DE112021006118T5 - Anzeigeeinrichtung, elektronische vorrichtung und verfahren zur herstellung einer anzeigeeinrichtung - Google Patents
Anzeigeeinrichtung, elektronische vorrichtung und verfahren zur herstellung einer anzeigeeinrichtung Download PDFInfo
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- DE112021006118T5 DE112021006118T5 DE112021006118.6T DE112021006118T DE112021006118T5 DE 112021006118 T5 DE112021006118 T5 DE 112021006118T5 DE 112021006118 T DE112021006118 T DE 112021006118T DE 112021006118 T5 DE112021006118 T5 DE 112021006118T5
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- display device
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- light emitting
- organic layer
- lower electrode
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- 238000004519 manufacturing process Methods 0.000 title claims description 60
- 239000000758 substrate Substances 0.000 claims abstract description 180
- 239000012044 organic layer Substances 0.000 claims abstract description 134
- 230000001681 protective effect Effects 0.000 claims abstract description 51
- 239000011159 matrix material Substances 0.000 claims abstract description 22
- 239000010410 layer Substances 0.000 claims description 94
- 238000000034 method Methods 0.000 claims description 92
- 230000008569 process Effects 0.000 claims description 66
- 239000000463 material Substances 0.000 claims description 61
- 238000012545 processing Methods 0.000 claims description 37
- 238000005530 etching Methods 0.000 claims description 36
- 238000009413 insulation Methods 0.000 claims description 20
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 9
- 229910052814 silicon oxide Inorganic materials 0.000 claims description 9
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 8
- 229910052710 silicon Inorganic materials 0.000 claims description 8
- 239000010703 silicon Substances 0.000 claims description 8
- 239000002689 soil Substances 0.000 claims description 8
- 238000001312 dry etching Methods 0.000 claims description 7
- 229910052581 Si3N4 Inorganic materials 0.000 claims description 6
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 claims description 6
- 150000003377 silicon compounds Chemical class 0.000 claims description 5
- 239000012212 insulator Substances 0.000 claims description 4
- 238000004891 communication Methods 0.000 description 77
- 230000006854 communication Effects 0.000 description 77
- 238000001514 detection method Methods 0.000 description 45
- 210000003128 head Anatomy 0.000 description 43
- 238000003384 imaging method Methods 0.000 description 35
- 230000006870 function Effects 0.000 description 28
- 230000003287 optical effect Effects 0.000 description 21
- 230000005540 biological transmission Effects 0.000 description 14
- 238000005516 engineering process Methods 0.000 description 12
- 238000007789 sealing Methods 0.000 description 12
- 230000001276 controlling effect Effects 0.000 description 9
- 238000010586 diagram Methods 0.000 description 9
- 239000011810 insulating material Substances 0.000 description 9
- 238000003860 storage Methods 0.000 description 9
- 210000001519 tissue Anatomy 0.000 description 9
- 239000011521 glass Substances 0.000 description 8
- 238000006243 chemical reaction Methods 0.000 description 7
- 238000010336 energy treatment Methods 0.000 description 7
- 238000000059 patterning Methods 0.000 description 7
- 239000004020 conductor Substances 0.000 description 6
- 239000004065 semiconductor Substances 0.000 description 6
- 239000006227 byproduct Substances 0.000 description 5
- 239000003990 capacitor Substances 0.000 description 5
- 230000004048 modification Effects 0.000 description 5
- 238000012986 modification Methods 0.000 description 5
- 230000011514 reflex Effects 0.000 description 5
- 238000005070 sampling Methods 0.000 description 5
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 4
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 4
- 208000005646 Pneumoperitoneum Diseases 0.000 description 4
- 230000005284 excitation Effects 0.000 description 4
- 239000011229 interlayer Substances 0.000 description 4
- 230000007246 mechanism Effects 0.000 description 4
