TWI795825B - 黏接劑組成物 - Google Patents

黏接劑組成物 Download PDF

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Publication number
TWI795825B
TWI795825B TW110123664A TW110123664A TWI795825B TW I795825 B TWI795825 B TW I795825B TW 110123664 A TW110123664 A TW 110123664A TW 110123664 A TW110123664 A TW 110123664A TW I795825 B TWI795825 B TW I795825B
Authority
TW
Taiwan
Prior art keywords
epoxy
adhesive composition
formula
modified resin
styrene
Prior art date
Application number
TW110123664A
Other languages
English (en)
Chinese (zh)
Other versions
TW202208577A (zh
Inventor
片桐航
門間栞
Original Assignee
日商信越聚合物股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商信越聚合物股份有限公司 filed Critical 日商信越聚合物股份有限公司
Publication of TW202208577A publication Critical patent/TW202208577A/zh
Application granted granted Critical
Publication of TWI795825B publication Critical patent/TWI795825B/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/30—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J125/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an aromatic carbocyclic ring; Adhesives based on derivatives of such polymers
    • C09J125/02—Homopolymers or copolymers of hydrocarbons
    • C09J125/04—Homopolymers or copolymers of styrene
    • C09J125/08—Copolymers of styrene
    • C09J125/10—Copolymers of styrene with conjugated dienes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J153/00—Adhesives based on block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Adhesives based on derivatives of such polymers
    • C09J153/02—Vinyl aromatic monomers and conjugated dienes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C09J163/10—Epoxy resins modified by unsaturated compounds

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Laminated Bodies (AREA)
TW110123664A 2020-07-01 2021-06-29 黏接劑組成物 TWI795825B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2020113800 2020-07-01
JP2020-113800 2020-07-01

Publications (2)

Publication Number Publication Date
TW202208577A TW202208577A (zh) 2022-03-01
TWI795825B true TWI795825B (zh) 2023-03-11

Family

ID=79316251

Family Applications (1)

Application Number Title Priority Date Filing Date
TW110123664A TWI795825B (zh) 2020-07-01 2021-06-29 黏接劑組成物

Country Status (4)

Country Link
JP (1) JP7690474B2 (https=)
CN (1) CN115996999A (https=)
TW (1) TWI795825B (https=)
WO (1) WO2022004476A1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20230073322A (ko) * 2020-09-29 2023-05-25 닛토덴코 가부시키가이샤 점착제 조성물, 점착제층, 및 점착 시트
TW202502994A (zh) * 2023-04-06 2025-01-16 日商Ｄｉｃ股份有限公司 熱硬化型黏著片及印刷配線板

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08319466A (ja) * 1995-03-20 1996-12-03 Fujitsu Ltd 接着剤、半導体装置及びその製造方法
CN1715354A (zh) * 2004-06-28 2006-01-04 蒂萨股份公司 用于电子元件和导体轨迹的可热活化和可交联的胶粘带

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7005394B1 (en) * 1998-07-10 2006-02-28 3M Innovative Properties Company Tackified thermoplastic-epoxy pressure sensitive adhesives
JP3685791B2 (ja) * 2003-08-08 2005-08-24 日東電工株式会社 鋼板用貼着シート
JP2008189823A (ja) * 2007-02-06 2008-08-21 Yokohama Rubber Co Ltd:The 熱硬化性接着剤組成物
JP2009132879A (ja) * 2007-11-02 2009-06-18 Toray Ind Inc 接着剤組成物およびそれを用いたカバーレイフィルム
JP6019883B2 (ja) * 2012-07-25 2016-11-02 日立化成株式会社 熱硬化性樹脂組成物、これを用いたプリプレグ、積層板及び多層プリント配線板
WO2014045625A1 (ja) * 2012-09-20 2014-03-27 積水化学工業株式会社 絶縁樹脂フィルム、予備硬化物、積層体及び多層基板
WO2014147903A1 (ja) * 2013-03-22 2014-09-25 東亞合成株式会社 接着剤組成物並びにこれを用いたカバーレイフィルム及びフレキシブル銅張積層板
JP6379675B2 (ja) * 2014-05-28 2018-08-29 日立化成株式会社 熱硬化性樹脂組成物、プリプレグ、樹脂付フィルム、積層板、多層プリント配線板及び半導体パッケージ
JP6332458B2 (ja) * 2014-07-31 2018-05-30 東亞合成株式会社 接着剤層付き積層体、並びに、これを用いたフレキシブル銅張積層板及びフレキシブルフラットケーブル
KR101797723B1 (ko) 2014-12-08 2017-11-14 셍기 테크놀로지 코. 엘티디. 접착용 수지 조성물, 접착용 필름 및 연성 금속 적층체
JP7069561B2 (ja) * 2017-04-10 2022-05-18 昭和電工マテリアルズ株式会社 積層板の製造方法、プリント配線板の製造方法、及び半導体パッケージの製造方法
JP7736567B2 (ja) * 2019-12-23 2025-09-09 信越ポリマー株式会社 接着剤組成物

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08319466A (ja) * 1995-03-20 1996-12-03 Fujitsu Ltd 接着剤、半導体装置及びその製造方法
CN1715354A (zh) * 2004-06-28 2006-01-04 蒂萨股份公司 用于电子元件和导体轨迹的可热活化和可交联的胶粘带

Also Published As

Publication number Publication date
JP7690474B2 (ja) 2025-06-10
WO2022004476A1 (ja) 2022-01-06
JPWO2022004476A1 (https=) 2022-01-06
TW202208577A (zh) 2022-03-01
CN115996999A (zh) 2023-04-21

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