CN116472572A - 显示装置、电子设备和用于制造显示装置的方法 - Google Patents
显示装置、电子设备和用于制造显示装置的方法 Download PDFInfo
- Publication number
- CN116472572A CN116472572A CN202180078265.1A CN202180078265A CN116472572A CN 116472572 A CN116472572 A CN 116472572A CN 202180078265 A CN202180078265 A CN 202180078265A CN 116472572 A CN116472572 A CN 116472572A
- Authority
- CN
- China
- Prior art keywords
- display device
- substrate
- light emitting
- organic layer
- display
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/1201—Manufacture or treatment
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B33/00—Electroluminescent light sources
- H05B33/02—Details
- H05B33/04—Sealing arrangements, e.g. against humidity
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/123—Connection of the pixel electrodes to the thin film transistors [TFT]
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/30—Devices specially adapted for multicolour light emission
- H10K59/38—Devices specially adapted for multicolour light emission comprising colour filters or colour changing media [CCM]
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/805—Electrodes
- H10K59/8051—Anodes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/805—Electrodes
- H10K59/8052—Cathodes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/87—Passivation; Containers; Encapsulations
- H10K59/871—Self-supporting sealing arrangements
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/87—Passivation; Containers; Encapsulations
- H10K59/873—Encapsulations
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/20—Changing the shape of the active layer in the devices, e.g. patterning
- H10K71/231—Changing the shape of the active layer in the devices, e.g. patterning by etching of existing layers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/60—Forming conductive regions or layers, e.g. electrodes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/30—Devices specially adapted for multicolour light emission
- H10K59/35—Devices specially adapted for multicolour light emission comprising red-green-blue [RGB] subpixels
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/805—Electrodes
- H10K59/8051—Anodes
- H10K59/80515—Anodes characterised by their shape
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/805—Electrodes
- H10K59/8052—Cathodes
- H10K59/80521—Cathodes characterised by their shape
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Electroluminescent Light Sources (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2020195714 | 2020-11-26 | ||
| JP2020-195714 | 2020-11-26 | ||
| PCT/JP2021/042354 WO2022113864A1 (ja) | 2020-11-26 | 2021-11-18 | 表示装置および電子機器、並びに、表示装置の製造方法 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN116472572A true CN116472572A (zh) | 2023-07-21 |
Family
ID=81754285
