KR200448913Y1 - Test handler - Google Patents

Abstract

The present invention relates to a test handler. According to the present invention, the semiconductor devices are loaded from the customer tray into the test tray or the semiconductor devices are tested by removing static electricity or residual charges from the semiconductor elements moving according to the operation of the test handler. When unloading from the tray to the customer tray (unloading can be followed by an example of ultimate unloading from the test tray to the customer tray via the sorting table), so that the semiconductor devices can be properly seated in the test tray or the customer tray. A technique is disclosed.

Description

Test handler {TEST HANDLER}

1 is a schematic diagram of a test handler according to the prior art.

2 is a schematic diagram of a picking element constructed in a typical pick and place apparatus.

3 is a conceptual plan view of a general test handler.

4 to 8 are reference diagrams for explaining the problem of the test handler according to the prior art.

9 is a conceptual diagram of a static electricity or residual charge remover according to an embodiment of the present invention.

10 is a conceptual perspective view for expressing a relative relationship between a test tray and a static electricity or residual charge remover.

11 is a conceptual perspective view for expressing a relative relationship between a pick and place device and a static electricity or residual current remover.

12 is a reference diagram for explaining a method of removing static electricity or residual charge from all semiconductor elements loaded in a matrix in a test tray.

Fig. 13 is a reference diagram for explaining a method of removing static electricity or residual charge from all semiconductor elements held in the pick and place device.

14 to 20 is a conceptual perspective view of a test handler according to the present invention for representing the installation position of the static electricity or residual charge eliminator.

* Description of the symbols for the main parts of the drawings *

90: static electricity or residual charge eliminator

91: conductive brush

91a: conductive microfiber

92: brush frame

93: register

The present invention relates to a test handler for supporting inspection of a semiconductor device produced, and more particularly, to a technique for removing static electricity or residual charge from semiconductor devices.

In general, a test handler supports a semiconductor device manufactured through a predetermined manufacturing process to be tested by a tester, and classifies semiconductor devices according to test results and loads them into a customer tray. It is open to the public.

FIG. 1 is a schematic diagram according to the prior art for such a test handler, which will be described schematically with reference to FIG. 1.

As shown in FIG. 1, the conventional test handler includes a loading device 110, a soak chamber 120, a test chamber 130, a desock chamber 140, and an unloading device 150.

The loading device 110 loads the semiconductor devices loaded in the customer tray of 10a into the test tray TT in a horizontal state. For reference, semiconductor devices are stacked in a matrix form in the customer trays 10a and 10b and the test tray TT.

The soak chamber 120 sequentially receives the loaded test tray TT, and is provided to preheat / precool the semiconductor device loaded in the received test tray TT. To this end, the soak chamber 120 has a temperature environment for preheating / precooling the semiconductor device.

The test chamber 130 is provided to directly support a test of the semiconductor device loaded in the test tray TT supplied from the soak chamber 120. To this end, the test chamber 130 has a mechanical configuration for mating the semiconductor device loaded in the test tray TT with the test socket of the tester.

The desock chamber 140 is provided to remove heat or cold air from the semiconductor device at a high temperature or a cooling state.

The unloading device 150 classifies the tested semiconductor devices by grade and unloads them to the customer tray of code 10b.

In the above configuration, the loading device 110 should move the semiconductor device from the customer tray 10a to the test tray TT, and the unloading device 150 moves the semiconductor device from the test tray TT to the customer tray 10b. Since it includes a device (pick and place device: PICK AND PLACE APPARATUS) that can hold or release the semiconductor device in that it must be moved to the Korean Patent Publication No. 10-0223093 As shown in the test tray transfer method of the expression handler, hereinafter referred to as 'prior art 1', it may be implemented as a single loading and unloading device that performs both loading and unloading.

The technology related to the above pick-and-place device is Korean Patent Publication No. 10-0596739 (the name of the design: Loader hand of the test handler, hereinafter referred to as 'prior art 2', prior art 2 in the loader hand instead of the pick and place device And the like are already known in detail. In general, a pick-and-place apparatus includes a plurality of picking elements for the purpose of moving a plurality of semiconductor elements at a time, each picking element being capable of holding the semiconductor elements by vacuum pressure. As shown in FIG. 2, each of the picking elements 20 includes a vacuum adsorption pad 21 at a portion holding the semiconductor element D in order to gently suck and hold the semiconductor elements by vacuum pressure.

