CN116194513A - 包含聚酰胺酰亚胺的漆包线漆组合物 - Google Patents
包含聚酰胺酰亚胺的漆包线漆组合物 Download PDFInfo
- Publication number
- CN116194513A CN116194513A CN202180064490.XA CN202180064490A CN116194513A CN 116194513 A CN116194513 A CN 116194513A CN 202180064490 A CN202180064490 A CN 202180064490A CN 116194513 A CN116194513 A CN 116194513A
- Authority
- CN
- China
- Prior art keywords
- polyamideimide
- composition
- diisocyanate
- polyamideimide resin
- wire
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004962 Polyamide-imide Substances 0.000 title claims abstract description 38
- 229920002312 polyamide-imide Polymers 0.000 title claims abstract description 38
- 239000000203 mixture Substances 0.000 title claims abstract description 35
- 210000003298 dental enamel Anatomy 0.000 title description 11
- 229920005989 resin Polymers 0.000 claims abstract description 24
- 239000011347 resin Substances 0.000 claims abstract description 24
- BNXZHVUCNYMNOS-UHFFFAOYSA-N 1-butylpyrrolidin-2-one Chemical compound CCCCN1CCCC1=O BNXZHVUCNYMNOS-UHFFFAOYSA-N 0.000 claims abstract description 12
- 238000000576 coating method Methods 0.000 claims description 11
- 239000002105 nanoparticle Substances 0.000 claims description 10
- 239000011248 coating agent Substances 0.000 claims description 9
- 150000008064 anhydrides Chemical class 0.000 claims description 8
- 238000000034 method Methods 0.000 claims description 8
- 125000005442 diisocyanate group Chemical group 0.000 claims description 7
- 238000002360 preparation method Methods 0.000 claims description 7
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 claims description 6
- BDAGIHXWWSANSR-UHFFFAOYSA-N methanoic acid Natural products OC=O BDAGIHXWWSANSR-UHFFFAOYSA-N 0.000 claims description 6
- 150000001875 compounds Chemical class 0.000 claims description 5
- 150000002763 monocarboxylic acids Chemical class 0.000 claims description 5
- XBDQKXXYIPTUBI-UHFFFAOYSA-N dimethylselenoniopropionate Natural products CCC(O)=O XBDQKXXYIPTUBI-UHFFFAOYSA-N 0.000 claims description 4
- OSWFIVFLDKOXQC-UHFFFAOYSA-N 4-(3-methoxyphenyl)aniline Chemical compound COC1=CC=CC(C=2C=CC(N)=CC=2)=C1 OSWFIVFLDKOXQC-UHFFFAOYSA-N 0.000 claims description 3
- 235000019253 formic acid Nutrition 0.000 claims description 3
- 229910052751 metal Inorganic materials 0.000 claims description 3
- 239000002184 metal Substances 0.000 claims description 3
- 239000003607 modifier Substances 0.000 claims description 3
- 235000011054 acetic acid Nutrition 0.000 claims description 2
- 235000019260 propionic acid Nutrition 0.000 claims description 2
- IUVKMZGDUIUOCP-BTNSXGMBSA-N quinbolone Chemical compound O([C@H]1CC[C@H]2[C@H]3[C@@H]([C@]4(C=CC(=O)C=C4CC3)C)CC[C@@]21C)C1=CCCC1 IUVKMZGDUIUOCP-BTNSXGMBSA-N 0.000 claims description 2
- 150000003627 tricarboxylic acid derivatives Chemical class 0.000 claims 2
- 238000009413 insulation Methods 0.000 abstract 1
- 239000002904 solvent Substances 0.000 description 20
- 238000006243 chemical reaction Methods 0.000 description 18