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202180078265.1A Pending CN116472572A (zh) | 2020-11-26 | 2021-11-18 | 显示装置、电子设备和用于制造显示装置的方法 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US20230397474A1 (https=) |
| JP (1) | JP7703569B2 (https=) |
| KR (1) | KR20230107231A (https=) |
| CN (1) | CN116472572A (https=) |
| DE (1) | DE112021006118T5 (https=) |
| TW (1) | TW202226641A (https=) |
| WO (1) | WO2022113864A1 (https=) |
Family Cites Families (84)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20020105265A1 (en) * | 2000-03-20 | 2002-08-08 | Feng-Ju Chuang | Organic electroluminescent device and method of making same |
| JP4016144B2 (ja) * | 2003-09-19 | 2007-12-05 | ソニー株式会社 | 有機発光素子およびその製造方法ならびに表示装置 |
| WO2005105428A1 (ja) * | 2004-04-28 | 2005-11-10 | Zeon Corporation | 積層体、発光素子及びその使用 |
| KR100611652B1 (ko) * | 2004-06-28 | 2006-08-11 | 삼성에스디아이 주식회사 | 유기 전계 발광 표시 소자 및 그 제조방법 |
| DE112004002893A5 (de) * | 2004-06-30 | 2007-05-24 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Leuchtdiodenmatrix und Verfahren zum Herstellen einer Leuchtdiodenmatrix |
| US7535163B2 (en) * | 2006-02-22 | 2009-05-19 | Tpo Displays Corp. | System for displaying images including electroluminescent device and method for fabricating the same |
| JP4893392B2 (ja) * | 2007-03-15 | 2012-03-07 | ソニー株式会社 | 表示装置および電子機器 |
| JP2009170336A (ja) | 2008-01-18 | 2009-07-30 | Sony Corp | 表示装置の製造方法 |
| US8188506B2 (en) * | 2008-09-30 | 2012-05-29 | Lg Innotek Co., Ltd. | Semiconductor light emitting device |
| KR101097321B1 (ko) * | 2009-12-14 | 2011-12-23 | 삼성모바일디스플레이주식회사 | 유기 발광 장치 및 이의 제조 방법 |
| JP4996706B2 (ja) * | 2010-03-03 | 2012-08-08 | 株式会社東芝 | 半導体発光素子およびその製造方法 |
| US9520536B2 (en) * | 2010-11-18 | 2016-12-13 | Seoul Viosys Co., Ltd. | Light emitting diode chip having electrode pad |
| KR20140066974A (ko) * | 2011-09-26 | 2014-06-03 | 파나소닉 주식회사 | 발광 장치의 제조 방법 및 발광 장치 |
| US9093665B2 (en) * | 2011-10-19 | 2015-07-28 | Semiconductor Energy Laboratory Co., Ltd. | Light-emitting module and method for manufacturing the same |
| EP2685515A1 (en) * | 2012-07-12 | 2014-01-15 | Nederlandse Organisatie voor toegepast -natuurwetenschappelijk onderzoek TNO | Method and system for dividing a barrier foil |
| KR101941661B1 (ko) * | 2012-09-04 | 2019-01-24 | 삼성디스플레이 주식회사 | 유기 발광 표시 장치 및 이의 제조방법 |
| JP6204012B2 (ja) * | 2012-10-17 | 2017-09-27 | 株式会社半導体エネルギー研究所 | 発光装置 |
| JP6124584B2 (ja) * | 2012-12-21 | 2017-05-10 | 株式会社半導体エネルギー研究所 | 発光装置及びその製造方法 |
| JP6104649B2 (ja) * | 2013-03-08 | 2017-03-29 | 株式会社半導体エネルギー研究所 | 発光装置 |
| CN104659070B (zh) * | 2015-03-13 | 2018-11-16 | 上海天马有机发光显示技术有限公司 | 一种显示面板、显示装置及显示面板的制造方法 |
| KR102394427B1 (ko) * | 2015-04-02 | 2022-05-04 | 엘지디스플레이 주식회사 | 유기발광표시장치 및 이를 제조하는 방법 |
| KR102490891B1 (ko) * | 2015-12-04 | 2023-01-25 | 삼성디스플레이 주식회사 | 표시 장치 |
