CN116325138A - 热传导片材保持体以及放热装置的制造方法 - Google Patents
热传导片材保持体以及放热装置的制造方法 Download PDFInfo
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- CN116325138A CN116325138A CN202180070469.0A CN202180070469A CN116325138A CN 116325138 A CN116325138 A CN 116325138A CN 202180070469 A CN202180070469 A CN 202180070469A CN 116325138 A CN116325138 A CN 116325138A
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Abstract
本发明的热传导片材保持体依次具备长条状的承载膜;多个热传导片材;以及覆盖上述多个热传导片材的长条状的覆盖膜,相邻的上述热传导片材的最短距离为2mm以上,上述多个热传导片材在上述承载膜以及上述覆盖膜的长度方向上空有间隔地进行配置,上述多个热传导片材可以从上述覆盖膜以及上述承载膜上剥离。
Description
技术领域
本发明涉及热传导片材保持体以及放热装置的制造方法。
背景技术
近年来,使用了多层布线板的半导体封装中的布线以及电子部件的搭载密度的高密度化所导致的发热量增大、半导体元件的高集成化所导致的每单位面积的发热量增大,期待提高自半导体封装的散热性。
通常简便地使用在半导体封装等发热体与铝、铜等放热体之间夹持热传导润滑油或热传导片材并使其密合、从而对热进行放散的放热装置。通常,相比较于热传导润滑油,热传导片材在组装放热装置时的操作性上更优异。
作为热传导片材,已知填充了热传导填充物的树脂片材。作为填充了热传导填充物的热传导性优异的树脂片材,提出了各种选择热传导性高的无机粒子作为热传导填充物、进而使无机粒子相对于片材面垂直取向的树脂片材。
例如提出了热传导填充物(氮化硼)在相对于片材面大致垂直的方向上取向的热传导片材(例如参照专利文献1)、以及分散在凝胶状物质中的碳纤维相对于片材面垂直取向的结构的热传导片材(例如参照专利文献2)。
现有技术文献
专利文献
专利文献1:日本特开2002-26202号公报
专利文献2:日本特开2001-250894号公报
发明内容
发明要解决的技术问题
通过在半导体封装等发热体与铝、铜等放热体之间夹持专利文献1及2所记载的热传导片材并使其密合,可以制造放热装置,但由于放热装置的需求提高,因此需要能够高效地制造放热装置的方法、这种方法中使用的热传导片材等。
本公开鉴于上述内容而完成,其目的在于提供能够高效地制造放热装置的热传导片材保持体、以及使用了该热传导片材保持体的放热装置的制造方法。
用于解决技术问题的手段
用于解决上述技术问题的具体手段包含以下方式。
<1>一种热传导片材保持体,其依次具备:
长条状的承载膜;
多个热传导片材;以及
覆盖上述多个热传导片材的长条状的覆盖膜,
上述多个热传导片材在上述承载膜以及上述覆盖膜的长度方向上空有间隔地进行配置,
上述多个热传导片材可以从上述覆盖膜以及上述承载膜上剥离。
<2>根据<1>所述的热传导片材保持体,其在上述承载膜与上述多个热传导片材之间进一步具备脱模层,介由上述脱模层,上述多个热传导片材可以从上述承载膜上剥离。
<3>根据<2>所述的热传导片材保持体,其具备沿着上述承载膜的长度方向配置的多个上述脱模层,在上述多个脱模层中分别配置有1个以上的上述热传导片材。
<4>根据<3>所述的热传导片材保持体,其中,在按照上述覆盖膜成为垂直方向下侧、上述承载膜成为垂直方向上侧的方式进行配置时,由相邻的上述脱模层以及通过分别配置在相邻的上述脱模层而相邻的上述热传导片材形成的空隙的形状在从热传导片材保持体的宽度方向进行观察时为凸形状。
<5>根据<1>~<4>中任一项所述的热传导片材保持体,其中,相比较于上述覆盖膜与上述热传导片材之间的剥离力,上述承载膜与上述热传导片材之间的剥离力更大。
<6>根据<1>~<5>中任一项所述的热传导片材保持体,其中,上述热传导片材的平均厚度为50μm~500μm。
<7>根据<1>~<6>中任一项所述的热传导片材保持体,其中,上述热传导片材含有热传导填充物和树脂。
<8>根据<1>~<7>中任一项所述的热传导片材保持体,其沿着长度方向被卷绕成卷状。
<9>根据<1>~<8>中任一项所述的热传导片材保持体,其中,在与上述承载膜以及上述覆盖膜的长度方向正交的宽度方向上,上述承载膜的宽度以及上述覆盖膜的宽度比上述热传导片材的宽度大。
<10>根据<1>~<9>中任一项所述的热传导片材保持体,其中,相邻的上述热传导片材的最短距离为2mm以上。
<11>根据<1>~<10>中任一项所述的热传导片材保持体,其中,在上述承载膜的表面中未产生刻痕。
<12>一种放热装置的制造方法,其为使用上述<1>~<11>中任一项所述的热传导片材保持体、使上述热传导片材介于发热体与放热体之间来制造放热装置的放热装置的制造方法,其具备以下工序:
将上述覆盖膜从上述热传导片材保持体上剥离的工序;
在剥离了上述覆盖膜的上述热传导片材保持体中,使上述热传导片材压合在发热体以及放热体中的一者上的工序;
将上述承载膜从粘接有上述发热体以及上述放热体中的一者的上述热传导片材上剥离的工序;以及
在上述热传导片材的与粘接有上述发热体以及上述放热体中的一者的那侧相反的一侧上,压合上述发热体以及上述放热体中的另一者的工序。
发明效果
根据本公开,可以提供能够高效制造放热装置的热传导片材保持体、以及使用了该热传导片材保持体的放热装置的制造方法。
附图说明
图1为表示本公开的热传导片材保持体的一例的侧视图。
图2为从覆盖膜1侧观察对应于图1的虚线部的区域α时的图。
图3为表示放热装置的制造方法的一例中的制造工序的一部分的示意图。
具体实施方式
以下,对用于实施本发明的方式详细地进行说明。但本发明并不限定于以下的实施方式。以下的实施方式中,其构成要素(也包含步骤要素等)除了特别明示的情况之外,并非是必须的。对于数值及其范围也是同样的,并不限制本发明。
本公开中,“工序”这一用语除了独立于其它工序的工序之外,即便是无法与其它工序明确地区分时,只要达成该工序的目的,则也包含该工序。
本公开中,使用“~”表示的数值范围中是将“~”前后记载的数值分别作为最小值及最大值并包含在内。
本公开中,阶段性记载的数值范围中,一个数值范围中记载的上限值或下限值也可以替换成其它阶段性记载的数值范围的上限值或下限值。另外,本公开中记载的数值范围中,该数值范围的上限值或下限值还可以替换成实施例所示的值。
本公开中,组合物中的各成分的含有率在组合物中相当于各成分的物质存在多种时,只要无特别解释,则是指组合物中存在的所述多种物质的总含有率。
本公开中,相当于各成分的粒子可以包含多种。组合物中相当于各成分的粒子存在多种时,各成分的粒径只要无特别解释,则是指关于组合物中存在的所述多种粒子的混合物的值。
本公开中,“层”这一用语中,在观察所述层存在的区域时,除了形成在所述区域的整体上的情况之外,还包括仅形成在所述区域的一部分上的情况。
本公开中,“层叠”这一用语表示将层堆积,可以两个以上的层结合在一起,还可以两个以上的层是可装卸的。
本公开中,层的厚度是测定成为对象的层的5点的厚度、作为其算术平均值获得的值。
