CN115627131A - 一种热压导电膜及其制备方法 - Google Patents
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Abstract
本发明涉及高分子材料技术领域,尤其涉及一种热压导电膜及其制备方法,包括载体膜层、接着层和导电胶膜层,所述接着层位于载体膜层和导电胶层之间;所述导电胶层,按照重量份计,包括以下组分:丁腈橡胶20~80份,胺类固化剂2~40份,促进剂2~10份,环氧树脂20~110份,改性剂0.1~0.5份,金属磁性导电粒子100~400份。本发明通过合理的组分和制备方法获得导电膜的导电性稳定,耐高温高湿性能好,粘性性能好,剥离强度高,环保、使用方便,经热压使用在导电接地连接的需求场景,特别是Z向低电阻要求场景,具有重要的应用前景和商用价值。
Description
技术领域
本发明涉及高分子材料技术领域,尤其涉及一种热压导电膜及其制备方法。
背景技术
电子行业的迅猛发展,智能手机、通讯、显示等产品大幅增长,已经成为社会发展的主要消耗品。对相关器件如信号线路制作、装配的要求越来越精细化、集成化,如何确保线路、IC、等器件良好导通接地、避免静电堆积,使的终端使用功能得以顺畅发挥,导电胶膜以成为关键元器件。
电子信息产业链手机、显示器,汽车电子等,几乎所有具有显示、电路(特别是柔性电路FPC)、摄像、按键等电子产品关键部件皆需要使用导电胶产品来实现接地连接等。由于大部分线路需要绑定IC,如果产生静电而产生电荷堆积,将造成IC工作稳定性差甚至损坏,具体表现为闪屏、花屏、黑屏等,因此电子产品都需要将静电因素考虑进去,尽量避免静电产生,如显示模组用FPC排线必须预留地线PAD点,通过导电胶与钢片相接接地,目前电子产品设计基本是这样处理的,对导电胶的稳定性可靠性有极高的要求,2000年前使用银浆涂印连接,所制成的产品,电阻稳定性差,污染大、不能自动化生产。不适用于低电阻需求导电连接,特别是Z向低电阻要求小于1欧姆场景,如IC接地、敏感线路接地连接等,且污染大、不易自动化生产等诸多缺点。
发明内容
本发明提供目的在于克服现有技术中,导电膜Z向电阻高,电阻稳定性差,污染大、不能自动化生产等问题,提供一种热压导电膜及其制备方法。
本发明目的通过以下技术方案予以实现:
一种热压导电膜,包括载体膜层、接着层和导电胶膜层,所述接着层位于载体膜层和导电胶层之间;所述导电胶层,按照重量份计,包括以下组分:丁腈橡胶20~80份,胺类固化剂2~40份,促进剂2~10份,环氧树脂20~110份,改性剂0.1~0.5份,金属磁性导电粒子100~400份。
优选地,所述载体膜层为PET、PEN或PI薄膜,所述载体膜的厚度为25~100μm,更优选地载体膜为PET膜。
优选地,所述接着层为离型剂层,厚度为0.2~6μm。接着层包括有机硅离型剂、非硅离型剂以及适合热转印功能的树脂涂料经涂布加工制成。
优选地,所述导电胶膜层的厚度为2~100μm。
优选地,所述胺类固化剂包括脂肪胺、脂环胺、芳香胺和聚酰胺四种中的一种或多种。更优选地,固化剂为二胺基二苯砜(DDS)、双氰胺(DICY)。
优选地,所述改性剂为有机秘、二月硅酸二丁基锡、三苯基磷中的一种或几种。
优选地,所述促进剂包括咪唑、硫脲或双氰胺。
优选地,所述环氧类树脂包括双酚A型环氧树脂、缩水甘油酯类环氧树脂、联苯型环氧树脂、多官能团环氧树脂中的一种或多种。
所述热压导电膜的制备方法,包括以下步骤:
