CN115996999A - 粘接剂组合物 - Google Patents

粘接剂组合物 Download PDF

Info

Publication number
CN115996999A
CN115996999A CN202180045764.0A CN202180045764A CN115996999A CN 115996999 A CN115996999 A CN 115996999A CN 202180045764 A CN202180045764 A CN 202180045764A CN 115996999 A CN115996999 A CN 115996999A
Authority
CN
China
Prior art keywords
adhesive composition
epoxy
styrene
modified resin
formula
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202180045764.0A
Other languages
English (en)
Chinese (zh)
Inventor
片桐航
门间刊
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shin Etsu Polymer Co Ltd
Original Assignee
Shin Etsu Polymer Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shin Etsu Polymer Co Ltd filed Critical Shin Etsu Polymer Co Ltd
Publication of CN115996999A publication Critical patent/CN115996999A/zh
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/30—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J125/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an aromatic carbocyclic ring; Adhesives based on derivatives of such polymers
    • C09J125/02—Homopolymers or copolymers of hydrocarbons
    • C09J125/04—Homopolymers or copolymers of styrene
    • C09J125/08—Copolymers of styrene
    • C09J125/10—Copolymers of styrene with conjugated dienes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J153/00—Adhesives based on block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Adhesives based on derivatives of such polymers
    • C09J153/02—Vinyl aromatic monomers and conjugated dienes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C09J163/10—Epoxy resins modified by unsaturated compounds

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Laminated Bodies (AREA)
CN202180045764.0A 2020-07-01 2021-06-22 粘接剂组合物 Pending CN115996999A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020113800 2020-07-01
JP2020-113800 2020-07-01
PCT/JP2021/023522 WO2022004476A1 (ja) 2020-07-01 2021-06-22 接着剤組成物

Publications (1)

Publication Number Publication Date
CN115996999A true CN115996999A (zh) 2023-04-21

Family

ID=79316251

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202180045764.0A Pending CN115996999A (zh) 2020-07-01 2021-06-22 粘接剂组合物

Country Status (4)

Country Link
JP (1) JP7690474B2 (https=)
CN (1) CN115996999A (https=)
TW (1) TWI795825B (https=)
WO (1) WO2022004476A1 (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN116323845A (zh) * 2020-09-29 2023-06-23 日东电工株式会社 粘合剂组合物、粘合剂层及粘合片

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW202502994A (zh) * 2023-04-06 2025-01-16 日商Ｄｉｃ股份有限公司 熱硬化型黏著片及印刷配線板

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08319466A (ja) * 1995-03-20 1996-12-03 Fujitsu Ltd 接着剤、半導体装置及びその製造方法
US20050032447A1 (en) * 2003-08-08 2005-02-10 Katsuhiko Tachibana Adhesive sheet for steel plate
JP2008189823A (ja) * 2007-02-06 2008-08-21 Yokohama Rubber Co Ltd:The 熱硬化性接着剤組成物
JP2014024926A (ja) * 2012-07-25 2014-02-06 Hitachi Chemical Co Ltd 熱硬化性樹脂組成物、これを用いたプリプレグ、積層板及び多層プリント配線板
WO2014045625A1 (ja) * 2012-09-20 2014-03-27 積水化学工業株式会社 絶縁樹脂フィルム、予備硬化物、積層体及び多層基板
JP2015224304A (ja) * 2014-05-28 2015-12-14 日立化成株式会社 熱硬化性樹脂組成物、プリプレグ、樹脂付フィルム、積層板、多層プリント配線板及び半導体パッケージ
JP2018182004A (ja) * 2017-04-10 2018-11-15 日立化成株式会社 積層板の製造方法、プリント配線板の製造方法、及び半導体パッケージの製造方法
CN114867807A (zh) * 2019-12-23 2022-08-05 信越聚合物株式会社 粘接剂组合物

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7005394B1 (en) * 1998-07-10 2006-02-28 3M Innovative Properties Company Tackified thermoplastic-epoxy pressure sensitive adhesives
DE102004031189A1 (de) * 2004-06-28 2006-01-19 Tesa Ag Hitzeaktivierbares und vernetzbares Klebeband für die Verklebung von elektronischen Bauteilen und Leiterbahnen
JP2009132879A (ja) * 2007-11-02 2009-06-18 Toray Ind Inc 接着剤組成物およびそれを用いたカバーレイフィルム
WO2014147903A1 (ja) * 2013-03-22 2014-09-25 東亞合成株式会社 接着剤組成物並びにこれを用いたカバーレイフィルム及びフレキシブル銅張積層板
JP6332458B2 (ja) * 2014-07-31 2018-05-30 東亞合成株式会社 接着剤層付き積層体、並びに、これを用いたフレキシブル銅張積層板及びフレキシブルフラットケーブル
KR101797723B1 (ko) 2014-12-08 2017-11-14 셍기 테크놀로지 코. 엘티디. 접착용 수지 조성물, 접착용 필름 및 연성 금속 적층체

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08319466A (ja) * 1995-03-20 1996-12-03 Fujitsu Ltd 接着剤、半導体装置及びその製造方法
US20050032447A1 (en) * 2003-08-08 2005-02-10 Katsuhiko Tachibana Adhesive sheet for steel plate
JP2008189823A (ja) * 2007-02-06 2008-08-21 Yokohama Rubber Co Ltd:The 熱硬化性接着剤組成物
JP2014024926A (ja) * 2012-07-25 2014-02-06 Hitachi Chemical Co Ltd 熱硬化性樹脂組成物、これを用いたプリプレグ、積層板及び多層プリント配線板
WO2014045625A1 (ja) * 2012-09-20 2014-03-27 積水化学工業株式会社 絶縁樹脂フィルム、予備硬化物、積層体及び多層基板
JP2015224304A (ja) * 2014-05-28 2015-12-14 日立化成株式会社 熱硬化性樹脂組成物、プリプレグ、樹脂付フィルム、積層板、多層プリント配線板及び半導体パッケージ
JP2018182004A (ja) * 2017-04-10 2018-11-15 日立化成株式会社 積層板の製造方法、プリント配線板の製造方法、及び半導体パッケージの製造方法
CN114867807A (zh) * 2019-12-23 2022-08-05 信越聚合物株式会社 粘接剂组合物

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN116323845A (zh) * 2020-09-29 2023-06-23 日东电工株式会社 粘合剂组合物、粘合剂层及粘合片

Also Published As

Publication number Publication date
TWI795825B (zh) 2023-03-11
JP7690474B2 (ja) 2025-06-10
WO2022004476A1 (ja) 2022-01-06
JPWO2022004476A1 (https=) 2022-01-06
TW202208577A (zh) 2022-03-01

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