TWI838661B - 雷射加工裝置、雷射剝離方法及半導體裝置的製造方法 - Google Patents

雷射加工裝置、雷射剝離方法及半導體裝置的製造方法 Download PDF

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Publication number
TWI838661B
TWI838661B TW110141846A TW110141846A TWI838661B TW I838661 B TWI838661 B TW I838661B TW 110141846 A TW110141846 A TW 110141846A TW 110141846 A TW110141846 A TW 110141846A TW I838661 B TWI838661 B TW I838661B
Authority
TW
Taiwan
Prior art keywords
laser
irradiation device
laser irradiation
substrate
aforementioned
Prior art date
Application number
TW110141846A
Other languages
English (en)
Chinese (zh)
Other versions
TW202314831A (zh
Inventor
大久保拓郎
林秀和
Original Assignee
日商鎧俠股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商鎧俠股份有限公司 filed Critical 日商鎧俠股份有限公司
Publication of TW202314831A publication Critical patent/TW202314831A/zh
Application granted granted Critical
Publication of TWI838661B publication Critical patent/TWI838661B/zh

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P34/00—Irradiation with electromagnetic or particle radiation of wafers, substrates or parts of devices
    • H10P34/40—Irradiation with electromagnetic or particle radiation of wafers, substrates or parts of devices with high-energy radiation
    • H10P34/42—Irradiation with electromagnetic or particle radiation of wafers, substrates or parts of devices with high-energy radiation with electromagnetic radiation, e.g. laser annealing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
    • B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/067—Dividing the beam into multiple beams, e.g. multi-focusing
    • B23K26/0676—Dividing the beam into multiple beams, e.g. multi-focusing into dependently operating sub-beams, e.g. an array of spots with fixed spatial relationship or for performing simultaneously identical operations
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/073—Shaping the laser spot
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/0823—Devices involving rotation of the workpiece
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/083—Devices involving movement of the workpiece in at least one axial direction
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/40—Semiconductor devices

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Electromagnetism (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Dicing (AREA)
TW110141846A 2021-09-17 2021-11-10 雷射加工裝置、雷射剝離方法及半導體裝置的製造方法 TWI838661B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2021152673A JP7814873B2 (ja) 2021-09-17 2021-09-17 レーザー加工装置、レーザー剥離方法および半導体装置の製造方法
JP2021-152673 2021-09-17

Publications (2)

Publication Number Publication Date
TW202314831A TW202314831A (zh) 2023-04-01
TWI838661B true TWI838661B (zh) 2024-04-11

Family

ID=85516112

Family Applications (1)

Application Number Title Priority Date Filing Date
TW110141846A TWI838661B (zh) 2021-09-17 2021-11-10 雷射加工裝置、雷射剝離方法及半導體裝置的製造方法

Country Status (4)

Country Link
US (1) US20230105004A1 (https=)
JP (1) JP7814873B2 (https=)
CN (1) CN115815815A (https=)
TW (1) TWI838661B (https=)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN121890269A (zh) * 2024-08-13 2026-04-17 东京毅力科创株式会社 半导体装置的制造方法
WO2026038301A1 (ja) * 2024-08-13 2026-02-19 東京エレクトロン株式会社 半導体装置の製造方法
WO2026038302A1 (ja) * 2024-08-13 2026-02-19 東京エレクトロン株式会社 半導体装置の製造方法

Citations (5)

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US20110126985A1 (en) * 2009-12-02 2011-06-02 Tokyo Electron Limited Substrate processing apparatus
US20110177746A1 (en) * 2010-01-19 2011-07-21 Samsung Mobile Display Co., Ltd. Laser beam irradiation apparatus for substrate sealing, and method of manufacturing organic light emitting display device by using the laser beam irradiation apparatus
US20150083343A1 (en) * 2012-02-20 2015-03-26 Tokyo Ohka Kogyo Co., Ltd. Supporting member separation method and supporting member separation apparatus
TW201726970A (zh) * 2015-10-28 2017-08-01 東京威力科創股份有限公司 成膜裝置
TW201901739A (zh) * 2017-03-10 2019-01-01 日商東京威力科創股份有限公司 成膜裝置

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US6324195B1 (en) * 1999-01-13 2001-11-27 Kaneka Corporation Laser processing of a thin film
WO2009148022A1 (ja) * 2008-06-04 2009-12-10 三菱電機株式会社 レーザ加工装置およびレーザ加工方法
KR20120120283A (ko) * 2010-02-03 2012-11-01 리모 파텐트페어발퉁 게엠베하 운트 코. 카게 태양 전지의 웨이퍼형 기본 재료의 열처리 방법 및 장치
JP2013046924A (ja) * 2011-07-27 2013-03-07 Toshiba Mach Co Ltd レーザダイシング方法
JP2013239650A (ja) 2012-05-16 2013-11-28 Tokyo Ohka Kogyo Co Ltd 支持体分離方法および支持体分離装置
CN105103271B (zh) * 2013-03-15 2018-05-22 应用材料公司 用于脉冲式光激发沉积与蚀刻的装置与方法
DE102014202801B4 (de) * 2014-02-17 2023-08-24 Robert Bosch Gmbh Verfahren zum Herstellen eines mikromechanischen Bauelements
KR20180110018A (ko) * 2016-03-09 2018-10-08 미쓰비시덴키 가부시키가이샤 열처리 장치, 열처리 방법, 레이저 어닐 장치, 및, 레이저 어닐 방법
EP3718134A4 (en) 2017-12-01 2021-09-01 Silicon Genesis Corporation THREE-DIMENSIONAL INTEGRATED CIRCUIT
KR102240325B1 (ko) * 2018-06-18 2021-04-13 신에츠 엔지니어링 가부시키가이샤 워크 분리 장치 및 워크 분리 방법
DE112019005453T5 (de) 2018-10-30 2021-08-12 Hamamatsu Photonics K.K. Laserbearbeitungsvorrichtung
DE102018133083A1 (de) 2018-12-20 2020-06-25 Carl Zeiss Jena Gmbh Vorrichtung und Verfahren zum geregelten Bearbeiten eines Werkstückes mit einer Bearbeitungsstrahlung
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Publication number Priority date Publication date Assignee Title
US20110126985A1 (en) * 2009-12-02 2011-06-02 Tokyo Electron Limited Substrate processing apparatus
US20110177746A1 (en) * 2010-01-19 2011-07-21 Samsung Mobile Display Co., Ltd. Laser beam irradiation apparatus for substrate sealing, and method of manufacturing organic light emitting display device by using the laser beam irradiation apparatus
US20150083343A1 (en) * 2012-02-20 2015-03-26 Tokyo Ohka Kogyo Co., Ltd. Supporting member separation method and supporting member separation apparatus
TW201726970A (zh) * 2015-10-28 2017-08-01 東京威力科創股份有限公司 成膜裝置
TW201901739A (zh) * 2017-03-10 2019-01-01 日商東京威力科創股份有限公司 成膜裝置

Also Published As

Publication number Publication date
JP7814873B2 (ja) 2026-02-17
JP2023044571A (ja) 2023-03-30
CN115815815A (zh) 2023-03-21
US20230105004A1 (en) 2023-04-06
TW202314831A (zh) 2023-04-01

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