层的厚度可以使用千分尺等进行测定。本公开中,能够直接测定层的厚度时,使用千分尺进行测定。另一方面,在测定1个层的厚度或多个层的总厚度时,还可以通过使用电子显微镜观察测定对象的截面来进行测定。
本公开中,参照附图说明实施方式时,所述实施方式的构成并不限定于附图所示的构成。另外,各图中的构件的大小是示意性的,构件间的大小的相对关系并不限定于此。
<热传导片材保持体>
本公开的热传导片材保持体依次具备:长条状的承载膜;多个热传导片材;以及覆盖上述多个热传导片材的长条状的覆盖膜,上述多个热传导片材在上述承载膜及上述覆盖膜的长度方向上空有间隔地进行配置,上述多个热传导片材能够从上述覆盖膜以及上述承载膜上剥离。
本公开的热传导片材保持体中,将多个热传导片材配置在长条状的承载膜上,能够随承载膜一起传送多个热传导片材。由此,通过一边将从热传导片材保持体上剥离了覆盖膜后的多个热传导片材随承载膜一起传送,一边粘贴在发热体、放热体等上,可以将热传导片材连续地安装在发热体、放热体等上。由以上,可以高效地制造放热装置。
本公开的热传导片材保持体优选是沿着长度方向被卷绕成卷状的构成。此时,热传导片材保持体也可以被缠绕在卷芯上。通过将卷绕成卷状的热传导片材保持体拉出,并将覆盖膜从热传导片材上剥离,可以使用卷对卷的连续工艺将热传导片材连续安装在发热体、放热体等上,可以更高效地制造放热装置。
(承载膜)
本公开的热传导片材保持体具备长条状的承载膜。承载膜是用于传送热传导片材的长条状的膜构件,将多个热传导片材直接或者介由后述的脱模层等沿着长度方向、空有间隔地配置在承载膜上。承载膜可以从热传导片材上剥离。
作为承载膜的材质,只要是能够传送直接或者介由脱模层等配置在承载膜上的多个热传导片材,则无特别限定,可举出聚乙烯、聚酯、聚丙烯、聚对苯二甲酸乙二醇酯、聚酰亚胺、聚醚酰亚胺、聚醚萘二甲酸酯、甲基戊烯等树脂。
承载膜可以是包含至少1种上述树脂的单层膜,还可以是层叠2层以上的包含至少1种上述树脂的层而成的多层膜。
从易于将承载膜从热传导片材上剥离的观点出发,可以在承载膜与多个热传导片材之间设置脱模层,承载膜可以介由脱模层从多个热传导片材上剥离。脱模层例如可以是用有机硅系、二氧化硅系等脱模剂进行过表面处理的脱模膜。作为用脱模剂表面处理的脱模膜的材质,与上述承载膜的材质相同。另外,脱模膜等脱模层还可以介由粘合层设置在承载膜上,本公开的热传导片材保持体中,从承载膜侧进行观察,可以依次层叠有承载膜、粘合层、脱模层以及热传导片材。
承载膜的平均厚度并无特别限定,可以考虑承载膜的强度、热传导片材的传送性等适当选择。具体地说,承载膜的平均厚度优选为25μm~200μm,更优选为50μm~150μm,进一步优选为50μm~100μm。
在承载膜与多个热传导片材之间设置有脱模层时,脱模层的平均厚度并无特别限制,从热传导片材的脱模性以及热传导片材保持体的小型化的观点出发,优选为0.01μm~30μm,更优选为1μm~10μm。
脱模层为用脱模剂进行过表面处理的脱模膜时,脱模膜的平均厚度并无特别限定,从确保粘合特性以及热传导片材保持体的小型化的观点出发,优选为2μm~200μm,更优选为25μm~200μm,进一步优选为50μm~150μm,特别优选为50μm~100μm。
在脱模层与承载膜之间设置有粘合层时,作为粘合层中使用的粘合剂,例如可举出通常使用的丙烯酸系粘合剂、天然橡胶系粘合剂、合成橡胶系粘合剂、有机硅系粘合剂以及它们的混合系粘合剂。粘合层也可以包含除粘合剂以外的成分,还可以包含交联剂、粘合赋予剂等。
粘合层的平均厚度并无特别限制,从确保粘合特性以及热传导片材保持体的小型化的观点出发,优选为2μm~200μm,更优选为5μm~100μm,进一步优选为10μm~50μm。
(覆盖膜)
本公开的热传导片材保持体具备长条状的覆盖膜。覆盖膜是用于覆盖多个热传导片材进行保护的长条状的构件。覆盖膜可以从热传导片材上剥离。
作为覆盖膜并无特别限定,可举出承载膜中可以包含的上述树脂制的膜,高级纸、铜版纸、牛皮纸、玻璃纸、再生纸等纸制的膜,铝等金属箔等。其中,从易于将覆盖膜从热传导片材上剥离的观点出发,优选是纸制的膜。
覆盖膜可以是由上述膜、金属箔等中的任一者形成的单层膜,还可以是层叠了2层以上的上述膜、金属箔等的多层膜。
另外,还可以在覆盖膜的多个热传导片材那侧的面上设置脱模层,覆盖膜可以介由脱模层从多个热传导片材上剥离。脱模层只要是包含例如有机硅系、二氧化硅系等脱模剂的层即可。当覆盖膜为纸制的膜时,从抑制脱模剂渗透到纸制的膜中的观点出发,还可以在包含脱模剂的层与纸制的膜之间配置包含作为止渗剂发挥功能的聚乙烯等的层。
覆盖膜的平均厚度并无特别限制,从覆盖膜的强度、热传导片材保持体的小型化的观点出发,优选为25μm~200μm,更优选为50μm~150μm,进一步优选为75μm~150μm。这里,当在覆盖膜的多个热传导片材侧的面上设置有脱模层、根据需要的包含聚乙烯等的层等时,覆盖膜的平均厚度是指包含脱模层等在内的总平均厚度。
本公开的热传导片材保持体中,在覆盖膜、承载膜或脱模膜的表面中、优选在热传导片材侧的表面中优选不产生刻痕,更优选不发生因切片加工、激光加工等造成的剪切所导致的刻痕。特别优选在覆盖膜或承载膜的表面中不产生刻痕,更优选在承载膜的表面中不产生刻痕。当在这些膜上不产生刻痕时,当对热传导片材保持体施加了拉伸应力等时,可抑制这些膜发生断裂或变形。结果,可抑制发生以下问题:无法使用热传导片材保持体将热传导片材连续地压合在被压合体上的问题;在热传导片材保持体中,多个热传导片材之间的相对位置偏离,无法精度良好地将热传导片材压合在被压合体上的问题等。特别是,由于在承载膜上不会产生刻痕,即便是使用后述图3所示方法中的连续工艺将热传导片材压合在被压合体上时,也可优选地抑制因拉伸应力等导致的承载膜的断裂、承载膜上的热传导片材的位置偏离等。
本公开的热传导片材保持体中,优选承载膜与热传导片材之间的剥离力大于覆盖膜与热传导片材之间的剥离力。由此,在将覆盖膜从热传导片材保持体上剥离时,可以抑制在承载膜与热传导片材之间发生剥离、热传导片材附着在被剥离了的覆盖膜上等。
例如,可以通过在承载膜与多个热传导片材之间设置脱模层,或者在覆盖膜的多个热传导片材侧的面上设置脱模层,或者改变这些脱模层中包含的脱模剂的种类,来调节覆盖膜与热传导片材之间的剥离力以及承载膜与热传导片材之间的剥离力。
当在承载膜与多个热传导片材之间设置有脱模层时,优选所述脱模层与热传导片材之间的剥离力大于覆盖膜与热传导片材之间的剥离力。
覆盖膜与热传导片材之间的剥离力优选为0mN/25mm~30mN/25mm,更优选为0mN/25mm~10mN/25mm,进一步优选为0mN/25mm~5mN/25mm。这里,剥离力为0mN/25mm表示将覆盖膜按照相对于与热传导片材的界面在90°的方向上进行拉伸的方式安装在拉伸试验机中时,覆盖膜已经发生了剥离。
本公开的覆盖膜与热传导片材之间的剥离力是准备宽度为25mm的层叠膜,使用拉伸试验机,在拉伸速度为100mm/min以及温度为23℃的条件下,通过相对于与热传导片材的界面在90°的方向上拉伸覆盖膜而使覆盖膜与热传导片材之间剥离时的剥离强度的最大值。
承载膜与热传导片材之间的剥离力、优选配置于承载膜与热传导片材之间的脱模层与热传导片材之间的剥离力优选为5mN/25mm~50mN/25mm,更优选为10mN/25mm~30mN/25mm,进一步优选为12mN/25mm~30mN/25mm。
本公开的承载膜或脱模层与热传导片材之间的剥离力是准备宽度为25mm的层叠膜,使用拉伸试验机,在拉伸速度为100mm/min以及温度为23℃的条件下,通过相对于与热传导片材的界面在90°的方向上拉伸承载膜或脱模层而使承载膜或脱模层与热传导片材之间剥离时的剥离强度的最大值。
承载膜与热传导片材之间的剥离力(优选配置于承载膜与热传导片材之间的脱模层与热传导片材之间的剥离力)优选大于覆盖膜与热传导片材之间的剥离力,它们的差优选为5mN/25mm~30mN/25mm,更优选为10mN/25mm~25mN/25mm,进一步优选为15mN/25mm~20mN/25mm。
热传导片材等片材状物从与被压合体的粘接性的观点出发,还可以在与覆盖膜相向的那侧的面上具有粘合成分。在片材状物保持体中,在覆盖膜不接触片材状物的状态下保持片材状物,因此抑制了因粘合成分而片材状物附着在覆盖膜上。
(热传导片材)
本公开的热传导片材保持体在长条状的承载膜与长条状的覆盖膜之间具备多个热传导片材,多个热传导片材在上述承载膜以及上述覆盖膜的长度方向上空有间隔地进行配置。
热传导片材的平均厚度并无特别限制,可以根据目的适当选择。具体地说,热传导片材的平均厚度可以为50μm~500μm,从热传导性以及密合性的方面出发,优选为60μm~300μm,更优选为70μm~200μm。
热传导片材的主面的形状并无特别限定,可以根据成为热传导片材的被压合体的发热体及放热体的形状适当变更。热传导片材的主面的形状可以是圆状、椭圆状、多边形状等。
热传导片材的主面的形状为多边形状、优选为矩形状等四边形状时,一边的长度可以为3mm~100mm,还可以为5mm~80mm。
热传导片材的主面的形状为矩形状时,优选按照主面的相对向的2个边沿着承载膜的长度方向的方式配置多个热传导片材。此时,沿着承载膜长度方向的2个边的长度(长度方向长度)与沿着正交于承载膜长度方向的宽度方向的2个边的长度(宽度方向长度)的比率(宽度方向长度/长度方向长度)可以为0.1~5,还可以为0.2~4,还可以为0.3~3。
关于在承载膜以及覆盖膜的长度方向上空有间隔地配置的多个热传导片材,相邻的热传导片材的最短距离可以为2mm以上,还可以为2mm~100mm,还可以为5mm~60mm,还可以为5mm~30mm。通过相邻的热传导片材的最短距离为2mm以上,在使热传导片材压合在发热体、放热体等被压合体上时,可以抑制相邻于压合对象的热传导片材的另外的热传导片材干涉在被压合体上的压合。由此,具有能够抑制另外热传导片材的损伤、另外热传导片材导致的在被压合体上的非预期的附着等的倾向。另外,通过相邻热传导片材的最短距离为100mm以下,具有使热传导片材压合在发热体、放热体等被压合体上时的生产率优异的倾向。
本公开的热传导片材保持体可以在承载膜与多个热传导片材之间具备沿着承载膜的长度方向配置的多个脱模层,还可以在多个脱模层上分别配置1个以上的热传导片材。另外,还可以在多个脱模层上分别配置2个以上的热传导片材,还可以配置2个~50个的热传导片材。通过配置多个脱模层,具有能够抑制脱模层的弯曲、因弯曲导致的热传导片材的位置偏离等的倾向。
进而,在按照覆盖膜成为垂直方向下侧、承载膜成为垂直方向上侧的方式配置本公开的热传导片材保持体时,由相邻的脱模层以及通过分别配置在相邻的上述脱模层而相邻的上述热传导片材形成的空隙的形状优选在从热传导片材保持体的宽度方向进行观察时为凸形状。由此,在多个脱模层的配置热传导片材的面上,热传导片材不会被配置在长度方向的两端部上,有承载膜易从热传导片材上剥离的倾向。
上述空隙的形状从热传导片材保持体的宽度方向进行观察时为凸形状时,作为相邻脱模层的最短距离的凸形状的垂直方向上侧的边与作为相邻热传导片材的最短距离的凸形状的垂直方向下侧的边的比率(凸形状的垂直方向下侧的边/凸形状的垂直方向上侧的边)可以大于1且300以下,还可以为1.2~50,还可以为1.5~10。
上述空隙的形状从热传导片材保持体的宽度方向进行观察时为凸形状时,凸形状的高度与作为相邻脱模层的最短距离的凸形状的垂直方向上侧的边的比率(凸形状的垂直方向上侧的边/凸形状的高度)可以为0.1~1000,还可以为0.5~100,还可以为1~50。
承载膜的宽度方向长度以及覆盖膜的宽度方向长度优选大于热传导片材的宽度方向长度。由于承载膜的宽度方向长度大于热传导片材的宽度方向长度,可以容易地传送承载膜,可以容易地将承载膜从热传导片材上剥离。另外,由于覆盖膜的宽度方向长度大于热传导片材的宽度方向长度,可以优选地保护热传导片材,可以容易地将覆盖膜从热传导片材上剥离。
承载膜的宽度方向长度相对于热传导片材的宽度方向长度的比率(承载膜的宽度方向长度/热传导片材的宽度方向长度)优选大于1且15以下,更优选为1.05~10,进一步优选为1.1~5。
覆盖膜的宽度方向长度相对于热传导片材的宽度方向长度的比率(覆盖膜的宽度方向长度/热传导片材的宽度方向长度)优选大于1且15以下,更优选为1.05~10,进一步优选为1.1~5。
本公开的热传导片材保持体从传送性的观点出发,优选在承载膜的宽度方向的两端部上不配置热传导片材,更优选在承载膜的两端部上沿着长度方向空有一定间隔地设置有多个承载膜传送用的链轮孔。进而,通过空有一定间隔地设置多个链轮孔,易于根据链轮孔的间隔、在承载膜的长度方向上空有一定间隔地配置多个热传导片材,另外,将热传导片材压合在发热体以及放热体中的一者上时的定位也变得容易。
相邻链轮孔的中心间距离可以为2mm~10mm,还可以为3mm~6mm。
另外,链轮孔的当量圆直径可以为0.5mm~5mm,还可以为1mm~3mm。
本公开中使用的热传导片材中,从在后述第二压合工序中的高温压制条件下热传导片材变得容易被压碎、更易密合于发热体以及放热体中的另一者的观点出发,150℃下的压缩应力为0.1MPa时的压缩弹性模量优选为1.4MPa以下,更优选为1.3MPa以下,进一步优选为1.2MPa以下。150℃下的压缩应力为0.1MPa时的压缩弹性模的下限并无特别限制。上述压缩弹性模量可以为0.5MPa以上,还可以为0.7MPa以上。
热传导片材的压缩弹性模量可以使用压缩试验装置(例如INSTRON5948 MicroTester(INSTRON公司))进行测定。对热传导片材在厚度方向上施加负荷,测定位移(mm)和负荷(N)。将利用位移(mm)/厚度(mm)求算的形变(无量纲)示于横轴,将利用负荷(N)/面积(mm2)求算的应力(MPa)示于纵轴,将规定应力时的斜率作为压缩弹性模量(MPa)。具体地说,例如可以利用实施例记载的方法进行测定。
本公开中使用的热传导片材中,25℃下的粘附力优选为5.0N·mm以上,更优选为6.0N·mm以上,进一步优选为7.0N·mm以上。粘附力为5.0N·mm以上时,当具备热传导片材的放热装置中发生翘曲、发热体与放热体的间隔增大时,可以抑制热传导片材从发热体以及放热体上剥落。粘附力的上限值并无特别限制。上述粘附力可以为20.0N·mm以下,还可以为15.0N·mm以下。
热传导片材的25℃下的粘附力可以使用万能物性试验机(例如Texture Analyser(英弘精机株式会社))进行测定。在25℃(常温)下,将直径为7mm的探针以负荷40N按压在热传导片材上并保持10秒钟后,对提起探针时的负荷和位移曲线进行积分获得面积,将所得的面积作为25℃下的粘附力(N·mm)。
本公开中使用的热传导片材优选150℃下的压缩应力为0.1MPa时的压缩弹性模量以及25℃下的粘附力这两者均满足上述条件。
如上所述,150℃下的压缩应力为0.1MPa时的压缩弹性模量为1.4MPa以下的热传导片材是软质的片材,25℃下的粘附力为5.0N·mm以上时的热传导片材是高粘合性的片材。因此,在拾取这种软质或高粘合性的热传导片材自身,尝试安装在发热体、放热体等上时,具有以下问题:软质或高粘合性的热传导片材自身易于发生变形、断裂等;无法容易地将软质或高粘合性的热传导片材从保护片材等基材上剥离;或者剥离后的热传导片材自身发生变形、断裂等,无法在发热体、放热体等的安装中使用。
