JP7690474B2 - 接着剤組成物 - Google Patents

接着剤組成物 Download PDF

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Publication number
JP7690474B2
JP7690474B2 JP2022533885A JP2022533885A JP7690474B2 JP 7690474 B2 JP7690474 B2 JP 7690474B2 JP 2022533885 A JP2022533885 A JP 2022533885A JP 2022533885 A JP2022533885 A JP 2022533885A JP 7690474 B2 JP7690474 B2 JP 7690474B2
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JP
Japan
Prior art keywords
epoxy
adhesive composition
modified resin
styrene
formula
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2022533885A
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English (en)
Japanese (ja)
Other versions
JPWO2022004476A1 (https=
Inventor
航 片桐
栞 門間
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shin Etsu Polymer Co Ltd
Original Assignee
Shin Etsu Polymer Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shin Etsu Polymer Co Ltd filed Critical Shin Etsu Polymer Co Ltd
Publication of JPWO2022004476A1 publication Critical patent/JPWO2022004476A1/ja
Application granted granted Critical
Publication of JP7690474B2 publication Critical patent/JP7690474B2/ja
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Anticipated expiration legal-status Critical

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/30—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J125/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an aromatic carbocyclic ring; Adhesives based on derivatives of such polymers
    • C09J125/02—Homopolymers or copolymers of hydrocarbons
    • C09J125/04—Homopolymers or copolymers of styrene
    • C09J125/08—Copolymers of styrene
    • C09J125/10—Copolymers of styrene with conjugated dienes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J153/00—Adhesives based on block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Adhesives based on derivatives of such polymers
    • C09J153/02—Vinyl aromatic monomers and conjugated dienes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C09J163/10—Epoxy resins modified by unsaturated compounds

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Laminated Bodies (AREA)
JP2022533885A 2020-07-01 2021-06-22 接着剤組成物 Active JP7690474B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020113800 2020-07-01
JP2020113800 2020-07-01
PCT/JP2021/023522 WO2022004476A1 (ja) 2020-07-01 2021-06-22 接着剤組成物

Publications (2)

Publication Number Publication Date
JPWO2022004476A1 JPWO2022004476A1 (https=) 2022-01-06
JP7690474B2 true JP7690474B2 (ja) 2025-06-10

Family

ID=79316251

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022533885A Active JP7690474B2 (ja) 2020-07-01 2021-06-22 接着剤組成物

Country Status (4)

Country Link
JP (1) JP7690474B2 (https=)
CN (1) CN115996999A (https=)
TW (1) TWI795825B (https=)
WO (1) WO2022004476A1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20230073322A (ko) * 2020-09-29 2023-05-25 닛토덴코 가부시키가이샤 점착제 조성물, 점착제층, 및 점착 시트
TW202502994A (zh) * 2023-04-06 2025-01-16 日商Ｄｉｃ股份有限公司 熱硬化型黏著片及印刷配線板

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005054000A (ja) 2003-08-08 2005-03-03 Nitto Denko Corp 鋼板用貼着シート
JP2017538800A (ja) 2014-12-08 2017-12-28 エルジー・ケム・リミテッド 接着用樹脂組成物、接着用フィルムおよびフレキシブル金属積層体

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08319466A (ja) * 1995-03-20 1996-12-03 Fujitsu Ltd 接着剤、半導体装置及びその製造方法
US7005394B1 (en) * 1998-07-10 2006-02-28 3M Innovative Properties Company Tackified thermoplastic-epoxy pressure sensitive adhesives
DE102004031189A1 (de) * 2004-06-28 2006-01-19 Tesa Ag Hitzeaktivierbares und vernetzbares Klebeband für die Verklebung von elektronischen Bauteilen und Leiterbahnen
JP2008189823A (ja) * 2007-02-06 2008-08-21 Yokohama Rubber Co Ltd:The 熱硬化性接着剤組成物
JP2009132879A (ja) * 2007-11-02 2009-06-18 Toray Ind Inc 接着剤組成物およびそれを用いたカバーレイフィルム
JP6019883B2 (ja) * 2012-07-25 2016-11-02 日立化成株式会社 熱硬化性樹脂組成物、これを用いたプリプレグ、積層板及び多層プリント配線板
WO2014045625A1 (ja) * 2012-09-20 2014-03-27 積水化学工業株式会社 絶縁樹脂フィルム、予備硬化物、積層体及び多層基板
WO2014147903A1 (ja) * 2013-03-22 2014-09-25 東亞合成株式会社 接着剤組成物並びにこれを用いたカバーレイフィルム及びフレキシブル銅張積層板
JP6379675B2 (ja) * 2014-05-28 2018-08-29 日立化成株式会社 熱硬化性樹脂組成物、プリプレグ、樹脂付フィルム、積層板、多層プリント配線板及び半導体パッケージ
JP6332458B2 (ja) * 2014-07-31 2018-05-30 東亞合成株式会社 接着剤層付き積層体、並びに、これを用いたフレキシブル銅張積層板及びフレキシブルフラットケーブル
JP7069561B2 (ja) * 2017-04-10 2022-05-18 昭和電工マテリアルズ株式会社 積層板の製造方法、プリント配線板の製造方法、及び半導体パッケージの製造方法
JP7736567B2 (ja) * 2019-12-23 2025-09-09 信越ポリマー株式会社 接着剤組成物

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005054000A (ja) 2003-08-08 2005-03-03 Nitto Denko Corp 鋼板用貼着シート
JP2017538800A (ja) 2014-12-08 2017-12-28 エルジー・ケム・リミテッド 接着用樹脂組成物、接着用フィルムおよびフレキシブル金属積層体

Also Published As

Publication number Publication date
TWI795825B (zh) 2023-03-11
WO2022004476A1 (ja) 2022-01-06
JPWO2022004476A1 (https=) 2022-01-06
TW202208577A (zh) 2022-03-01
CN115996999A (zh) 2023-04-21

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