CN116344415A - Substrate processing apparatus and substrate processing method - Google Patents

Substrate processing apparatus and substrate processing method Download PDF

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Publication number
CN116344415A
CN116344415A CN202211615722.9A CN202211615722A CN116344415A CN 116344415 A CN116344415 A CN 116344415A CN 202211615722 A CN202211615722 A CN 202211615722A CN 116344415 A CN116344415 A CN 116344415A
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China
Prior art keywords
substrate
roller
transfer
suction
processing apparatus
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CN202211615722.9A
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Chinese (zh)
Inventor
李柱荣
洪忠吾
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Semes Co Ltd
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Semes Co Ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67742—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
    • H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67253—Process monitoring, e.g. flow or thickness monitoring
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67276—Production flow monitoring, e.g. for increasing throughput
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67706—Mechanical details, e.g. roller, belt
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/6776—Continuous loading and unloading into and out of a processing chamber, e.g. transporting belts within processing chambers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67784—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations using air tracks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Robotics (AREA)
  • Automation & Control Theory (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

The invention discloses a substrate processing device, comprising: a suspension stage capable of suspending the substrate; an adsorption transfer member that can adsorb an edge portion of the substrate and can transfer the substrate above the levitation table; a roller transfer member that may be disposed adjacent to the levitation table and that may transfer the substrate from the levitation table; at least one lifting member which may be disposed between the levitation table and the roller transfer member, and which may transfer the substrate from the adsorption transfer member onto the roller transfer member; and a control part that can adjust a time point at which the substrate is separated from the suction conveying part, a time point at which the at least one lifting part is lifted and lowered, and a time point at which the roller conveying part is started.

Description

Substrate processing apparatus and substrate processing method
Cross Reference to Related Applications
The present application claims priority from korean patent application No. 10-2021-0187015 filed in the korean intellectual property agency on day 12 and 24 of 2021.
Technical Field
Exemplary embodiments of the present invention relate to a substrate processing apparatus and a substrate processing method. More particularly, exemplary embodiments of the present invention relate to a substrate processing apparatus including an adsorption transfer member that is capable of adsorbing an edge portion of a substrate and transferring the substrate over a levitation table when a substrate processing process is performed, and a substrate processing method using the same.
Background
A manufacturing process for a display device, such as an Organic Light Emitting Display (OLED) device or a quantum dot display (QLED) device, may generally include a substrate processing process of providing a liquid chemical including a photoresist solution to a substrate.
The substrate processing step may be performed in a state where the substrate is suspended above the levitation table. In this case, the transfer member may adsorb the substrate and transfer the substrate above the suspension table. The substrate removed from the levitation table may be substantially continuously transferred by using a roller. The transfer member may release the suction of the substrate when a portion of the substrate is placed on the roller. However, when the substrate moves onto the roller immediately after the suction of the substrate is released from the transfer member, the substrate may not be completely separated from the transfer member due to static electricity and/or mirroring between the transfer member sucking the lower surface of the substrate and the substrate. As a result, the substrate may be damaged, and the substrate may be damaged when the rollers convey the substrate.
Disclosure of Invention
Technical problem to be solved
An aspect of the present invention provides a substrate processing apparatus capable of accurately separating a substrate from a suction member sucking a rear edge of the substrate in a process of continuously transferring the substrate removed from a levitation table by driving of rollers.
Another aspect of the present invention provides a substrate processing method capable of accurately separating a substrate from a suction member sucking a rear edge of the substrate in a process of continuously transferring the substrate removed from a levitation table by driving of a roller.
Still another aspect of the present invention provides a substrate processing apparatus that accurately separates a substrate from an adsorption member that adsorbs a rear edge of the substrate in a process of continuously transferring the substrate removed from a levitation table by driving of a roller while performing a liquid chemical discharging process.
Solution method
According to an aspect of the present invention, there is provided a substrate processing apparatus, which may include: a suspension stage capable of suspending the substrate; an adsorption transfer member that can adsorb an edge portion of the substrate and can transfer the substrate above the levitation table; a roller transfer member that may be disposed adjacent to the levitation table and that may transfer the substrate from the levitation table; at least one lifting member which may be disposed between the levitation table and the roller transfer member, and which may transfer the substrate from the adsorption transfer member onto the roller transfer member; and a control part that can adjust a time point at which the substrate is separated from the suction conveying part, a time point at which the at least one lifting part is lifted and lowered, and a time point at which the roller conveying part is started.
In an exemplary embodiment, the levitation table may levitate the substrate by supplying air to a lower surface of the substrate.
In an exemplary embodiment, the adsorption transfer member may adsorb an edge portion of the lower surface of the substrate in a vacuum adsorption manner.
In an exemplary embodiment, the adsorption transfer member may include: an adsorption member that can adsorb an edge portion of a lower surface of the substrate in a vacuum adsorption manner; a guide rail which may be arranged along a side of the levitation table to provide a path for the suction element to move; and a driving member that moves the suction member along the guide rail.
In an exemplary embodiment, the at least one lifting member may include: a first elevation member which may be disposed adjacent to the suspension table; and a second elevating member which may be disposed adjacent to the roller transfer member. The first elevation member may include a plurality of pins that may pass through the suspension table to contact the lower surface of the substrate and raise and lower the substrate. The second elevating member may elevate and lower the roller of the roller transfer member to bring the roller of the roller transfer member into contact with the lower surface of the substrate.
According to another aspect of the present invention, a substrate processing method is provided. In the substrate processing method, an edge portion of the substrate may be suctioned by the suction transfer member, and the substrate may be transferred over the levitation table. The liquid chemical supply process may be performed on the substrate during the transfer of the substrate by the liquid chemical supply part. The substrate may be transferred from the levitation table onto the roller transfer member by at least one lifting member. The timing of separating the substrate from the suction conveying member, the timing of raising and lowering of the at least one lifting member, and the timing of starting the roller conveying member may be adjusted by the control member.
In an exemplary embodiment, the substrate may be levitated by supplying air to a lower surface of the substrate by a levitation table.
In an exemplary embodiment, an edge portion of the lower surface of the substrate may be adsorbed in a vacuum adsorption manner by the adsorption transfer member.
In an exemplary embodiment, the at least one lifting member may include: a first elevation member which may be disposed adjacent to the suspension table; and a second elevating member which may be disposed adjacent to the roller transfer member. The plurality of pins of the first elevating member may contact the lower surface of the substrate through the suspension table to raise and lower the substrate. The second elevating member may elevate and lower the roller of the roller transfer member to bring the roller of the roller transfer member into contact with the lower surface of the substrate.
According to still another aspect of the present invention, there is provided a substrate processing apparatus that may include a suspension table, a liquid chemical supply part, an adsorption transfer part, a roller transfer part, at least one lifting part, and a control part. The suspension stage may include: a loading table for loading a substrate; a liquid chemical supply stage for supplying a liquid chemical onto the substrate; and an unloading stage for removing the substrate. The liquid chemical supply part may discharge the liquid chemical onto the substrate passing over the liquid chemical supply table. The suction transfer member may suction an edge portion of the substrate, and may transfer the substrate over the levitation table. The roller transfer member may be disposed adjacent to the unloading stage, and may transfer the substrate from the unloading stage. At least one lifting member may be disposed between the unloading stage and the roller transfer member, and may transfer the substrate from the suction transfer member onto the roller transfer member. The control part may adjust a time point at which the substrate is separated from the suction conveying part, a time point at which the at least one lifting part is lifted and lowered, and a time point at which the roller conveying part is started.
In an exemplary embodiment, the loading stage and the unloading stage may each supply air to the lower surface of the substrate to suspend the substrate, and the liquid chemical supply stage may supply air and vacuum to the lower surface of the substrate to suspend the substrate.
In an exemplary embodiment, the adsorption transfer member may adsorb an edge portion of the lower surface of the substrate in a vacuum adsorption manner.
In an exemplary embodiment, the adsorption transfer member may include: an adsorption member that can adsorb an edge portion of a lower surface of the substrate by vacuum adsorption; a guide rail which may be arranged along a side of the levitation table to provide a path for the suction element to move; and a driving member that moves the suction member along the guide rail.
In an exemplary embodiment, the at least one lifting member may include: a first elevating member disposed adjacent to the suspension table; and a second elevating member disposed adjacent to the roller transfer member.
In an exemplary embodiment, the first elevation member may include a plurality of pins that contact the lower surface of the substrate through the suspension table to raise and lower the substrate. The second elevating member may elevate and lower the roller of the roller transfer member to bring the roller of the roller transfer member into contact with the lower surface of the substrate.
Advantageous effects
In the substrate transfer apparatus according to an exemplary embodiment of the present invention, the substrate may be precisely separated from the adsorption transfer part, and the adsorption transfer part may adsorb and transfer an edge portion of a lower surface of the substrate by using at least one lifting part and a control part. Therefore, the substrate can be accurately and safely transferred from the suction transfer member to the roller transfer member without damaging or damaging the substrate. Accordingly, reliability and yield of a display device manufactured using the substrate can be improved.
However, the effects of the present invention are not limited to the above, and various extensions can be made without departing from the spirit and scope of the present invention.
Drawings
Fig. 1 is a schematic cross-sectional view for explaining a substrate processing apparatus according to an exemplary embodiment of the present invention.
Fig. 2 is a schematic plan view for explaining an adsorption transfer member of a substrate processing apparatus according to an exemplary embodiment of the present invention.
Fig. 3 and 4 are schematic cross-sectional views for explaining a lifting part of a substrate processing apparatus according to an exemplary embodiment of the present invention.
Detailed Description
Hereinafter, exemplary embodiments of the present invention will be described. The present invention is capable of various modifications and various forms, and embodiments thereof are described in detail below. The invention is not limited to the disclosed forms, however, but is to be understood to cover all modifications, equivalents and/or alternatives falling within the spirit and technical scope of the invention. In describing the drawings, like reference numerals are used to describe like components. The terms first, second, etc. may be used to describe various components, but the components are not limited by the terms. The above terms are used only for the purpose of distinguishing one component from another component. The terminology used in the present application is for the purpose of describing exemplary embodiments only and is not intended to be limiting of the invention. Unless the context clearly indicates otherwise, singular forms of expression include plural forms of expression. It should be understood that in this application, the terms "comprises," "comprising," "having," "including," and the like are used to specify the presence of stated features, integers, steps, operations, elements, components, or groups thereof, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, or groups thereof.
Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. Terms such as those defined in commonly used dictionaries should be interpreted as having a meaning that is consistent with their meaning in the context of the relevant art and will not be interpreted in an idealized or overly formal sense unless expressly so defined herein.
Fig. 1 is a schematic cross-sectional view for explaining a substrate processing apparatus according to an exemplary embodiment of the present invention. Fig. 2 is a schematic plan view for explaining an adsorption transfer member of a substrate processing apparatus according to an exemplary embodiment of the present invention. Fig. 3 and 4 are schematic cross-sectional views for explaining a lifting part of a substrate processing apparatus according to an exemplary embodiment of the present invention.
Referring to fig. 1 to 4, the substrate processing apparatus 100 according to the exemplary embodiment may be applied to a liquid chemical supply process for supplying a liquid chemical including a photoresist solution or red (R), green (G), and blue (B) inks to a substrate 10 for manufacturing a display device such as an Organic Light Emitting Display (OLED) device or a quantum dot display (QLED) device.
The substrate processing apparatus 100 may include a suspension stage 11, a liquid chemical supply part 19, an adsorption transfer part 21, a roller transfer part 29, at least one lifting part 33, and a control part 31.
In an exemplary embodiment, the substrate processing apparatus 100 may perform a liquid chemical supply process on the substrate 10 in a state where the substrate 10 is suspended above the suspension stage 11. In the liquid chemical supply process, when the substrate 10 is bent downward to contact the suspension table 11, the substrate 10 may be damaged or the transfer of the substrate 10 may be blocked. Accordingly, the substrate processing apparatus 100 may perform a liquid chemical supply process on the substrate 10 in a state where the substrate 10 is suspended above the levitation table 11, and transfer the substrate 10. For this reason, the suction conveying member 21 may suction an edge portion of the substrate 10, and may convey the substrate 10 above the levitation table 11. Further, after the liquid chemical supply process is completed, the substrate 10 may be placed from the adsorption transfer member 21 onto the roller transfer member 29.
As shown in fig. 1, the levitation stage 11 may include a loading stage 13, a liquid chemical supply stage 15, and an unloading stage 17. The substrate 10 may be placed on the loading stage 13 from the outside, a liquid chemical supply process may be performed on the substrate 10 above the liquid chemical supply stage 15, and the substrate 10 may be placed on the roller transfer member 29 through the unloading stage 17.
In the liquid chemical supply process, the loading stage 13 and the unloading stage 17 may not require precise height control, and the loading stage 13 and the unloading stage 17 may suspend the substrate 10 above them by spraying air onto the lower surface of the substrate 10. On the other hand, the liquid chemical supply stage 15 may require relatively precise height control during the liquid chemical supply process, and the liquid chemical supply stage 15 may provide air and vacuum to the lower surface of the substrate 10 to suspend the substrate 10 to a precise position thereabove.
As shown in fig. 1, the liquid chemical supply part 19 may be located at a predetermined position above the liquid chemical supply stage 15. The liquid chemical supply part 19 may supply liquid chemical onto the substrate 10, for example, in an inkjet manner. In this case, the liquid chemical supply part 19 may include a plurality of nozzles arranged at substantially constant intervals. During the liquid chemical supply process performed on the substrate 10, the liquid chemical supply part 19 may discharge the liquid chemical onto the substrate 10 passing over the liquid chemical supply table 15 at a predetermined speed.
In an exemplary embodiment, the adsorption transfer member 21 may transfer the substrate 10 above the loading table 13, the liquid chemical supply table 15, and the unloading table 17. In this case, for example, the suction conveying member 21 may suction an edge portion of the substrate 10 to convey the substrate 10 at a predetermined position above the levitation table 11. For example, the suction conveying member 21 may suction an edge portion of the lower surface of the substrate 10 by a vacuum suction manner.
According to an exemplary embodiment, as shown in fig. 2, the suction conveying member 21 may include a suction member 23, a guide rail 25, and a driving member 27. The suction member 23 may vacuum-suck an edge portion of the substrate 10, and the guide rail 25 may be disposed along a side portion of the levitation table 11, and may guide the transfer of the substrate 10 over the levitation table 11. Further, the driving member 27 may move the suction member 23 sucking the substrate 10 along the guide rail 25. Accordingly, the substrate processing apparatus 100 may transfer the substrate 10 in a state where the substrate 10 is suspended above the levitation table 11, and may perform a liquid chemical supply process on the substrate 10.
In some exemplary embodiments, when a substrate having a relatively large size today is used, the substrate processing apparatus 100 may include two suction transfer members as described above to suction both side edge portions of the substrate. Here, the suction transfer members may vacuum-suck both side edge portions of the lower surface of the substrate, respectively.
Referring again to fig. 1, after the liquid chemical supply process is completed, the substrate 10 may be transferred from the unloading stage 17 onto the roller transfer part 29. The roller conveying member 29 may be disposed adjacent to the unloading stage 17, and the roller conveying member 29 may include a plurality of rollers arranged at substantially constant intervals. The substrate 10 may be transferred on the rollers of the roller transfer part 29 for a subsequent process step.
In some exemplary embodiments, the substrate processing apparatus 100 may include an additional transfer member to load the substrate 10 onto the loading stage 13. In this case, the additional transfer member may be disposed adjacent to the loading table 13, and may include a plurality of rollers arranged at substantially constant intervals. That is, the additional conveying member may have a similar structure to the roller conveying member 29. Accordingly, in the substrate processing apparatus 100, the substrate 10 on which the previous predetermined process has been performed may be loaded onto the loading stage 13 using the additional transfer member, and the substrate 10 on which the liquid chemical supply process has been performed may be transferred from the unloading stage 17 using the roller transfer member 29 for the subsequent process.
When the substrate 10 is moved from the unloading stage 17 onto the roller conveying member 29, if the substrate 10 is placed on the roller conveying member 29 immediately after the suction of the substrate 10 is released from the suction conveying member 21, the substrate 10 may not be properly released from the suction conveying member 21 due to static electricity and/or mirroring that may occur between the suction conveying member 21 and the substrate 10. In other words, the substrate 10 may not be properly separated from the adsorption transfer member 21 due to static electricity and/or mirroring effects. As described above, in a state where the substrate 10 is not completely separated from the suction conveying member 21, when the substrate 10 is placed on the roller conveying member 29, the substrate 10 may be damaged or even the substrate 10 may be damaged since the rollers of the roller conveying member 29 pull the substrate 10. In order to solve such a problem, the substrate processing apparatus 100 has a structure in which at least one lifting member 33 can accurately separate the substrate 10 from the suction conveying member 21 in the process in which the substrate 10 removed from the levitation table 11 is conveyed onto the roller conveying member 29, and then can safely place the substrate 10 onto the roller conveying member 29.
In an exemplary embodiment, the substrate processing apparatus 100 may include a structure capable of lifting and lowering the substrate 10 when the substrate 10 is transferred from the levitation table 11 onto the roller transfer part 29.
As shown in fig. 3 and 4, the substrate processing apparatus 100 may include at least one elevation member 33, and the at least one elevation member 33 may include a first elevation member 35 and a second elevation member 37. Here, the first elevating member 35 may be disposed adjacent to the suspension table 11, and the second elevating member 37 may be disposed adjacent to the roller transfer member 29.
