JP2008078283A - Substrate support device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To prevent a substrate from being damaged by arcs by efficiently dissipating charge electrified to the substrate due to a peeling electrification phenomenon to the outside. <P>SOLUTION: A substrate support device 1 comprises: a support plate 3 for placing a thin-plate-shaped substrate A; and at least one contact member 6 that is placed at a location other than a plurality of locations for pushing up the substrate A placed on a placement surface 3a of the support plate 3 for floating from the placement surface 3a, and comes into contact with the back of the substrate A. The contact member 6 is made of a conductive material and is grounded electrically. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a substrate support apparatus.

  Conventionally, when inspecting or processing a flexible thin plate substrate such as a wafer or an FPD glass substrate, the back surface of the substrate is brought into surface contact with the mounting surface of the support plate in order to fix the substrate. There are known substrate support devices that support the substrate.

  In such a substrate support apparatus, in order to place the substrate on the support plate or to remove it from the support plate, it is common to support and transport the substrate by an externally installed robot hand. In order to provide a space for the robot hand to enter below the substrate, lift pins are provided on the support plate, and the substrate is lifted from the mounting surface of the support plate by the lift pins.

In this case, since the substrate that is in close contact with the mounting surface of the support plate is peeled off from the mounting surface by the lift pins, a peeling electrification phenomenon occurs. May be damaged.
Conventionally, in order to prevent damage to the substrate due to this type of peeling charging phenomenon, the lift pin is made of a conductive material and electrically grounded, so that the charge charged on the substrate is released to the outside through the lift pin. Also known is a method of neutralizing charges charged on the substrate by blowing an ionized gas onto the substrate at the time of peeling (see, for example, Patent Document 1 and Patent Document 2).
JP 2004-172494 A JP-A-7-7072

However, as the substrate becomes larger, it has become impossible to effectively suppress breakage of the substrate due to the peeling charging phenomenon.
That is, since the amount of charge on the substrate depends on the contact area between the substrate and the support plate, the amount of charge increases significantly as the substrate becomes larger.

On the other hand, the number of lift pins for levitating the substrate is limited due to the increase in the size of the robot hand, etc., and the charged charges are only discharged locally without being fully discharged. It remains on the substrate.
In the method of injecting ionized gas, the charge is neutralized because it is injected on the front surface side of the substrate, but the charge remains because it is not injected on the back surface side of the substrate.

  When a large substrate is levitated with a small number of lift pins, the substrate is bent, so that peeling is not performed at a stretch but gradually. And the electric charge which remained on the board | substrate gathers locally toward the location where a board | substrate peels from a support plate. For this reason, when the substrate rises from the support plate, excessive charges are collected at the last contact point of the substrate with the support plate, and air discharge tends to occur at the moment the substrate rises.

  The present invention has been made in view of the above-described circumstances, and provides a substrate support device capable of effectively escaping charges charged on a substrate due to a peeling charging phenomenon to the outside and preventing damage to the substrate due to an arc. The purpose is to do.

In order to achieve the above object, the present invention provides the following means.
The present invention is arranged at a place other than a support plate for placing a thin plate-like substrate and a place where the substrate placed on the placement surface of the support plate is pushed up to float from the placement surface. There is provided a substrate support device including at least one contact member that contacts the back surface of the substrate, wherein the contact member is made of a conductive material and is electrically grounded.

  According to the present invention, the substrate can be levitated by pushing up the back surface of the substrate at a plurality of locations from the state where the thin plate-like substrate is placed and supported on the placement surface of the support plate. In this case, the portion of the substrate that has been pressed from the bottom leaves the mounting surface first, but since the substrate is bent, peeling from the support plate is gradually performed around the pressed portion. . As a result, the charges charged on the substrate move so as to gather on the separation line that is the boundary line between the peeled region and the non-peeled region.

  When the peeling line reaches the vicinity of the contact member, the collected charges are released to the outside through the contact member. Accordingly, it is possible to prevent the occurrence of inconvenience that the charge that has accumulated on the substrate due to the peeling charging phenomenon and has no place to go when the substrate completely peels from the support plate is discharged in the air.

In the above invention, a plurality of lift members are provided so as to be able to protrude and retract from an opening opening on the mounting surface of the support plate, and the substrate floats from the mounting surface, and the contact member includes the lift member. It is good also as arrange | positioning between them.
By doing so, the plurality of lift members are raised and their upper ends are projected from the openings of the placement surface, whereby the back surface of the substrate can be pushed and floated.

In the above invention, the contact member may be disposed at a position in contact with the back surface of the lowermost substrate due to bending of the substrate when the substrate is levitated.
By doing in this way, the floated board | substrate will peel from the support plate last in the position of a contact member. Therefore, the charges collected locally by the peeling charging phenomenon are released to the outside from the contact member disposed at the position where the substrate is finally peeled off from the support plate. Thereby, the charge remaining on the floating substrate can be sufficiently reduced, and the occurrence of air discharge can be more reliably prevented.

In the above invention, the contact member is configured to protrude slightly upward from the mounting surface of the support plate and then separate from the back surface of the substrate when the substrate is levitated. Also good.
By doing in this way, after a board | substrate floats from a support plate, a contact member can be maintained in a contact state for a while. Since the contact member is made of a conductive material, the charge remaining on the substrate due to the peeling electrification phenomenon is likely to be discharged in the air toward the contact member, but by maintaining the contact member and the substrate in contact even after rising. The separation position and the contact member can be kept away from each other to make it difficult to be discharged in the air.

Moreover, in the said invention, the said contact member is good also as being formed in the line shape extended in the direction which cross | intersects the peeling line of the board | substrate and support plate which peel from the said support plate.
In this way, when the peeling of the substrate from the support plate proceeds, the peeling line between the substrate and the support plate formed at the peeling position moves in a direction intersecting the peeling line. The contact member formed in a line along the direction can maintain the contact state with the substrate for a long time, and the charge accumulated on the substrate due to the peeling charging phenomenon can be sufficiently released to the outside.

In the above invention, the contact member may be grounded via an electric resistance member.
By doing so, the charge accumulated on the substrate due to the peeling electrification phenomenon is released to the outside from the contact member via the electric resistance member. As a result, a current corresponding to the resistance value of the electrical resistance member flows, and thus the current can be limited by adjusting the resistance value of the electrical resistance member.

Moreover, in the said invention, it is good also as resistance value of the said electrical resistance member being variable.
By doing so, the resistance value of the electric resistance member is changed in accordance with the amount of charge due to the peeling charging phenomenon that changes in accordance with the size of the substrate so that the same current flows regardless of the size of the substrate. can do.

Moreover, in the said invention, the said contact member is earth | grounded via an electrical resistance member, It is good also as providing the resistance value variable mechanism which increases the resistance value of this electrical resistance member according to the raise of the said contact member.
By doing in this way, when the board | substrate is raised and a board | substrate leaves | separates from a contact member, the resistance value of an electrical resistance member can be enlarged. As a result, it is possible to more reliably prevent air discharge toward the contact member even if charges remain on the substrate.

In the above invention, the electric resistance member may be a variable resistor that varies the resistance value by moving the slider, and the resistance value variable mechanism may move the slider in synchronization with the movement of the contact member. Good.
In this way, the resistance value of the electric resistance member can be increased when the substrate is lifted and separated from the contact member with a simple configuration.

  According to the present invention, it is possible to effectively release the electric charge charged on the substrate due to the peeling charging phenomenon to the outside and prevent the substrate from being damaged by the arc.

Hereinafter, a substrate support device 1 according to an embodiment of the present invention will be described with reference to FIGS.
The substrate support apparatus 1 according to the present embodiment is provided in a substrate inspection apparatus 2 that optically inspects a flexible substrate A such as a glass substrate, for example, as shown in FIGS. .

As shown in FIGS. 1 and 2, the substrate support device 1 according to the present embodiment includes a support plate 3 having a mounting surface 3 a that is brought into surface contact with the back surface of the substrate A, and a mounting surface of the support plate 3. A plurality of lift pins (lift members) 5 that are projected and lowered from an opening 4 that opens in 3a, and contact pins (contact members) 6 that are arranged at positions between the lift pins 5 are provided.
In the figure, reference numeral 7 denotes an inspection head disposed so as to be able to travel above the support plate 3.

  The support plate 3 has a mounting surface 3a formed so as to have high flatness in order to bring the substrate A into surface contact and to support the substrate A in a flat state. In order to protect the substrate A in contact with the mounting surface 3a, the mounting surface 3a is subjected to surface treatment such as anodizing when the support plate 3 is made of metal, or is permeable. In order to ensure, it is comprised with the glass material. Anodized has poor conductivity, and the glass material is an insulator.

  As shown in FIG. 2, the lift pin 5 is fixed to an elevating mechanism 8 disposed below the substrate, and the upper end of the lift pin 5 is made to protrude upward and downward from the opening 4 of the support plate 3 by the operation of the elevating mechanism 8. Can be done. The elevating mechanism 8 includes a linear guide 8a, a slider 8b movable along the linear guide 8a, and a drive unit (not shown) that elevates and lowers the slider 8b.

  The lift pins 5 are made of, for example, a resin material such as PEEK or UPE in order to protect the substrate A in contact therewith. In addition, a plurality of lift pins 5 are provided, for example, four in the example shown in the figure, with a parallel interval at four corners of the support plate 3. The number of lift pins 5 is not limited. However, in order to avoid interference with the robot hand for transport (see FIG. 3) 9, it is necessary that the lift pins 5 be arranged with a sufficiently wide interval. It is.

Each lift pin 5 is completely lowered into the opening 4 of the support plate 3 in the lowered state, and the upper end thereof is disposed at a position equal to or less than the placement surface 3a so as to be placed on the placement surface 3a. The flatness of the substrate A to be placed is not affected.
In addition, the lift pins 5 are fully lifted upward from the openings 4 of the support plate 3 while being lifted, and the substrate A is supported on the upper ends of the four lift pins 5, It is possible to float completely from the mounting surface 3a. At this time, a gap 10 into which the transfer robot hand 9 can be inserted is formed between the substrate A and the mounting surface 3 a of the support plate 3.

  A plurality of contact pins 6, for example, four in the example shown in the figure, are arranged in the region surrounded by the four lift pins 5. Each contact pin 6 is made of a conductive material, for example, a conductive resin or a conductive metal. Each contact pin 6 is electrically grounded.

  The upper end surface of the contact pin 6 is set to be flush with the placement surface 3a of the support plate 3, and can come into contact with the back surface of the substrate A that is brought into surface contact with the placement surface 3a. . As a result, when the substrate A is in contact with the contact pins 6, the charges charged on the substrate A are released to the outside through the contact pins 6.

The operation of the substrate support apparatus 1 according to the present embodiment configured as described above will be described below.
According to the substrate support apparatus 1 according to the present embodiment, in order to carry a large substrate A such as a flexible glass substrate into the support plate 3, the lifting mechanism 8 is operated to open the support plate 3. The upper end of the lift pin 5 is projected from the portion 4. In this state, the substrate A supported by the robot hand 9 is transported from the outside, brought close to the upper side of the support plate 3, and brought into contact with the upper end of the lift pin 5.

  From this state, the robot hand 9 is further lowered to deliver the substrate A from the robot hand 9 to the lift pins 5. Since the substrate A has flexibility, the region disposed between the lift pins 5 bends to a position lower than the upper end of the lift pins 5, but by lowering the robot hand 9 below, It can be supported entirely by the lift pins 5 alone.

  Then, after the robot hand 9 is pulled out from the gap 10 between the substrate A and the support plate 3 in the horizontal direction, the lift mechanism 5 is operated to lower the lift pins 5. As a result, the substrate A is lowered and brought into contact with the placement surface 3 a of the support plate 3.

  By lowering the lift pin 5 to a position where it is completely immersed in the opening 4, the substrate A can be supported in a state of being in surface contact with the mounting surface 3 a of the support plate 3. As a result, it is possible to accurately inspect the inspection head 7 while maintaining the flexible substrate A in a flat state with high accuracy.

In order to carry the substrate A out of the support plate 3 after the inspection is completed, the substrate support device 1 is operated in the reverse order of the loading. That is, the inspection head 7 is retracted from above the support plate 3, the lift mechanism 5 is operated to lift the lift pin 5, and the substrate A is moved by the upper end of the lift pin 5 until a gap 10 is formed between the inspection plate 7 and the support plate 3. Push up.
In this case, the support plate 3 is made of a low conductive material, and the substrate A is made of glass made of an insulating material. Therefore, when the substrate A is brought into surface contact with the support plate 3, the difference between the charged columns is caused. The charge will be charged on the contact surface.

  Since the contact pin 6 is made of a conductive material and is electrically grounded, the electric charge charged in the region in the vicinity of the contact pin 6 is released to the outside through the contact pin 6. However, when the substrate A is large, only a part of the electric charge is released to the outside, and the most remains on the substrate A.

When the lift pins 5 are raised and the substrate A is peeled off from the mounting surface 3a of the support plate 3, the electric charge remaining on the substrate A is in an electrically floating state, and the support plate of the substrate A A peeling electrification phenomenon that moves so as to be gathered toward a peeling line formed at the boundary between the part peeled off from 3 and the part in contact therewith occurs.
In this case, according to the substrate support apparatus 1 according to the present embodiment, since four lift pins 5 are provided at the four corners of the support plate 3, the substrate A is denoted by reference numerals A-1 to A- in FIG. As shown by 4, peeling begins from the outside, and the peeling line moves toward the inside.

  Since the electrically grounded contact pin 6 is disposed inside the lift pin 5, the peeling line comes close to the contact pin 6, and the charges collected toward the peeling line are contact pins. 6 will be escaped to the outside. That is, the collected charge is effectively released to the outside by the contact pins 6 by utilizing the peeling charging phenomenon in which charges are collected toward the peeling line, so that the substrate A is finally peeled off when the substrate A is finally peeled off. There is an advantage that the remaining electric charge can be reduced and the occurrence of air discharge can be effectively suppressed.

  In the present embodiment, the four contact pins 6 are arranged in the inner region surrounded by the four lift pins 5. Instead, for the reasons described above, the position at which the deflection of the substrate A is maximized when it is levitated by the lift pins 5, that is, the position at which the substrate A is finally separated from the support plate 3, for example, the support shown in FIG. It is effective to arrange the contact pin 6 at the center position of the plate 3.

  Further, in the present embodiment, a structure in which the substrate A is floated by the lift pins 5 which are projected and retracted from the opening 4 of the support plate 3 and the substrate A is transferred to the robot hand 9 inserted into the formed gap 10 is used. Although illustrated, instead of this, as shown in FIG. 6, the support plate 3 is provided with a notch 11 through which the robot hand 9 can pass, and the contact pin 6 is arranged at a position different from the notch 11. Also good.

Next, a substrate support apparatus 20 according to a second embodiment of the present invention will be described with reference to FIGS.
In the description of the present embodiment, portions having the same configuration as those of the substrate support device 1 according to the first embodiment described above are denoted by the same reference numerals and description thereof is omitted.

  The substrate support device 20 according to the present embodiment is different from the substrate support device 1 according to the first embodiment in the structure of the contact pins 21. In this embodiment, as shown in FIGS. 7 and 8, the contact pin 21 is accommodated in an opening 22 provided in the support plate 3 and supported by a bearing 23 so as to be movable up and down, and a coil spring. The biasing means 24 is biased upward. The urging force of the urging means 24 is weak and does not generate a force enough to deform the mounted substrate A, while the contact pins 21 are kept in contact with the back surface of the substrate A when the substrate A is levitated. The state can be raised by a predetermined distance. In the figure, reference numeral 25 denotes a grounding wiring. Note that the contact pin ascending distance is limited to a height that does not prevent the robot hand from entering.

  According to the substrate support device 20 according to the present embodiment configured as described above, when the peeling line approaches the contact pin 21 as the substrate A is peeled off from the support plate 3, it is collected by the peeling charging phenomenon. As in the first embodiment, the electric charge is effectively discharged to the outside by flowing into the contact pin 21. Furthermore, according to the substrate support apparatus 20 according to the present embodiment, when the substrate A is lifted from the support plate 3, the contact pin 21 is raised by the urging force of the urging means 24, and the peeling line is contact pin 21. Even after passing through the position, the contact pin 21 is kept in contact with the back surface of the substrate A for a while.

  That is, it is possible to ensure a long time for the electric charge to escape to the outside through the contact pin 21. As a result, there is an advantage that charges remaining on the substrate A can be sufficiently released to the outside, and the possibility of air discharge can be further reduced. In addition, since the amount of charge that can be released to the outside per one contact pin 21 can be increased, there is also an advantage that the number of contact pins 21 provided on the support plate 3 can be reduced.