S1.将丁腈橡胶用丁酮类稀释剂混合,恒温匀速搅拌10~14h,静置得到橡胶溶液;
S2.在步骤S1得到的橡胶溶液中加入环氧树脂、丁酮,恒温匀速搅拌4~8h;
S3.在步骤S2混合液中加入改性剂,升温至80~120℃,以100~300r/min的转速搅拌2.5~4h,然后冷却至室温;
S4.将金属磁性导电粒子加入到步骤S3搅拌之后的混合液中,搅拌1.5~3h;
S5.在步骤S4得到的混合液中加入固化剂、促进剂分散搅拌0.5~1h得到导电胶溶液;
S6.将步骤S5制备的导电胶涂布于接着层,涂覆时用0.6~3T的磁场引导涂布;涂布厚度为2~100μm,待溶剂挥发后,收卷即得。
与现有技术相比,本发明具有以下技术效果:
本发明公开的一种热压导电膜及其制备方法,通过合理的组分和制备方法获得导电膜的导电性稳定,耐高温高湿性能好,粘性性能好,剥离强度高,环保、使用方便,经热压使用在导电接地连接的需求场景,特别是Z向低电阻要求场景,具有重要的应用前景和商用价值。良导体金属微粒填料磁性化处理或磁性导电粒子,使的具有磁性引导性能,同时具有抗氧化作用;使用磁性引导加工工艺,使导电填料(金属粒子)定向排列,导电性能优异;使用改性环氧树脂作为基体树脂,配方设计,确保成膜性能、粘结性能,耐化性、环测性能优异;适用于热固化导电连接,特别是IC接地、电路板导电连接、钢片接地、消除静电等场景、导电性稳定,综合性能优于日本同类产品:利于使用加工、性能稳定、成本低。
具体实施方式
本发明实施例中的技术方案进行清楚、完整地描述,显然,所描述的实施例仅仅是本发明一部分实施例,而不是全部的实施例;基于本发明中的实施例,本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例,都属于本发明保护的范围。
实施例1
一种热压导电膜,包括载体膜层、接着层和导电胶膜层,所述接着层位于载体膜层和导电胶层之间;所述导电胶层,按照重量份计,包括以下组分:
上述热压导电膜的制备方法,包括以下步骤:
步骤一,橡胶溶液制备:将丁腈橡胶单体分切成1厘米大小的方块,用丁酮充分混合放入反应斧中持续搅拌12小时,并恒温匀速搅拌,搅拌转速控制在800-1200转,待完全溶解后,静止得到橡胶溶液;
步骤二,在橡胶溶液中依次加入E51、E20环氧树酯、丁酮持续搅拌6小时,并恒温匀速搅拌,得到橡胶树脂混合液。
步骤三,将步骤二混合液,加入有机秘,升温至80-120℃开始计时。反应釜搅拌棒转速控制在100-300转/分钟。计时3小时后冷却到到常温待用,得到预聚溶液;
步骤四,选择铜粒子,粒径D50为15微米,表面电沉积镍,均匀包覆铜粒子表面,得到镍包铜导电粉体,使其具有磁性、并具抗氧化作用,将具有磁性的镍包铜导电粉体,加入预聚溶液中,再加入适当稀释剂充分混合,持续搅拌2小时,待2小时分散完全后,静止得到磁性导电粉体橡胶树脂混合溶液;
步骤五,在步骤四制备的磁性导电粉体橡胶树脂混合溶液中,缓慢依次加入固化剂、潜伏型促进剂分散搅拌1小时后,即得到导电胶溶液。
步骤六,以步骤五制得的导电胶溶液,涂布于接着层,胶层厚度55-70μm,通过烘道,涂布过程采用0.6~3T的磁场引导涂布,待溶剂充分挥发后,收卷后得到热压导电胶膜膜。
实施例2
一种热压导电膜,包括载体膜层、接着层和导电胶膜层,所述接着层位于载体膜层和导电胶层之间;所述导电胶层,按照重量份计,包括以下组分:
制备方法同实施例1。
实施例3
一种热压导电膜,包括载体膜层、接着层和导电胶膜层,所述接着层位于载体膜层和导电胶层之间;所述导电胶层,按照重量份计,包括以下组分:
制备方法同实施例1。
对比例1
一种热压导电膜,包括载体膜层、接着层和导电胶膜层,所述接着层位于载体膜层和导电胶层之间;所述导电胶层,按照重量份计,包括以下组分:
制备方法同实施例1。
对比例2
一种热压导电膜,包括载体膜层、接着层和导电胶膜层,所述接着层位于载体膜层和导电胶层之间;所述导电胶层,按照重量份计,包括以下组分:
制备方法同实施例1。
实验例
对各实施例获得的导电膜进行性能测试,测试结果如下表所示。
测试条件:①FPC电阻测试板、贴合钢片方法:过塑或自动贴合机滚压(压力20KG),100-120℃.②贴合电阻测试板方法:手工60℃固定,预压10秒,快压机180秒,压力120KG,温度150-185℃,后固化:120-150℃,1-2小时。
尽管已经示出和描述了本发明的实施例,对于本领域的普通技术人员而言,可以理解在不脱离本发明的原理和精神的情况下可以对这些实施例进行多种变化、修改、替换和变型,本发明的范围由所附权利要求及其等同物限定。
Claims (10)
1.一种热压导电膜,其特征在于,包括载体膜层、接着层和导电胶膜层,所述接着层位于载体膜层和导电胶层之间;所述导电胶层,按照重量份计,包括以下组分:丁腈橡胶20~80份,胺类固化剂2~40份,促进剂2~10份,环氧树脂20~110份,改性剂0.1~0.5份,金属磁性导电粒子100~400份。
2.根据权利要求1所述热压导电膜,其特征在于,所述载体膜层为PET、PEN或PI薄膜,所述载体膜的厚度为25~100μm。
3.根据权利要求1所述热压导电膜,其特征在于,所述接着层为离型剂层,厚度为0.2~6μm。
4.根据权利要求1所述热压导电膜,其特征在于,所述导电胶膜层的厚度为2~100μm。
5.根据权利要求1所述热压导电膜,其特征在于,所述固化剂包括脂肪胺、脂环胺、芳香胺和聚酰胺四种中的一种或多种。
6.根据权利要求1所述热压导电膜,其特征在于,所述改性剂为有机秘、二月硅酸二丁基锡、三苯基磷中的一种或几种。
7.根据权利要求1所述热压导电膜,其特征在于,所述促进剂包括咪唑、硫脲或双氰胺。
8.根据权利要求1所述热压导电膜,其特征在于,所述环氧树脂包括所述环氧类树脂包括双酚A型环氧树脂、缩水甘油酯类环氧树脂、联苯型环氧树脂、多官能团环氧树脂中的一种或多种。
9.根据权利要求8所述热压导电膜,其特征在于,所述环氧树脂包括:E51、E20或苯并噁臻树脂。
10.权利要求1至9任一项所述热压导电膜的制备方法,其特征在于,包括以下步骤:
S1.将丁腈橡胶用丁酮类等稀释剂混合溶解,恒温匀速搅拌10~14h,静置得到橡胶溶液;
S2.在步骤S1得到的橡胶溶液中加入环氧树脂、丁酮,恒温匀速搅拌4~8h;
S3.在步骤S2混合液中加入改性剂,升温至80~120℃,以100~300r/min的转速搅拌2.5~4h,然后冷却至室温;
S4.将金属磁性导电粒子加入到步骤S3搅拌之后的混合液中,搅拌1.5~3h;
S5.在步骤S4得到的混合液中加入固化剂、促进剂分散搅拌0.5~1h得到导电胶溶液;
S6.将步骤S5制备的导电胶涂布于接着层,涂覆时用0.6~3T的磁场引导涂布;涂布厚度为2~100μm,待溶剂挥发后,收卷即得。
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