In an exemplary embodiment, the first elevating member 35 may safely separate the substrate 10 from the adsorption transfer member 21. For example, the first elevating member 35 may include a plurality of pins that pass through the unloading stage 17 to be in contact with the lower surface of the substrate 10, and the unloading stage 17 may have a plurality of through holes that respectively correspond to the plurality of pins. The pins of the first elevating member 35 may be raised so that the substrate 10 may be placed onto the unloading stage 17 from the suction conveying member 21, and the pins of the first elevating member 35 may be lowered so that the substrate 10 may be placed onto the roller conveying member 29 from the unloading stage 17. Further, the second elevating member 37 may elevate or lower the roller of the roller conveying member 29. In other words, the second elevating member 37 may elevate some of the rollers of the roller transfer member 29 so that the substrate 10 is placed onto the unloading stage 17 from the suction transfer member 21, and lower some of the rollers so that the substrate 10 is placed onto the roller transfer member 29 from the unloading stage 17. For example, the second elevating member 37 may have a cylinder structure in contact with the roller of the roller conveying member 29.
In another exemplary embodiment, the second elevating member 37 may have a similar structure to the first elevating member 35. For example, the second elevating member 37 may include a plurality of pins contacting the lower surface of the substrate 10. Accordingly, the pins of the second elevating member 37 may be raised so that the substrate 10 is placed onto the unloading stage 17 from the suction conveying member 21, and the pins of the second elevating member 37 may be lowered so that the substrate 10 is placed onto the roller conveying member 29 from the unloading stage 17.
As described above, the substrate processing apparatus 100 may include the first and second elevating members 35 and 37, and the substrate 10 may be safely placed on the unloading stage 17 from the adsorption conveying member 21 by the first and second elevating members 35 and 37, and then may be stably conveyed from the unloading stage 17 to the roller conveying member 29. Therefore, the substrate 10 can be safely transferred from the suction transfer member 21 to the roller transfer member 29 without damaging or damaging the substrate 10. The substrate 10 placed on the roller transfer part 29 may be transferred to a predetermined position by the roller transfer part 29 to perform a subsequent process.
The control part 31 may adjust a time point at which the substrate 10 is separated from the suction transporting part 21, a time point at which the first and second elevating parts 35 and 37 are elevated and lowered, and a time point at which the roller transporting part 29 is started during the transportation of the substrate 10 from the suction transporting part 21 onto the roller transporting part 29. For example, the control part 31 may cause the suction conveying part 21 to release suction of the substrate 10 after the first and second elevating parts 35 and 37 are elevated, and may activate the roller conveying part 29 after the first and second elevating parts 35 and 37 are lowered. In this case, by precisely controlling the point in time at which the substrate 10 is separated from the suction conveying member 21, static electricity and/or a mirror phenomenon that may occur between the substrate 10 and the suction conveying member 21 can be effectively prevented. Therefore, after the liquid chemical supply process for the substrate 10 is completed, the substrate 10 can be accurately and safely transferred from the levitation table 11 onto the roller transfer part 29.
The substrate processing apparatus having the above-described structure can be advantageously applied to a manufacturing process of today's display devices such as Organic Light Emitting Display (OLED) devices, quantum dot light emitting display (QLED) devices, and the like.
While the exemplary embodiments of the present invention have been described above, it will be understood by those skilled in the art that various modifications and changes may be made thereto without departing from the spirit and scope of the present invention as set forth in the appended claims.

Claims (16)

1. A substrate processing apparatus comprising:
a suspension stage configured to suspend the substrate;
an adsorption transfer member for adsorbing an edge portion of the substrate and transferring the substrate over the suspension table;
a roller transfer member disposed adjacent to the levitation table and configured to transfer the substrate from the levitation table;
at least one lifting member disposed between the suspension table and the roller transfer member and configured to transfer the substrate from the suction transfer member onto the roller transfer member; and
and a control part for adjusting a time point at which the substrate is separated from the suction conveying part, a time point at which the at least one lifting part is lifted and lowered, and a time point at which the roller conveying part is started.
2. The substrate processing apparatus of claim 1, wherein the levitation table levitates the substrate by supplying air to a lower surface of the substrate.
3. The substrate processing apparatus according to claim 1, wherein the suction conveying member suctions an edge portion of a lower surface of the substrate in a vacuum suction manner.
4. The substrate processing apparatus according to claim 3, wherein the adsorption transfer member comprises:
an adsorption member that adsorbs an edge portion of a lower surface of the substrate in a vacuum adsorption manner;
a guide rail disposed along a side of the levitation table to provide a path along which the suction member moves; and
and the driving element moves the adsorption element along the guide rail.
5. The substrate processing apparatus of claim 1, wherein the at least one lifting member comprises:
a first elevating member disposed adjacent to the levitation table; and
a second elevating member disposed adjacent to the roller conveying member.
6. The substrate processing apparatus according to claim 5, wherein the first elevating member includes a plurality of pins that pass through the levitation table to contact the lower surface of the substrate to raise and lower the substrate, and the second elevating member raises and lowers the roller of the roller conveying member to contact the roller of the roller conveying member with the lower surface of the substrate.
7. A substrate processing method, wherein,
adsorbing an edge portion of a substrate by an adsorption transfer member and transferring the substrate over a suspension table;
performing a liquid chemical supply process on the substrate during the transfer of the substrate by a liquid chemical supply part;
transferring the substrate from the levitation table onto a roller transfer part by at least one lifting part;
the timing of separating the substrate from the suction conveying member, the timing of raising and lowering the at least one lifting member, and the timing of activating the roller conveying member are regulated by a control member.
8. The substrate processing method according to claim 7, wherein the levitation table levitates the substrate by supplying air to a lower surface of the substrate.
9. The substrate processing method according to claim 7, wherein the suction transfer member sucks an edge portion of a lower surface of the substrate in a vacuum suction manner.
10. The substrate processing method of claim 7, wherein the at least one lift member comprises: a first elevating member disposed adjacent to the levitation table; and a second elevating member disposed adjacent to the roller conveying member, and
the plurality of pins of the first elevating member pass through the levitation table to contact the lower surface of the substrate to elevate and lower the substrate, and the second elevating member elevates and lowers the roller of the roller transfer member to contact the roller of the roller transfer member with the lower surface of the substrate.
11. A substrate processing apparatus comprising:
a suspension station comprising: a loading table for loading a substrate; a liquid chemical supply stage for supplying a liquid chemical onto the substrate; and an unloading stage for removing the substrate, the levitation stage levitating the substrate above it;
a liquid chemical supply part for discharging the liquid chemical onto the substrate passing over the liquid chemical supply table;
an adsorption transfer member configured to adsorb an edge portion of the substrate and transfer the substrate over the suspension table;
a roller transfer member disposed adjacent to the unloading stage and configured to transfer the substrate from the unloading stage;
at least one lifting member disposed between the unloading stage and the roller conveying member and configured to convey the substrate from the suction conveying member onto the roller conveying member; and
and a control part for adjusting a time point at which the substrate is separated from the suction conveying part, a time point at which the at least one lifting part is lifted and lowered, and a time point at which the roller conveying part is started.
12. The substrate processing apparatus of claim 11, wherein the loading stage and the unloading stage each supply air to a lower surface of the substrate to suspend the substrate, and the liquid chemical supply stage supplies air and vacuum to the lower surface of the substrate to suspend the substrate.
13. The substrate processing apparatus according to claim 11, wherein the suction conveying member suctions an edge portion of a lower surface of the substrate in a vacuum suction manner.
14. The substrate processing apparatus according to claim 13, wherein the adsorption transfer member comprises:
an adsorption element for adsorbing an edge portion of a lower surface of the substrate by vacuum adsorption;
a guide rail disposed along a side of the levitation table to provide a path along which the suction member moves; and
and the driving element moves the adsorption element along the guide rail.
15. The substrate processing apparatus according to claim 11, wherein,
the at least one lifting member includes: a first elevating member disposed adjacent to the levitation table; and a second elevating member disposed adjacent to the roller transfer member.
16. The substrate processing apparatus according to claim 15, wherein the first elevating member includes a plurality of pins that pass through the levitation table to contact the lower surface of the substrate to raise and lower the substrate, and the second elevating member raises and lowers the roller of the roller conveying member to contact the roller of the roller conveying member with the lower surface of the substrate.
CN202211615722.9A 2021-12-24 2022-12-15 Substrate processing apparatus and substrate processing method Pending CN116344415A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1020210187015A KR20230097481A (en) 2021-12-24 2021-12-24 Apparatus for processing substrate and method for processing substrate
KR10-2021-0187015 2021-12-24

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Publication Number Publication Date
CN116344415A true CN116344415A (en) 2023-06-27

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