For reference, the test handlers that have been widely used up to now have an underhead docking method (the test tray is in contact with the tester in a horizontal state) and a side docking method (the test tray is in contact with the tester in a vertical state depending on how the test tray is in contact with the tester). The test handler of FIG. 1 relates to a side docking method. Such a side docking test handler requires a posture converting apparatus for converting a horizontal test tray into a vertical position or a vertical test tray into a horizontal state. Reference numeral 160 in FIG. 1 denotes a vertical posture converting apparatus for performing posture conversion of a test tray in a horizontal state in which loading is completed into a vertical state. It is a horizontal posture converting device for performing posture conversion into a vertical position, and as referred to in the prior art 1, a vertical posture converting device and a horizontal posture converting device may also be implemented as one device.

FIG. 3 is a schematic plan view of the test handler of FIG. 1.

In FIG. 3, the conveyance direction a of the test tray TT and the conveyance direction b of the semiconductor element in the test handler of FIG. As illustrated in FIG. 3, the test tray TT is configured to circulate a circulation path including a loading position LP, a test position TP, and an unloading position UP. For reference, Korean Patent Application No. 10-2006-0009771 for performing classification of test devices by test grade prior to unloading the semiconductor device from the test tray TT in the unloading position UP to the customer tray. A sorting table 180 (see FIG. 1) is provided as shown in the heading (designation: sorting table apparatus for test handler, hereinafter referred to as 'prior art 3'), which sorting table 180 is shown in FIG. As referred to in the A portion which is one side of the unloading position (UP). When the sorting table 180 is provided, when the semiconductor device is unloaded, the sorting table 180 is moved from the test tray TT to the customer tray via the sorting table 180. In addition, when the sorting table 180 is provided, a pick and place device for moving the semiconductor device from the test tray TT to the sorting table 180 and a pick and place for moving the semiconductor device from the sorting table 180 to the customer tray. The place device may be provided together with the unloading device 150.

On the other hand, the semiconductor device needs to be electrically connected to the tester for the test. In this case, the tested semiconductor device may have static electricity or residual charge, and also, due to friction or other reasons, during the manufacturing and transportation process, May have static or residual charge.

If the semiconductor device has static electricity or residual charge, problems may arise in proper movement by the pick and place device. For example, as shown in FIG. 4, if there is static electricity or residual charge between the vacuum adsorption pad of the picking device and the semiconductor device in the portion B, the picking device holds the semiconductor device and releases it to release the semiconductor device at a predetermined position. When it is to be seated, as shown in FIG. 5, the semiconductor device is inclined so that proper seating is not performed.

A representative example of examples in which the semiconductor device is not properly seated as described above will be described with reference to FIGS. 6 to 8.

In general, the test tray TT has an insert 30 in which a semiconductor device is seated in a matrix form. The insert 30 has a seating space 31 in which the semiconductor device is seated, as shown in the plan view of FIG. 6. Have In this seating space 31, both sides (i and j side) are opened as referred to in the side view of FIG. This is because the semiconductor device must be loaded or unloaded in the i-direction and the semiconductor device seated in the j-direction must be electrically connected to the tester. Therefore, when the semiconductor device is loaded, the locking projections 32a and 32b are configured to prevent the semiconductor device from falling out in the j-direction. However, when the semiconductor element falls into the insert in the state as shown in FIG. 5 at the time of loading, as shown in FIG. 8, the semiconductor element is not caught by the latching jaws 32a and 32b and falls below the insert 30. There is a danger. In general, as described in the Republic of Korea Patent Publication No. 10-0486412 (the name of the design: test tray insert of the test handler, hereinafter referred to as "prior art 4"), the insert 30 is fixed to the loaded semiconductor element Since a locking device is provided, a release device for releasing the locking device is required. There are various embodiments as such a release device, but in the loading position or the unloading position as referred to in the Republic of Korea Patent Publication No. 10-0687676 (the name of the design: test handler, hereinafter 'prior art 5') In the case where the opener is provided below the test tray, according to the state as shown in FIG. 8, since the semiconductor device passes through the seating space 31 of the insert 30 and falls to the opener, the opener is tested during the operation of the opener. Failure to properly mate with the tray may result in jams or damage to the insert 30 and the semiconductor device. Of course, even in the case of a test handler not according to the prior art 5, that is, even if the opener is not configured below the test tray in the loading position or the unloading position, the test tray in the loading position or the unloading position The semiconductor device falls into any of the operating devices positioned at, resulting in a malfunction of the operating device.

Therefore, there is a need for a technique for removing static electricity or residual charge from a semiconductor device.

A study on the technique of removing static electricity from semiconductor devices was first attempted by an advanced test company in Japan, and an advanced test company in Japan was published in Japanese Patent Application Laid-Open No. Hei 8-267383 (design: adsorption head of IC handler). In this paper, a technique for removing static electricity from semiconductor devices has been proposed through Korean Patent No. 2001-600-6 and Japanese Patent Laid-Open No. 2001-260065.

Prior art 6 discloses a technique for removing static electricity from a semiconductor device held by a picking device by constructing a metallic pad adapter electrically grounded to the picking device. However, in this case, there is a problem that the mobility of the pick-and-place device is slowed down and the productivity of the device is reduced due to the increase in the weight of the metallic pad adapters configured in each of the plurality of picking elements of the pick-and-place device. In general, the pick-and-place apparatus includes a plurality of picking elements to reduce loading time or unloading time, and the number of picking elements provided is limited by the limiting factors such as rapid movement and minimization of inertia. . However, when the metallic pad adapter is configured in the picking device as in the prior art 6, there is a problem that the loading time or the unloading time of the pick and place device is inevitably increased due to the increase of the weight or the reduction of the picking device to reduce the weight. have. This increase in loading time or unloading time is contrary to the task of shortening the test time required by the continuous increase in the demand of semiconductor devices, so that the prior art 6 is difficult to be applied to the actual product.

In addition, the prior art 7 discloses a technique for removing static electricity from a semiconductor device held through a pad, a pad pin, a pad guard, and a base plate of a metallic material, but also due to the increase in the weight of the picking device and the complexity of the device. It may cause the same problems as the prior art 6 is difficult to commercialize as a real product.

For reference, see Japanese Unexamined Utility Model Publication No. 6-50400 (design of the design: electrostatic countermeasure device of an automatic mounting machine or a printed circuit board using the same, hereinafter referred to as 'Reference Technology 1'). It provides a technique using a conductive brush to remove the. According to the reference technology 1, the conductive brush is in contact with the grand pattern of the printed board to remove the static electricity of the printed board. However, since a plurality of semiconductor devices stacked in a matrix in the test tray are spaced apart from each other, even if some rows or columns of semiconductor devices are in contact with the conductive brush, static electricity of all the semiconductor devices loaded in the test tray may not be removed. . That is, the reference technology 1 is a technology to remove static electricity from one printed board, but a plurality of semiconductor devices are loaded in a test tray or a customer tray, and a plurality of semiconductor devices are held in a single pick and place device. Because of this, it is difficult to apply a technique to a test handler that uses a conductive brush to remove static electricity from a single printed circuit board, such as reference technology 1.

Of course, if the installation area of the conductive brush is the same as the area of the test tray so that the semiconductor devices loaded on the test tray can be in contact with the conductive brush at once, the application of the reference technology may be theoretically possible. However, in order to apply such a technique to a test handler, a separate space must be provided for installing a conductive brush having a contact area that is at least as large as the area of the test tray. Since the spatial organic positional relations appropriately distributed among the component units must be corrected, it leads to waste of R & D costs and manpower for establishing new positional relations, and improves the stability of the device according to the mechanical configuration change of each changed unit. There is a problem that cannot be secured immediately. In addition, as it occupies a large occupied space, there is a problem that it cannot be applied to a test handler already applied to a test site.

In addition, the Republic of Korea Patent Publication No. 10-0237428 (the name of the design: brush for removing static electricity, referred to as "reference technology 2") discloses a technology for removing the static electricity of semiconductor devices manufactured through a brush made of a carbon chamber Doing.

According to reference technology 2, static electricity is removed from the semiconductor device while the semiconductor device being moved through the transfer path and the carbon chamber drooping downward, and the reference technology 2 is a semiconductor device as the semiconductor devices sequentially pass through the transfer path. The surface of the device is in contact with the carbon chamber.

On the other hand, in recent years, since the structure of the tester becomes complicated, residual charge remains in the semiconductor device when the test is completed, and the remaining charge remains at the electrical contact portion of the semiconductor device. In some cases, the residual voltage after test completion reaches 800V. Therefore, it is essential to remove the residual charges in the electrical contact portion of the semiconductor device. In general, however, the surface of the semiconductor device faces upward and the electrical contact portion of the semiconductor device faces downward in the test handler, or the semiconductor device moves vertically (partly moving section in the side-doking type test handler). Therefore, it is difficult to apply the reference technology 2 as it is.

The present invention has been made to solve the above problems has the following object.

First, by providing a conductive brush that is grounded on the path of the semiconductor device to move, the semiconductor device passing through the path can be moved in contact with the conductive brush, and furthermore, Regardless, the present invention provides a technology for allowing semiconductor devices to contact a conductive brush.

Secondly, the present invention provides a technology capable of removing static electricity or residual charge from a semiconductor device loaded in a test tray on a path from a test position where the semiconductor device is most likely to be charged with static electricity or residual charge to an unloading position.

The ultimate purpose of the first and second objects can be derived regardless of the configuration of the pick and place device.

The test handler according to the present invention for achieving the above object, a loading device for loading a semiconductor device from the customer tray to the test tray in the loading position; A test chamber provided to support a test of a semiconductor device loaded in a test tray transferred from the loading position to a test position after the loading is completed by the loading apparatus; An unloading device for unloading the semiconductor element loaded in the test tray transferred from the test position to the unloading position in the test tray after the test of the semiconductor element loaded in the test position on the test chamber is completed; And at least one static or residual charge remover for removing static or residual charge of the semiconductor device. The electrostatic or residual charge remover includes: a conductive brush in contact with the semiconductor device; And it maintains the frame of the conductive brush, characterized in that it comprises an electrically grounded brush frame.

The electrostatic or residual charge eliminator may be in contact with the electrical contact of the semiconductor element loaded in the test tray when the test tray moves on the path from the test position on the test chamber to the unloading position. Another feature is that it is fixed to be installed.

The electrostatic or residual charge eliminator may cause the conductive brush to come into contact with an electrical contact portion of the semiconductor device held by the loading device or the unloading device when the semiconductor device is moved while being held by the loading device or the unloading device. It is another feature that is fixed to be installed.

The static electricity or residual charge eliminator further includes a separate resistor (RESISTOR) for arbitrarily mitigating the degree of elimination of static electricity or residual charge.

When a plurality of static electricity or residual charge eliminators are provided, the electrical resistance of the resistor applied to each of the static electricity or the residual charge eliminator has a different value, but first, the static electricity or residual charge eliminator removes static electricity or residual charge. In another aspect, the electrical resistance value of the resistor included in the resistor is larger than the electrical resistance value of the resistor provided in the static electricity or residual charge eliminator for removing static electricity or residual charge later.

The thickness of the conductive microfiber (적용된) applied to the conductive brush is characterized by more specific than that larger than 0㎛ and less than 20㎛.

The brush frame has a rod shape, the conductive brush is characterized in that a plurality of conductive microfiber (極 細絲) is formed in the brush frame in the longitudinal direction of the brush frame more specific.

The planted lengths of the plurality of conductive microfibers correspond to the widths of the rows or columns of the semiconductor elements that are arranged and moved in a matrix so that the semiconductor devices belonging to the same row or the same column may be in contact with the plurality of conductive microfibers. It is one feature.

The conductive microfiber is characterized in that the metal is more specific.

Hereinafter, one preferred embodiment according to the present invention will be described in detail with reference to the accompanying drawings, in the case of the configuration for performing the same function for the convenience of description is denoted by the same reference numerals, and also with respect to the same configuration as the prior art The same reference numerals are used to describe them.

In the test handler according to the present invention, the electrostatic or residual charge remover 90 as shown in FIG. 9 is applied to the conventional test handler as shown in FIG.

Referring to FIG. 9, the static electricity or residual charge remover 90 includes a conductive brush 91, a brush frame 92, a resistor 93, and the like.

The conductive brush 91 is planted in the brush frame 92 so that the frame is maintained through the brush frame 92. The conductive brush 91 is composed of many conductive microfibers 91a. The conductive microfibers 91a are made of a conductive material such as metal or carbon (carbon). However, in the test handler, since the test chamber or the soak chamber needs to be maintained at a high temperature, it is limited to its application in the case of carbon that is weak in heat, and the conductive brush 91 is an electrical contact portion of the semiconductor element. Since the part needs to be planted upward in order to be in contact with the side facing downward or sideward, it is preferable to be made of a metal material having good hardness and elastic restoring force. And the thickness is provided in micro units because it must be very thin in order to prevent scratching of the semiconductor element or the insert. The conductive microfiber 91a in the present embodiment is made of stainless material, and is intended to have a thickness of 12 μm, but is not limited thereto. It can be bent or restored and thus preferably applied.

