JP2011066369A - Placing mechanism, method for transporting dicing frame-attached wafer and program for wafer transport used for the transporting method - Google Patents

Placing mechanism, method for transporting dicing frame-attached wafer and program for wafer transport used for the transporting method Download PDF

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JP2011066369A
JP2011066369A JP2009218245A JP2009218245A JP2011066369A JP 2011066369 A JP2011066369 A JP 2011066369A JP 2009218245 A JP2009218245 A JP 2009218245A JP 2009218245 A JP2009218245 A JP 2009218245A JP 2011066369 A JP2011066369 A JP 2011066369A
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wafer
mounting table
dicing frame
mounting
pins
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JP5356962B2 (en
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Munetoshi Nagasaka
旨俊 長坂
Ikuo Ogasawara
郁男 小笠原
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Tokyo Electron Ltd
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Tokyo Electron Ltd
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Priority to KR1020100090510A priority patent/KR101231428B1/en
Priority to CN2010102876322A priority patent/CN102024730B/en
Priority to TW099131857A priority patent/TWI552252B/en
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
    • H01L21/7806—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices involving the separation of the active layers from a substrate

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method for transporting dicing frame-attached wafers, capable of suppressing delamination charging between a placing pedestal and a sheet in an initial step of transporting the dicing frame-attached wafers from the placing pedestal. <P>SOLUTION: This method for transporting dicing frame-attached wafers includes: a first step of using a hoisting and lowering mechanism to lower the placing pedestal 11 at a first predetermined speed, thereby allowing a first acting body 13 to act to a plurality of supports 12 to move up a dicing frame DF at the first speed so that a sheet F securing the wafers W is separated from the placing pedestal 11 to a first position; and a second step of using the hoisting and lowering mechanism to lower the placing pedestal 11 at a second predetermined speed higher than the first speed, thereby allowing the first acting body 13 to act to a plurality of supports 12 to move up the dicing frame DF at the second speed so that the sheet F securing the wafers W is separated from the placing pedestal 11 to a second position. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

本発明は、ダイシングフレーム付きウエハを載置する載置機構、ダイシングフレーム付きウエハの搬送方法及び搬送方法に用いられるウエハ搬送用プログラムに関し、更に詳しくは、載置機構にダイシングフレーム付きウエハを載置し、ウエハの電気的特性検査を行った後、ダイシングフレーム付きウエハを載置機構から剥離する際に発生する剥離帯電を抑制することができる載置機構、ダイシングフレーム付きウエハの搬送方法及びこの搬送方法に用いられるウエハ搬送用プログラムに関するものである。   The present invention relates to a mounting mechanism for mounting a wafer with a dicing frame, a transfer method for a wafer with a dicing frame, and a wafer transfer program used in the transfer method, and more particularly, to mount a wafer with a dicing frame on the mounting mechanism. Then, after carrying out the electrical characteristic inspection of the wafer, a mounting mechanism capable of suppressing peeling electrification generated when the wafer with the dicing frame is peeled from the mounting mechanism, a method for transporting the wafer with the dicing frame, and this transport The present invention relates to a wafer transfer program used in the method.

半導体製造工程で製造されたデバイスの検査方法として、例えば、複数のデバイスが形成されたウエハを検査装置に供給し、ウエハ状態のまま各デバイスの電気的特性検査を行う方法がある。この種の検査装置は、例えば、ウエハをカセット単位で収納し、検査のためにウエハを搬送するローダ室と、ローダ室からウエハを受け取ってウエハの電気的特性検査を行うプローバ室と、を備えている。   As a method for inspecting a device manufactured in a semiconductor manufacturing process, for example, there is a method in which a wafer on which a plurality of devices are formed is supplied to an inspection apparatus, and an electrical characteristic inspection of each device is performed in the wafer state. This type of inspection apparatus includes, for example, a loader chamber for storing wafers in units of cassettes and transporting the wafers for inspection, and a prober chamber for receiving wafers from the loader chamber and inspecting electrical characteristics of the wafers. ing.

ローダ室は、ウエハを搬送するためのウエハ搬送機構と、ウエハの向きを一定方向に揃えるためのプリアライメント機構と、を備え、ウエハ搬送機構がウエハをプローバ室へ搬送する途中でプリアライメント機構によってウエハを一定の向きに揃えた後、ウエハをプローバ室へ引き渡す。プローバ室は、ウエハを載置する移動可能な載置台と、載置台の上方に配置されたプローブカードと、ウエハの電極パッドとプローブカードのプローブとの位置を合わせるアライメント機構と、を備え、載置台とアライメント機構が協働して載置台上のウエハとプローブカードとの位置を合わせた後、載置台を移動させてウエハとプローブカードとを電気的に接触させてウエハの電気的特性検査を行った後、ウエハをローダ室へ返す。   The loader chamber includes a wafer transport mechanism for transporting the wafer and a pre-alignment mechanism for aligning the orientation of the wafer in a certain direction, and the wafer transport mechanism moves the wafer to the prober chamber by the pre-alignment mechanism. After aligning the wafer in a certain direction, the wafer is delivered to the prober chamber. The prober chamber includes a movable mounting table for mounting a wafer, a probe card disposed above the mounting table, and an alignment mechanism for aligning the position of the electrode pad of the wafer and the probe of the probe card. After the mounting table and the alignment mechanism cooperate to align the position of the wafer and the probe card on the mounting table, the mounting table is moved so that the wafer and the probe card are brought into electrical contact with each other to inspect the electrical characteristics of the wafer. After that, the wafer is returned to the loader chamber.