- SECXISVLQFMRJM-UHFFFAOYSA-N N-Methylpyrrolidone Chemical compound CN1CCCC1=O SECXISVLQFMRJM-UHFFFAOYSA-N 0.000 description 13
- 229920000642 polymer Polymers 0.000 description 7
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 6
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 6
- 229910052782 aluminium Inorganic materials 0.000 description 6
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 6
- 239000007822 coupling agent Substances 0.000 description 6
- 229910044991 metal oxide Inorganic materials 0.000 description 5
- SRPWOOOHEPICQU-UHFFFAOYSA-N trimellitic anhydride Chemical compound OC(=O)C1=CC=C2C(=O)OC(=O)C2=C1 SRPWOOOHEPICQU-UHFFFAOYSA-N 0.000 description 5
- IAZDPXIOMUYVGZ-UHFFFAOYSA-N Dimethylsulphoxide Chemical compound CS(C)=O IAZDPXIOMUYVGZ-UHFFFAOYSA-N 0.000 description 4
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 4
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 4
- 239000004411 aluminium Substances 0.000 description 4
- 125000003118 aryl group Chemical group 0.000 description 4
- 239000006185 dispersion Substances 0.000 description 4
- 239000010410 layer Substances 0.000 description 4
- 150000004706 metal oxides Chemical class 0.000 description 4
- LCEDQNDDFOCWGG-UHFFFAOYSA-N morpholine-4-carbaldehyde Chemical compound O=CN1CCOCC1 LCEDQNDDFOCWGG-UHFFFAOYSA-N 0.000 description 4
- -1 naphthalene tricarboxylic anhydride Chemical class 0.000 description 4
- UPMLOUAZCHDJJD-UHFFFAOYSA-N 4,4'-Diphenylmethane Diisocyanate Chemical compound C1=CC(N=C=O)=CC=C1CC1=CC=C(N=C=O)C=C1 UPMLOUAZCHDJJD-UHFFFAOYSA-N 0.000 description 3
- WVDDGKGOMKODPV-UHFFFAOYSA-N Benzyl alcohol Chemical compound OCC1=CC=CC=C1 WVDDGKGOMKODPV-UHFFFAOYSA-N 0.000 description 3
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 3
- 239000002253 acid Substances 0.000 description 3
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 238000002474 experimental method Methods 0.000 description 3
- KYWXRBNOYGGPIZ-UHFFFAOYSA-N 1-morpholin-4-ylethanone Chemical compound CC(=O)N1CCOCC1 KYWXRBNOYGGPIZ-UHFFFAOYSA-N 0.000 description 2
- 239000005057 Hexamethylene diisocyanate Substances 0.000 description 2
- FXHOOIRPVKKKFG-UHFFFAOYSA-N N,N-Dimethylacetamide Chemical compound CN(C)C(C)=O FXHOOIRPVKKKFG-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- QCWXUUIWCKQGHC-UHFFFAOYSA-N Zirconium Chemical compound [Zr] QCWXUUIWCKQGHC-UHFFFAOYSA-N 0.000 description 2
- YRKCREAYFQTBPV-UHFFFAOYSA-N acetylacetone Chemical compound CC(=O)CC(C)=O YRKCREAYFQTBPV-UHFFFAOYSA-N 0.000 description 2
- 125000003545 alkoxy group Chemical group 0.000 description 2
- 125000000217 alkyl group Chemical group 0.000 description 2
- 150000004984 aromatic diamines Chemical class 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 2
- 125000004432 carbon atom Chemical group C* 0.000 description 2
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 2
- 239000008199 coating composition Substances 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 230000036461 convulsion Effects 0.000 description 2