  As the contact pins 21 of the substrate support apparatus 20 according to the present embodiment, as shown in FIG. 9, an upper contact piece 21a that contacts the substrate A is supported by a spherical bearing 26 so as to be swingable. You may decide to keep it. By doing so, the contact piece 21a is swung in accordance with the inclination of the substrate A when it is peeled off, and the contact area between the substrate A and the contact pin 21 is increased so that electric charges can easily flow. it can.

  Further, instead of the contact pin 21 supported so as to be movable up and down, as shown in FIG. 10, a lever-shaped contact pin 27 supported so as to be swingable within a vertical plane may be adopted. By providing the roller 28 at the tip of the contact pin 27, friction between the substrate A and the contact pin 27 can be reduced, and damage to the substrate A can be prevented.

  In addition, as shown in FIG. 11, an electric resistance member 29 may be disposed on the wiring 25 that grounds the contact pin 6. As a result, it is possible to prevent the occurrence of aerial discharge due to the rapid collection of charges collected toward the peeling line due to the peeling charging phenomenon through the contact pins 6.

  Further, as shown in FIG. 12, a plurality of members having different resistance values may be prepared as the electric resistance members 29A and 29B connected to the contact pin 6, and a switch 30 that switches as necessary may be provided. . By doing so, it is possible to select the electric resistance members 29A and 29B having appropriate resistance values in accordance with the amount of electric charges charged on the substrate A due to the difference in the size of the substrate A placed on the support plate 3 and the like. it can.

  Further, as shown in FIG. 13, the static electricity measuring device 31 is arranged in the vicinity of the support plate 3, and the home appliance quantity information of the substrate A is monitored by the control unit 32 connected to the static electricity measuring device 31, and according to the charged state. The electrical resistance members 29A and 29B to be connected may be switched. Alternatively, the controller 32 may predict the charging state of the substrate A based on process information received from a host computer (not shown) or the like.

  Further, as shown in FIG. 14, a variable resistor that continuously changes the resistance value by sliding the slider 33 is adopted as the electric resistance member 29, and the slider 33 is attached to the contact pin 21. It may be fixed. In this case, the resistance value is increased when the contact pin 21 rises when the substrate A begins to peel from the support plate 3. Thereby, the resistance value of the electrical resistance member 29 when the substrate A is separated from the contact pin 21 can be maximized.

  That is, when the substrate A is in reliable contact with the contact pin 21, the resistance value of the electric resistance member 29 is reduced so that the charge charged on the substrate A can be easily released to the outside through the contact pin 21. It is preferable to keep it. On the other hand, when the substrate A is separated from the contact pin 21, the electric resistance member 29 is used to prevent the electric charge charged on the substrate A toward the contact pin 21 having good conductivity from being discharged in the air. It is preferable to increase the resistance value.

Therefore, the above two requirements can be easily satisfied by increasing the resistance value when the contact pin 21 is raised.
In addition, the position of the contact pin 21 may be detected by a position sensor or the like (not shown), and the resistance value may be switched. The switching of the resistance value is not limited steplessly like a variable resistor, but may be switched stepwise.

In the present embodiment, the contact pin 21 is moved up and down by raising and lowering the substrate A. Instead, it may be synchronized with the raising and lowering operation of the contact pin 21.
For example, as shown in FIG. 15, the contact pin 21 is supported by an elevating mechanism 34 composed of a linear guide 34a and a slider 34b so as to be raised and lowered, and is urged upward by an urging means 24 such as a coil spring. ing. The pressed member 36 fixed to the contact pin 21 is pressed downward by the pressing member 35 provided on the slider of the lifting mechanism 8 for the lift pin 5.

  Thereby, in the state where the lift pin 5 is lowered, the pressed member 36 is pushed down by the pressing member 35, whereby the contact pin 21 is maintained in a state where it is pushed down against the urging force of the urging means 24. . When the lift pin 5 rises and pushes up the substrate A, the restraint of the pressed member 36 by the pressing member 35 is released, so that the contact pin 21 is moved by the urging force of the urging means 24 in synchronization with the rise of the substrate A. Raised.

  In the present embodiment, the contact pins 6 and 21 made of a conductive material are brought into contact with the substrate A. However, the conductive contact member is not limited to the contact pins 6 and 21. For example, you may employ | adopt the linear contact member (illustration omitted) exposed over the mounting surface 3a of the support plate 3 over a long range.

In this case, it is preferable to arrange the line-shaped contact member so as to extend along a direction intersecting with a peeling line formed when the substrate A is floated. By doing so, even if the peeling line moves as the substrate A floats, the substrate A can be kept in contact with the contact member at the position of the peeling line, and the peeling charging phenomenon causes the substrate A to move to the substrate A. The accumulated electric charge can be continuously released to the outside through the contact member.
Thereby, the charge remaining on the substrate A can be reduced, and damage to the substrate due to air discharge can be prevented more reliably.

It is a top view which shows the board | substrate support apparatus which concerns on the 1st Embodiment of this invention. It is a longitudinal cross-sectional view which shows a board | substrate inspection apparatus provided with the board | substrate support apparatus of FIG. It is a longitudinal cross-sectional view which shows the state which inserted the robot hand between the support plate and the board | substrate which floated in the board | substrate inspection apparatus of FIG. It is explanatory drawing which shows the form of the board | substrate floating by the lift pin of the board | substrate support apparatus of FIG. It is a longitudinal cross-sectional view which shows the 1st modification of the board | substrate support apparatus of FIG. It is a longitudinal cross-sectional view which shows the 2nd modification of the board | substrate support apparatus of FIG. It is an expanded sectional view of the contact pin vicinity which shows the board | substrate support apparatus which concerns on the 2nd Embodiment of this invention. It is a longitudinal cross-sectional view which shows the state which the contact pin of FIG. 7 is raising with the floating of a board | substrate. It is a figure which shows the 1st modification of the contact pin in the board | substrate support apparatus of FIG. It is a figure which shows the 2nd modification of the contact pin in the board | substrate support apparatus of FIG. It is a schematic diagram which shows the modification which connected the electrical resistance member to the contact pin of the board | substrate support apparatus of FIG. FIG. 12 is a schematic diagram showing a modification in which the electric resistance member of FIG. 11 is switched by a switch. It is a figure which shows the modification which changed the switch of FIG. 12 according to the charge amount of the board | substrate. It is an expanded sectional view which shows the modification which connected an electrical resistance member to the contact pin of the board | substrate support apparatus of FIG. 7, and made resistance value become large with a raise of a board | substrate. FIG. 8 is a longitudinal sectional view showing a modified example in which the operation of the contact pin of the substrate support apparatus of FIG. 7 is synchronized with the operation of the lift pin.

Explanation of symbols

A board | substrate 1,20 board | substrate support apparatus 3 support plate 3a mounting surface 4 opening part 5 lift member 6,21 contact pin (contact member)
29, 29A, 29B Electric resistance member 33 Slider

Claims (9)

A support plate on which a thin plate-like substrate is placed;
Including at least one contact member that is disposed at a location other than the location where the substrate placed on the placement surface of the support plate is pushed up to float from the placement surface and contacts the back surface of the substrate;
A substrate support device in which the contact member is made of a conductive material and is electrically grounded. Provided with a plurality of lift members which are provided so as to be able to protrude and retract from an opening opening on the mounting surface of the support plate, and float the substrate from the mounting surface;
The substrate support apparatus according to claim 1, wherein the contact member is disposed between the lift members.   The substrate support apparatus according to claim 1, wherein the contact member is disposed at a position in contact with the back surface of the lowermost substrate due to bending of the substrate when the substrate is levitated.   The said contact member is comprised so that it may space apart from the back surface of a board | substrate after protruding upward from the mounting surface of the said support plate when the said board | substrate is levitated. The substrate support apparatus described in 1.   4. The substrate support device according to claim 1, wherein the contact member is formed in a line shape extending in a direction intersecting with a peeling line between the substrate and the support plate that is peeled from the support plate. 5.   The substrate support device according to claim 1, wherein the contact member is grounded via an electric resistance member.   The substrate support apparatus according to claim 6, wherein a resistance value of the electric resistance member is variable. The contact member is grounded via an electrical resistance member;
The substrate support apparatus according to claim 4, further comprising a variable resistance value mechanism that increases a resistance value of the electric resistance member in accordance with a rise of the contact member. The electrical resistance member comprises a variable resistor that varies the resistance value by moving the slider,
The substrate support device according to claim 8, wherein the variable resistance mechanism moves the slider in synchronization with the movement of the contact member.

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