KR102748424B1 - 기판 유지 핸드 및 기판 반송 로봇 - Google Patents

기판 유지 핸드 및 기판 반송 로봇 Download PDF

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Publication number
KR102748424B1
KR102748424B1 KR1020237008332A KR20237008332A KR102748424B1 KR 102748424 B1 KR102748424 B1 KR 102748424B1 KR 1020237008332 A KR1020237008332 A KR 1020237008332A KR 20237008332 A KR20237008332 A KR 20237008332A KR 102748424 B1 KR102748424 B1 KR 102748424B1
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KR
South Korea
Prior art keywords
blade
substrate
inclination
support
pressurizing
Prior art date
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KR1020237008332A
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English (en)
Korean (ko)
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KR20230048405A (ko
Inventor
잇페이 시미즈
Original Assignee
가와사끼 쥬고교 가부시끼 가이샤
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Publication of KR20230048405A publication Critical patent/KR20230048405A/ko
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
    • H10P72/3302—Mechanical parts of transfer devices
    • H01L21/67742—
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J15/00—Gripping heads and other end effectors
    • B25J15/0014—Gripping heads and other end effectors having fork, comb or plate shaped means for engaging the lower surface on a object to be transported
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J11/00—Manipulators not otherwise provided for
    • B25J11/0095—Manipulators transporting wafers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J15/00—Gripping heads and other end effectors
    • B25J15/0028—Gripping heads and other end effectors with movable, e.g. pivoting gripping jaw surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J15/00—Gripping heads and other end effectors
    • B25J15/0052—Gripping heads and other end effectors multiple gripper units or multiple end effectors
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J19/00—Accessories fitted to manipulators, e.g. for monitoring, for viewing; Safety devices combined with or specially adapted for use in connection with manipulators
    • B25J19/0008—Balancing devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
    • B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
    • B65G49/07—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for semiconductor wafers Not used, see H10P72/00
    • H01L21/68707—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7602—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a robot blade or gripped by a gripper for conveyance

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  • Engineering & Computer Science (AREA)
  • Robotics (AREA)
  • Mechanical Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Details Of Cutting Devices (AREA)
  • Grinding Of Cylindrical And Plane Surfaces (AREA)
  • Manipulator (AREA)
KR1020237008332A 2020-09-03 2020-11-02 기판 유지 핸드 및 기판 반송 로봇 Active KR102748424B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020148493 2020-09-03
JPJP-P-2020-148493 2020-09-03
PCT/JP2020/041029 WO2022049786A1 (ja) 2020-09-03 2020-11-02 基板保持ハンドおよび基板搬送ロボット

Publications (2)

Publication Number Publication Date
KR20230048405A KR20230048405A (ko) 2023-04-11
KR102748424B1 true KR102748424B1 (ko) 2024-12-30

Family

ID=79907541

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020237008332A Active KR102748424B1 (ko) 2020-09-03 2020-11-02 기판 유지 핸드 및 기판 반송 로봇

Country Status (6)

Country Link
US (1) US20230311334A1 (https=)
JP (1) JP7420954B2 (https=)
KR (1) KR102748424B1 (https=)
CN (1) CN116114053B (https=)
TW (1) TWI747588B (https=)
WO (1) WO2022049786A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7610943B2 (ja) * 2020-09-18 2025-01-09 ニデックインスツルメンツ株式会社 産業用ロボット

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011228625A (ja) * 2010-03-31 2011-11-10 Yaskawa Electric Corp 基板搬送用ハンドおよび基板搬送ロボット
CN102751228A (zh) * 2011-06-28 2012-10-24 清华大学 一种利用弹簧夹子的晶圆夹持装置

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JPH04113445U (ja) * 1991-03-20 1992-10-05 株式会社日立製作所 ウエハ移載装置のウエハ吸着板固定装置
JP3802119B2 (ja) * 1996-02-02 2006-07-26 株式会社安川電機 ウェハ搬送装置
KR100331157B1 (ko) * 1998-07-24 2002-04-03 다니구찌 이찌로오, 기타오카 다카시 웨이퍼 홀딩 핸드
JP2006150538A (ja) * 2004-11-30 2006-06-15 Rorze Corp 把持型搬送装置並びにこれを用いるロボット、円盤状物加工設備及び円盤状物搬送方法。
US7290813B2 (en) * 2004-12-16 2007-11-06 Asyst Technologies, Inc. Active edge grip rest pad
JP4607756B2 (ja) * 2005-12-22 2011-01-05 川崎重工業株式会社 ロボットハンドおよび基板搬送ロボット
KR101181560B1 (ko) * 2008-09-12 2012-09-10 다이닛뽕스크린 세이조오 가부시키가이샤 기판처리장치 및 그것에 사용되는 기판반송장치
TWI538789B (zh) * 2011-08-10 2016-06-21 川崎重工業股份有限公司 A end effector device, and a substrate transport robot including the end effector device
JP5553065B2 (ja) 2011-09-22 2014-07-16 株式会社安川電機 基板搬送用ハンドおよび基板搬送ロボット
JP5750472B2 (ja) * 2013-05-22 2015-07-22 株式会社安川電機 基板搬送ロボット、基板搬送システムおよび基板の配置状態の検出方法
JP2015079820A (ja) * 2013-10-16 2015-04-23 株式会社東京精密 基板搬送装置
JP6314157B2 (ja) * 2013-12-26 2018-04-18 川崎重工業株式会社 エンドエフェクタおよび基板搬送ロボット
US9929034B2 (en) * 2015-09-03 2018-03-27 Kawasaki Jukogyo Kabushiki Kaisha Substrate transfer device
JP2017175072A (ja) * 2016-03-25 2017-09-28 川崎重工業株式会社 基板搬送ハンド及びロボット
JP6276317B2 (ja) * 2016-03-31 2018-02-07 平田機工株式会社 ハンドユニットおよび移載方法
US10090188B2 (en) * 2016-05-05 2018-10-02 Applied Materials, Inc. Robot subassemblies, end effector assemblies, and methods with reduced cracking
JP2018041854A (ja) * 2016-09-08 2018-03-15 株式会社荏原製作所 基板把持検出装置、基板把持装置、基板把持検出装置の調整方法
JP6782180B2 (ja) * 2017-01-31 2020-11-11 川崎重工業株式会社 基板把持ハンド及び基板搬送装置
JP6889631B2 (ja) * 2017-08-04 2021-06-18 川崎重工業株式会社 状態監視システム及び状態監視方法
JP2020077699A (ja) * 2018-11-06 2020-05-21 川崎重工業株式会社 ロボットハンド及びそれを備えるロボット
US11964383B2 (en) * 2019-01-16 2024-04-23 Kawasaki Jukogyo Kabushiki Kaisha Robot hand and robot having the same

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011228625A (ja) * 2010-03-31 2011-11-10 Yaskawa Electric Corp 基板搬送用ハンドおよび基板搬送ロボット
CN102751228A (zh) * 2011-06-28 2012-10-24 清华大学 一种利用弹簧夹子的晶圆夹持装置

Also Published As

Publication number Publication date
TWI747588B (zh) 2021-11-21
WO2022049786A1 (ja) 2022-03-10
CN116114053B (zh) 2025-02-25
US20230311334A1 (en) 2023-10-05
CN116114053A (zh) 2023-05-12
JP7420954B2 (ja) 2024-01-23
JPWO2022049786A1 (https=) 2022-03-10
KR20230048405A (ko) 2023-04-11
TW202210254A (zh) 2022-03-16

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