- 239000006184 cosolvent Substances 0.000 description 2
- 150000004985 diamines Chemical class 0.000 description 2
- USIUVYZYUHIAEV-UHFFFAOYSA-N diphenyl ether Chemical compound C=1C=CC=CC=1OC1=CC=CC=C1 USIUVYZYUHIAEV-UHFFFAOYSA-N 0.000 description 2
- KZTYYGOKRVBIMI-UHFFFAOYSA-N diphenyl sulfone Chemical compound C=1C=CC=CC=1S(=O)(=O)C1=CC=CC=C1 KZTYYGOKRVBIMI-UHFFFAOYSA-N 0.000 description 2
- 238000010292 electrical insulation Methods 0.000 description 2
- RRAMGCGOFNQTLD-UHFFFAOYSA-N hexamethylene diisocyanate Chemical compound O=C=NCCCCCCN=C=O RRAMGCGOFNQTLD-UHFFFAOYSA-N 0.000 description 2
- 125000005462 imide group Chemical group 0.000 description 2
- 150000002762 monocarboxylic acid derivatives Chemical class 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 239000005056 polyisocyanate Substances 0.000 description 2
- 229920001228 polyisocyanate Polymers 0.000 description 2
- 239000002952 polymeric resin Substances 0.000 description 2
- 239000011541 reaction mixture Substances 0.000 description 2
- 229910000077 silane Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 229920003002 synthetic resin Polymers 0.000 description 2
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 2
- 239000010936 titanium Substances 0.000 description 2
- 229910052719 titanium Inorganic materials 0.000 description 2
- DVKJHBMWWAPEIU-UHFFFAOYSA-N toluene 2,4-diisocyanate Chemical compound CC1=CC=C(N=C=O)C=C1N=C=O DVKJHBMWWAPEIU-UHFFFAOYSA-N 0.000 description 2
- 150000003628 tricarboxylic acids Chemical class 0.000 description 2
- 229910052726 zirconium Inorganic materials 0.000 description 2
- FKTHNVSLHLHISI-UHFFFAOYSA-N 1,2-bis(isocyanatomethyl)benzene Chemical compound O=C=NCC1=CC=CC=C1CN=C=O FKTHNVSLHLHISI-UHFFFAOYSA-N 0.000 description 1
- MTZUIIAIAKMWLI-UHFFFAOYSA-N 1,2-diisocyanatobenzene Chemical compound O=C=NC1=CC=CC=C1N=C=O MTZUIIAIAKMWLI-UHFFFAOYSA-N 0.000 description 1
- ZXHZWRZAWJVPIC-UHFFFAOYSA-N 1,2-diisocyanatonaphthalene Chemical compound C1=CC=CC2=C(N=C=O)C(N=C=O)=CC=C21 ZXHZWRZAWJVPIC-UHFFFAOYSA-N 0.000 description 1
- OVBFMUAFNIIQAL-UHFFFAOYSA-N 1,4-diisocyanatobutane Chemical compound O=C=NCCCCN=C=O OVBFMUAFNIIQAL-UHFFFAOYSA-N 0.000 description 1
- CDMDQYCEEKCBGR-UHFFFAOYSA-N 1,4-diisocyanatocyclohexane Chemical compound O=C=NC1CCC(N=C=O)CC1 CDMDQYCEEKCBGR-UHFFFAOYSA-N 0.000 description 1
- VZXPHDGHQXLXJC-UHFFFAOYSA-N 1,6-diisocyanato-5,6-dimethylheptane Chemical compound O=C=NC(C)(C)C(C)CCCCN=C=O VZXPHDGHQXLXJC-UHFFFAOYSA-N 0.000 description 1
- UTFSEWQOIIZLRH-UHFFFAOYSA-N 1,7-diisocyanatoheptane Chemical compound O=C=NCCCCCCCN=C=O UTFSEWQOIIZLRH-UHFFFAOYSA-N 0.000 description 1
- XEOANEVNYYOZOX-UHFFFAOYSA-N 1-isocyanato-4-(isocyanatomethyl)benzene Chemical compound O=C=NCC1=CC=C(N=C=O)C=C1 XEOANEVNYYOZOX-UHFFFAOYSA-N 0.000 description 1
- LJGHYPLBDBRCRZ-UHFFFAOYSA-N 3-(3-aminophenyl)sulfonylaniline Chemical group NC1=CC=CC(S(=O)(=O)C=2C=C(N)C=CC=2)=C1 LJGHYPLBDBRCRZ-UHFFFAOYSA-N 0.000 description 1