- 238000005240 physical vapour deposition Methods 0.000 description 4
- 230000004044 response Effects 0.000 description 4
- 230000000007 visual effect Effects 0.000 description 4
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 3
- 230000008901 benefit Effects 0.000 description 3
- 210000004204 blood vessel Anatomy 0.000 description 3
- 238000000151 deposition Methods 0.000 description 3
- 230000007613 environmental effect Effects 0.000 description 3
- 239000007789 gas Substances 0.000 description 3
- 230000005525 hole transport Effects 0.000 description 3
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 3
- LIVNPJMFVYWSIS-UHFFFAOYSA-N silicon monoxide Chemical compound [Si-]#[O+] LIVNPJMFVYWSIS-UHFFFAOYSA-N 0.000 description 3
- 239000002344 surface layer Substances 0.000 description 3
- 235000004522 Pentaglottis sempervirens Nutrition 0.000 description 2
- 210000003815 abdominal wall Anatomy 0.000 description 2
- 230000001133 acceleration Effects 0.000 description 2
- 230000004913 activation Effects 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- 229910052786 argon Inorganic materials 0.000 description 2
- 238000000231 atomic layer deposition Methods 0.000 description 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 2
- 230000010267 cellular communication Effects 0.000 description 2
- 239000003153 chemical reaction reagent Substances 0.000 description 2
- 238000005229 chemical vapour deposition Methods 0.000 description 2
- 239000011651 chromium Substances 0.000 description 2
- 238000002485 combustion reaction Methods 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 230000008021 deposition Effects 0.000 description 2
- 230000006866 deterioration Effects 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 230000005669 field effect Effects 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- MOFVSTNWEDAEEK-UHFFFAOYSA-M indocyanine green Chemical compound [Na+].[O-]S(=O)(=O)CCCCN1C2=CC=C3C=CC=CC3=C2C(C)(C)C1=CC=CC=CC=CC1=[N+](CCCCS([O-])(=O)=O)C2=CC=C(C=CC=C3)C3=C2C1(C)C MOFVSTNWEDAEEK-UHFFFAOYSA-M 0.000 description 2
- 229960004657 indocyanine green Drugs 0.000 description 2
- 238000002347 injection Methods 0.000 description 2
- 239000007924 injection Substances 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 238000002955 isolation Methods 0.000 description 2
- 239000007769 metal material Substances 0.000 description 2
- 229910052757 nitrogen Inorganic materials 0.000 description 2
- 239000001301 oxygen Substances 0.000 description 2
- 229910052760 oxygen Inorganic materials 0.000 description 2
- 230000000149 penetrating effect Effects 0.000 description 2
- 230000035515 penetration Effects 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 239000000047 product Substances 0.000 description 2
- 230000009467 reduction Effects 0.000 description 2
- 230000005236 sound signal Effects 0.000 description 2
- 238000004544 sputter deposition Methods 0.000 description 2
- 238000001356 surgical procedure Methods 0.000 description 2
- 239000012780 transparent material Substances 0.000 description 2
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 2
- 229910052721 tungsten Inorganic materials 0.000 description 2
- 239000010937 tungsten Substances 0.000 description 2
- 238000005019 vapor deposition process Methods 0.000 description 2
- BUHVIAUBTBOHAG-FOYDDCNASA-N (2r,3r,4s,5r)-2-[6-[[2-(3,5-dimethoxyphenyl)-2-(2-methylphenyl)ethyl]amino]purin-9-yl]-5-(hydroxymethyl)oxolane-3,4-diol Chemical compound COC1=CC(OC)=CC(C(CNC=2C=3N=CN(C=3N=CN=2)[C@H]2[C@@H]([C@H](O)[C@@H](CO)O2)O)C=2C(=CC=CC=2)C)=C1 BUHVIAUBTBOHAG-FOYDDCNASA-N 0.000 description 1
- 229910018182 Al—Cu Inorganic materials 0.000 description 1
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 208000032843 Hemorrhage Diseases 0.000 description 1
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 1
- 240000004050 Pentaglottis sempervirens Species 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 230000003190 augmentative effect Effects 0.000 description 1
- 230000007175 bidirectional communication Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 229910017052 cobalt Inorganic materials 0.000 description 1