近年、デバイスの微細化及び薄型化に伴ってダイシングフレーム付きウエハを検査装置に供給し、ウエハの電気的特性検査を行うことがある。ここで、ダイシングフレーム付きウエハとは、ダイシングフレームのシート上に粘着固定されたウエハのことを云う。ダイシングフレーム付きウエハには例えば図３に示す載置機構が使用される。   In recent years, with the miniaturization and thinning of devices, a wafer with a dicing frame is supplied to an inspection apparatus, and the electrical characteristics of the wafer are inspected. Here, the wafer with a dicing frame refers to a wafer that is adhesively fixed on a sheet of the dicing frame. For example, a mounting mechanism shown in FIG. 3 is used for the wafer with the dicing frame.

そこで、図３の（ａ）〜（ｃ）に基づいてダイシングフレーム付きウエハの検査に使用される載置機構について説明する。尚、図３の（ａ）〜（ｃ）は載置機構を使用してウエハの検査をした後、ダイシングフレーム付きウエハＤＦＷを載置機構からローダ室へ搬送する方法の初期段階を示している。この載置機構は、図３に示すように、ダイシングフレーム付きウエハＤＦＷを載置する載置台１と、載置台１の外周面に沿って所定間隔を空けて取り付けられた複数のシリンダ機構２と、を備えている。シリンダ機構２は、シリンダ本体２Ａと、シリンダ本体２Ａの上面において伸縮するロッド２Ｂと、ロッド先端に形成され且つダイシングフレームＤＦを吸着固定する受け部２Ｃと、を有している。そして、ウエハＷの検査時には、ウエハＷはシートＦを介して載置台１の載置面上に吸着固定され、ダイシングフレームＤＦはシリンダ機構２のロッド２Ａが最も縮んだ時の受け部２Ａに吸着固定されている。   Therefore, a mounting mechanism used for inspecting a wafer with a dicing frame will be described with reference to FIGS. 3A to 3C show an initial stage of a method for carrying the wafer DFW with a dicing frame from the mounting mechanism to the loader chamber after inspecting the wafer using the mounting mechanism. . As shown in FIG. 3, the mounting mechanism includes a mounting table 1 on which a wafer DFW with a dicing frame is mounted, and a plurality of cylinder mechanisms 2 attached at predetermined intervals along the outer peripheral surface of the mounting table 1. It is equipped with. The cylinder mechanism 2 includes a cylinder body 2A, a rod 2B that expands and contracts on the upper surface of the cylinder body 2A, and a receiving portion 2C that is formed at the tip of the rod and that fixes the dicing frame DF by suction. When the wafer W is inspected, the wafer W is sucked and fixed onto the mounting surface of the mounting table 1 via the sheet F, and the dicing frame DF is sucked to the receiving portion 2A when the rod 2A of the cylinder mechanism 2 is most contracted. It is fixed.

而して、検査後にウエハＷを載置台１からローダ室側へ搬送する際に、ダイシングフレーム付きウエハＤＦＷをウエハ搬送機構へ引き渡すために、ウエハＷを載置台１の載置面から一定の寸法だけ持ち上げる。この際、シリンダ機構２が駆動して図３の（ａ）に示す状態からロッド２Ｂを伸ばし受け部２Ｃの受け面が、同図の（ｂ）に示す載置台１の載置面の高さを越え、更にロッド２Ｂが延びるとダイシングフレーム付きウエハＤＦＷのシートＦが載置面から剥離し、所定の寸法だけ離間して停止する。この時のウエハＷと載置面の間にできる隙間にウエハ搬送機構のアームが進出し、アームによってダイシングフレーム付きウエハＤＦＷをローダ室側へ搬送する。   Thus, when the wafer W is transferred from the mounting table 1 to the loader chamber side after the inspection, the wafer W is transferred from the mounting surface of the mounting table 1 to a certain size so as to deliver the wafer DFW with a dicing frame to the wafer transfer mechanism. Just lift up. At this time, the cylinder mechanism 2 is driven to extend the rod 2B from the state shown in FIG. 3A, and the receiving surface of the receiving portion 2C is the height of the mounting surface of the mounting table 1 shown in FIG. If the rod 2B further extends, the sheet F of the wafer DFW with a dicing frame is peeled off from the mounting surface, and is stopped after being separated by a predetermined dimension. At this time, the arm of the wafer transfer mechanism advances into the gap formed between the wafer W and the mounting surface, and the wafer DFW with a dicing frame is transferred to the loader chamber side by the arm.

しかしながら、図３の（ｂ）から（ｃ）に示すようにシリンダ機構２によってダイシングフレーム付きウエハを持ち上げてウエハＷを載置台１の載置面から剥離する時にシートＦに剥離帯電が発生し、その時の静電気でウエハＷのデバイスの配線構造が損傷する虞があった。このような事態を避けるためにイオナイザーを用いてイオンを同図に矢印Ａで示すように照射してシートＦでの帯電量を軽減しているが、十分でないことがある。尚、この時の剥離帯電量は３ＫＶ〜５ＫＶ程度に達することがある。   However, as shown in FIGS. 3B to 3C, when the wafer with the dicing frame is lifted by the cylinder mechanism 2 and the wafer W is peeled from the mounting surface of the mounting table 1, peeling charge is generated on the sheet F, There is a possibility that the wiring structure of the device on the wafer W may be damaged by static electricity at that time. In order to avoid such a situation, an ionizer is used to irradiate ions as indicated by an arrow A in the figure to reduce the amount of charge on the sheet F, but this may not be sufficient. At this time, the peel charge amount may reach about 3 KV to 5 KV.

剥離帯電を軽減する方法は、例えば特許文献１、２に記載されている。特許文献１には載置部から板状部材を移動させる際に、載置部を励振させることによって生じる音波の放射圧を利用して板状部材を載置部から浮揚させて板状部材の剥離帯電を抑制する方法について記載されている。しかしながら、この方法は、音波に放射圧を発生させる機構が複雑である。また、特許文献２には除電器を使用しながら、昇降部材を用いて基板の少なくとも一部がステージから離れた第１の停止位置で基板の上昇を停止させ、少なくとも一回、第１の停止位置よりも高い第２の停止位置で基板の上昇を停止させることにより、基板での剥離帯電を軽減する方法が記載されている。この方法は簡便であるが、この特許文献１にはダイシングフレーム付きウエハを載置面から剥離する方法について何ら言及されていない。尚、特許文献１にも特許文献２と同様にダイシングフレーム付きウエハについて言及されていない。   For example, Patent Documents 1 and 2 describe methods for reducing the peeling charge. In Patent Document 1, when moving a plate-shaped member from the mounting portion, the plate-shaped member is levitated from the mounting portion using the radiation pressure of sound waves generated by exciting the mounting portion. A method for suppressing peeling charge is described. However, this method has a complicated mechanism for generating radiation pressure in sound waves. Further, in Patent Document 2, while using a static eliminator, the raising and lowering member is used to stop the raising of the substrate at a first stop position where at least a part of the substrate is separated from the stage, and at least once the first stop is performed. A method is described in which the peeling charge on the substrate is reduced by stopping the rising of the substrate at a second stop position higher than the position. Although this method is simple, this Patent Document 1 does not mention any method for peeling the wafer with a dicing frame from the mounting surface. Incidentally, Patent Document 1 does not mention a wafer with a dicing frame as in Patent Document 2.

特開２００４−０６７３６９号公報JP 2004-067369 A 特開２００６−０４９３９１号公報JP 2006-043991 A

本発明は、上記課題を解決するためになされたもので、載置台からダイシングフレーム付きウエハを搬送する初期段階で載置台とシートの間で発生する剥離帯電を抑制することができる載置機構、ダイシングフレーム付きウエハの搬送方法及びこの搬送方法に用いられるウエハ搬送用プログラムを提供することを目的としている。   The present invention was made in order to solve the above-described problem, and a mounting mechanism that can suppress peeling electrification generated between the mounting table and the sheet at an initial stage of transporting a wafer with a dicing frame from the mounting table, It is an object of the present invention to provide a wafer transfer method with a dicing frame and a wafer transfer program used in the transfer method.

本発明者らは、ダイシングフレーム付きウエハを載置台から剥離する時の剥離帯電について検討した結果、従来の載置機構におけるシリンダ機構を用いてダイシングフレーム付きウエハを載置台から剥離する方法では、ダイシングフレーム付きウエハの上昇速度が不安定であり、上昇速度を任意に設定することができないため、剥離帯電量を十分に抑制できないことが判った。   As a result of studying peeling electrification when the wafer with a dicing frame is peeled from the mounting table, the present inventors have found that a method of peeling a wafer with a dicing frame from the mounting table by using a cylinder mechanism in a conventional mounting mechanism It has been found that the rising speed of the wafer with the frame is unstable and the rising speed cannot be set arbitrarily, so that the peel charge amount cannot be sufficiently suppressed.

本発明は、上記知見に基づいてなされたもので、請求項１に記載の載置機構は、ダイシングフレームのシートに固定されたウエハを載置する載置台と、上記載置台を昇降させる昇降駆動機構と、上記ダイシングフレームを下面から支持し且つ上記載置台の外周面に沿って所定間隔を空けて上記載置台に対して相対的に昇降可能に配置され複数の支持体と、上記載置台が下降する時に複数の上記支持体に作用して上記ダイシングフレームを持ち上げて上記ウエハが固定されたシートを上記載置台から離間させる第１の作用体と、を備え、コンピュータの制御下で上記昇降駆動機構を駆動制御することを特徴とするものである。   The present invention has been made on the basis of the above knowledge, and the mounting mechanism according to claim 1 includes a mounting table on which a wafer fixed to a sheet of a dicing frame is mounted, and a lifting drive that moves the mounting table up and down. A mechanism, a plurality of support members that support the dicing frame from the lower surface and that can be moved up and down relatively with respect to the mounting table at a predetermined interval along the outer peripheral surface of the mounting table; A first action body that acts on a plurality of the support bodies to lift the dicing frame and separates the sheet on which the wafer is fixed from the mounting table when lowered, and is driven to move up and down under the control of a computer The mechanism is driven and controlled.

また、本発明の請求項２に記載の載置機構は、請求項１に記載の発明において、上記複数の支持体は、上記載置台の外周面に上下方向に固定されたガイド部材と係合する係合部を有することを特徴とするものである。   According to a second aspect of the present invention, in the first aspect of the present invention, the plurality of supports are engaged with a guide member fixed in the vertical direction on the outer peripheral surface of the mounting table. It has the engaging part to do.

また、本発明の請求項３に記載の載置機構は、請求項１または請求項２に記載の発明において、上記載置台に形成された複数の貫通孔に昇降自在に懸垂されて下端が上記載置台の下面から突出する複数のピンと、上記複数のピンに対応して設けられ且つ上記載置台と一緒に下降する上記複数のピンに作用して上記複数のピンを上記載置台の載置面から突出させる第２の作用体と、を備えたことを特徴とするものである。   According to a third aspect of the present invention, there is provided a mounting mechanism according to the first or second aspect, wherein the mounting mechanism is suspended from a plurality of through holes formed in the mounting table so that the lower end is raised. A plurality of pins projecting from the lower surface of the mounting table and the plurality of pins provided corresponding to the plurality of pins and descending together with the mounting table to act as the mounting surface of the mounting table And a second action body protruding from the head.