- JUMUEPDLAXMYHG-UHFFFAOYSA-N 3-[5-(4-aminophenyl)-1,3,4-thiadiazol-2-yl]aniline Chemical compound C1=CC(N)=CC=C1C1=NN=C(C=2C=C(N)C=CC=2)S1 JUMUEPDLAXMYHG-UHFFFAOYSA-N 0.000 description 1
- CSOGSFLQPUMFOB-UHFFFAOYSA-N 4-(4-aminocyclohexyl)aniline Chemical compound C1CC(N)CCC1C1=CC=C(N)C=C1 CSOGSFLQPUMFOB-UHFFFAOYSA-N 0.000 description 1
- YEJRWHAVMIAJKC-UHFFFAOYSA-N 4-Butyrolactone Chemical compound O=C1CCCO1 YEJRWHAVMIAJKC-UHFFFAOYSA-N 0.000 description 1
- ZEJGMGVVOLRJKV-UHFFFAOYSA-N 4-[5-(4-aminophenyl)-1,3,4-thiadiazol-2-yl]aniline Chemical compound C1=CC(N)=CC=C1C1=NN=C(C=2C=CC(N)=CC=2)S1 ZEJGMGVVOLRJKV-UHFFFAOYSA-N 0.000 description 1
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 1
- XDTMQSROBMDMFD-UHFFFAOYSA-N Cyclohexane Chemical compound C1CCCCC1 XDTMQSROBMDMFD-UHFFFAOYSA-N 0.000 description 1
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 description 1
- 239000005058 Isophorone diisocyanate Substances 0.000 description 1
- LGRFSURHDFAFJT-UHFFFAOYSA-N Phthalic anhydride Natural products C1=CC=C2C(=O)OC(=O)C2=C1 LGRFSURHDFAFJT-UHFFFAOYSA-N 0.000 description 1
- 239000004952 Polyamide Substances 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- GSEJCLTVZPLZKY-UHFFFAOYSA-N Triethanolamine Chemical compound OCCN(CCO)CCO GSEJCLTVZPLZKY-UHFFFAOYSA-N 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- 238000005299 abrasion Methods 0.000 description 1
- 150000004729 acetoacetic acid derivatives Chemical class 0.000 description 1
- 229910052768 actinide Inorganic materials 0.000 description 1
- 150000001255 actinides Chemical class 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 125000004103 aminoalkyl group Chemical group 0.000 description 1
- 239000000010 aprotic solvent Substances 0.000 description 1
- 150000004945 aromatic hydrocarbons Chemical class 0.000 description 1
- 235000019445 benzyl alcohol Nutrition 0.000 description 1
- 238000009835 boiling Methods 0.000 description 1
- 229910052796 boron Inorganic materials 0.000 description 1
- JHIWVOJDXOSYLW-UHFFFAOYSA-N butyl 2,2-difluorocyclopropane-1-carboxylate Chemical compound CCCCOC(=O)C1CC1(F)F JHIWVOJDXOSYLW-UHFFFAOYSA-N 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000007810 chemical reaction solvent Substances 0.000 description 1
- 238000009833 condensation Methods 0.000 description 1
- 230000005494 condensation Effects 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 150000003972 cyclic carboxylic anhydrides Chemical class 0.000 description 1
- KSFBTBXTZDJOHO-UHFFFAOYSA-N diaminosilicon Chemical compound N[Si]N KSFBTBXTZDJOHO-UHFFFAOYSA-N 0.000 description 1
- 150000001991 dicarboxylic acids Chemical class 0.000 description 1
- KORSJDCBLAPZEQ-UHFFFAOYSA-N dicyclohexylmethane-4,4'-diisocyanate Chemical compound C1CC(N=C=O)CCC1CC1CCC(N=C=O)CC1 KORSJDCBLAPZEQ-UHFFFAOYSA-N 0.000 description 1
- ZBCBWPMODOFKDW-UHFFFAOYSA-N diethanolamine Chemical compound OCCNCCO ZBCBWPMODOFKDW-UHFFFAOYSA-N 0.000 description 1
- LTYMSROWYAPPGB-UHFFFAOYSA-N diphenyl sulfide Chemical compound C=1C=CC=CC=1SC1=CC=CC=C1 LTYMSROWYAPPGB-UHFFFAOYSA-N 0.000 description 1