另一方面,本公开的热传导片材保持体中,在将热传导片材安装在发热体、放热体等上时,无需上述的拾取,可以在抑制热传导片材自身的变形、断裂等的同时将热传导片材连续安装在发热体、放热体等上,因此热传导片材的处理性以及放热装置的制造效率优异。
上述压缩弹性模量以及上述粘附力例如可以通过调整热传导片材中使用的各成分的配比来获得。
以下,对热传导片材的优选组成等进行说明。
《热传导填充物》
热传导片材优选含有热传导填充物。热传导填充物只要是具有热传导性的填充物则无特别限制。作为热传导填充物,可举出银、铜、铝等高热传导性金属的粒子,氧化铝、氮化铝、氮化硼、氧化镁等陶瓷的粒子,石墨粒子等。此外,作为热传导填充物,可以单独使用1种,还可以组合使用2种以上。
作为热传导填充物,特别是从热电阻少、且热传导性优异的方面出发,优选石墨粒子,更优选后述的选自鳞片状粒子、椭球状粒子以及棒状粒子中的至少1种石墨粒子。
热传导填充物的质量平均粒径(D50)是使用适用了激光衍射-散射法的激光衍射式粒度分布装置(例如日机装株式会社制“Microtrac Series MT3300”)进行测定,从小粒径侧描绘重量累积粒度分布曲线时对应于重量累积达到50%的粒径。
热传导填充物的粒径分布并无特别限制,可以是横轴采用粒径、纵轴采用频率的粒径分布具有单一峰的单分散体系,还可以是粒径分布具有多个峰的多分散体系。另外,粒径分布可以狭窄、粒径分布也可以宽泛。
热传导片材中的热传导填充物的含有率例如从热传导性和与发热体、放热体等的密合性的平衡的方面出发,优选为15体积%~50体积%,更优选为20体积%~45体积%,进一步优选为25体积%~40体积%。
热传导填充物的含有率为15体积%以上时,有热传导性进一步提高的倾向。热传导填充物的含有率为50体积%以下时,有能够更有效地抑制粘合性以及与发热体、放热体等的密合性降低的倾向。
热传导填充物的含有率(体积%)是利用下式求算的值。
热传导填充物的含有率(体积%)=(Aw/Ad)/((Aw/Ad)+(Bw/Bd)+(Cw/Cd))×100
Aw:热传导填充物的质量组成(质量%)
Bw:树脂的质量组成(质量%)
Cw:其它任意成分的质量组成(质量%)
Ad:热传导填充物的密度
Bd:树脂的密度
Cd:其它任意成分的密度
作为热传导填充物,可以含有选自鳞片状粒子、椭球状粒子以及棒状粒子中的至少1种石墨粒子。另外,石墨粒子为鳞片状粒子时,可以是面方向在厚度方向上取向,石墨粒子为椭球状粒子时,可以的长轴方向在厚度方向上取向,或者石墨粒子为棒状粒子时,可以是长轴方向在厚度方向上取向。
通过为这种构成,热传导片材的热电阻小、热传导性优异。
石墨粒子的形状优选为鳞片状。通过选择鳞片状的石墨粒子,具有热传导性进一步提高的倾向。可以认为其原因在于,例如鳞片状的石墨粒子在热传导片材中更容易在规定的方向上取向。此外,六元环面是在六方晶体系中形成了六元环的面、是指(0001)结晶面。
石墨粒子的结晶中的六元环面是否是在鳞片状粒子的面方向、椭圆体状粒子的长轴方向或棒状粒子的长轴方向上取向可以通过X射线衍射测定进行确认。石墨粒子的结晶中的六元环面的取向方向具体地利用以下的方法进行确认。
首先,制作石墨粒子的鳞片状粒子的面方向、椭圆体状粒子的长轴方向或棒状粒子的长轴方向沿着片材的面方向进行取向的测定用样品片材。作为测定用样品片材的具体的制作方法,例如可举出以下方法。
将树脂和相对于树脂为10体积%以上的量的石墨粒子的混合物进行片材化。这里所使用的“树脂”只要是不出现妨碍X射线衍射的峰的材料、且能够形成片材物的材料,则无特别限制。具体地说,可以使用丙烯酸橡胶、NBR(丙烯腈丁二烯橡胶)、SIBS(苯乙烯-异丁烯-苯乙烯共聚物)等具有作为粘合剂的凝集力的非晶质树脂。
将该混合物的片材按照成为原始厚度的1/10以下的方式进行压制,将多张压制过的片材层叠,形成层叠体。反复3次以上的将该层叠体进一步挤压至1/10以下的操作,获得测定用样品片材。通过该操作,在测定用样品片材中,形成石墨粒子为鳞片状粒子时、面方向沿着测定用样品片材的面方向进行取向的状态,为椭圆体状粒子时、长轴方沿着测定用样品片材的面方向进行取向的状态,以及为棒状粒子时、长轴方向沿着测定用样品片材的面方向进行取向的状态。
对如上制作的测定用样品片材的表面进行X射线衍射测定。测定在2θ=77°附近出现的对应于石墨的(110)面的峰的高度H1和在2θ=27°附近出现的对应于石墨的(002)面的峰的高度H2。如此制作的测定用样品片材中,H1除以H2的值变为0~0.02。
由此,“石墨粒子的结晶中的六元环面在为鳞片状粒子时在面方向上取向、为椭圆体状粒子时在长轴方向上取向、以及为棒状粒子时在长轴方向上取向”是指对含有石墨粒子的片材的表面进行X射线衍射测定,在2θ=77°附近出现的对应于石墨的(110)面的峰的高度除以在2θ=27°附近出现的对应于石墨的(002)面的峰的高度的值成为0~0.02的状态。
本公开中,X射线衍射测定在以下的条件下进行。
装置:Bruker AXS株式会社制“D8DISCOVER”
X射线源:波长为1.5406nm的CuKα、40kV、40mA
步进(测定步长):0.01°
步进时间:720sec
这里,“石墨粒子为鳞片状粒子时、面方向在热传导片材的厚度方向上取向,为椭圆体状粒子时、长轴方向在热传导片材的厚度方向上取向,以及为棒状粒子时、长轴方向在热传导片材的厚度方向上取向”是指为鳞片状粒子时、面方向与热传导片材的表面所成的角度(以下也称作“取向角度”)为60°以上,为椭圆体状粒子时、长轴方向与热传导片材的表面所成的角度为60°以上,以及为棒状粒子时、长轴方向与热传导片材的表面所成的角度为60°以上。取向角度优选为80°以上,更优选为85°以上,进一步优选为88°以上。
取向角度是利用SEM(扫描型电子显微镜)观察热传导片材的截面,对于任意的50个石墨粒子,为鳞片状粒子时、测定面方向与热传导片材表面(主面)所成的角度(取向角度)时的平均值,为椭圆体状粒子时、测定长轴方向与热传导片材表面(主面)所成的角度时的平均值,以及为棒状粒子时、测定长轴方向与热传导片材表面(主面)所成的角度时的平均值。
石墨粒子的粒径并无特别限制。石墨粒子的平均粒径优选是热传导片材的平均厚度的1/2~平均厚度。石墨粒子的平均粒径为热传导片材的平均厚度的1/2以上时,在热传导片材中高效地形成热传导路径,有热传导率提高的倾向。石墨粒子的平均粒径为热传导片材的平均厚度以下时,具有抑制石墨粒子从热传导片材的表面突出、热传导片材的表面的密合性优异的倾向。
此外,使用日本特开2008-280496号公报中记载的的层叠切片法时,作为原料使用的石墨粒子的粒径以质量平均粒径计优选为热传导片材的平均厚度的1/2倍以上,也可以超过平均厚度。作为原料使用的石墨粒子的粒径也可以超过热传导片材的平均厚度的理由例如是即便是包含超过热传导片材的平均厚度的粒径的石墨粒子,由于每个石墨粒子地进行切片来形成热传导片材,结果石墨粒子不会从热传导片材的表面突出。另外,如此每个石墨粒子地进行切片时,产生多个在热传导片材的厚度方向上贯穿的石墨粒子,具有极高效地形成热传导路径、热传导性进一步提高的倾向。
使用层叠切片法时,作为原料使用的石墨粒子的粒径以质量平均粒径计更优选为热传导片材的平均厚度的1倍~5倍。石墨粒子的质量平均粒径为热传导片材的平均厚度的1倍以上时,更高效地形成热传导路径、热传导性进一步提高。为热传导片材的平均厚度的5倍以下时,可抑制占据石墨粒子表面部的面积变得过大,可以抑制密合性的降低。
热传导填充物中的石墨粒子的含有率相对于热传导填充物总体积例如优选为50体积%~100体积%,更优选为80体积%~100体积%,进一步优选为95体积%~100体积%,特别优选为100体积%。
热传导片材作为石墨粒子还可以包含除鳞片状粒子、椭圆体状粒子以及棒状粒子以外的粒子,还可以包含球状石墨粒子、人造石墨粒子、薄片化石墨粒子、酸处理石墨粒子、膨胀石墨粒子、碳纤维薄片等。
作为石墨粒子,优选鳞片状粒子,从结晶化度高、且易获得大粒径的鳞片的观点出发,优选是对经片材化的膨胀石墨进行粉碎而获得的鳞片状的膨胀石墨粒子。
《树脂》
热传导片材优选含有树脂。热传导片材通过含有树脂,热传导片材的柔软性优异,具有可获得对发热体、放热体等的密合性良好的热传导片材的倾向。
作为树脂并无特别限定,例如可以是固化性树脂,还可以是非固化性树脂。作为树脂,可举出环氧树脂、有机硅、丙烯酸树脂、聚酰亚胺树脂、双马来酰亚胺树脂、苯并环丁烯树脂、酚醛树脂、不饱和聚酯、邻苯二甲酸二烯丙酯树脂、聚氨酯、聚酰亚胺有机硅、热固化型聚苯醚、热固化型改性聚苯醚、聚丁烯、聚异戊二烯、多硫化物、丙烯腈橡胶、有机硅橡胶、烃树脂、萜烯树脂、萜烯酚醛树脂、氢化萜烯酚等。树脂可单独使用1种,还可以并用2种以上。
热传导片材中的树脂的含量优选根据树脂的种类以及所希望的柔软性、粘合力、密合性、片材强度、耐水解性等进行选择。例如,树脂的含有率相对于热传导片材的总体积优选为25体积%~75体积%,更优选为40体积%~70体积%,进一步优选为50体积%~65体积%。
《其它成分》
热传导片材还可以根据目的含有除热传导填充物以及树脂以外的其它成分。例如,热传导片材以赋予阻燃性为目的,还可以含有阻燃剂。
阻燃剂并无特别限定,可以从通常使用的阻燃剂中适当选择。例如,可举出红磷系阻燃剂以及磷酸酯系阻燃剂。其中,从安全性优异、因增塑性效果而密合性提高的方面出发,优选磷酸酯系阻燃剂。
作为红磷系阻燃剂,除了纯粹的红磷粉末之外,还可以使用以提高安全性或稳定性为目的而实施了各种涂覆的阻燃剂、进行了母料化的阻燃剂等。具体地说,可举出磷化学工业株式会社制的RINKA FR、RINKA FE、RINKA FQ、RINKA FP(均为商品名)等。
作为磷酸酯系阻燃剂,可举出磷酸三甲酯、磷酸三乙酯、磷酸三丁酯等脂肪族磷酸酯;磷酸三苯酯、磷酸三甲苯酯、磷酸甲苯基二苯酯、磷酸三(二甲苯基)酯、磷酸甲苯基-2,6-二甲苯基酯、磷酸三(叔丁基化苯基)酯、磷酸三(异丙基化苯基)酯、磷酸三芳基异丙基化物等芳香族磷酸酯;间苯二酚双二苯基磷酸酯、双酚A双(二苯基磷酸酯)、间苯二酚双二甲苯基磷酸酯等芳香族缩合磷酸酯等。
其中,双酚A双(二苯基磷酸酯)从耐水解性优异、且因增塑效果而提高密合性的效果优异的方面出发优选。
热传导片材中的阻燃剂的含有率并无特别限制,可以以发挥阻燃性的量进行使用,优选为40体积%以下,从抑制因阻燃剂成分渗出至热传导片材的表面导致的热电阻恶化的方面出发,优选为30体积%以下。
热传导片材还可根据需要含有抗氧化剂、自由基捕获剂、pH调节剂等添加剂,优选地可以含有抗氧化剂。这些添加剂的含有率在热传导片材中优选为5体积%以下,更优选为3体积%以下,进一步优选为1体积%以下。
[热传导片材保持体的制造方法]
热传导片材保持体的制造方法例如可举出以下的方法。该制造方法具有以下工序:准备包含热传导填充物、树脂以及根据需要的其它成分的组合物的工序(也称作“准备工序”);将上述组合物片材化而获得片材的工序(也称作“片材制作工序”);将多张上述片材重叠,将上述片材中的1张折叠、或将上述片材中的1张卷绕,制作层叠体的工序(也称作“层叠体制作工序”);将上述层叠体的侧端面切片的工序(切片工序);以及将经切片的多个热传导片材夹持在覆盖膜与承载膜之间,将多个热传导片材层压的工序(层压工序)。
利用该方法制造的热传导片材保持体中包含的热传导片材易于形成高效的热传导路径,因而具有高热传导性和密合性优异的倾向。
<准备工序>
构成热传导片材的组合物的制备只要是能够均匀地混合热传导填充物、树脂以及根据需要的其它成分,则可以是任一种方法,并无特别限定。另外,组合物还可以入手市售品进行准备。组合物制备的详细情况可以参照日本特开2008-280496号公报的段落[0033]。
<片材制作工序>
片材制作工序只要是能够将之前工序获得的组合物片材化,则可以是任一种方法,并无特别限定。例如,优选使用选自轧制、压制、挤出以及涂饰中的至少1个成形方法实施。片材制作工序的详细情况可以参照日本特开2008-280496号公报的段落[0034]。
<层叠体制作工序>
层叠体制作工序中形成在之前工序中获得的片材的层叠体。层叠体例如并不限于将独立的多张片材依次重叠的方式,还可以是将1张片材不剪切地折叠的方式,或者还可以是将1张片材卷绕的方式。层叠体制作工序详细情况可以参照日本特开2008-280496号公报的段落[0035]~[0037]。
<切片工序>
切片工序只要是能够将之前工序获得的层叠体的侧端面切片,则可以是任一种方法,并无特别限定。从利用在热传导片材的厚度方向上贯穿的石墨粒子形成极为高效的热传导路径、热传导性进一步提高的观点出发,优选以石墨粒子的质量平均粒径的2倍以下的厚度进行切片。切片工序的详细情况可以参照日本特开2008-280496号公报的段落[0038]。
<层压工序>
层压工序只要是将经切片的多个热传导片材夹持在覆盖膜与承载膜或覆盖膜与脱模膜之间,将多个热传导片材粘贴在覆盖膜以及承载膜或脱模膜上,则可以是任一种方法,并无特别限定。例如可以将经切片的热传导片材剪切成规定尺寸后,将多个热传导片材配置在覆盖膜、承载膜或脱模膜上,接着将所配置的多个热传导片材夹持在覆盖膜与承载膜或覆盖膜与脱模膜之间,将热传导片材粘贴在它们上,获得热传导片材保持体。除了上述方法以外,还可以例如将经切片的热传导片材配置在覆盖膜、承载膜或脱模膜上,按照变为规定尺寸的方式利用冲切等将热传导片材剪切,接着将经剪切的多个热传导片材夹持在覆盖膜与承载膜或覆盖膜与脱模膜之间,将热传导片材贴合在它们上,从而获得热传导片材保持体。
例如,在层压工序中,也可以通过将长条状的热传导片材配置在覆盖膜、承载膜或脱模膜上,利用切片加工、激光加工等将长条状的热传导片材剪切,从而将多个热传导片材配置在覆盖膜、承载膜或脱模膜上。但是,利用切片加工、激光加工等将长条状的热传导片材剪切时,配置有长条状的热传导片材的覆盖膜、承载膜或脱模膜在厚度方向上也被部分地剪切,会产生刻痕。当在这些膜上产生刻痕时,在对所得热传导片材保持体施加拉伸应力等时,有这些膜发生断裂或者变形的危险。结果,易于发生以下的问题:无法使用热传导片材保持体连续地将热传导片材压合在被压合体上的问题;在热传导片材保持体中,多个热传导片材之间的相对位置会偏离,无法精度良好地将热传导片材压合在被压合体上的问题。特别是,当在覆盖膜或承载膜中产生刻痕时,容易发生这种问题,进而当在承载膜中产生刻痕时,后述图3所示方法中的连续工艺变难。
由以上的方面出发,在层压工序中,优选包含将多个热传导片材配置在覆盖膜、承载膜或脱模膜上,或者利用冲切等将配置于覆盖膜、承载膜或脱模膜上的热传导片材剪切。由此,在覆盖膜、承载膜或脱模膜上不会产生刻痕或者抑制刻痕,可以优选地抑制在对热传导片材保持体施加拉伸应力等时的膜的断裂、变形等。进而,与利用切片加工、激光加工等将长条状的热传导片材剪切时不同,按照相邻热传导片材的最短距离变为2mm以上的方式配置多个热传导片材也变得容易。
<放热装置的制造方法>
本公开的放热装置的制造方法是使用本公开的热传导片材保持体制造使上述热传导片材介于发热体与放热体之间而成的放热装置的放热装置的制造方法,其具备以下工序:将上述覆盖膜从上述热传导片材保持体上剥离的工序;在剥离了上述覆盖膜的上述热传导片材保持体中,使上述热传导片材压合在发热体以及放热体中的一者上的工序;将上述承载膜从粘接有上述发热体以及上述放热体中的一者的上述热传导片材上剥离的工序;以及在上述热传导片材的与粘接有上述发热体以及上述放热体中的一者的那侧相反的一侧上,压合上述发热体以及上述放热体中的另一者的工序。
通过本公开制造方法获得的放热装置通过介由热传导片材将发热体与放热体层叠,可以高效地将来自发热体的热量传导至放热体。另外,将放热体从发热体中取出时,可以容易地将热传导片材除去。
本公开的制造方法包含将覆盖膜从热传导片材保持体上剥离的工序。例如,在将本公开的热传导片材保持体卷绕成卷状时,能够一边在安装于能够旋转卷状热传导片材保持体的拉出辊上的状态下将热传导片材保持体拉出,一边将覆盖膜剥离。
本公开的制造方法包含在剥离了覆盖膜的热传导片材保持体中,使热传导片材压合在发热体以及放热体中的一者上的工序(以下也称作“第一压合工序”)。此时,还可以使用卷对卷的连续工艺,传送剥离了覆盖膜的热传导片材保持体,进行使配置于热传导片材保持体的热传导片材压合在发热体以及放热体中的一者上的处理。
作为发热体,例如可举出在基板上配置有半导体芯片的半导体封装、显示器、LED、电灯、汽车用功率模块以及产业用功率模块。作为放热体,例如可举出利用了铝片或铜片、铝板或铜板等的散热器;连接于热管的铝块或铜块;内部通过泵循环有冷却液体的铝块或铜块;珀尔帖元件以及具备该元件的铝块或铜块等。
第一压合工序中的压力以及加热温度只要是能够使热传导片材粘接在发热体以及放热体中的一者上,则无特别限定。例如上述的压力可以为0.1MPa~4.0MPa,还可以为0.15MPa~2.0MPa。另外,上述的加热温度可以为15℃~100℃,还可以为20℃~35℃。使热传导片材压合在发热体上时,可以使发热体发热来进行压合。
本公开的制造方法包含将承载膜从粘接有发热体以及放热体中的一者的热传导片材上剥离的工序。例如,只要是在上述压合的工序中使热传导片材压合在发热体以及放热体中的一者上之后解除压合,将承载膜从热传导片材上剥离即可。通过该工序,可以获得粘接有热传导片材的发热体以及放热体中的一者。另外,还可以在承载膜与热传导片材之间设置脱模层,此时,也可以介由脱模层将承载膜从热传导片材上剥离。
可以使用卷对卷的连续工艺,将剥离了热传导片材的承载膜安装于在传送方向上游侧能够旋转的卷绕辊上,通过使卷绕辊以及上述拉出辊旋转,将剥离了热传导片材的承载膜回收,同时传送新的热传导片材,连续地进行与新的发热体以及放热体中的一者的压合的处理。
本公开的制造方法包含在热传导片材的与粘接有发热体以及放热体中的一者的那侧相反的一侧上压合发热体以及放热体中的另一者的工序(以下也称作“第二压合工序”)。该工序中,通过在粘接有热传导片材的发热体以及放热体中的一者上压合发热体以及放热体中的另一者,可以获得使热传导片材介于发热体与放热体之间而成的放热装置。第二压合工序中的压力以及加热温度的优选条件只要是能够将热传导片材粘接在发热体以及放热体中的另一者,则无特别限定。例如,上述的压力可以是0.1MPa~2.0MPa,还可以是0.15MPa~1.0MPa。另外,上述的加热温度可以是80℃~180℃,还可以是100℃~170℃。当使一个面露出的热传导片材压合在发热体上时,可以使发热体发热来进行压合。
本公开的制造方法中,还可以按照第二压合工序后减少的热传导片材的厚度相对于第一压合工序前的热传导片材的初始厚度的比例(压缩率)达到5%~35%的方式来调整第一压合工序以及第二压合工序中的压合条件。
(热传导片材保持体的一例)
以下,使用图1以及图2对热传导片材保持体的一例进行说明。图1为表示本公开的热传导片材保持体的一例的侧视图。图2为从覆盖膜1侧观察对应于图1虚线部的区域α时的图。此外,图2中省略了覆盖膜1。如图1所示,热传导片材保持体10依次具备长条状的承载膜3、多个热传导片材2、及长条状的覆盖膜1。进而,热传导片材保持体10在从覆盖膜1侧观察时,在承载膜3与多个热传导片材2之间依次配置有脱模膜4以及粘合层5。沿着承载膜3的长度方向配置有多个脱模膜4,在多个脱模膜中分别配置有9个热传导片材。另外,图1中被圆点虚线包围的区域α相当于由相邻脱模膜4以及通过分别配置于相邻脱模膜上而相邻的热传导片材2形成的空隙,其形状从正面进行观察时为凸形状。
热传导片材保持体10具有在卷芯6上沿着长度方向卷绕成卷状的构成,图1中,将卷绕成卷状的热传导片材保持体10的一部分拉出。此外,图1中,将热传导片材保持体10的被拉出的部分较卷芯6更加强调地进行图示,被拉出的部分以及卷芯6的大小的相对关系并不限定于此。另外,图1中,按照相对于中心轴、覆盖膜1处于外侧、承载膜3处于内侧的方式将热传导片材保持体10卷绕成卷状,但并不限定于此,也可以是按照相对于中心轴、覆盖膜1处于内侧、承载膜3处于外侧的方式将热传导片材保持体10卷绕成卷状。
承载膜3的宽度方向长度以及覆盖膜1的宽度方向长度相比较于热传导片材2的宽度方向长度变得更大。在承载膜3的宽度方向的两端部上未配置热传导片材2,在承载膜3的两端部上沿着长度方向空有一定间隔地设置有多个承载膜传送用的链轮孔7。空有一定间隔地设置的链轮孔7还被用于承载膜传送时的热传导片材2的定位。
(放热装置的制造方法的一例)
以下,使用图3对放热装置的制造方法的一例进行说明。图3为表示放热装置的制造方法一例中的制造工序的一部分的示意图。图3中省略了脱模膜4以及粘合层5。
如图3所示,将卷绕成卷状的热传导片材保持体10安装在可在箭头X方向上旋转的拉出辊11上,将覆盖膜1从自拉出辊11中拉出的热传导片材保持体10上剥离。将剥离了覆盖膜1的热传导片材保持体10的承载膜3安装于距离拉出辊11一定距离且在箭头Z方向上能够旋转的卷绕辊16上。在传送方向上,在拉出辊11与卷绕辊16之间设置有将热传导片材2压合在作为发热体的半导体芯片13上的压制机14。
在拉出辊11与卷绕辊16之间配置未图示的链轮辊,在等间隔设置于链轮辊表面上的链轮销上插通链轮孔7,通过使拉出辊11在箭头X方向上旋转、且使卷绕辊16在箭头Z方向上旋转,将配置于承载膜3上的热传导片材2传送至与压制机14相向的区域。
将配置于承载膜3上的热传导片材2传送至与压制机14相向的区域之后,在压制机14与配置于基板12上的半导体芯片13之间配置有热传导片材2的状态下,使用压制机14,在箭头Y方向上进行加压,使热传导片材2压合在半导体芯片13上。此外,并不限定于如图3所示使1个热传导片材2压合在1个半导体芯片13上的构成,还可以使多个热传导片材2压合在1个半导体芯片13上,还可以使1个或多个热传导片材2压合在多个半导体芯片13的各个芯片上。
在热传导片材2的压合后,使拉出辊11以及卷绕辊16旋转,在区域15中将承载膜3从压合于半导体芯片13表面上的热传导片材2上剥离。此时,介由未图示的脱模层将承载膜3从热传导片材2上剥离,使用卷绕辊16将带有脱模层的承载膜3回收,同时获得压合有热传导片材2的带半导体芯片的基板。
进而,将通过承载膜3传送的下一个热传导片材2压合在配置于下一个带半导体芯片的基板上的半导体芯片13的表面上,通过反复上述工序,可以将热传导片材2连续地安装在带半导体芯片的基板上。由以上,可以高效地使热传导片材压合在发热体上。
[实施例]
以下,利用实施例更具体地说明本发明,但本发明并不限定于这些实施例。此外,只要无特别说明,则“%”为质量基准。
[实施例1]
准备多个150℃下的压缩应力为0.10MPa时的压缩弹性模量为1.16MPa、25℃下的粘附力为7.6N·mm、热传导性率为16W/(m·K)的昭和电工材料株式会社制的厚度为150μm、承载膜的长度方向长度为30mm、宽度方向长度为50mm的热传导片材。在该热传导片材中,作为热传导填充物,使用鳞片状的膨胀石墨粒子(昭和电工材料株式会社“HGF-L”、质量平均粒径:270μm、通过上述的使用了X射线衍射测定的方法确认到结晶中的六元环面在鳞片状粒子的面方向上进行取向)。
进而,准备以下所示的长条状的承载膜以及长条状的覆盖膜。另外,准备设置于承载膜与热传导片材之间的以下的粘合层以及脱模膜。
(承载膜)
长条状的PET膜:Toray株式会社的商品名Lumirror S30、厚度为75μm、宽度方向长度为66mm
(覆盖膜)
长条状的纸膜:有机硅脱模剂/聚乙烯/牛皮纸的层叠体、住化加工纸株式会社的商品名SL-70S(U2)、总厚度为105μm、宽度方向长度为66mm、对于热传导片材的剥离力为0mN/25mm。这里,剥离力为0mN/25mm是指将覆盖膜按照相对于与热传导片材的界面在90°的方向上进行拉伸的方式安装在拉伸试验机上时,已经发生了剥离。
(粘合层)
丙烯酸树脂制的双面胶:日荣新化株式会社的商品名Neo Fix30、厚度为30μm、宽度方向长度为50mm
(脱模膜)
用脱模处理剂处理过的PET膜:Nippa株式会社的商品名FU、厚度为75μm、宽度方向长度为50mm、对于热传导片材的剥离力为18mN/25mm
在长条状承载膜的宽度方向的两端部上,沿着长度方向,按照中心间距离约为5.0mm、链轮孔的中心与承载膜的宽度方向的端部的最短距离约为3.0mm的方式,以一定间隔设置多个直径约为2.0mm的链轮孔。进而,关于承载膜,在沿着长度方向设有链轮孔的两端部之间依次配置粘合层以及脱模膜。此时,按照脱模膜的用脱模处理剂处理过的面成为与粘合层相反一侧的方式配置脱模膜。
按照脱模膜的宽度方向的两端部与热传导片材的宽度方向的两端部变得一致的方式,在1张脱模膜上各配置6张热传导片材,沿着长度方向排列多个配置有6张热传导片材的脱模膜。此时,将相邻热传导片材的最短距离调整为20mm。
接着,承载膜的宽度方向的两端部与覆盖膜的宽度方向的两端部按照在俯视下变得一致的方式进行配置,在覆盖膜与承载膜之间夹持多个热传导片材的状态下,将多个热传导片材粘贴在覆盖膜以及承载膜上。由此,制造依次具备长条状的承载膜、粘合层、脱模膜、多个热传导片材及长条状的覆盖膜的长条状的热传导片材保持体。通过将该长条状的热传导片材保持体按照承载膜侧位于卷芯侧的方式沿着长度方向卷绕在卷芯上,获得卷状的热传导片材保持体。此外,在图3所示的以卷对卷的连续工艺中使用卷状的热传导片材保持体时,需要在开始压合工序之前将热传导片材保持体拉出安装在卷绕辊上。为了不产生在压合工序中无法使用的热传导片材,在最初从卷状的热传导片材保持体拉出的长度为1m左右的区域中,在覆盖膜与承载膜之间不设置热传导片材。
如图3所示,将卷状的热传导片材保持体安装在拉出辊上,将覆盖膜从自拉出辊拉出的热传导片材保持体上剥离,同时将剥离了覆盖膜、未设置热传导片材的部分的承载膜安装在卷绕辊上,旋转拉出辊以及卷绕辊,连续地传送承载膜上的多个热传导片材。使用在热传导片材的传送方向上配置于拉出辊与卷绕辊之间的压制机,在25℃、0.8MPa的条件下使热传导片材压合在配置于带半导体芯片的基板上的半导体芯片的表面上。在压合后,旋转卷绕辊,将承载膜从压合在半导体芯片的表面上的热传导片材上剥离,将压合有热传导片材的带半导体芯片的基板回收。进而,将通过承载膜传送的下一个热传导片材压合在配置于下一个带半导体芯片的基板上的半导体芯片的表面上,反复上述工序,由此将热传导片材连续安装在带半导体芯片的基板上。进而,在本实施例中,将覆盖膜介由脱模层从热传导片材上剥离时,热传导片材从承载膜侧上剥离,热传导片材不会转印至覆盖膜侧,而且还抑制了因热传导片材从承载膜侧上剥离所导致的在半导体芯片上的粘贴位置偏离。
[实施例2]
除了将实施例1中的脱模膜从Nippa株式会社的商品名FU变为Nippa株式会社的商品名X1-A3(厚度为75μm、宽度方向长度为50mm、对于热传导片材的剥离力为38mN/25mm)以外,与实施例1同样地制造长条状的热传导片材保持体。
对于实施例2中制造的热传导片材保持体,与实施例1同样地在使热传导片材压合在带半导体芯片的基板上。在压合后,将承载膜从压合于半导体芯片的表面上的热传导片材上剥离时,相比较于实施例1,更难将承载膜从热传导片材上剥离,热传导片材更易破损。
[实施例3]
除了将实施例1中的脱模膜从Nippa株式会社的商品名FU变为藤森工业株式会社的商品名75E-0010(厚度为75μm、宽度方向长度为50mm、对于热传导片材的剥离力为50mN/25mm)以外,与实施例1同样地制造长条状的热传导片材保持体。
对于实施例3中制造的热传导片材保持体,与实施例1同样地在使热传导片材压合在带半导体芯片的基板上。在压合后,将承载膜从压合于半导体芯片的表面上的热传导片材上剥离时,相比较于实施例2,更难将承载膜从热传导片材上剥离,热传导片材更易破损。
[实施例4]
除了将实施例1中的覆盖膜从住化加工纸株式会社的商品名SL-70S(U2)变为Nippa株式会社的商品名FU(厚度为75μm、宽度方向长度为66mm、对于热传导片材的剥离力为18mN/25mm)以外,与实施例1同样地制造长条状的热传导片材保持体。
对于实施例4中制造的热传导片材保持体,与实施例1同样地在使热传导片材压合在带半导体芯片的基板上。在剥离覆盖膜时,相比较于实施例1,热传导片材的一部分更易粘附在覆盖膜侧,热传导片材更易破损。
[实施例5]
除了将实施例1中的覆盖膜从住化加工纸株式会社的商品名SL-70S(U2)变为Lintec株式会社的商品名SP-8LK(厚度为88μm、宽度方向长度为66mm、对于热传导片材的剥离力为8mN/25mm)以外,与实施例1同样地制造长条状的热传导片材保持体。
对于实施例5中制造的热传导片材保持体,与实施例1同样地在使热传导片材压合在带半导体芯片的基板上。在剥离覆盖膜时,相比较于实施例1,热传导片材的一部分更易粘附在覆盖膜侧,热传导片材更易破损。
[实施例6]
除了将实施例4中的脱模膜从Nippa株式会社的商品名FU变为藤森工业株式会社的商品名75E-0010(厚度为75μm、宽度方向长度为50mm、对于热传导片材的剥离力为50mN/25mm)以外,与实施例4同样地制造长条状的热传导片材保持体。
对于实施例6中制造的热传导片材保持体,与实施例1同样地在使热传导片材压合在带半导体芯片的基板上。在剥离覆盖膜时,相比较于实施例1,热传导片材的一部分更易粘附在覆盖膜侧,热传导片材更易破损。
在2020年10月16日申请的PCT/JP2020/039140的公开通过参照将其整体纳入本说明书中。
本说明书中记载的全部文献、专利申请以及技术标准与具体且分别地记载通过参照纳入各个文献、专利申请以及技术标准时同等程度地通过参照纳入本说明书中。
符号说明
1 覆盖膜
2 热传导片材
3 承载膜
4 脱模膜
5 粘合层
6 卷芯
7 链轮孔
10 热传导片材保持体
11 拉出辊
12 基板
13 发热体
14 压制机
15 区域
16 卷绕辊
Claims (11)
1.一种热传导片材保持体,其依次具备:
长条状的承载膜;
多个热传导片材;以及
覆盖所述多个热传导片材的长条状的覆盖膜,
相邻的所述热传导片材的最短距离为2mm以上,
所述多个热传导片材在所述承载膜以及所述覆盖膜的长度方向上空有间隔地进行配置,
所述多个热传导片材可以从所述覆盖膜以及所述承载膜上剥离。
2.根据权利要求1所述的热传导片材保持体,其在所述承载膜与所述多个热传导片材之间进一步具备脱模层,介由所述脱模层,所述多个热传导片材可以从所述承载膜上剥离。
3.根据权利要求2所述的热传导片材保持体,
其具备沿着所述承载膜的长度方向配置的多个所述脱模层,
在所述多个脱模层中分别配置有1个以上的所述热传导片材。
4.根据权利要求3所述的热传导片材保持体,其中,在按照所述覆盖膜成为垂直方向下侧、所述承载膜成为垂直方向上侧的方式进行配置时,由相邻的所述脱模层以及通过分别设置在相邻的所述脱模层而相邻的所述热传导片材形成的空隙的形状在从热传导片材保持体的宽度方向进行观察时为凸形状。
5.根据权利要求1~4中任一项所述的热传导片材保持体,其中,相比较于所述覆盖膜与所述热传导片材之间的剥离力,所述承载膜与所述热传导片材之间的剥离力更大。
6.根据权利要求1~5中任一项所述的热传导片材保持体,其中,所述热传导片材的平均厚度为50μm~500μm。
7.根据权利要求1~6中任一项所述的热传导片材保持体,其中,所述热传导片材含有热传导填充物和树脂。
8.根据权利要求1~7中任一项所述的热传导片材保持体,其沿着长度方向被卷绕成卷状。
9.根据权利要求1~8中任一项所述的热传导片材保持体,其中,在与所述承载膜以及所述覆盖膜的长度方向正交的宽度方向上,所述承载膜的宽度以及所述覆盖膜的宽度比所述热传导片材的宽度大。
10.根据权利要求1~9中任一项所述的热传导片材保持体,其中,在所述承载膜的表面中未产生刻痕。
11.一种放热装置的制造方法,其为使用权利要求1~10中任一项所述的热传导片材保持体、使所述热传导片材介于发热体与放热体之间来制造放热装置的放热装置的制造方法,其具备以下工序:
将所述覆盖膜从所述热传导片材保持体上剥离的工序;
在剥离了所述覆盖膜的所述热传导片材保持体中,使所述热传导片材压合在发热体以及放热体中的一者上的工序;
将所述承载膜从粘接有所述发热体以及所述放热体中的一者的所述热传导片材上剥离的工序;以及
在所述热传导片材的与粘接有所述发热体以及所述放热体中的一者的那侧相反的一侧上,压合所述发热体以及所述放热体中的另一者的工序。
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JPPCT/JP2020/039140 | 2020-10-16 | ||
PCT/JP2020/039140 WO2022079914A1 (ja) | 2020-10-16 | 2020-10-16 | 熱伝導シート保持体及び放熱装置の製造方法 |
PCT/JP2021/038132 WO2022080471A1 (ja) | 2020-10-16 | 2021-10-14 | 熱伝導シート保持体及び放熱装置の製造方法 |
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EP (1) | EP4213201A4 (zh) |
JP (1) | JPWO2022080471A1 (zh) |
KR (1) | KR20230070277A (zh) |
CN (1) | CN116325138A (zh) |
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JPH07149365A (ja) * | 1993-11-26 | 1995-06-13 | Denki Kagaku Kogyo Kk | 絶縁放熱シート包装体、及び基板又は放熱フィン |
JP3288029B2 (ja) | 2000-03-08 | 2002-06-04 | 北川工業株式会社 | 成形体、並びに、熱伝導材及びその製造方法 |
JP2002026202A (ja) | 2000-06-29 | 2002-01-25 | Three M Innovative Properties Co | 熱伝導性シート及びその製造方法 |
JP3562713B2 (ja) * | 2001-01-26 | 2004-09-08 | 富士高分子工業株式会社 | 放熱シート積層体の巻回体、及び放熱シートの貼り付け方法 |
JP5407120B2 (ja) | 2007-04-11 | 2014-02-05 | 日立化成株式会社 | 熱伝導シート、その製造方法およびこれを用いた放熱装置 |
JP5194232B2 (ja) * | 2007-11-07 | 2013-05-08 | 北川工業株式会社 | 熱伝導材及びその製造方法 |
JP6087518B2 (ja) * | 2012-05-14 | 2017-03-01 | 信越化学工業株式会社 | 熱伝導性シート供給体及び熱伝導性シートの供給方法 |
JP2015201573A (ja) * | 2014-04-09 | 2015-11-12 | 富士高分子工業株式会社 | 放熱シート |
CN104505347B (zh) * | 2014-12-04 | 2017-05-24 | 江苏长电科技股份有限公司 | 一种在塑封过程中贴装石墨烯散热薄膜的方法 |
JPWO2018110255A1 (ja) * | 2016-12-15 | 2019-10-24 | Jnc株式会社 | 転写シート |
JP2019204933A (ja) * | 2018-05-25 | 2019-11-28 | デクセリアルズ株式会社 | 電子部品供給体、電子部品供給リール |
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2021
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- 2021-10-14 KR KR1020237013235A patent/KR20230070277A/ko unknown
- 2021-10-14 CN CN202180070469.0A patent/CN116325138A/zh active Pending
- 2021-10-14 TW TW110138207A patent/TW202216449A/zh unknown
- 2021-10-14 EP EP21880206.4A patent/EP4213201A4/en active Pending
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WO2022080471A1 (ja) | 2022-04-21 |
TW202216449A (zh) | 2022-05-01 |
JPWO2022080471A1 (zh) | 2022-04-21 |
WO2022079914A1 (ja) | 2022-04-21 |
KR20230070277A (ko) | 2023-05-22 |
EP4213201A1 (en) | 2023-07-19 |
EP4213201A4 (en) | 2024-03-06 |
US20240017955A1 (en) | 2024-01-18 |
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