The brush frame 92 maintains the frame of the conductive brush 91 and is electrically grounded. Of course, the brush frame 92 should be made of a material having conductivity. Brush frame 92 is a long rod-like conductive microfibers (91a) are planted in the longitudinal direction of the brush frame (92).

And the length of the brush frame 92 has a length corresponding to the length of one side of the test tray (TT) as generally referred to in Figure 10 or one of the pick and place device 80 as referred to in Figure 11 It is intended to have a length corresponding to the side width. The reason for this is that the planted length of the conductive microfiber 91a may correspond to the width of the row or column of the semiconductor devices loaded in a matrix form in the test tray TT, or the semiconductor devices held in the pick and place device 80 (usually Is held in a matrix behavior of 2 X 8 columns) so as to correspond to the width of a row or column.

The resistor 93 is provided to alleviate the degree of elimination of static electricity or residual charge. Of course, the conductive brush 91 or the brush frame 92 may also act as a resistance, but in the case of the conductive brush 91 or the brush frame 92, since the resistance may be regarded as 0 Ω level, a separate electrical resistance may be obtained. This will help to mitigate the removal of static or residual charge. The reason why the degree of elimination of static electricity or residual charge is alleviated is that when the semiconductor device is excessively charged by static electricity or residual charge, the instantaneous excess current immediately before contacting the conductive brush 91 is energized, thereby conducting conductivity with the semiconductor device. Dielectric (air) breakdown phenomenon (same as lightning strike) may occur in the space between the brushes 91 at the moment of contact, and energization caused by the dielectric breakdown impacts the semiconductor device, This is because there is a risk of damage. It is preferable that the magnitude | size of the electrical resistance which this resistor 93 has is 14.3 kPa or less. Because the experimental results show that the effect of eliminating static electricity or residual charge is insignificant at high resistance of 125 mA or more, and the smaller the resistance is, the better the effect is. Because it was enough.

Next, the operation of the static electricity or residual charge remover 90 as described above will be described.

The static electricity or residual charge remover 90 removes static electricity or residual charge from semiconductor elements at any position on a path along which a test tray TT in which semiconductor elements are loaded or a pick and place device 80 holding a semiconductor element moves. It is installed so that it can be done. This will be described in more detail in the following example of the installation position.

Referring to FIGS. 10 and 12 (a) to (e), when the test tray TT in which semiconductor devices are loaded moves, semiconductor devices belonging to the same row or column are simultaneously brought into contact with the conductive brush 91. It represents a case where static electricity or residual charge is sequentially removed from semiconductor elements of all rows or all columns.

11 and 13 (a) to 13 (c) illustrate that semiconductor elements held in the pick and place device 80 are sequentially contacted with the conductive brush 91 while being moved as the pick and place device 80 moves. The case is expressed.

For reference, referring to FIGS. 10 to 13, it can be seen that a method of removing static electricity or residual charge by contacting the electrical contact portion of the semiconductor element with the conductive brush 91 is taken. The electrostatic or residual charge remover 90 which acts as described above may include a conductive brush that is electrically connected to the semiconductor devices in the process of being moved together while being loaded or held in the test tray TT or the pick and place device 80. 91, and should be installed so as to be able to contact all individually, it should be installed so that the direction in which the conductive microfiber 91a is planted in the brush frame 92 is perpendicular to the moving direction of the semiconductor device.

Hereinafter, the installation position of the static electricity or the remaining charge remover 90 will be described.

FIG. 14 shows that an electrostatic or residual charge remover 90 is installed on a path to which the semiconductor device loaded in the test tray TT is moved to the desock chamber 140 after the test is completed at the test position. 15, the static electricity or residual charge eliminator 90 is installed on the path of the semiconductor element loaded in the test tray TT which is upwardly moved after completing the translation in the vertical state in the desock chamber 140. In FIG. 16, the static electricity or residual charge eliminator is removed on the path of the semiconductor element loaded in the test tray TT which is transferred to the unloading position after the posture transformation is completed by the horizontal posture converting apparatus 170. As shown in FIG. It shows that 90 is installed.

In addition, in FIG. 17, the static electricity or the residual charge remover 90 is installed on the movement path of the semiconductor devices held in the pick and place device 80 moving from the test tray TT in the unloading position to the sorting table 180. FIG. 18 illustrates a case in which a static electricity or residual charge remover 90 is installed on a movement path of semiconductor elements held in a pick and place device 80 moving from a customer tray to a test tray TT. .

19 and 20, two electrostatic or residual charge eliminators 90 are provided.

19 is a case where the example of FIG. 14 and the example of FIG. 17 are combined. As described above, the static electricity or residual charge eliminator 90 according to the present invention is provided with a resistor 93 for mitigating the degree of elimination of static electricity or residual charge, in which case one static electricity or residual charge eliminator 90 is provided. All static or residual charges may not be removed by this. Therefore, by installing a plurality of static or residual charge remover 90 is to be able to remove all of the static or residual charge sequentially. Of course, although the resistor 93 having the same electrical resistance may be employed in the plurality of static electricity or residual charge eliminators 90, the electrical resistances of the resistors 93 provided in the respective static electricity or residual charge eliminators 90 are different from each other. It may be considered to be preferably provided to. If the electrical resistances of the resistors 93 provided in the static electricity or residual charge remover 90 are different from each other, first, the resistors provided in the static electricity or residual charge remover 90 for removing static electricity or residual charge are first provided. It is preferable that the electrical resistance value of 93 be greater than the electrical resistance value of the resistor 93 provided in the static electricity or residual charge eliminator 90 which later eliminates static electricity or residual charge. Because, when excessive electrostatic charge is charged to the semiconductor device, first by removing the static electricity or residual charge by the action of the electrostatic or residual charge remover 90 having a resistor 93 having a large electrical resistance, and then the electrical resistance is small This is because the remaining static electricity or residual charge must be removed by the action of the static electricity or the residual charge remover 90 having the resistor 93 to ensure the protection of the semiconductor device by preventing the dielectric breakdown.

In addition, although the two electrostatic or residual charge eliminators 90 are installed in a state spaced apart from each other by a considerable distance from each other in FIG. 19, a plurality of electrostatic or residual charge eliminators 90 are installed adjacent to each other as shown in FIG. It is possible. 19 and 20, two static electricity or residual charge eliminators may be installed in different combinations.

On the other hand, since the position where the semiconductor device is most likely to be charged by static electricity or residual charge is a test position where the semiconductor devices are tested by the tester, it is implemented to remove static electricity or residual charge from the semiconductor device held in the test tray. In this case, it is preferable that the static or residual charge eliminator 90 is installed at any position from the test position to the unloading position, rather than the static or residual charge eliminator 90 being installed between the test position and the loading position.

For reference, a method of removing static electricity or residual charge from semiconductor elements by installing the ionizer in a closed space such as a soak chamber, a test chamber, a desock chamber, or the like may also be considered. However, since the electrostatic or residual charge remover 90 of FIG. 9 using the simple and installable conductive brush 91 is more preferable than the expensive ionizer, it is more preferable in terms of installation or productivity.

In addition, according to the embodiment, when the conductive brush 91 is configured to remove static electricity or residual charges from all the semiconductor elements loaded in the test tray TT, the resistance is gradually reduced by using a variable resistor. By doing so, it is also possible to sequentially remove static electricity or residual charge over time from the semiconductor device.

In addition, the test handler according to the present invention includes a case in which the conductive brush 91 is moved to be in contact with the stationary semiconductor elements to remove static electricity or residual charge, but a separate device for moving the conductive brush 91 is provided. It will be appreciated that a method of utilizing the movement of the semiconductor device that has already been constructed is more preferable than adding.

Detailed description of the present invention as described above was made by the embodiment with reference to the accompanying drawings, but the above-described embodiment has been described by way of example only for the present invention, the present invention is limited to the above embodiment It should not be understood that the scope of the present invention will be understood by the claims and equivalent concepts described below.

According to the present invention as described in detail above has the following effects.

First, the mobility of the pick-and-place device may be guaranteed by removing static electricity or residual charge of the semiconductor device by using a conductive brush installed independently of the pick-and-place device.

Second, because it uses the movement of semiconductor devices, it minimizes the size of static electricity or residual charge eliminator to improve installation, and it can be applied without changing the position or configuration of existing components, and it is also simple to the product applied to the current test support. Can be installed.

Third, according to one embodiment of the present invention, because it is to remove the static electricity or the residual charge at any position between the moving path from the test position to the unloading position, excessive static or residual charge in the semiconductor device by the test Even if is maintained, the unloading by the pick and place device can be made properly.

Fourth, by using a resistor to reduce the degree of elimination of static electricity or residual charge to prevent damage to the semiconductor device that can come when the static electricity or residual charge is removed, and further, a plurality of static electricity each having a resistor having a different electrical resistance Alternatively, the residual charge eliminator may be installed to sequentially remove static electricity or residual charge, thereby removing static electricity or residual charge without damaging the semiconductor device.

Fifth, since the residual charge at the electrical contact portion of the semiconductor device can be removed, damage to the semiconductor device caused by the residual charge can be prevented.

Claims (9)

delete A loading device for loading a semiconductor device from a customer tray into a test tray at a loading position; A test chamber provided to support a test of a semiconductor device loaded in a test tray transferred from the loading position to a test position after the loading is completed by the loading apparatus; An unloading device for unloading the semiconductor element loaded in the test tray transferred from the test position to the unloading position in the test tray after the test of the semiconductor element loaded in the test position on the test chamber is completed; And At least one static or residual charge remover for removing static or residual charge of the semiconductor device; Including; The static electricity or residual charge eliminator is installed on the path that the semiconductor device is moved, A conductive brush fixedly installed to be in contact with an electrical contact portion of the semiconductor device; And A brush frame that is electrically grounded while maintaining a frame of the conductive brush, and has a rod shape; Including, The static electricity or residual charge eliminator is installed on the path that the test tray moves from the test position to the unloading position, The conductive brush is made of a plurality of conductive microfiber (심) is planted in the brush frame in the longitudinal direction of the brush frame, The planted lengths of the plurality of conductive microfibers correspond to the widths of the rows or columns of the semiconductor elements that are arranged and moved in a matrix so that the semiconductor devices belonging to the same row or the same column may be in contact with the plurality of conductive microfibers. By Test handler. A loading device for loading a semiconductor device from a customer tray into a test tray at a loading position; A test chamber provided to support a test of a semiconductor device loaded in a test tray transferred from the loading position to a test position after the loading is completed by the loading apparatus; An unloading device for unloading the semiconductor element loaded in the test tray transferred from the test position to the unloading position in the test tray after the test of the semiconductor element loaded in the test position on the test chamber is completed; And At least one static or residual charge remover for removing static or residual charge of the semiconductor device; Including; The static electricity or residual charge eliminator is installed on the path that the semiconductor device is moved, A conductive brush fixedly installed to be in contact with an electrical contact portion of the semiconductor device; And The brush is electrically grounded while maintaining the frame of the conductive brush, and includes a brush frame having a rod shape. The static electricity or residual charge eliminator is installed on a path through which the semiconductor element is held in the loading device or the unloading device. The conductive brush is made of a plurality of conductive microfiber (심) is planted in the brush frame in the longitudinal direction of the brush frame, The planted lengths of the plurality of conductive microfibers correspond to the widths of the rows or columns of the semiconductor elements that are arranged and moved in a matrix so that the semiconductor devices belonging to the same row or the same column may be in contact with the plurality of conductive microfibers. By Test handler. A loading device for loading a semiconductor device from a customer tray into a test tray at a loading position; A test chamber provided to support a test of a semiconductor device loaded in a test tray transferred from the loading position to a test position after the loading is completed by the loading apparatus; An unloading device for unloading the semiconductor element loaded in the test tray transferred from the test position to the unloading position in the test tray after the test of the semiconductor element loaded in the test position on the test chamber is completed; And At least one static or residual charge remover for removing static or residual charge of the semiconductor device; Including; The static electricity or residual charge eliminator is installed on the path that the semiconductor device is moved, A conductive brush in contact with the semiconductor element; And An electrically grounded brush frame holding the frame of the conductive brush; And A separate register for randomly mitigating the removal of static or residual charge; Characterized in that it comprises Test handler. The method of claim 4, wherein When a plurality of static electricity or residual charge eliminators are provided, the electrical resistance of the resistor applied to each of the static electricity or the residual charge eliminator has a different value, but first, the static electricity or residual charge eliminator removes static electricity or residual charge. Characterized in that the electrical resistance value of the resistor provided in the greater than the electrical resistance value of the resistor provided in the electrostatic or residual charge eliminator to remove the static or residual charge later Test handler. delete delete delete The method of claim 2, The conductive microfiber is characterized in that the metal material Test handler.

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