- 239000012777 electrically insulating material Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 125000000524 functional group Chemical group 0.000 description 1
- 229910052733 gallium Inorganic materials 0.000 description 1
- 229910052732 germanium Inorganic materials 0.000 description 1
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 description 1
- FAHBNUUHRFUEAI-UHFFFAOYSA-M hydroxidooxidoaluminium Chemical compound O[Al]=O FAHBNUUHRFUEAI-UHFFFAOYSA-M 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- IQPQWNKOIGAROB-UHFFFAOYSA-N isocyanate group Chemical group [N-]=C=O IQPQWNKOIGAROB-UHFFFAOYSA-N 0.000 description 1
- NIMLQBUJDJZYEJ-UHFFFAOYSA-N isophorone diisocyanate Chemical compound CC1(C)CC(N=C=O)CC(C)(CN=C=O)C1 NIMLQBUJDJZYEJ-UHFFFAOYSA-N 0.000 description 1
- 239000004922 lacquer Substances 0.000 description 1
- 229910052747 lanthanoid Inorganic materials 0.000 description 1
- 150000002602 lanthanoids Chemical class 0.000 description 1
- 231100001231 less toxic Toxicity 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 238000000691 measurement method Methods 0.000 description 1
- UAEPNZWRGJTJPN-UHFFFAOYSA-N methylcyclohexane Chemical compound CC1CCCCC1 UAEPNZWRGJTJPN-UHFFFAOYSA-N 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 1
- 239000002798 polar solvent Substances 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 229920000768 polyamine Polymers 0.000 description 1
- 125000002924 primary amino group Chemical group [H]N([H])* 0.000 description 1
- 230000035484 reaction time Effects 0.000 description 1
- 239000011342 resin composition Substances 0.000 description 1
- 150000004756 silanes Chemical class 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 125000001424 substituent group Chemical group 0.000 description 1
- CXWXQJXEFPUFDZ-UHFFFAOYSA-N tetralin Chemical compound C1=CC=C2CCCCC2=C1 CXWXQJXEFPUFDZ-UHFFFAOYSA-N 0.000 description 1
- 150000004867 thiadiazoles Chemical group 0.000 description 1
- 229910052718 tin Inorganic materials 0.000 description 1
- RUELTTOHQODFPA-UHFFFAOYSA-N toluene 2,6-diisocyanate Chemical compound CC1=C(N=C=O)C=CC=C1N=C=O RUELTTOHQODFPA-UHFFFAOYSA-N 0.000 description 1
- 231100000331 toxic Toxicity 0.000 description 1
- 230000002588 toxic effect Effects 0.000 description 1
- 229910052723 transition metal Inorganic materials 0.000 description 1
- 150000003624 transition metals Chemical class 0.000 description 1
- 125000005369 trialkoxysilyl group Chemical group 0.000 description 1
- 229910052720 vanadium Inorganic materials 0.000 description 1
- GPPXJZIENCGNKB-UHFFFAOYSA-N vanadium Chemical compound [V]#[V] GPPXJZIENCGNKB-UHFFFAOYSA-N 0.000 description 1
- 239000002966 varnish Substances 0.000 description 1
- 229910052727 yttrium Inorganic materials 0.000 description 1
- VWQVUPCCIRVNHF-UHFFFAOYSA-N yttrium atom Chemical compound [Y] VWQVUPCCIRVNHF-UHFFFAOYSA-N 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/14—Polyamide-imides
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/1003—Preparatory processes
- C08G73/1007—Preparatory processes from tetracarboxylic acids or derivatives and diamines
- C08G73/1028—Preparatory processes from tetracarboxylic acids or derivatives and diamines characterised by the process itself, e.g. steps, continuous
- C08G73/1032—Preparatory processes from tetracarboxylic acids or derivatives and diamines characterised by the process itself, e.g. steps, continuous characterised by the solvent(s) used
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/1003—Preparatory processes
- C08G73/1035—Preparatory processes from tetracarboxylic acids or derivatives and diisocyanates
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/16—Nitrogen-containing compounds
- C08K5/34—Heterocyclic compounds having nitrogen in the ring
- C08K5/3412—Heterocyclic compounds having nitrogen in the ring having one nitrogen atom in the ring
- C08K5/3415—Five-membered rings
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D177/00—Coating compositions based on polyamides obtained by reactions forming a carboxylic amide link in the main chain; Coating compositions based on derivatives of such polymers
- C09D177/06—Polyamides derived from polyamines and polycarboxylic acids
- C09D177/08—Polyamides derived from polyamines and polycarboxylic acids from polyamines and polymerised unsaturated fatty acids
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
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Abstract
本发明涉及非常适合用作线材的初级绝缘的聚酰胺酰亚胺组合物。所述组合物包含55至65pbw的N‑正丁基吡咯烷酮、25至40pbw的聚酰胺酰亚胺树脂、0至20pbw的其它组分，其中所述聚酰胺酰亚胺树脂具有在10000至40000g/mol(道尔顿)之间的Mw和在1.1至2之间的Mw/Mn比。
Description
本发明涉及一种漆包线漆(wire enamel)组合物，其包含聚酰胺酰亚胺(polyamideimide)。
在变压器、发电机和电动机中，保护铜线或铝线的电绝缘材料是高性能聚合物的薄涂层。该涂层，被称为初级电绝缘或漆包线漆，尽可能薄以在每个槽空间中获得最大的匝数。必须保持足够的热、机械和电性质。用作初级电绝缘的一种这样的聚合物是聚(酰胺-酰亚胺)或聚酰胺酰亚胺树脂。突出的特征包括高热性能、耐化学性和耐磨性以及低摩擦系数。
聚酰胺酰亚胺涂料组合物形成柔性且耐用的膜，并且特别可用作漆包线漆、清漆、层压材料的胶粘剂、不粘涂料、polyamideimidents等。这些组合物特别以它们的长期高温能力(＝220℃(430F))著称。
在GB570858中，公开了通过使偏苯三酸酐和芳族二胺反应制备芳族聚酰胺酰亚胺树脂。通常这些反应在非质子溶剂，如N-甲基吡咯烷酮(NMP)、二甲基乙酰胺(DMAc)或二甲基甲酰胺(DMF)中进行。
在US3541038中，描述了使用偏苯三酸酐和多异氰酸酯，优选二异氰酸酯制备芳族聚酰胺酰亚胺树脂。这一反应优选使用N-甲基吡咯烷酮(NMP)作为溶剂进行。或者，可以使用NMP与芳烃的混合物作为溶剂。
不久前发现，暴露于NMP的人可能受到潜在健康影响。替代溶剂，如四氢呋喃(THF)、甲乙酮(MEK)、γ-丁内酯(GBL)或二甲基亚砜(DMSO)是已知的，但它们具有沸点太低以致无法用作反应溶剂、聚合物树脂溶解度低或储存稳定性差之类的缺点，这可能改变聚合物在其要用于的应用中的性能。
尽管NMP在以正确的方式操作并采取足够的安全和健康预防措施时是安全的，但已经公开了涉及替代溶剂的各种文献，如US2013/0217812、WO2013/090933、WO2013/107822、US2015/0299393和WO2015/144663中公开的那些。
在US2015/0299393中公开了在替代性的较低毒性溶剂如N-甲酰吗啉(NFM)和N-乙酰吗啉(NAM)中制备聚酰胺酰亚胺树脂。这些较低毒性溶剂(主溶剂)可与助溶剂(或第二溶剂)结合使用，其中助溶剂的量低于主溶剂的量。在该文献中提到许多潜在的助溶剂。据说以这种方式制备的聚酰胺酰亚胺树脂可用作线材涂层的涂料组合物，但是没有已知的基于这些组合物的商业线材涂料体系。
在WO2013/107822中公开了可用作替代溶剂的各种溶剂以替代包含聚酰胺酰亚胺树脂的漆包线漆组合物中的NMP。在WO2013/107822中给出适用于漆包铜线的漆包线漆组合物的实例。本申请的发明人重复了WO2013/107822中的实验并发现，尽管使用替代溶剂的漆包铜线的某些性质与使用NMP溶剂获得的结果相当，但使用替代溶剂的漆包铜线的性质总体上不足以使用该组合物作为基于NMP的组合物的替代品。特别地，耐切通性、耐乙醇性、柔性和Tanδ不符合用于漆包线漆应用的NMP基聚酰胺酰亚胺树脂组合物的商业规范。
本发明涉及满足有资格真正替代包含NMP溶剂的漆包线漆组合物的所有要求的组合物。
根据本发明的组合物包含：
a.55至65pbw的N-正丁基吡咯烷酮(NBP)
b.25至40pbw的聚酰胺酰亚胺树脂
c.0至20pbw的其它组分
其中所述聚酰胺酰亚胺树脂具有在10000至40000g/mol(道尔顿)之间的Mw和在1.1至2之间的Mw/Mn比。
本发明进一步涉及这种组合物作为铜或铝导电材料的绝缘材料的用途。
本发明进一步涉及聚酰胺酰亚胺树脂的制备，其中使用N-正丁基吡咯烷酮作为溶剂在调节剂(moderator)化合物存在下在80至120℃的温度下使酐与二异氰酸酯反应。
本发明进一步涉及一种用根据本发明的组合物将金属线上漆的方法。
本发明中所用的聚酰胺酰亚胺树脂可以源自多羧酸或其酐——其中两个羧基位于邻位(vicinal position)并且其中必须存在至少一个附加官能团，和源自具有至少一个能够形成酰亚胺环的伯氨基的多胺，或源自具有至少2个异氰酸酯基团的化合物。该聚酰胺酰亚胺也可以通过使聚酰胺、含有至少2个NCO基团的多异氰酸酯和含有至少一个可通过缩合或加成发生反应的附加基团的环状二羧酸酐反应获得。
此外，也可能由二异氰酸酯或二胺和二羧酸制备聚酰胺酰亚胺，条件是组分之一已含有酰亚胺基团。例如，特别有可能首先使三羧酸酐与二伯二胺(diprimary diamine)反应以得到相应的二酰亚氨基羧酸，然后使其与二异氰酸酯反应以形成聚酰胺酰亚胺。
为了制备聚酰胺酰亚胺，优选使用其中2个羧基位于邻位的三羧酸或其酐。优选的是相应的芳族三羧酸酐，例如偏苯三酸酐、萘三羧酸酐、联苯三羧酸酐，以及分子中具有2个苯环和2个邻位羧基的其它三羧酸，如DE-A 19 56 512中给出的实例。非常特别优选使用偏苯三酸酐。作为胺组分，有可能使用已经联系聚酰氨基羧酸描述的二伯二胺。此外，还有可能使用含有噻二唑环的芳族二胺，例如2,5-双(4-氨基苯基)-1,3,4-噻二唑、2,5-双(3-氨基苯基)-3,3,4-噻二唑、2-(4-氨基苯基)-5-(3-氨基苯基)-1,3,4-噻二唑，以及各种异构体的混合物。
适用于制备聚酰胺酰亚胺的二异氰酸酯是脂族二异氰酸酯，如四亚甲基二异氰酸酯、六亚甲基二异氰酸酯、七亚甲基二异氰酸酯和三甲基六亚甲基二异氰酸酯；脂环族二异氰酸酯，例如异佛尔酮二异氰酸酯、ω,ω'-二异氰酸根合-1,4-二甲基环己烷、环己烷1,3-二异氰酸酯、环己烷1,4-二异氰酸酯、1-甲基环己烷2,4-二异氰酸酯和二环己基甲烷4,4'-二异氰酸酯；芳族二异氰酸酯，例如苯二异氰酸酯、甲苯二异氰酸酯、萘二异氰酸酯和苯二亚甲基二异氰酸酯，以及取代芳族体系，例如二苯醚、二苯硫醚、二苯砜和二苯甲烷二异氰酸酯；混合芳族-脂族和芳族-氢化芳族二异氰酸酯，例如4-异氰酸根合甲基苯基异氰酸酯、四氢化萘1,5-二异氰酸酯和六氢联苯胺4,4'-二异氰酸酯。优选使用4,4'-二苯甲烷二异氰酸酯、2,4-和2,6-甲苯二异氰酸酯和六亚甲基二异氰酸酯。
据发现，只有在明确界定的反应条件下在NBP中制备聚酰胺酰亚胺树脂时才能获得表现出有资格作为漆包线漆所必需的有益性质的溶解在NBP中的聚酰胺酰亚胺树脂。据发现，反应温度不应该太高，优选在80至130℃的范围内，更优选在80至120℃的范围内。据发现，当反应温度高于130℃时，该反应太快并且不受控制以致无法获得具有至少10000g/mol的Mw和在1.1至2之间的Mw/Mn比的聚酰胺酰亚胺树脂。当反应温度低于80℃时，该反应非常慢(如果有发生)，以致在实践中无法用于制造聚酰胺酰亚胺树脂。
进一步发现在反应混合物中存在少量调节剂化合物，如低分子量单酐或单羧酸是有益的。合适的低分子量单羧酸的实例包括(C1-C10)单羧酸或C4-C6支化单羧酸，如甲酸、乙酸、丙酸等，合适的酸酐的实例包括邻苯二甲酸酐。反应混合物中的低分子量单酐或单羧酸的量应该为基于反应中形成的聚酰胺酰亚胺树脂的量计4至8摩尔％。
本发明能够制备包含N-正丁基吡咯烷酮作为主溶剂和>21重量％的量的聚酰胺酰亚胺树脂的溶液，所述聚酰胺酰亚胺树脂具有在10000至40000g/mol(道尔顿)之间的Mw和在1.1至2之间的Mw/Mn比。
这种溶液可包含其它溶剂，但这些其它溶剂的量比N-正丁基吡咯烷酮的量低得多。
本发明还涉及通过使用本发明的组合物制造漆包线。
根据本发明的组合物的涂布和固化不需要任何特定或特殊的程序，可以使用常规施加方法。线材通常具有0.005至6mm的直径。合适的线材包括常规金属线，优选铜、铝或其合金。对线材形状没有限制，特别可以使用圆形或矩形线。本发明的组合物可作为单层涂层、双层涂层或多层涂层施加。
该组合物可以以常规层厚度施加，干层厚度依据用于细线和粗线的标准化值。将本发明的组合物施加到线材上并在卧式或立式炉中固化。线材可以接连涂布和固化一次到数次。作为固化温度，根据用于漆的常规参数和要涂布的线材的性质，合适的范围可从300至800℃不等。上漆条件，如道数(number of passes)、上漆速度(enamelling speed)、炉温取决于要涂布的线材的性质。
为了增强用本发明的组合物涂覆的线材的耐切通性(cut through resistance)，在根据本发明的组合物中也可以包括纳米粒子。
可用于根据本发明的组合物的纳米粒子是其平均半径在1至300nm的范围内，优选在2至100nm的范围内，特别优选在5至65nm的范围内的粒子。优选纳米粒子的实例是纳米氧化物、纳米金属氧化物、胶体氧化物、胶体金属氧化物、金属氧化物或铝、锡、硼、锗、镓、铅、过渡金属和镧系元素和锕系元素的水合氧化物，特别是包含铝、硅、钛、锌、钇、钒、锆和/或镍，优选铝、硅、钛和/或锆的系列的水合氧化物，它们在分散相中为纳米级，可以单独或组合使用。在纳米金属氧化物中，纳米氧化铝最优选。纳米氧化铝的实例是：BYK-Chemie GmbH的BYK-LP X 20693和NanoBYK 3610、Nycol Nano Technologies lnc.的Nycol AI20OSD、Sasol Germany GmbH的Dispal X-25SR和SRL、Disperal P2、P3、OS1和OS2。在纳米氧化铝中，预分散在极性溶剂中的氧化铝的陶瓷粒子，如BYK-Chemie GmbH的BYK-LP X 20693和NanoBYK 3610是优选的。
纳米粒子可以与偶联剂一起使用。作为偶联剂，可以使用任何众所周知的官能烷氧基硅烷或芳氧基硅烷。在官能硅烷中，(异氰酸根合烷基)-三烷氧基硅烷、(氨基烷基)-三烷氧基硅烷、(三烷氧基甲硅烷基)-烷基酸酐、低聚二氨基硅烷体系是优选的。官能硅烷的烷基和烷氧基具有1至6个碳原子，更优选1至4个碳原子。上述烷基和烷氧基可进一步具有在其上的取代基。钛酸酯和/或锆酸酯也可用作偶联剂。可以使用任何常见的原钛酸或锆酸酯，例如，四异丙基、四丁基、乙酰丙酮、乙酰乙酸酯、二乙醇胺、三乙醇胺、甲酚的钛酸酯或锆酸酯。
为了增强纳米粒子在聚合物溶液基质中的分散，偶联剂如官能硅烷、钛酸酯或锆酸酯可以直接添加到纳米粒子分散体中并在此混合，然后将其加载到聚合物树脂溶液中，或者可以在加入纳米粒子分散体之前直接添加到聚合物溶液中。偶联剂可以选择性地在加载纳米粒子分散体之前混合到聚合物溶液中，以使无机部分更好地与有机部分连接。聚合物溶液和偶联剂的混合物可以在室温下或在相对较低温度下搅拌几小时，然后再加入纳米金属氧化物溶液。
根据IEC 60851测试制成的漆包线。
测量方法
根据DIN 55672-2测量Mw；
根据DIN 55672-2测量Mn；
根据ASTM D 3288测量粘度；
根据IEC 60851-第3部分测量心轴试验(mandrel test)。
根据IEC 60851-第4部分测量耐乙醇性。
根据IEC 60851-第6部分测量切通试验。
根据IEC 60851-第5部分测量Tanδ。
根据IEC 60851-第3部分测量急拉试验(jerk test)。
实施例
实施例1(对比)：在完全相同的条件下重复来自WO2013/107822的实验1以制备聚酰胺酰亚胺在N-正丁基吡咯烷酮(NBP)中的溶液。获得具有7136克/摩尔的平均分子量的聚酰胺酰亚胺溶液(样品1)。
实施例2：将18.08重量份(pbw)的偏苯三酸酐、23.5pbw的4,4'-二苯甲烷二异氰酸酯、0.12pbw的甲酸和58.29pbw的NBP装载在反应容器中并加热至85℃。将混合物在85℃下保持2小时，然后缓慢加热至100℃。将反应容器中的温度在此温度下保持数小时。
在达到100℃后1小时，从反应容器中提取10.9pbw的样品并测得分子量为9665克/摩尔(样品2)。
继续反应并在另外1小时后从反应容器中提取10.9pbw的进一步样品并测得分子量为15593克/摩尔(样品3)。
继续反应并在另外1小时后从反应容器中提取10.9pbw的进一步样品并测得分子量为16771克/摩尔(样品4)。
继续反应并在100℃下7小时的总反应时间后从反应容器中提取10.9pbw的进一步样品并测得分子量为24583克/摩尔。这一样品进一步用苄醇稀释以达到在23℃下13000mPas的粘度(样品5)。
实施例3：对实施例1和2中收集的所有样品进行典型的漆包线漆测试。在该比较中，还使用在NMP中的市售聚酰胺酰亚胺树脂溶液(样品6)。这些试验的结果显示在表1中。
表1：测试结果
样品
R：商业用途的要求
*)对比例
Claims (8)
1.组合物，其包含
a.55至65pbw的N-正丁基吡咯烷酮，
b.25至40pbw的聚酰胺酰亚胺树脂，
c.0至20pbw的其它组分，
其特征在于所述聚酰胺酰亚胺树脂具有在10000至40000g/mol(道尔顿)之间的Mw和在1.1至2之间的Mw/Mn比。
2.权利要求1的组合物，其进一步包含平均直径在1至300nm的范围内的纳米粒子。
3.权利要求1的组合物，其可通过使包含具有2个邻位羧基的三羧酸或其酐、二异氰酸酯、调节剂化合物和N-正丁基吡咯烷酮的混合物在80-120℃的温度下反应获得。
4.制备聚酰胺酰亚胺树脂的方法，其中使包含具有2个邻位羧基的三羧酸或其酐、二异氰酸酯、调节剂化合物和N-正丁基吡咯烷酮的混合物在80-120℃的温度下反应，直至获得在10000至40000g/mol(道尔顿)的范围内的Mw和在1.1至2之间的Mw/Mn比的聚酰胺酰亚胺树脂。
5.根据权利要求4的方法，其中所述调节剂是低分子量单羧酸。
6.根据权利要求5的方法，其中所述低分子量单羧酸选自甲酸、乙酸和丙酸。
7.根据权利要求4-6任一项的方法，其中所述混合物还包含平均直径在1至300nm的范围内的纳米粒子。
8.涂布金属线的方法，其中用权利要求1-3的组合物涂布所述线材。
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| EP20197470 | 2020-09-22 | ||
| EP20197470.6 | 2020-09-22 | ||
| PCT/EP2021/075752 WO2022063715A1 (en) | 2020-09-22 | 2021-09-20 | Wire enamel composition comprising polyamideimide |
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| CN116194513A true CN116194513A (zh) | 2023-05-30 |
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| CN202180064490.XA Pending CN116194513A (zh) | 2020-09-22 | 2021-09-20 | 包含聚酰胺酰亚胺的漆包线漆组合物 |
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| US (1) | US20230287180A1 (zh) |
| EP (1) | EP4217413A1 (zh) |
| JP (1) | JP2023542189A (zh) |
| KR (1) | KR20230052939A (zh) |
| CN (1) | CN116194513A (zh) |
| WO (1) | WO2022063715A1 (zh) |
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| DE102014104223A1 (de) | 2014-03-26 | 2015-10-01 | Elantas Italia S.R.L. | Neues Lösemittel für Polyamidimide und Polyimide |
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- 2021-09-20 CN CN202180064490.XA patent/CN116194513A/zh active Pending
- 2021-09-20 JP JP2023518244A patent/JP2023542189A/ja active Pending
- 2021-09-20 KR KR1020237009290A patent/KR20230052939A/ko unknown
- 2021-09-20 EP EP21778122.8A patent/EP4217413A1/en active Pending
- 2021-09-20 US US18/026,152 patent/US20230287180A1/en active Pending
- 2021-09-20 WO PCT/EP2021/075752 patent/WO2022063715A1/en unknown
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Also Published As
| Publication number | Publication date |
|---|---|
| WO2022063715A1 (en) | 2022-03-31 |
| KR20230052939A (ko) | 2023-04-20 |
| EP4217413A1 (en) | 2023-08-02 |
| US20230287180A1 (en) | 2023-09-14 |
| JP2023542189A (ja) | 2023-10-05 |
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