- 239000010941 cobalt Substances 0.000 description 1
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 230000000295 complement effect Effects 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 230000010485 coping Effects 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 238000012937 correction Methods 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005401 electroluminescence Methods 0.000 description 1
- 238000002674 endoscopic surgery Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 1
- 229910010272 inorganic material Inorganic materials 0.000 description 1
- 239000011147 inorganic material Substances 0.000 description 1
- 238000002350 laparotomy Methods 0.000 description 1
- 230000031700 light absorption Effects 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 230000000116 mitigating effect Effects 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000010295 mobile communication Methods 0.000 description 1
- 210000004400 mucous membrane Anatomy 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 239000013307 optical fiber Substances 0.000 description 1
- 239000011368 organic material Substances 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 238000001454 recorded image Methods 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 238000002271 resection Methods 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 230000004043 responsiveness Effects 0.000 description 1
- 239000005336 safety glass Substances 0.000 description 1
- 238000001881 scanning electron acoustic microscopy Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 230000006641 stabilisation Effects 0.000 description 1
- 238000011105 stabilization Methods 0.000 description 1
- 230000001954 sterilising effect Effects 0.000 description 1
- 238000004659 sterilization and disinfection Methods 0.000 description 1
- 230000002194 synthesizing effect Effects 0.000 description 1
- 229910052715 tantalum Inorganic materials 0.000 description 1
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
- YVTHLONGBIQYBO-UHFFFAOYSA-N zinc indium(3+) oxygen(2-) Chemical compound [O--].[Zn++].[In+3] YVTHLONGBIQYBO-UHFFFAOYSA-N 0.000 description 1
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/1201—Manufacture or treatment
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B33/00—Electroluminescent light sources
- H05B33/02—Details
- H05B33/04—Sealing arrangements, e.g. against humidity
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/123—Connection of the pixel electrodes to the thin film transistors [TFT]
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/30—Devices specially adapted for multicolour light emission
- H10K59/38—Devices specially adapted for multicolour light emission comprising colour filters or colour changing media [CCM]
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/805—Electrodes
- H10K59/8051—Anodes
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/805—Electrodes
- H10K59/8052—Cathodes
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/87—Passivation; Containers; Encapsulations
- H10K59/871—Self-supporting sealing arrangements
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/87—Passivation; Containers; Encapsulations
- H10K59/873—Encapsulations
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/20—Changing the shape of the active layer in the devices, e.g. patterning
- H10K71/231—Changing the shape of the active layer in the devices, e.g. patterning by etching of existing layers
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/60—Forming conductive regions or layers, e.g. electrodes
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/30—Devices specially adapted for multicolour light emission
- H10K59/35—Devices specially adapted for multicolour light emission comprising red-green-blue [RGB] subpixels
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/805—Electrodes
- H10K59/8051—Anodes
- H10K59/80515—Anodes characterised by their shape
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/805—Electrodes
- H10K59/8052—Cathodes
- H10K59/80521—Cathodes characterised by their shape
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Electroluminescent Light Sources (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2020195714 | 2020-11-26 | ||
| JP2020-195714 | 2020-11-26 | ||
| PCT/JP2021/042354 WO2022113864A1 (ja) | 2020-11-26 | 2021-11-18 | 表示装置および電子機器、並びに、表示装置の製造方法 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| DE112021006118T5 true DE112021006118T5 (de) | 2023-09-28 |
Family
ID=81754285
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE112021006118.6T Pending DE112021006118T5 (de) | 2020-11-26 | 2021-11-18 | Anzeigeeinrichtung, elektronische vorrichtung und verfahren zur herstellung einer anzeigeeinrichtung |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US20230397474A1 (https=) |
| JP (1) | JP7703569B2 (https=) |
| KR (1) | KR20230107231A (https=) |
| CN (1) | CN116472572A (https=) |
| DE (1) | DE112021006118T5 (https=) |
| TW (1) | TW202226641A (https=) |
| WO (1) | WO2022113864A1 (https=) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009170336A (ja) | 2008-01-18 | 2009-07-30 | Sony Corp | 表示装置の製造方法 |
Family Cites Families (83)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20020105265A1 (en) * | 2000-03-20 | 2002-08-08 | Feng-Ju Chuang | Organic electroluminescent device and method of making same |
| JP4016144B2 (ja) * | 2003-09-19 | 2007-12-05 | ソニー株式会社 | 有機発光素子およびその製造方法ならびに表示装置 |
| WO2005105428A1 (ja) * | 2004-04-28 | 2005-11-10 | Zeon Corporation | 積層体、発光素子及びその使用 |
| KR100611652B1 (ko) * | 2004-06-28 | 2006-08-11 | 삼성에스디아이 주식회사 | 유기 전계 발광 표시 소자 및 그 제조방법 |
| DE112004002893A5 (de) * | 2004-06-30 | 2007-05-24 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Leuchtdiodenmatrix und Verfahren zum Herstellen einer Leuchtdiodenmatrix |
| US7535163B2 (en) * | 2006-02-22 | 2009-05-19 | Tpo Displays Corp. | System for displaying images including electroluminescent device and method for fabricating the same |
| JP4893392B2 (ja) * | 2007-03-15 | 2012-03-07 | ソニー株式会社 | 表示装置および電子機器 |
| US8188506B2 (en) * | 2008-09-30 | 2012-05-29 | Lg Innotek Co., Ltd. | Semiconductor light emitting device |
| KR101097321B1 (ko) * | 2009-12-14 | 2011-12-23 | 삼성모바일디스플레이주식회사 | 유기 발광 장치 및 이의 제조 방법 |
| JP4996706B2 (ja) * | 2010-03-03 | 2012-08-08 | 株式会社東芝 | 半導体発光素子およびその製造方法 |
| US9520536B2 (en) * | 2010-11-18 | 2016-12-13 | Seoul Viosys Co., Ltd. | Light emitting diode chip having electrode pad |
| KR20140066974A (ko) * | 2011-09-26 | 2014-06-03 | 파나소닉 주식회사 | 발광 장치의 제조 방법 및 발광 장치 |
| US9093665B2 (en) * | 2011-10-19 | 2015-07-28 | Semiconductor Energy Laboratory Co., Ltd. | Light-emitting module and method for manufacturing the same |
| EP2685515A1 (en) * | 2012-07-12 | 2014-01-15 | Nederlandse Organisatie voor toegepast -natuurwetenschappelijk onderzoek TNO | Method and system for dividing a barrier foil |
| KR101941661B1 (ko) * | 2012-09-04 | 2019-01-24 | 삼성디스플레이 주식회사 | 유기 발광 표시 장치 및 이의 제조방법 |
| JP6204012B2 (ja) * | 2012-10-17 | 2017-09-27 | 株式会社半導体エネルギー研究所 | 発光装置 |
| JP6124584B2 (ja) * | 2012-12-21 | 2017-05-10 | 株式会社半導体エネルギー研究所 | 発光装置及びその製造方法 |
| JP6104649B2 (ja) * | 2013-03-08 | 2017-03-29 | 株式会社半導体エネルギー研究所 | 発光装置 |
| CN104659070B (zh) * | 2015-03-13 | 2018-11-16 | 上海天马有机发光显示技术有限公司 | 一种显示面板、显示装置及显示面板的制造方法 |
| KR102394427B1 (ko) * | 2015-04-02 | 2022-05-04 | 엘지디스플레이 주식회사 | 유기발광표시장치 및 이를 제조하는 방법 |
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2021
- 2021-11-02 TW TW110140685A patent/TW202226641A/zh unknown
- 2021-11-18 WO PCT/JP2021/042354 patent/WO2022113864A1/ja not_active Ceased
- 2021-11-18 US US18/033,991 patent/US20230397474A1/en active Pending
- 2021-11-18 JP JP2022565277A patent/JP7703569B2/ja active Active
- 2021-11-18 DE DE112021006118.6T patent/DE112021006118T5/de active Pending
- 2021-11-18 CN CN202180078265.1A patent/CN116472572A/zh active Pending
- 2021-11-18 KR KR1020237015504A patent/KR20230107231A/ko active Pending
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Also Published As
| Publication number | Publication date |
|---|---|
| KR20230107231A (ko) | 2023-07-14 |
| US20230397474A1 (en) | 2023-12-07 |
| WO2022113864A1 (ja) | 2022-06-02 |
| CN116472572A (zh) | 2023-07-21 |
| JPWO2022113864A1 (https=) | 2022-06-02 |
| JP7703569B2 (ja) | 2025-07-07 |
| TW202226641A (zh) | 2022-07-01 |
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