また、本発明の請求項４に記載のダイシングフレーム付きウエハの搬送方法は、請求項１〜３に記載の載置機構の載置台に載置されたダイシングフレームのシートに固定されたウエハを上記載置台から搬送する方法であって、昇降駆動機構を用いて上記載置台を一定の第１の速度で下降させることにより第１の作用体を複数の支持体に作用させて上記第１の速度で上記ダイシングフレームを持ち上げて上記ウエハが固定された上記シートを上記載置台から第１の位置まで離間させる第１の工程と、上記昇降駆動機構を用いて上記載置台を上記第１の速度より速い一定の第２の速度で下降させることにより第１の作用体を複数の支持体に作用させて上記第２の速度で上記ダイシングフレームを持ち上げて上記ウエハが固定された上記シートを上記載置台から第２の位置まで離間させる第２の工程と、を備えたことを特徴とするものである。   According to a fourth aspect of the present invention, there is provided a method for transporting a wafer with a dicing frame, wherein the wafer fixed on the sheet of the dicing frame mounted on the mounting table of the mounting mechanism according to the first to third embodiments is moved upward. A method of transporting from a mounting table, wherein the first operating body is caused to act on a plurality of supports by lowering the mounting table at a constant first speed using an elevating drive mechanism. The first step of lifting the dicing frame to separate the sheet, on which the wafer is fixed, from the mounting table to the first position, and using the lifting drive mechanism to move the mounting table from the first speed. The first working body is caused to act on the plurality of supports by lowering at a fast constant second speed, and the dicing frame is lifted at the second speed to raise the sheet on which the wafer is fixed. A second step of separating from the mounting table to a second position, and comprising the.

また、本発明の請求項５に記載のダイシングフレーム付きウエハの搬送方法は、請求項４に記載の発明において、第２の作用体を複数のピンに作用させて上記複数のピンを上記載置台の載置面から突出させて上記載置台から上記ウエハを離間させることを特徴とするものである。   According to a fifth aspect of the present invention, there is provided the method for transporting a wafer with a dicing frame according to the fourth aspect of the present invention, wherein the second acting body is caused to act on the plurality of pins so that the plurality of pins are placed on the mounting table. The wafer is separated from the mounting table by protruding from the mounting surface.

また、本発明の請求項６に記載のダイシングフレーム付きウエハの搬送方法は、請求項５に記載の発明において、上記第１の作用体が上記複数の支持体に作用した後、上記第２の作用体が上記複数のピンに作用することを特徴とするものである。   According to a sixth aspect of the present invention, there is provided a method for transporting a wafer with a dicing frame according to the fifth aspect of the present invention, wherein the first action body acts on the plurality of support bodies, and then the second action body. The operating body acts on the plurality of pins.

また、本発明の請求項７に記載のウエハ搬送用プログラムは、コンピュータを駆動させて、請求項４〜６のいずれか１項に記載のダイシングフレーム付きウエハの搬送方法を実行することを特徴とするものである。   According to a seventh aspect of the present invention, there is provided a wafer transfer program for executing the wafer transfer method with a dicing frame according to any one of claims 4 to 6 by driving a computer. To do.

本発明によれば、載置台からダイシングフレーム付きウエハを搬送する際に発生する剥離帯電を抑制することができる載置機構、ダイシングフレーム付きウエハの搬送方法及びこの搬送方法に用いられるウエハ搬送用プログラムを提供することができる。   According to the present invention, a mounting mechanism that can suppress peeling electrification that occurs when a wafer with a dicing frame is transferred from the mounting table, a method for transferring a wafer with a dicing frame, and a wafer transfer program used in this transfer method Can be provided.

（ａ）〜（ｃ）はそれぞれは本発明の載置機構を用いたダイシングフレーム付きウエハの搬送方法の一実施形態を示す工程図である。(A)-(c) is process drawing which shows one Embodiment of the conveyance method of the wafer with a dicing frame using the mounting mechanism of this invention, respectively. 図１に示すダイシングフレーム付きウエハの一部を拡大して示す断面図である。It is sectional drawing which expands and shows a part of wafer with a dicing frame shown in FIG. （ａ）〜（ｃ）はそれぞれは従来の載置機構を用いたダイシングフレーム付きウエハの搬送方法の一例を示す工程図である。(A)-(c) is process drawing which shows an example of the conveyance method of the wafer with a dicing frame using the conventional mounting mechanism, respectively.

以下、図１の（ａ）〜（ｃ）に示す実施形態に基づいて本発明を説明する。   Hereinafter, the present invention will be described based on the embodiment shown in FIGS.

まず、本実施形態の載置機構について図１の（ａ）に基づいて説明する。本実施形態の載置機構１０は、図１の（ａ）に示すように、ダイシングフレーム付きウエハＤＦＷを載置する載置台１１と、載置台１１を昇降させる昇降駆動機構（図示せず）と、ダイシングフレームＤＦを下面から支持し且つ載置台１１の外周面に沿って所定間隔を空けて載置台１１に対して相対的に昇降可能に配置され複数の支持体１２と、載置台１１が昇降駆動機構を介して下降する時に複数の支持体１２に作用してダイシングフレームＤＦを持ち上げてダイシングフレーム付きウエハＤＦＷのシートＦを載置台から離間させる第１の作用体１３と、を備え、コンピュータ（図示せず）の制御下で昇降駆動機構を駆動制御するように構成されている。ダイシングフレーム付きウエハＤＦＷのウエハＷの上面には図２に示すようにダイシングによる溝Ｔが形成されている。   First, the mounting mechanism of the present embodiment will be described with reference to FIG. As shown in FIG. 1A, the mounting mechanism 10 according to the present embodiment includes a mounting table 11 on which a wafer DFW with a dicing frame is mounted, and a lift drive mechanism (not shown) that moves the mounting table 11 up and down. The dicing frame DF is supported from the lower surface, and is arranged so as to be movable up and down relatively with respect to the mounting table 11 at a predetermined interval along the outer peripheral surface of the mounting table 11. A first action body 13 that acts on the plurality of support bodies 12 to lift the dicing frame DF and separate the sheet F of the wafer DFW with dicing frame from the mounting table when it is lowered via the drive mechanism, and a computer ( The elevating drive mechanism is driven and controlled under the control of (not shown). Grooves T by dicing are formed on the upper surface of wafer W of wafer DFW with a dicing frame as shown in FIG.

昇降駆動機構は、例えばモータと、ボールネジと、載置台１１に固定されたナット部材と、を有し、載置台１１を一定の速度で昇降させることができる。載置台１１の昇降速度はモータによって所望の速度に設定することができる。   The elevating drive mechanism has, for example, a motor, a ball screw, and a nut member fixed to the mounting table 11, and can raise and lower the mounting table 11 at a constant speed. The raising / lowering speed of the mounting table 11 can be set to a desired speed by a motor.

また、載置機構１０は、コンピュータの制御下でＸＹステージ（図示せず）を介してＸ、Ｙ方向へ移動するように構成されている。載置機構１０の上方にはプローブカード（図示せず）が配置されており、載置機構１１とアライメント機構（図示せず）が協働してウエハＷの電極パッドとプローブカードのプローブとをアライメントするようにしてある。   The mounting mechanism 10 is configured to move in the X and Y directions via an XY stage (not shown) under the control of a computer. A probe card (not shown) is disposed above the mounting mechanism 10, and the mounting mechanism 11 and the alignment mechanism (not shown) cooperate to connect the electrode pad of the wafer W and the probe of the probe card. Align it.

載置台１１の周面には支持体１２に対応するガイドレール１４が上下方向に取り付けられている。支持体１２は、側面にある係合部（図示せず）がガイドレール１４と係合し、ガイドレール１４に従って昇降するようになっている。支持体１２の下方には例えば上端位置の高さを調整できるロッドによって形成された作用体１３が配置され、載置台１１が上昇端に位置する時に作用体１３の上端面が支持体１２の下面に接触している。従って、昇降駆動機構が駆動して載置台１１が下降すると、支持体１２はガイドレール１４に従って載置台１１に対して相対的に上昇する。   A guide rail 14 corresponding to the support 12 is attached to the peripheral surface of the mounting table 11 in the vertical direction. The support body 12 is configured such that an engaging portion (not shown) on a side surface engages with the guide rail 14 and moves up and down according to the guide rail 14. Below the support 12, for example, an action body 13 formed by a rod capable of adjusting the height of the upper end position is disposed, and when the mounting table 11 is located at the rising end, the upper end surface of the action body 13 is the lower surface of the support 12. Touching. Therefore, when the elevating drive mechanism is driven and the mounting table 11 is lowered, the support 12 is raised relative to the mounting table 11 according to the guide rails 14.

支持体１２はダイシングフレームＤＦを下面から受ける受け部１２Ａを有している。この受け部１２ＡにはダイシングフレームＤＦを真空吸着する吸着部が形成され、この吸着部が真空ポンプ（図示せず）に接続されている。従って、ウエハＷの電気的特性検査をする時にはウエハＷがシートＦを介して載置台１１の載置面に真空吸着され、ダイシングフレームＤＦが支持体１２の受け部１２Ａに真空吸着され、ダイシングフレーム付きウエハＤＦＷを載置機構１０においてしっかり固定する。   The support 12 has a receiving portion 12A that receives the dicing frame DF from the lower surface. The receiving portion 12A is formed with a suction portion that vacuum-sucks the dicing frame DF, and this suction portion is connected to a vacuum pump (not shown). Therefore, when the electrical characteristics of the wafer W are inspected, the wafer W is vacuum-sucked to the mounting surface of the mounting table 11 via the sheet F, and the dicing frame DF is vacuum-sucked to the receiving portion 12A of the support 12 so that the dicing frame is The attached wafer DFW is firmly fixed in the mounting mechanism 10.

また、載置台１１にはその上面から下面に貫通する複数（例えば、３つ）の貫通孔が形成され、これらの貫通孔は載置台１１の周方向に等間隔を空けて配置され、これらの貫通孔にはそれぞれピン１５が昇降自在に挿入されている。ピン１５は、上端に逆円錐台状の受け部１５Ａを有し、この受け部１５Ａが貫通孔の上端に形成された円錐溝１１Ａに嵌合している。ピン１５の下端は載置台１１の貫通孔を貫通して下面から突出している。従って、ピン１５は、受け部１５Ａを介して円錐溝１１Ａと嵌合した状態で懸垂されている。ピン１５が円錐溝１１Ａで懸垂された状態では、受け部１５Ａの受け面が載置台１１の載置面と面一になっている。そのため、ウエハＷがダイシングされて形成されたデバイスが受け部１５Ａで支承されているため、そのデバイスにプローブカードのプローブが電気的に接触して強い押圧力が付与されても円錐溝１１Ａ内に落ち込まないようになっている。   In addition, a plurality of (for example, three) through holes penetrating from the upper surface to the lower surface are formed in the mounting table 11, and these through holes are arranged at equal intervals in the circumferential direction of the mounting table 11. A pin 15 is inserted in each through hole so as to be movable up and down. The pin 15 has an inverted frustoconical receiving portion 15A at the upper end, and the receiving portion 15A is fitted in a conical groove 11A formed at the upper end of the through hole. The lower end of the pin 15 penetrates the through hole of the mounting table 11 and protrudes from the lower surface. Accordingly, the pin 15 is suspended in a state of being fitted to the conical groove 11A via the receiving portion 15A. In a state where the pin 15 is suspended by the conical groove 11 </ b> A, the receiving surface of the receiving portion 15 </ b> A is flush with the mounting surface of the mounting table 11. For this reason, since the device formed by dicing the wafer W is supported by the receiving portion 15A, even if the probe of the probe card is electrically contacted with the device and a strong pressing force is applied, the conical groove 11A is provided. It is designed not to be depressed.

ピン１５の下方には第１の作用体１３と同一構造の第２の作用体１６が配置され、載置台１１が昇降駆動機構を介して下降して支持体１２の受け部１２Ａが載置台１１の載置面に達した時点で第２の作用体１６の上端がピン１５の下端に接触するようにしてある。載置台１１が更に下降すると第２の作用体１６でピン１５が相対的に押し上げられてピン１５の受け部１５Ａが載置面から突出してウエハＷを載置面から剥離させる。ウエハＷが載置面から剥離する時に剥離帯電が発生し、その時の帯電量によってデバイスの配線構造が損傷する虞がある。   A second action body 16 having the same structure as that of the first action body 13 is disposed below the pin 15, the mounting table 11 is lowered via the lifting drive mechanism, and the receiving portion 12 </ b> A of the support body 12 is mounted on the mounting table 11. When the mounting surface is reached, the upper end of the second working body 16 comes into contact with the lower end of the pin 15. When the mounting table 11 is further lowered, the pins 15 are relatively pushed up by the second action body 16 so that the receiving portions 15A of the pins 15 protrude from the mounting surface to peel the wafer W from the mounting surface. When the wafer W is peeled from the mounting surface, peeling electrification occurs, and the wiring structure of the device may be damaged depending on the amount of charge at that time.

そこで、剥離帯電によるシートＦの帯電量を抑制するために、本実施形態のダイシングフレーム付きウエハの搬送方法では、ダイシングフレーム付きウエハＤＦＷの上昇速度を途中で切り換えるようにしてある。本実施形態のダイシングフレーム付きウエハの搬送方法は、コンピュータに登録されたウエハ搬送用プログラムによって実行される。そこで、本実施形態のウエハ搬送用プログラムによって実行されるダイシングフレーム付きウエハの搬送方法について説明する。   Therefore, in order to suppress the charge amount of the sheet F due to peeling charging, the ascending speed of the wafer DFW with dicing frame is switched halfway in the method for transporting the wafer with dicing frame according to the present embodiment. The wafer transfer method with a dicing frame of this embodiment is executed by a wafer transfer program registered in a computer. Therefore, a wafer transfer method with a dicing frame executed by the wafer transfer program of this embodiment will be described.

本実施形態のダイシングフレーム付きウエハの搬送方法は、ウエハＷの電気的特性検査を終えた後、図１の（ａ）に示すようにダイシングフレーム付きウエハＤＦＷが載置機構１０に固定された状態からローダ室側へ搬送する方法で、イオナイザーを併用する。   In the method for transporting a wafer with a dicing frame according to the present embodiment, the wafer DFW with a dicing frame is fixed to the mounting mechanism 10 as shown in FIG. Ionizer is used together with the method of conveying from the loader chamber side.

まず、イオナイザーから図１に矢印Ａで示すようにイオンをウエハＷに向けて照射した状態で、昇降駆動機構が駆動して載置台１１を一定の速度（例えば、１ｍｍ／秒）で下降させると、第１の作用体１３が複数の支持体１２に作用して支持体１２がガイドレール１４に従って載置台１１に対して相対的に一定の速い速度で上昇してダイシングフレームＤＦを持ち上げる。ダイシングフレームＤＦが持ち上げられる途中で支持体１２の受け部１２Ａの上面が載置面の上面を越えるあたりで第２の作用体１６が複数のピン１５に作用して受け部１５Ａが載置面から突出し、同図の（ｂ）に示すように複数のピン１５が一定の遅い速度でウエハＷ（シートＦ）を載置面から剥離し、一定の距離だけ離間した第１の位置（例えば、載置面から５ｍｍの位置）で停止する。このようにウエハＷ（シートＦ）が載置面から一定の遅い速度で剥離することにより、ウエハＷ（シートＦ）を載置面からの剥離速度が安定しているため、剥離帯電量を抑制することができる。   First, in a state where ions are irradiated from the ionizer toward the wafer W as indicated by an arrow A in FIG. 1, when the elevation drive mechanism is driven to lower the mounting table 11 at a constant speed (for example, 1 mm / second). The first action body 13 acts on the plurality of support bodies 12, and the support body 12 rises at a relatively high speed relative to the mounting table 11 according to the guide rails 14 to lift the dicing frame DF. While the dicing frame DF is being lifted, the second action body 16 acts on the plurality of pins 15 when the upper surface of the receiving portion 12A of the support body 12 exceeds the upper surface of the mounting surface, so that the receiving portion 15A is removed from the mounting surface. As shown in FIG. 4B, the plurality of pins 15 peels the wafer W (sheet F) from the mounting surface at a constant slow speed, and is separated from the mounting surface by a first distance (for example, a mounting position). Stop at a position of 5 mm from the mounting surface. Since the wafer W (sheet F) is peeled from the mounting surface at a constant slow speed in this manner, the peeling speed of the wafer W (sheet F) from the mounting surface is stable, so the amount of peeling charge is suppressed. can do.

ウエハＷ（シートＦ）が載置台１１の載置面から第１の位置まで離間して剥離帯電を抑制した後、イオナイザーでウエハＷでの帯電を抑制しながら昇降駆動機構を介して載置台１１を第１の速度より速い第２の速度で速く一気に下降させ、複数の支持体１２及び複数のピン１５によって載置面からウエハＷ（シートＦ）を離間させて図１の（ｃ）に示す第２の位置（例えば、載置面から１１ｍｍの位置）で停止させる。ウエハＷ（シートＦ）が第１の位置から第２の位置に達するまでは剥離帯電が発生し難く、ウエハＷ（シートＦ）での帯電を抑制することができる。ウエハＷ（シートＦ）が第２の位置に達すると、載置面とウエハＷ（シートＦ）との隙間にウエハ搬送機構のアームが進出し、ウエハ搬送機構によってダイシングフレーム付きウエハＤＦＷを搬送することができる。   After the wafer W (sheet F) is separated from the mounting surface of the mounting table 11 to the first position and suppresses peeling electrification, the mounting table 11 is controlled via the lifting drive mechanism while suppressing charging on the wafer W with an ionizer. 1 is rapidly lowered at a second speed higher than the first speed, and the wafer W (sheet F) is separated from the mounting surface by the plurality of supports 12 and the plurality of pins 15 and is shown in FIG. It stops at a second position (for example, a position 11 mm from the placement surface). Until the wafer W (sheet F) reaches the second position from the first position, peeling electrification hardly occurs, and charging on the wafer W (sheet F) can be suppressed. When the wafer W (sheet F) reaches the second position, the arm of the wafer transfer mechanism advances into the gap between the mounting surface and the wafer W (sheet F), and the wafer DFW with the dicing frame is transferred by the wafer transfer mechanism. be able to.

以上説明したように本実施形態によれば、載置機構１０は、ダイシングフレーム付きウエハＤＦＷを載置する載置台１１と、載置台１１を昇降させる昇降駆動機構（図示せず）と、ダイシングフレームＤＦを下面から支持し且つ載置台１１の外周面に沿って所定間隔を空けて載置台１１に対して相対的に昇降可能に配置され複数の支持体１２と、載置台が下降する時に複数の支持体１２に作用してダイシングフレームＤＦを持ち上げてウエハＷが固定されたシートＦを載置台１１から離間させる第１の作用体１３と、を備え、コンピュータの制御下で昇降駆動機構を駆動制御するため、コンピュータの制御下で昇降駆動機構を用いて載置台１１を一定の第１の速度で下降させることにより第１の作用体１３を複数の支持体１２に作用させて第１の速度でダイシングフレームＤＦを持ち上げてウエハＷが固定されたシートＦを載置台１１から第１の位置まで離間させる第１の工程と、昇降駆動機構を用いて載置台１１を第１の速度より速い一定の第２の速度で下降させることにより第１の作用体１３を複数の支持体１２に作用させて第２の速度でダイシングフレームＤＦを持ち上げてウエハが固定されたシートＦを載置台から第２の位置まで離間させる第２の工程と、を実行して、載置台１１からダイシングフレーム付きウエハＤＦＷを搬送する際に発生する剥離帯電を抑制することができ、延いてはデバイスの静電気による損傷を防止することができる。   As described above, according to the present embodiment, the mounting mechanism 10 includes the mounting table 11 on which the wafer DFW with a dicing frame is mounted, the elevating drive mechanism (not shown) that moves the mounting table 11 up and down, and the dicing frame. The DF is supported from the lower surface and is arranged to be movable up and down relatively with respect to the mounting table 11 with a predetermined interval along the outer peripheral surface of the mounting table 11. And a first action body 13 that lifts the dicing frame DF by acting on the support body 12 and separates the sheet F on which the wafer W is fixed from the mounting table 11, and drives and controls the lifting drive mechanism under the control of the computer. Therefore, the first action body 13 is caused to act on the plurality of support bodies 12 by lowering the mounting table 11 at a constant first speed by using the lifting drive mechanism under the control of the computer. The first step of lifting the dicing frame DF at a speed of 1 to separate the sheet F, on which the wafer W is fixed, from the mounting table 11 to the first position, and using the lifting drive mechanism to move the mounting table 11 from the first speed. The sheet F on which the wafer is fixed by lifting the dicing frame DF at the second speed by causing the first acting body 13 to act on the plurality of supports 12 by lowering at a fast constant second speed is removed from the mounting table. And the second step of separating the wafer to the second position to suppress the peeling electrification that occurs when the wafer DFW with a dicing frame is transported from the mounting table 11, and due to the static electricity of the device. Damage can be prevented.

また、本実施形態によれば、載置機構１０が更に、載置台１１に形成された複数の貫通孔に昇降自在に懸垂されて下端が載置台１１の下面から突出する複数のピン１５と、複数のピン１５に対応して設けられ且つ載置台と一緒に下降する複数のピン１５に作用して複数のピン１５を載置台１１の載置面から突出させる第２の作用体１６と、を備えているため、ダイシングフレーム付きウエハＤＦＷのウエハＷ（シートＦ）を安定した姿勢で載置台１１の載置面から剥離することができ、剥離帯電をより抑制することができる。   Further, according to the present embodiment, the mounting mechanism 10 is further suspended in a plurality of through holes formed in the mounting table 11 so as to be lifted and lowered, and a plurality of pins 15 whose lower ends protrude from the lower surface of the mounting table 11; A second acting body 16 provided corresponding to the plurality of pins 15 and acting on the plurality of pins 15 descending together with the mounting table to project the plurality of pins 15 from the mounting surface of the mounting table 11; Accordingly, the wafer W (sheet F) of the wafer DFW with a dicing frame can be peeled from the placement surface of the placement table 11 in a stable posture, and peeling electrification can be further suppressed.

尚、上記実施形態では第１、第２の作用体１３、１６が複数の支持体１２及び複数のピン１５にそれぞれに対応した数だけ設置されているが、複数の支持体及び複数のピンが一体的に昇降できるように連結し、連結部材を介して一つの第１、第２の作用体で複数の支持体及び複数のピンを昇降させるようにしても良い。この逆の場合であっても良い。要は、本発明の要旨を逸脱しない限り、各構成要素を適宜の設計変更したものであれば、本発明に包含される。また、本発明の載置機構は、ダイシングフレーム付きウエハに限らず、通常のウエハ単体の検査にも適用することができる。   In the above-described embodiment, the first and second working bodies 13 and 16 are installed in a number corresponding to each of the plurality of support bodies 12 and the plurality of pins 15, but the plurality of support bodies and the plurality of pins are provided. The plurality of supports and the plurality of pins may be moved up and down by one first and second acting bodies via a connecting member so as to be able to move up and down integrally. The reverse case may be used. In short, as long as it does not deviate from the gist of the present invention, any structural change of each component is included in the present invention. Further, the mounting mechanism of the present invention is not limited to a wafer with a dicing frame, and can be applied to an inspection of a normal single wafer.

本発明は、ウエハの検査をする検査装置に好適に利用することができる。   The present invention can be suitably used for an inspection apparatus for inspecting a wafer.

１０ 載置機構
１１ 載置台
１２ 支持体
１３ 第１の作用体
１４ ガイドレール
１５ ピン
１６ 第２の作用体
ＤＦＷ ダイシングフレーム付きウエハ
ＤＦ ダイシングフレーム
Ｗ ウエハ DESCRIPTION OF SYMBOLS 10 Mounting mechanism 11 Mounting stand 12 Support body 13 1st action body 14 Guide rail 15 Pin 16 2nd action body DFW Wafer with a dicing frame DF Dicing frame W Wafer

Claims (7)

ダイシングフレームのシートに固定されたウエハを載置する載置台と、上記載置台を昇降させる昇降駆動機構と、上記ダイシングフレームを下面から支持し且つ上記載置台の外周面に沿って所定間隔を空けて上記載置台に対して相対的に昇降可能に配置され複数の支持体と、上記載置台が下降する時に複数の上記支持体に作用して上記ダイシングフレームを持ち上げて上記ウエハが固定されたシートを上記載置台から離間させる第１の作用体と、を備え、コンピュータの制御下で上記昇降駆動機構を駆動制御することを特徴とする載置機構。   A mounting table on which a wafer fixed to a sheet of the dicing frame is mounted, an elevating drive mechanism for raising and lowering the mounting table, a dicing frame that supports the dicing frame from the lower surface, and a predetermined interval along the outer peripheral surface of the mounting table. And a plurality of supports arranged so as to be able to move up and down relative to the mounting table, and a sheet on which the wafer is fixed by acting on the plurality of supports when the mounting table is lowered and lifting the dicing frame And a first action body that separates the above-mentioned raising and lowering mechanism from the mounting table, and controls the drive of the lifting drive mechanism under the control of a computer. 上記複数の支持体は、上記載置台の外周面に上下方向に固定されたガイド部材と係合する係合部を有することを特徴とする請求項１に記載の載置機構。   2. The mounting mechanism according to claim 1, wherein the plurality of supports include an engaging portion that engages with a guide member fixed in an up-down direction on an outer peripheral surface of the mounting table. 上記載置台に形成された複数の貫通孔に昇降自在に懸垂されて下端が上記載置台の下面から突出する複数のピンと、上記複数のピンに対応して設けられ且つ上記載置台と一緒に下降する上記複数のピンに作用して上記複数のピンを上記載置台の載置面から突出させる第２の作用体と、を備えたことを特徴とする請求項１または請求項２に記載の載置機構。   A plurality of pins suspended from a plurality of through-holes formed in the mounting table so as to be raised and lowered and projecting from the lower surface of the mounting table, and lowering together with the plurality of pins provided corresponding to the plurality of pins. 3. A mounting according to claim 1, further comprising: a second action body that acts on the plurality of pins to project the plurality of pins from the mounting surface of the mounting table. Placement mechanism. 請求項１〜３に記載の載置機構の載置台に載置されたダイシングフレームのシートに固定されたウエハを上記載置台から搬送する方法であって、昇降駆動機構を用いて上記載置台を一定の第１の速度で下降させることにより第１の作用体を複数の支持体に作用させて上記第１の速度で上記ダイシングフレームを持ち上げて上記ウエハが固定された上記シートを上記載置台から第１の位置まで離間させる第１の工程と、上記昇降駆動機構を用いて上記載置台を上記第１の速度より速い一定の第２の速度で下降させることにより第１の作用体を複数の支持体に作用させて上記第２の速度で上記ダイシングフレームを持ち上げて上記ウエハが固定された上記シートを上記載置台から第２の位置まで離間させる第２の工程と、を備えたことを特徴とするダイシングフレーム付きウエハの搬送方法。   A method for transporting a wafer fixed to a sheet of a dicing frame mounted on a mounting table of the mounting mechanism according to any one of claims 1 to 3 from the mounting table, wherein the mounting table is moved using an elevating drive mechanism. The sheet on which the wafer is fixed is lifted from the mounting table by lowering the dicing frame at the first speed by causing the first working body to act on the plurality of supports by lowering at a constant first speed. A first step of separating the first working body to a first position, and lowering the mounting table at a constant second speed faster than the first speed using the lifting drive mechanism, the first working body is moved to a plurality of positions. And a second step of acting on a support to lift the dicing frame at the second speed to separate the sheet on which the wafer is fixed from the mounting table to a second position. Toss Transfer method of the dicing frame with a wafer. 第２の作用体を複数のピンに作用させて上記複数のピンを上記載置台の載置面から突出させて上記載置台から上記ウエハを離間させることを特徴とする請求項４に記載のダイシングフレーム付きウエハの搬送方法。   5. The dicing according to claim 4, wherein the second acting body is caused to act on a plurality of pins so that the plurality of pins protrude from a mounting surface of the mounting table to separate the wafer from the mounting table. Transfer method of wafer with frame. 上記第１の作用体が上記複数の支持体に作用した後、上記第２の作用体が上記複数のピンに作用することを特徴とする請求項５に記載のダイシングフレーム付きウエハの搬送方法。   6. The method for transporting a wafer with a dicing frame according to claim 5, wherein the second acting member acts on the plurality of pins after the first acting member acts on the plurality of supports. コンピュータを駆動させて、請求項４〜６のいずれか１項に記載のダイシングフレーム付きウエハの搬送方法を実行することを特徴とするウエハ搬送用プログラム。   A computer for driving a wafer, wherein the method for transferring a wafer with a dicing frame according to any one of claims 4 to 6 is executed.
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