TWI838661B - 雷射加工裝置、雷射剝離方法及半導體裝置的製造方法 - Google Patents

雷射加工裝置、雷射剝離方法及半導體裝置的製造方法 Download PDF

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Publication number
TWI838661B
TWI838661B TW110141846A TW110141846A TWI838661B TW I838661 B TWI838661 B TW I838661B TW 110141846 A TW110141846 A TW 110141846A TW 110141846 A TW110141846 A TW 110141846A TW I838661 B TWI838661 B TW I838661B
Authority
TW
Taiwan
Prior art keywords
laser
irradiation device
laser irradiation
substrate
aforementioned
Prior art date
Application number
TW110141846A
Other languages
English (en)
Chinese (zh)
Other versions
TW202314831A (zh
Inventor
大久保拓郎
林秀和
Original Assignee
日商鎧俠股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商鎧俠股份有限公司 filed Critical 日商鎧俠股份有限公司
Publication of TW202314831A publication Critical patent/TW202314831A/zh
Application granted granted Critical
Publication of TWI838661B publication Critical patent/TWI838661B/zh

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P34/00—Irradiation with electromagnetic or particle radiation of wafers, substrates or parts of devices
    • H10P34/40—Irradiation with electromagnetic or particle radiation of wafers, substrates or parts of devices with high-energy radiation
    • H10P34/42—Irradiation with electromagnetic or particle radiation of wafers, substrates or parts of devices with high-energy radiation with electromagnetic radiation, e.g. laser annealing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
    • B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/067—Dividing the beam into multiple beams, e.g. multi-focusing
    • B23K26/0676—Dividing the beam into multiple beams, e.g. multi-focusing into dependently operating sub-beams, e.g. an array of spots with fixed spatial relationship or for performing simultaneously identical operations
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/073—Shaping the laser spot
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/0823—Devices involving rotation of the workpiece
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/083—Devices involving movement of the workpiece in at least one axial direction
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/40—Semiconductor devices

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Electromagnetism (AREA)
  • Dicing (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
TW110141846A 2021-09-17 2021-11-10 雷射加工裝置、雷射剝離方法及半導體裝置的製造方法 TWI838661B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2021152673A JP7814873B2 (ja) 2021-09-17 2021-09-17 レーザー加工装置、レーザー剥離方法および半導体装置の製造方法
JP2021-152673 2021-09-17

Publications (2)

Publication Number Publication Date
TW202314831A TW202314831A (zh) 2023-04-01
TWI838661B true TWI838661B (zh) 2024-04-11

Family

ID=85516112

Family Applications (1)

Application Number Title Priority Date Filing Date
TW110141846A TWI838661B (zh) 2021-09-17 2021-11-10 雷射加工裝置、雷射剝離方法及半導體裝置的製造方法

Country Status (4)

Country Link
US (1) US20230105004A1 (https=)
JP (1) JP7814873B2 (https=)
CN (1) CN115815815A (https=)
TW (1) TWI838661B (https=)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2026038301A1 (ja) * 2024-08-13 2026-02-19 東京エレクトロン株式会社 半導体装置の製造方法
WO2026038302A1 (ja) * 2024-08-13 2026-02-19 東京エレクトロン株式会社 半導体装置の製造方法
CN121890269A (zh) * 2024-08-13 2026-04-17 东京毅力科创株式会社 半导体装置的制造方法

Citations (5)

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US20110126985A1 (en) * 2009-12-02 2011-06-02 Tokyo Electron Limited Substrate processing apparatus
US20110177746A1 (en) * 2010-01-19 2011-07-21 Samsung Mobile Display Co., Ltd. Laser beam irradiation apparatus for substrate sealing, and method of manufacturing organic light emitting display device by using the laser beam irradiation apparatus
US20150083343A1 (en) * 2012-02-20 2015-03-26 Tokyo Ohka Kogyo Co., Ltd. Supporting member separation method and supporting member separation apparatus
TW201726970A (zh) * 2015-10-28 2017-08-01 東京威力科創股份有限公司 成膜裝置
TW201901739A (zh) * 2017-03-10 2019-01-01 日商東京威力科創股份有限公司 成膜裝置

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US6324195B1 (en) * 1999-01-13 2001-11-27 Kaneka Corporation Laser processing of a thin film
DE112009001200B4 (de) * 2008-06-04 2016-03-10 Mitsubishi Electric Corp. Laserbearbeitungsverfahren und Laserbearbeitungsvorrichtung hierfür
CN102859676A (zh) * 2010-02-03 2013-01-02 Limo专利管理有限及两合公司 用于对太阳能电池的片状基本材料进行热处理的方法和装置
JP2013046924A (ja) * 2011-07-27 2013-03-07 Toshiba Mach Co Ltd レーザダイシング方法
JP2013239650A (ja) 2012-05-16 2013-11-28 Tokyo Ohka Kogyo Co Ltd 支持体分離方法および支持体分離装置
KR102161241B1 (ko) * 2013-03-15 2020-09-29 어플라이드 머티어리얼스, 인코포레이티드 펄스형 광-여기된 증착 및 에칭을 위한 장치 및 방법들
DE102014202801B4 (de) * 2014-02-17 2023-08-24 Robert Bosch Gmbh Verfahren zum Herstellen eines mikromechanischen Bauelements
WO2017154597A1 (ja) * 2016-03-09 2017-09-14 三菱電機株式会社 熱処理装置、熱処理方法、レーザアニール装置、および、レーザアニール方法
TWI716864B (zh) 2017-12-01 2021-01-21 美商矽基因股份有限公司 三維積體電路之形成方法
US10840141B2 (en) * 2018-06-18 2020-11-17 Shin-Etsu Engineering Co., Ltd. Workpiece-separating device and workpiece-separating method
TWI910678B (zh) 2018-10-30 2026-01-01 日商濱松赫德尼古斯股份有限公司 對象物的加工方法
DE102018133083A1 (de) 2018-12-20 2020-06-25 Carl Zeiss Jena Gmbh Vorrichtung und Verfahren zum geregelten Bearbeiten eines Werkstückes mit einer Bearbeitungsstrahlung
KR102270780B1 (ko) * 2019-04-30 2021-06-30 세메스 주식회사 막질 제거 방법, 기판 처리 방법 및 기판 처리 장치
JP7339031B2 (ja) * 2019-06-28 2023-09-05 株式会社ディスコ レーザー加工装置
JP7721257B2 (ja) * 2020-06-08 2025-08-12 浜松ホトニクス株式会社 加工物の製造方法、加工物、及び、加工装置

Patent Citations (5)

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Publication number Priority date Publication date Assignee Title
US20110126985A1 (en) * 2009-12-02 2011-06-02 Tokyo Electron Limited Substrate processing apparatus
US20110177746A1 (en) * 2010-01-19 2011-07-21 Samsung Mobile Display Co., Ltd. Laser beam irradiation apparatus for substrate sealing, and method of manufacturing organic light emitting display device by using the laser beam irradiation apparatus
US20150083343A1 (en) * 2012-02-20 2015-03-26 Tokyo Ohka Kogyo Co., Ltd. Supporting member separation method and supporting member separation apparatus
TW201726970A (zh) * 2015-10-28 2017-08-01 東京威力科創股份有限公司 成膜裝置
TW201901739A (zh) * 2017-03-10 2019-01-01 日商東京威力科創股份有限公司 成膜裝置

Also Published As

Publication number Publication date
CN115815815A (zh) 2023-03-21
TW202314831A (zh) 2023-04-01
JP2023044571A (ja) 2023-03-30
JP7814873B2 (ja) 2026-02-17
US20230105004A1 (en) 2023-04-06

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