JP7420954B2 - 基板保持ハンドおよび基板搬送ロボット - Google Patents

基板保持ハンドおよび基板搬送ロボット Download PDF

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Publication number
JP7420954B2
JP7420954B2 JP2022546869A JP2022546869A JP7420954B2 JP 7420954 B2 JP7420954 B2 JP 7420954B2 JP 2022546869 A JP2022546869 A JP 2022546869A JP 2022546869 A JP2022546869 A JP 2022546869A JP 7420954 B2 JP7420954 B2 JP 7420954B2
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Japan
Prior art keywords
pressing
blade
support
substrate
inclination
Prior art date
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Active
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JP2022546869A
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English (en)
Japanese (ja)
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JPWO2022049786A1 (https=
Inventor
一平 清水
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kawasaki Motors Ltd
Original Assignee
Kawasaki Jukogyo KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
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Publication of JPWO2022049786A1 publication Critical patent/JPWO2022049786A1/ja
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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J11/00—Manipulators not otherwise provided for
    • B25J11/0095—Manipulators transporting wafers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J15/00—Gripping heads and other end effectors
    • B25J15/0014—Gripping heads and other end effectors having fork, comb or plate shaped means for engaging the lower surface on a object to be transported
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
    • H10P72/3302—Mechanical parts of transfer devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J15/00—Gripping heads and other end effectors
    • B25J15/0028—Gripping heads and other end effectors with movable, e.g. pivoting gripping jaw surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J15/00—Gripping heads and other end effectors
    • B25J15/0052—Gripping heads and other end effectors multiple gripper units or multiple end effectors
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J19/00—Accessories fitted to manipulators, e.g. for monitoring, for viewing; Safety devices combined with or specially adapted for use in connection with manipulators
    • B25J19/0008—Balancing devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
    • B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
    • B65G49/07—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for semiconductor wafers Not used, see H10P72/00
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7602—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a robot blade or gripped by a gripper for conveyance

Landscapes

  • Engineering & Computer Science (AREA)
  • Robotics (AREA)
  • Mechanical Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Details Of Cutting Devices (AREA)
  • Grinding Of Cylindrical And Plane Surfaces (AREA)
  • Manipulator (AREA)
JP2022546869A 2020-09-03 2020-11-02 基板保持ハンドおよび基板搬送ロボット Active JP7420954B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020148493 2020-09-03
JP2020148493 2020-09-03
PCT/JP2020/041029 WO2022049786A1 (ja) 2020-09-03 2020-11-02 基板保持ハンドおよび基板搬送ロボット

Publications (2)

Publication Number Publication Date
JPWO2022049786A1 JPWO2022049786A1 (https=) 2022-03-10
JP7420954B2 true JP7420954B2 (ja) 2024-01-23

Family

ID=79907541

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022546869A Active JP7420954B2 (ja) 2020-09-03 2020-11-02 基板保持ハンドおよび基板搬送ロボット

Country Status (6)

Country Link
US (1) US20230311334A1 (https=)
JP (1) JP7420954B2 (https=)
KR (1) KR102748424B1 (https=)
CN (1) CN116114053B (https=)
TW (1) TWI747588B (https=)
WO (1) WO2022049786A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7610943B2 (ja) * 2020-09-18 2025-01-09 ニデックインスツルメンツ株式会社 産業用ロボット

Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2000005761A1 (en) 1998-07-24 2000-02-03 Mitsubishi Denki Kabushiki Kaisha Wafer holding hand
JP2006150538A (ja) 2004-11-30 2006-06-15 Rorze Corp 把持型搬送装置並びにこれを用いるロボット、円盤状物加工設備及び円盤状物搬送方法。
JP2007169007A (ja) 2005-12-22 2007-07-05 Kawasaki Heavy Ind Ltd ロボットハンドおよび基板搬送ロボット
JP2011228625A (ja) 2010-03-31 2011-11-10 Yaskawa Electric Corp 基板搬送用ハンドおよび基板搬送ロボット
CN102751228A (zh) 2011-06-28 2012-10-24 清华大学 一种利用弹簧夹子的晶圆夹持装置
WO2013021645A1 (ja) 2011-08-10 2013-02-14 川崎重工業株式会社 エンドエフェクタ装置及び該エンドエフェクタ装置を備える基板搬送用ロボット
JP2013069914A (ja) 2011-09-22 2013-04-18 Yaskawa Electric Corp 基板搬送用ハンドおよび基板搬送ロボット
WO2015098153A1 (ja) 2013-12-26 2015-07-02 川崎重工業株式会社 エンドエフェクタおよび基板搬送ロボット
JP2017175072A (ja) 2016-03-25 2017-09-28 川崎重工業株式会社 基板搬送ハンド及びロボット
JP2017183593A (ja) 2016-03-31 2017-10-05 平田機工株式会社 ハンドユニットおよび移載方法
JP2018041854A (ja) 2016-09-08 2018-03-15 株式会社荏原製作所 基板把持検出装置、基板把持装置、基板把持検出装置の調整方法

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04113445U (ja) * 1991-03-20 1992-10-05 株式会社日立製作所 ウエハ移載装置のウエハ吸着板固定装置
JP3802119B2 (ja) * 1996-02-02 2006-07-26 株式会社安川電機 ウェハ搬送装置
US7290813B2 (en) * 2004-12-16 2007-11-06 Asyst Technologies, Inc. Active edge grip rest pad
KR101181560B1 (ko) * 2008-09-12 2012-09-10 다이닛뽕스크린 세이조오 가부시키가이샤 기판처리장치 및 그것에 사용되는 기판반송장치
JP5750472B2 (ja) * 2013-05-22 2015-07-22 株式会社安川電機 基板搬送ロボット、基板搬送システムおよび基板の配置状態の検出方法
JP2015079820A (ja) * 2013-10-16 2015-04-23 株式会社東京精密 基板搬送装置
US9929034B2 (en) * 2015-09-03 2018-03-27 Kawasaki Jukogyo Kabushiki Kaisha Substrate transfer device
US10090188B2 (en) * 2016-05-05 2018-10-02 Applied Materials, Inc. Robot subassemblies, end effector assemblies, and methods with reduced cracking
JP6782180B2 (ja) * 2017-01-31 2020-11-11 川崎重工業株式会社 基板把持ハンド及び基板搬送装置
JP6889631B2 (ja) * 2017-08-04 2021-06-18 川崎重工業株式会社 状態監視システム及び状態監視方法
JP2020077699A (ja) * 2018-11-06 2020-05-21 川崎重工業株式会社 ロボットハンド及びそれを備えるロボット
US11964383B2 (en) * 2019-01-16 2024-04-23 Kawasaki Jukogyo Kabushiki Kaisha Robot hand and robot having the same

Patent Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2000005761A1 (en) 1998-07-24 2000-02-03 Mitsubishi Denki Kabushiki Kaisha Wafer holding hand
JP2006150538A (ja) 2004-11-30 2006-06-15 Rorze Corp 把持型搬送装置並びにこれを用いるロボット、円盤状物加工設備及び円盤状物搬送方法。
JP2007169007A (ja) 2005-12-22 2007-07-05 Kawasaki Heavy Ind Ltd ロボットハンドおよび基板搬送ロボット
JP2011228625A (ja) 2010-03-31 2011-11-10 Yaskawa Electric Corp 基板搬送用ハンドおよび基板搬送ロボット
CN102751228A (zh) 2011-06-28 2012-10-24 清华大学 一种利用弹簧夹子的晶圆夹持装置
WO2013021645A1 (ja) 2011-08-10 2013-02-14 川崎重工業株式会社 エンドエフェクタ装置及び該エンドエフェクタ装置を備える基板搬送用ロボット
JP2013069914A (ja) 2011-09-22 2013-04-18 Yaskawa Electric Corp 基板搬送用ハンドおよび基板搬送ロボット
WO2015098153A1 (ja) 2013-12-26 2015-07-02 川崎重工業株式会社 エンドエフェクタおよび基板搬送ロボット
JP2017175072A (ja) 2016-03-25 2017-09-28 川崎重工業株式会社 基板搬送ハンド及びロボット
JP2017183593A (ja) 2016-03-31 2017-10-05 平田機工株式会社 ハンドユニットおよび移載方法
JP2018041854A (ja) 2016-09-08 2018-03-15 株式会社荏原製作所 基板把持検出装置、基板把持装置、基板把持検出装置の調整方法

Also Published As

Publication number Publication date
TWI747588B (zh) 2021-11-21
WO2022049786A1 (ja) 2022-03-10
CN116114053B (zh) 2025-02-25
US20230311334A1 (en) 2023-10-05
CN116114053A (zh) 2023-05-12
JPWO2022049786A1 (https=) 2022-03-10
KR20230048405A (ko) 2023-04-11
KR102748424B1 (ko) 2024-12-30
TW202210254A (zh) 2022-03-16

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