| KR102289220B1 (ko) * | 2016-03-18 | 2021-08-13 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 표시 장치 |
| KR102642369B1 (ko) * | 2016-03-25 | 2024-03-05 | 삼성디스플레이 주식회사 | 유기 발광 표시 장치 및 유기 발광 표시 장치의 제조 방법 |
| KR102530760B1 (ko) * | 2016-07-18 | 2023-05-11 | 삼성전자주식회사 | 반도체 발광소자 |
| KR102630001B1 (ko) * | 2016-10-31 | 2024-01-25 | 엘지디스플레이 주식회사 | 유기발광 표시장치, 그를 포함한 헤드 장착형 디스플레이, 및 그의 제조방법 |
| KR102724099B1 (ko) * | 2016-10-31 | 2024-10-31 | 엘지디스플레이 주식회사 | 보조 전극을 포함하는 디스플레이 장치 |
| WO2018147050A1 (ja) * | 2017-02-13 | 2018-08-16 | ソニー株式会社 | 表示装置、および電子機器 |
| CN107170904B (zh) * | 2017-06-30 | 2019-10-15 | 京东方科技集团股份有限公司 | Oled显示基板及其制作方法、显示装置 |
| JP7276131B2 (ja) * | 2017-08-02 | 2023-05-18 | ソニーグループ株式会社 | 表示装置、表示装置の製造方法、及び、電子機器 |
| KR102325674B1 (ko) * | 2017-08-16 | 2021-11-12 | 엘지디스플레이 주식회사 | 유기발광 표시장치, 그를 포함한 헤드 장착형 디스플레이, 및 그의 제조방법 |
| JP6957294B2 (ja) * | 2017-09-28 | 2021-11-02 | キヤノン株式会社 | 表示装置、電子機器、及び表示装置の製造方法 |
| KR102468861B1 (ko) * | 2017-12-22 | 2022-11-18 | 엘지디스플레이 주식회사 | 전계발광표시장치 |
| FR3079909B1 (fr) * | 2018-04-05 | 2022-10-14 | Microoled | Dispositif electroluminescent a resolution et fiabilite ameliorees |
| JP6754798B2 (ja) * | 2018-04-24 | 2020-09-16 | 株式会社Joled | 有機el表示パネル |
| WO2019216196A1 (ja) * | 2018-05-08 | 2019-11-14 | ソニーセミコンダクタソリューションズ株式会社 | 表示装置及び表示装置の製造方法、並びに、電子機器 |
| JP7077152B2 (ja) * | 2018-06-12 | 2022-05-30 | キヤノン株式会社 | 表示装置、電気装置および車両 |
| JP7075292B2 (ja) * | 2018-06-21 | 2022-05-25 | キヤノン株式会社 | 有機デバイス、表示装置、撮像装置、照明装置、移動体用灯具、および、移動体 |
| US11678550B2 (en) * | 2018-06-25 | 2023-06-13 | Sony Semiconductor Solutions Corporation | Organic EL device and method for manufacturing organic EL devices |
| US20190393278A1 (en) * | 2018-06-26 | 2019-12-26 | Innolux Corporation | Display device |
| KR102617962B1 (ko) * | 2018-10-02 | 2023-12-27 | 삼성전자주식회사 | 반도체 발광소자 |
| KR102663324B1 (ko) * | 2018-11-01 | 2024-05-02 | 엘지디스플레이 주식회사 | 표시 영역 내에 관통-홀을 구비한 전계 발광 표시장치 |
| US10790473B2 (en) * | 2018-12-18 | 2020-09-29 | Lg Display Co., Ltd. | High-aperture-ratio microdisplay with microcavity structure |
| KR102793800B1 (ko) * | 2019-01-21 | 2025-04-09 | 삼성디스플레이 주식회사 | 유기 발광 표시 장치 및 그의 제조 방법 |
| KR102663872B1 (ko) * | 2019-08-07 | 2024-05-03 | 엘지디스플레이 주식회사 | 표시장치 및 이의 제조방법 |
| CN111129085A (zh) * | 2019-12-12 | 2020-05-08 | 武汉华星光电半导体显示技术有限公司 | 一种显示面板及其显示装置 |
| US12089451B2 (en) * | 2019-12-25 | 2024-09-10 | Semiconductor Energy Laboratory Co., Ltd. | Functional panel, display device, input/output device, and data processing device |
| KR102687966B1 (ko) * | 2019-12-30 | 2024-07-23 | 엘지디스플레이 주식회사 | 표시장치 |
| CN115136738A (zh) * | 2020-03-03 | 2022-09-30 | 索尼集团公司 | 显示装置、制造显示装置的方法以及电子设备 |
| US11882731B2 (en) * | 2020-04-21 | 2024-01-23 | Boe Technology Group Co., Ltd. | Display device, display panel and manufacturing method thereof |
| CN111668381B (zh) * | 2020-06-19 | 2023-01-24 | 京东方科技集团股份有限公司 | 显示基板及其制备方法、显示装置 |
| US12557517B2 (en) * | 2020-09-10 | 2026-02-17 | Sony Semiconductor Solutions Corporation | Display device and electronic device |
| KR102920183B1 (ko) * | 2020-11-09 | 2026-01-30 | 삼성디스플레이 주식회사 | 표시 장치 및 표시 장치의 제조 방법 |
| JP7570896B2 (ja) * | 2020-11-17 | 2024-10-22 | 株式会社ジャパンディスプレイ | 表示装置 |
| WO2022144661A1 (ja) * | 2020-12-29 | 2022-07-07 | 株式会社半導体エネルギー研究所 | 表示パネル、情報処理装置、表示パネルの製造方法 |
| WO2022149042A1 (ja) * | 2021-01-08 | 2022-07-14 | 株式会社半導体エネルギー研究所 | 表示装置、表示装置の作製方法、及び電子機器 |
| WO2022153118A1 (ja) * | 2021-01-14 | 2022-07-21 | 株式会社半導体エネルギー研究所 | 表示装置の作製方法 |
| JP7657597B2 (ja) * | 2021-01-21 | 2025-04-07 | 株式会社ジャパンディスプレイ | 表示装置 |
| US12532606B2 (en) * | 2021-01-28 | 2026-01-20 | Semiconductor Energy Laboratory Co., Ltd. | Method for manufacturing display device, display device, display module, and electronic device |
| JPWO2022175789A1 (https=) * | 2021-02-19 | 2022-08-25 | ||
| KR20230152703A (ko) * | 2021-03-05 | 2023-11-03 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 표시 장치, 표시 모듈, 전자 기기, 및 표시 장치의 제작 방법 |
| JPWO2022189882A1 (https=) * | 2021-03-12 | 2022-09-15 | ||
| WO2022200916A1 (ja) * | 2021-03-25 | 2022-09-29 | 株式会社半導体エネルギー研究所 | 表示装置、表示装置の作製方法、表示モジュール、及び電子機器 |
| CN117242899A (zh) * | 2021-04-23 | 2023-12-15 | 株式会社半导体能源研究所 | 显示装置 |
| US20240276834A1 (en) * | 2021-06-08 | 2024-08-15 | Semiconductor Energy Laboratory Co., Ltd. | Display Device, Method For Manufacturing Display Device, Display Module, and Electronic Device |
| KR20230023858A (ko) * | 2021-08-10 | 2023-02-20 | 삼성디스플레이 주식회사 | 표시 장치 |
| US12550534B2 (en) * | 2021-08-11 | 2026-02-10 | Yunnan Invensight Optoelectronics Technology Co., Ltd. | Display substrate and electronic apparatus having concave points within gap between pixel regions |
| CN117898024A (zh) * | 2021-08-27 | 2024-04-16 | 株式会社半导体能源研究所 | 显示装置 |
| US12593576B2 (en) * | 2021-09-16 | 2026-03-31 | Yunnan Invensight Optoelectronics Technology Co., Ltd. | Display panel and display device |
| US20230116067A1 (en) * | 2021-10-07 | 2023-04-13 | Semiconductor Energy Laboratory Co., Ltd. | Display apparatus, display module, and electronic device |
| WO2023095663A1 (ja) * | 2021-11-26 | 2023-06-01 | ソニーセミコンダクタソリューションズ株式会社 | 表示装置および電子機器 |
| WO2023094943A1 (ja) * | 2021-11-29 | 2023-06-01 | 株式会社半導体エネルギー研究所 | 表示装置、及び、表示装置の作製方法 |
| KR20230094648A (ko) * | 2021-12-21 | 2023-06-28 | 엘지디스플레이 주식회사 | 전계 발광 표시장치 |
| JPWO2023176718A1 (https=) * | 2022-03-16 | 2023-09-21 | ||
| CN117204136A (zh) * | 2022-03-16 | 2023-12-08 | 京东方科技集团股份有限公司 | 显示基板及显示装置 |
| CN115274710B (zh) * | 2022-08-10 | 2025-08-26 | 京东方科技集团股份有限公司 | 一种显示模组及其制备方法 |
| KR20240105832A (ko) * | 2022-12-29 | 2024-07-08 | 엘지디스플레이 주식회사 | 발광표시장치 |
| KR20240107947A (ko) * | 2022-12-30 | 2024-07-09 | 엘지디스플레이 주식회사 | 표시 장치 |
| KR20240143658A (ko) * | 2023-03-24 | 2024-10-02 | 삼성전자주식회사 | 발광 표시장치 |
| CN116344703A (zh) * | 2023-04-04 | 2023-06-27 | 厦门三安光电有限公司 | 显示装置 |
| US20250048848A1 (en) * | 2023-08-02 | 2025-02-06 | Lg Display Co., Ltd. | Display panel and display device |
| KR20250120471A (ko) * | 2024-02-01 | 2025-08-11 | 삼성디스플레이 주식회사 | 표시 장치 및 이의 제조 방법 |
| KR20250129182A (ko) * | 2024-02-22 | 2025-08-29 | 엘지디스플레이 주식회사 | 표시 장치 |
| KR20250163433A (ko) * | 2024-05-13 | 2025-11-21 | 삼성디스플레이 주식회사 | 표시 장치 및 이의 제조 방법 |
-
2021
- 2021-11-02 TW TW110140685A patent/TW202226641A/zh unknown
- 2021-11-18 WO PCT/JP2021/042354 patent/WO2022113864A1/ja not_active Ceased
- 2021-11-18 US US18/033,991 patent/US20230397474A1/en active Pending
- 2021-11-18 JP JP2022565277A patent/JP7703569B2/ja active Active
- 2021-11-18 DE DE112021006118.6T patent/DE112021006118T5/de active Pending
- 2021-11-18 CN CN202180078265.1A patent/CN116472572A/zh active Pending
- 2021-11-18 KR KR1020237015504A patent/KR20230107231A/ko active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| KR20230107231A (ko) | 2023-07-14 |
| US20230397474A1 (en) | 2023-12-07 |
| WO2022113864A1 (ja) | 2022-06-02 |
| JPWO2022113864A1 (https=) | 2022-06-02 |
| DE112021006118T5 (de) | 2023-09-28 |
| JP7703569B2 (ja) | 2025-07-07 |
| TW202226641A (zh) | 2022-07-01 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN113056768B (zh) | 图像处理设备、图像处理方法和程序 | |
| CN109891875B (zh) | 图像传送设备、方法、系统和存储介质 | |
| US20240258356A1 (en) | Imaging device and electronic apparatus | |
| US11006060B2 (en) | Imaging device and electronic device | |
| US11119633B2 (en) | Information processing device and method | |
| US20200036930A1 (en) | Solid-state image sensor, imaging device, and method of controlling solid-state image sensor | |
| WO2018020857A1 (ja) | 固体撮像素子、撮像装置、および、固体撮像素子の制御方法 | |
| JP7548220B2 (ja) | 表示制御装置、表示制御方法および表示制御プログラム | |
| WO2020022421A1 (ja) | 光電変換素子 | |
| US11156751B2 (en) | Imaging optical system, camera module, and electronic device | |
| US20250294953A1 (en) | Solid-state imaging device and electronic equipment | |
| JP7503546B2 (ja) | 表示装置および電子機器 | |
| WO2018037680A1 (ja) | 撮像装置、撮像システム、及び、信号処理方法 | |
| US12514019B2 (en) | Solid-state imaging element and electronic device | |
| JP7703569B2 (ja) | 表示装置および電子機器、並びに、表示装置の製造方法 | |
| JP7727660B2 (ja) | 液晶表示素子、表示装置および電子機器、並びに、駆動基板および駆動基板の製造方法 | |
| US20210114988A1 (en) | Photoelectric conversion element | |
| US12613430B2 (en) | Lens array and stereoscopic display apparatus | |
| WO2022102466A1 (ja) | 液晶表示素子、表示装置および電子機器、並びに、駆動基板および駆動基板の製造方法 | |
| JP7484892B2 (ja) | 駆動モーター、像ぶれ補正装置及び撮像装置 | |
| TW202211724A (zh) | 顯示裝置及電子機器 | |
| WO2026028721A1 (ja) | 半導体装置及び電子機器 | |
| WO2025150439A1 (ja) | 光検出装置 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination |