CN115815815A - 激光加工装置、激光剥离方法以及半导体装置的制造方法 - Google Patents

激光加工装置、激光剥离方法以及半导体装置的制造方法 Download PDF

Info

Publication number
CN115815815A
CN115815815A CN202111478813.8A CN202111478813A CN115815815A CN 115815815 A CN115815815 A CN 115815815A CN 202111478813 A CN202111478813 A CN 202111478813A CN 115815815 A CN115815815 A CN 115815815A
Authority
CN
China
Prior art keywords
laser
substrate
stage
irradiation device
processing apparatus
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202111478813.8A
Other languages
English (en)
Chinese (zh)
Inventor
大久保拓郎
林秀和
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kioxia Corp
Original Assignee
Kioxia Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kioxia Corp filed Critical Kioxia Corp
Publication of CN115815815A publication Critical patent/CN115815815A/zh
Pending legal-status Critical Current

Links

Images

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/0823—Devices involving rotation of the workpiece
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P34/00—Irradiation with electromagnetic or particle radiation of wafers, substrates or parts of devices
    • H10P34/40—Irradiation with electromagnetic or particle radiation of wafers, substrates or parts of devices with high-energy radiation
    • H10P34/42—Irradiation with electromagnetic or particle radiation of wafers, substrates or parts of devices with high-energy radiation with electromagnetic radiation, e.g. laser annealing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
    • B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/067—Dividing the beam into multiple beams, e.g. multi-focusing
    • B23K26/0676—Dividing the beam into multiple beams, e.g. multi-focusing into dependently operating sub-beams, e.g. an array of spots with fixed spatial relationship or for performing simultaneously identical operations
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/073—Shaping the laser spot
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/083—Devices involving movement of the workpiece in at least one axial direction
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/40—Semiconductor devices

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Electromagnetism (AREA)
  • Dicing (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
CN202111478813.8A 2021-09-17 2021-12-06 激光加工装置、激光剥离方法以及半导体装置的制造方法 Pending CN115815815A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2021152673A JP7814873B2 (ja) 2021-09-17 2021-09-17 レーザー加工装置、レーザー剥離方法および半導体装置の製造方法
JP2021-152673 2021-09-17

Publications (1)

Publication Number Publication Date
CN115815815A true CN115815815A (zh) 2023-03-21

Family

ID=85516112

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202111478813.8A Pending CN115815815A (zh) 2021-09-17 2021-12-06 激光加工装置、激光剥离方法以及半导体装置的制造方法

Country Status (4)

Country Link
US (1) US20230105004A1 (https=)
JP (1) JP7814873B2 (https=)
CN (1) CN115815815A (https=)
TW (1) TWI838661B (https=)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2026038301A1 (ja) * 2024-08-13 2026-02-19 東京エレクトロン株式会社 半導体装置の製造方法
WO2026038302A1 (ja) * 2024-08-13 2026-02-19 東京エレクトロン株式会社 半導体装置の製造方法
CN121890269A (zh) * 2024-08-13 2026-04-17 东京毅力科创株式会社 半导体装置的制造方法

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1020934A2 (en) * 1999-01-13 2000-07-19 Kaneka Corporation Laser processing of a thin film
CN102896417A (zh) * 2011-07-27 2013-01-30 东芝机械株式会社 激光切片方法
CN108701594A (zh) * 2016-03-09 2018-10-23 三菱电机株式会社 热处理装置、热处理方法、激光退火装置及激光退火方法
CN111247622A (zh) * 2018-06-18 2020-06-05 信越工程株式会社 工件分离装置及工件分离方法
CN111863594A (zh) * 2019-04-30 2020-10-30 细美事有限公司 膜去除方法、基板处理方法和基板处理装置
CN112139684A (zh) * 2019-06-28 2020-12-29 株式会社迪思科 激光加工装置

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE112009001200B4 (de) * 2008-06-04 2016-03-10 Mitsubishi Electric Corp. Laserbearbeitungsverfahren und Laserbearbeitungsvorrichtung hierfür
JP5310512B2 (ja) * 2009-12-02 2013-10-09 東京エレクトロン株式会社 基板処理装置
KR101117732B1 (ko) * 2010-01-19 2012-02-24 삼성모바일디스플레이주식회사 기판 밀봉에 사용되는 레이저 빔 조사 장치 및 이를 이용한 유기 발광 디스플레이 장치의 제조 방법
CN102859676A (zh) * 2010-02-03 2013-01-02 Limo专利管理有限及两合公司 用于对太阳能电池的片状基本材料进行热处理的方法和装置
JP5977532B2 (ja) * 2012-02-20 2016-08-24 東京応化工業株式会社 支持体分離方法及び支持体分離装置
JP2013239650A (ja) 2012-05-16 2013-11-28 Tokyo Ohka Kogyo Co Ltd 支持体分離方法および支持体分離装置
KR102161241B1 (ko) * 2013-03-15 2020-09-29 어플라이드 머티어리얼스, 인코포레이티드 펄스형 광-여기된 증착 및 에칭을 위한 장치 및 방법들
DE102014202801B4 (de) * 2014-02-17 2023-08-24 Robert Bosch Gmbh Verfahren zum Herstellen eines mikromechanischen Bauelements
JP6512063B2 (ja) * 2015-10-28 2019-05-15 東京エレクトロン株式会社 成膜装置
JP6809304B2 (ja) * 2017-03-10 2021-01-06 東京エレクトロン株式会社 成膜装置
TWI716864B (zh) 2017-12-01 2021-01-21 美商矽基因股份有限公司 三維積體電路之形成方法
TWI910678B (zh) 2018-10-30 2026-01-01 日商濱松赫德尼古斯股份有限公司 對象物的加工方法
DE102018133083A1 (de) 2018-12-20 2020-06-25 Carl Zeiss Jena Gmbh Vorrichtung und Verfahren zum geregelten Bearbeiten eines Werkstückes mit einer Bearbeitungsstrahlung
JP7721257B2 (ja) * 2020-06-08 2025-08-12 浜松ホトニクス株式会社 加工物の製造方法、加工物、及び、加工装置

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1020934A2 (en) * 1999-01-13 2000-07-19 Kaneka Corporation Laser processing of a thin film
CN102896417A (zh) * 2011-07-27 2013-01-30 东芝机械株式会社 激光切片方法
CN108701594A (zh) * 2016-03-09 2018-10-23 三菱电机株式会社 热处理装置、热处理方法、激光退火装置及激光退火方法
CN111247622A (zh) * 2018-06-18 2020-06-05 信越工程株式会社 工件分离装置及工件分离方法
CN111863594A (zh) * 2019-04-30 2020-10-30 细美事有限公司 膜去除方法、基板处理方法和基板处理装置
CN112139684A (zh) * 2019-06-28 2020-12-29 株式会社迪思科 激光加工装置

Also Published As

Publication number Publication date
TWI838661B (zh) 2024-04-11
TW202314831A (zh) 2023-04-01
JP2023044571A (ja) 2023-03-30
JP7814873B2 (ja) 2026-02-17
US20230105004A1 (en) 2023-04-06

Similar Documents

Publication Publication Date Title
CN115815815A (zh) 激光加工装置、激光剥离方法以及半导体装置的制造方法
CN101663125B (zh) 激光加工方法及切割方法以及具有多层基板的结构体的分割方法
JP4027930B2 (ja) ポリゴンミラーと利用したレーザー加工装置及び方法
KR20040103757A (ko) 레이저빔을 사용한 가공기
JP7560055B2 (ja) レーザ加工方法、半導体部材製造方法及びレーザ加工装置
US10840141B2 (en) Workpiece-separating device and workpiece-separating method
WO2021182515A1 (ja) 切断装置および切断方法
US20170326682A1 (en) Method of manufacturing display apparatus
JP2005277136A (ja) 基板製造方法および基板製造装置
WO2010095671A1 (ja) 太陽電池パネルのレーザ加工方法
KR20220035442A (ko) 처리 장치 및 처리 방법
JP2023044571A5 (https=)
CN116802770A (zh) 基板处理装置、基板处理方法以及基板制造方法
JP6967179B2 (ja) ワーク分離装置及びワーク分離方法
US20240096682A1 (en) Processing apparatus using laser, method of laser lift-off and method of manufacturing semiconductor device
US12506015B2 (en) Semiconductor wafer thinned by horizontal stealth lasing
KR102884576B1 (ko) 기판 처리 장치 및 기판 처리 방법
CN1939644B (zh) 激光加工方法以及激光加工装置
JP2022163321A (ja) ウエーハの加工方法及びウエーハの加工装置
KR20170062385A (ko) 웨이퍼의 가공 방법 및 가공 장치
JP2021027127A (ja) 発光素子の製造方法
JP4764989B2 (ja) レーザ加工方法
JP7690038B2 (ja) 基板処理方法及び基板処理装置
CN212770466U (zh) 防护基板的激光加工系统
US20230268523A1 (en) Method for joining at least two components of a fuel cell and device for carrying out the method

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination