中所述干粉料与所述润滑剂、所述水捏合时的时长为30~40min，真空练泥次数1~6次，真空压力-80KPa。
5.根据权利要求1所述的陶瓷接板，其特征在于，所述步骤S4中所述泥料挤出成型时，挤出温度10~50℃，挤出速度0.2~3m/min，挤出压力5~15Mpa。
6.根据权利要求1所述的陶瓷接板，其特征在于，所述步骤S5中所述坯体干燥时，直接采用烘箱干燥，50~100℃，时长2~12h；
或者，所述步骤S5中所述坯体干燥时，先置于微波干燥设备中微波干燥，时长1~10min，然后再置于烘箱中继续干燥，温度50~100℃，时长2~12h。
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| CN110423493A (zh) * | 2019-07-24 | 2019-11-08 | 东莞市唯美陶瓷工业园有限公司 | 应用于通体大规格陶瓷板材的亲水型干拌色料的制备方法 |
| CN115259861A (zh) * | 2022-06-08 | 2022-11-01 | 山东工业陶瓷研究设计院有限公司 | 一种高孔隙率多孔陶瓷膜支撑体及其制备方法 |
| CN115180978A (zh) * | 2022-06-28 | 2022-10-14 | 杭州诺贝尔陶瓷有限公司 | 一种用于大板陶瓷砖背面抗裂涂层的复合料浆及涂布工艺 |
| CN115594505A (zh) * | 2022-10-24 | 2023-01-13 | 铜陵优必胜新材料科技有限公司（Cn） | 一种防弹陶瓷材料及其制备方法 |
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