CN116114053B - 基板保持机械手和基板搬运机器人 - Google Patents
基板保持机械手和基板搬运机器人 Download PDFInfo
- Publication number
- CN116114053B CN116114053B CN202080103693.0A CN202080103693A CN116114053B CN 116114053 B CN116114053 B CN 116114053B CN 202080103693 A CN202080103693 A CN 202080103693A CN 116114053 B CN116114053 B CN 116114053B
- Authority
- CN
- China
- Prior art keywords
- pressing
- blade
- substrate
- support
- main surface
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
- H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
- H10P72/3302—Mechanical parts of transfer devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J15/00—Gripping heads and other end effectors
- B25J15/0014—Gripping heads and other end effectors having fork, comb or plate shaped means for engaging the lower surface on a object to be transported
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J11/00—Manipulators not otherwise provided for
- B25J11/0095—Manipulators transporting wafers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J15/00—Gripping heads and other end effectors
- B25J15/0028—Gripping heads and other end effectors with movable, e.g. pivoting gripping jaw surfaces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J15/00—Gripping heads and other end effectors
- B25J15/0052—Gripping heads and other end effectors multiple gripper units or multiple end effectors
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J19/00—Accessories fitted to manipulators, e.g. for monitoring, for viewing; Safety devices combined with or specially adapted for use in connection with manipulators
- B25J19/0008—Balancing devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
- B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
- B65G49/07—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for semiconductor wafers Not used, see H10P72/00
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
- H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
- H10P72/7602—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a robot blade or gripped by a gripper for conveyance
Landscapes
- Engineering & Computer Science (AREA)
- Robotics (AREA)
- Mechanical Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Details Of Cutting Devices (AREA)
- Grinding Of Cylindrical And Plane Surfaces (AREA)
- Manipulator (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2020148493 | 2020-09-03 | ||
| JP2020-148493 | 2020-09-03 | ||
| PCT/JP2020/041029 WO2022049786A1 (ja) | 2020-09-03 | 2020-11-02 | 基板保持ハンドおよび基板搬送ロボット |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN116114053A CN116114053A (zh) | 2023-05-12 |
| CN116114053B true CN116114053B (zh) | 2025-02-25 |
Family
ID=79907541
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202080103693.0A Active CN116114053B (zh) | 2020-09-03 | 2020-11-02 | 基板保持机械手和基板搬运机器人 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US20230311334A1 (https=) |
| JP (1) | JP7420954B2 (https=) |
| KR (1) | KR102748424B1 (https=) |
| CN (1) | CN116114053B (https=) |
| TW (1) | TWI747588B (https=) |
| WO (1) | WO2022049786A1 (https=) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP7610943B2 (ja) * | 2020-09-18 | 2025-01-09 | ニデックインスツルメンツ株式会社 | 産業用ロボット |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2020095875A1 (ja) * | 2018-11-06 | 2020-05-14 | 川崎重工業株式会社 | ロボットハンド及びそれを備えるロボット |
Family Cites Families (22)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04113445U (ja) * | 1991-03-20 | 1992-10-05 | 株式会社日立製作所 | ウエハ移載装置のウエハ吸着板固定装置 |
| JP3802119B2 (ja) * | 1996-02-02 | 2006-07-26 | 株式会社安川電機 | ウェハ搬送装置 |
| KR100331157B1 (ko) * | 1998-07-24 | 2002-04-03 | 다니구찌 이찌로오, 기타오카 다카시 | 웨이퍼 홀딩 핸드 |
| JP2006150538A (ja) * | 2004-11-30 | 2006-06-15 | Rorze Corp | 把持型搬送装置並びにこれを用いるロボット、円盤状物加工設備及び円盤状物搬送方法。 |
| US7290813B2 (en) * | 2004-12-16 | 2007-11-06 | Asyst Technologies, Inc. | Active edge grip rest pad |
| JP4607756B2 (ja) * | 2005-12-22 | 2011-01-05 | 川崎重工業株式会社 | ロボットハンドおよび基板搬送ロボット |
| KR101181560B1 (ko) * | 2008-09-12 | 2012-09-10 | 다이닛뽕스크린 세이조오 가부시키가이샤 | 기판처리장치 및 그것에 사용되는 기판반송장치 |
| JP5589790B2 (ja) * | 2010-03-31 | 2014-09-17 | 株式会社安川電機 | 基板搬送用ハンドおよび基板搬送ロボット |
| CN202678300U (zh) * | 2011-06-28 | 2013-01-16 | 清华大学 | 一种利用弹簧夹子的晶圆夹持装置 |
| TWI538789B (zh) * | 2011-08-10 | 2016-06-21 | 川崎重工業股份有限公司 | A end effector device, and a substrate transport robot including the end effector device |
| JP5553065B2 (ja) | 2011-09-22 | 2014-07-16 | 株式会社安川電機 | 基板搬送用ハンドおよび基板搬送ロボット |
| JP5750472B2 (ja) * | 2013-05-22 | 2015-07-22 | 株式会社安川電機 | 基板搬送ロボット、基板搬送システムおよび基板の配置状態の検出方法 |
| JP2015079820A (ja) * | 2013-10-16 | 2015-04-23 | 株式会社東京精密 | 基板搬送装置 |
| JP6314157B2 (ja) * | 2013-12-26 | 2018-04-18 | 川崎重工業株式会社 | エンドエフェクタおよび基板搬送ロボット |
| US9929034B2 (en) * | 2015-09-03 | 2018-03-27 | Kawasaki Jukogyo Kabushiki Kaisha | Substrate transfer device |
| JP2017175072A (ja) * | 2016-03-25 | 2017-09-28 | 川崎重工業株式会社 | 基板搬送ハンド及びロボット |
| JP6276317B2 (ja) * | 2016-03-31 | 2018-02-07 | 平田機工株式会社 | ハンドユニットおよび移載方法 |
| US10090188B2 (en) * | 2016-05-05 | 2018-10-02 | Applied Materials, Inc. | Robot subassemblies, end effector assemblies, and methods with reduced cracking |
| JP2018041854A (ja) * | 2016-09-08 | 2018-03-15 | 株式会社荏原製作所 | 基板把持検出装置、基板把持装置、基板把持検出装置の調整方法 |
| JP6782180B2 (ja) * | 2017-01-31 | 2020-11-11 | 川崎重工業株式会社 | 基板把持ハンド及び基板搬送装置 |
| JP6889631B2 (ja) * | 2017-08-04 | 2021-06-18 | 川崎重工業株式会社 | 状態監視システム及び状態監視方法 |
| US11964383B2 (en) * | 2019-01-16 | 2024-04-23 | Kawasaki Jukogyo Kabushiki Kaisha | Robot hand and robot having the same |
-
2020
- 2020-11-02 JP JP2022546869A patent/JP7420954B2/ja active Active
- 2020-11-02 WO PCT/JP2020/041029 patent/WO2022049786A1/ja not_active Ceased
- 2020-11-02 CN CN202080103693.0A patent/CN116114053B/zh active Active
- 2020-11-02 US US18/024,530 patent/US20230311334A1/en active Pending
- 2020-11-02 KR KR1020237008332A patent/KR102748424B1/ko active Active
- 2020-11-02 TW TW109138069A patent/TWI747588B/zh active
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2020095875A1 (ja) * | 2018-11-06 | 2020-05-14 | 川崎重工業株式会社 | ロボットハンド及びそれを備えるロボット |
Also Published As
| Publication number | Publication date |
|---|---|
| TWI747588B (zh) | 2021-11-21 |
| WO2022049786A1 (ja) | 2022-03-10 |
| US20230311334A1 (en) | 2023-10-05 |
| CN116114053A (zh) | 2023-05-12 |
| JP7420954B2 (ja) | 2024-01-23 |
| JPWO2022049786A1 (https=) | 2022-03-10 |
| KR20230048405A (ko) | 2023-04-11 |
| KR102748424B1 (ko) | 2024-12-30 |
| TW202210254A (zh) | 2022-03-16 |
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| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |