CN115612439B - 一种oled保护膜用胶黏剂、制备方法及保护膜 - Google Patents

一种oled保护膜用胶黏剂、制备方法及保护膜 Download PDF

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CN115612439B
CN115612439B CN202211321309.1A CN202211321309A CN115612439B CN 115612439 B CN115612439 B CN 115612439B CN 202211321309 A CN202211321309 A CN 202211321309A CN 115612439 B CN115612439 B CN 115612439B
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adhesive
protective film
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oled
diisocyanate
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周守发
刘长丰
安佳丽
牛正富
黄永华
刘玉磊
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Hefei Lucky Science and Technology Industry Co Ltd
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Abstract

本发明属于光学保护膜领域,涉及一种OLED保护膜用胶黏剂、制备方法及保护膜,所述胶黏剂包括如下重量份的各物质:聚酯多元醇10‑20份、二异氰酸酯8‑12份、扩链剂1‑3份、耐热单体2‑4份、复合抗静电剂2‑4份、溶剂20‑40份、催化剂0.3‑0.6份、封闭型异氰酸酯5‑10份;所述胶黏剂的分子量为10万‑20万的聚合物。本申请的胶黏剂使得OLED保护膜用胶黏剂具备抗静电性能及耐热性能。

Description

一种OLED保护膜用胶黏剂、制备方法及保护膜
技术领域
本发明属于光学保护膜领域,涉及一种OLED保护膜用胶黏剂、制备方法及保护膜。
背景技术
OLED是一种利用多层有机薄膜结构产生电致发光的器件,由于OLED屏幕可弯曲、轻薄等特性,被广泛应用于可折叠手机中。在OLED的制程中,通常需要保护膜对表面进行保护。
聚氨酯保护膜由于自身排气性好、环保等优点被广泛应用于智能手机、平板电脑、车载系统等电子产品领域,触摸屏的制程及出货保护均用到聚氨酯保护膜。保护膜贴附于OLED屏幕表面后,将保护膜从屏幕表面剥离撕去,撕去保护膜的过程中,保护膜的胶黏层电阻值高,会产生剥离电压,容易破坏触摸屏的背光模组。为了防止撕除保护膜时产生的缺陷,常用的解决方法是在胶黏剂配方中加入抗静电剂组分,使胶黏层具有优异的抗静电功能,避免撕除保护膜时导致的电荷击穿造成损失,要求剥离时具有超低的撕膜电压。OLED在制程过程中需要进行高温处理,要求保护膜具有优异的耐热性能。OLED保护膜用胶黏剂属于过程保护,要求保护膜易于剥离,不损坏屏幕。因此,要求保护膜的胶黏层与屏幕贴合紧密,无气泡鼓起,要求保护膜剥离力0gf/25mm~1gf/25mm,撕膜电压低于100V,撕除保护膜不污染屏幕。
中国专利CN201910873683.4公开了一种折叠屏保护膜及其折叠组件,该保护膜包括折叠的第一保护膜和第二保护膜,采用双层膜的设计有效的保护折叠屏幕,防止对折叠屏幕的划伤及磕碰,但是该聚氨酯保护膜不具备抗静电性能及耐热性能。中国专利CN201811611200.5公开了一种手机用聚氨酯保护膜及其制备方法,该保护膜由聚醚多元醇A、聚醚多元醇B、HMDI、固化剂制备而成,制备的聚氨酯保护膜具有良好的防摔、耐磨、防尘、防水、高透光率、高韧性的性能,制备方法简单易操作、无污染,但是该聚氨酯保护膜不具备抗静电性能。
发明内容
本发明目的在于提供一种OLED保护膜用胶黏剂、制备方法及保护膜,使得OLED保护膜用胶黏剂具备抗静电性能及耐热性能。
为实现上述技术目的,本申请的技术方案为:一种OLED保护膜用胶黏剂,所述胶黏剂包括如下重量份的各物质:
聚酯多元醇10-20份
二异氰酸酯8-12份
扩链剂1-3份
耐热单体2-4份
复合抗静电剂2-4份
溶剂20-40份
催化剂0.3-0.6份
封闭型异氰酸酯5-10份;
所述胶黏剂的分子量为10万-20万的聚合物。
作为本申请改进的技术方案,所述耐热单体为含有苯环的单体。
作为本申请改进的技术方案,所述含有苯环的单体为4-溴-2-羟基苯羧酸甲酯、2-乙酰氨基-5-氯-2-羟基苯羧酸乙酯的一种或任意重量比的两种。
作为本申请改进的技术方案,所述复合抗静电剂为吡咯烷酮羧酸钠与纳米石墨烯中的一种或两种组合;当为两种组合时,所述吡咯烷酮羧酸钠与纳米石墨烯的重量比例为1:2-2:1。
作为本申请改进的技术方案,所述聚酯多元醇为苯酐聚酯多元醇、聚碳酸酯多元醇中一种或任意重量比的两种。
作为本申请改进的技术方案,所述二异氰酸酯为对苯二异氰酸酯、甲苯二异氰酸酯中的一种或任意重量比的两种。
作为本申请改进的技术方案,所述扩链剂为二羟甲基丁酸、1,4丁二醇中的一种或任意重量比的两种。
作为本申请改进的技术方案,所述溶剂为乙酸乙酯、乙酸丁酯中的一种或任意重量比的两种.
作为本申请改进的技术方案,所述催化剂为二月桂酸二丁基锡、辛酸亚锡中的一种或任意重量比的两种。
本申请的另一目的是提供一种OLED保护膜用胶黏剂制备方法,所述胶黏剂采用如下步骤制备而成:
在反应器中加入配比量的聚酯多元醇、二异氰酸酯、扩链剂、耐热单体与溶剂,在40℃-50℃反应20min-40min;
加入配比量的催化剂,再升温至70℃-90℃反应1h-3h;
加入配比量的复合抗静电剂,70℃-90℃保温反应1h-2h后,降温至40℃-50℃加入配比量的封闭型异氰酸酯,得OLED保护膜用胶黏剂。
本申请的另一目的是提供一种OLED保护膜,所述OLED保护膜的两面涂布有所述的OLED保护膜用胶黏剂,并在胶黏层上再贴合一层离型膜。
由以上技术方案可知:
1.本发明制备的聚氨酯胶保护膜用胶黏剂中引入耐热单体制备的胶黏剂高分子链中引入含有苯环的单体,提高了胶黏剂的耐热性能,制备的保护膜耐热性能优异。
2.本发明制备的聚氨酯胶保护膜用胶黏剂高分子链中引入羧酸钠单体,使得制备的胶黏剂本身具备抗静电性能,采用纳米石墨烯与羧酸钠作为复合抗静电剂,大大降低了胶黏剂的电阻,制备的保护膜具有优异的抗静电性能。
3.本发明制备的聚氨酯胶保护膜用胶黏剂,使用纳米级石墨烯作为抗静电剂,不影响保护膜的光学性能,制备的保护膜表观优异。
4.本发明采用的技术方案,制备的保护膜剥离力0gf/25mm~1gf/25mm,剥离力极低,易于剥离,从OLED表面剥离后不会损坏OLED表面。
5.本发明制备的保护膜胶层电阻在1*108Ω以下,撕膜电压在100V以下,保护膜的胶黏层贴合在玻璃表面时,经高温试验120h后,保护膜与玻璃表面贴合紧密,无气泡鼓起,撕除保护膜后无残胶、暗影等弊病。
应当理解,前述构思以及在下面更加详细地描述的额外构思的所有组合只要在这样的构思不相互矛盾的情况下都可以被视为本公开的发明主题的一部分。
具体实施方式
为使本发明实施例的目的、技术方案和优点更加清楚,下面将结合本发明实施例,对本发明实施例的技术方案进行清楚、完整地描述。显然,所描述的实施例是本发明的一部分实施例,而不是全部的实施例。基于所描述的本发明的实施例,本领域普通技术人员在无需创造性劳动的前提下所获得的所有其他实施例,都属于本发明保护的范围。除非另作定义,此处使用的技术术语或者科学术语应当为本发明所属领域内具有一般技能的人士所理解的通常意义。
本申请提供一种OLED保护膜用胶黏剂、制备方法及OLED保护膜。其中,所述胶黏剂是聚酯多元醇、二异氰酸酯、扩链剂、耐热单体、复合抗静电剂以及封闭型异氰酸酯,在溶剂与催化剂环境下得到分子量为10万-20万的聚合物。
为了很好的得到目的性能的胶黏剂,本申请进一步约束胶黏剂的组分,详细地为:所述胶黏剂包括如下重量份的各物质:聚酯多元醇10-20份,二异氰酸酯8-12份,耐热单体2-4份,复合抗静电剂2-4份,溶剂20-40份,催化剂0.3-0.6份,封闭型异氰酸酯5-10份。
为了提高耐高温稳定性能,所述聚酯多元醇为苯酐聚酯多元醇、聚碳酸酯多元醇中一种或任意重量比的两种。目的是与二异氰酸酯反应,有助于控制胶黏剂的剥离力和分子量。
所述二异氰酸酯为对苯二异氰酸酯、甲苯二异氰酸酯中的一种或任意重量比的两种。目的是与聚酯多元醇反应,有助于控制胶黏剂的剥离力和分子量。
为了提高剥离力稳定性,所述扩链剂为二羟甲基丁酸、1,4丁二醇中的一种或任意重量比的两种。目的是与二异氰酸酯反应,有助于控制胶黏剂的分子量。
为了提高耐热性能,所述耐热单体为含有苯环的单体,所述含有苯环的单体为4-溴-2-羟基苯羧酸甲酯、2-乙酰氨基-5-氯-2-羟基苯羧酸乙酯的一种或任意重量比的两种。所述胶黏剂高分子链段中引入含有苯环的耐热单体,提高了胶黏剂的耐热性能,制备的保护膜具有优异的耐热性能。为了提高耐高温稳定性能,所述对苯二异氰酸酯、甲苯二异氰酸酯中的一种或任意重量比的两种。
为了提高抗静电性能,所述复合抗静电剂为吡咯烷酮羧酸钠与纳米石墨烯的一种或两种组合,所述吡咯烷酮羧酸钠与纳米石墨烯的重量比例为1:2-2:1。所述胶黏剂高分子链段中引入羧酸钠单体,使得制备的胶黏剂本身具备抗静电性能,采用纳米石墨烯与羧酸钠作为复合抗静电剂,大大降低了胶黏剂的电阻,制备的保护膜具有优异的抗静电性能。
进一步地,为了提高涂布表观,所述溶剂为乙酸乙酯、乙酸丁酯中的一种或任意重量比的两种。起到分散作用,防止反应过程中出现凝胶现象。
进一步地,为了提高剥离力稳定性,所述催化剂为二月桂酸二丁基锡、辛酸亚锡中的一种或任意重量比的两种。目的是控制反应的速度。
本发明封闭型异氰酸酯选用选自下述市售物质但并不限于此:可以选用BI7674(德国朗盛)、BI7960(德国朗盛)、BL3370(科思创)、BL3379(德国拜耳)、HI100(德国巴斯夫)中的一种或任意组合。
本发明纳米石墨烯粒径优选50nm-200nm。
本申请的另一目的是提供一种OLED保护膜用胶黏剂的制备方法,所述胶黏剂采用如下步骤制备而成:在反应器中加入配比量的聚酯多元醇、二异氰酸酯、扩链剂、耐热单体与溶剂,在40℃-50℃反应20min-40min;
加入配比量的催化剂,再升温至70℃-90℃反应1h-3h;
加入配比量的复合抗静电剂,70℃-90℃保温反应1h-2h后,降温至40℃-50℃加入配比量的封闭型异氰酸酯,得OLED保护膜用胶黏剂。本申请提供的方法通过控制添加顺序,加热时间与温度达到的技术效果是制备剥离力稳定、分子量可控且具有优异的抗静电性能及耐热性能的胶黏剂。
本申请对所述胶黏剂进行应用,主要用于OLED保护膜。应用时,所述OLED保护膜的一面涂布氨酯胶保护膜用胶黏剂,并在胶黏层再贴合一层离型膜。本发明的聚酯薄膜为50μm的光学级聚酯薄膜。优选地,本发明抗静电层的厚度为8μm-12μm,原因是控制剥离力。
以下结合具体实施方式对本发明作进一步的详细说明,但本发明的实施不限于此。
实施例1
(1)在反应器中加入10g苯酐聚酯多元醇、5g聚碳酸酯多元醇、5g对苯二异氰酸酯、5g甲苯二异氰酸酯、1g二羟甲基丁酸、0.5g1,4丁二醇、3g 4-溴-2-羟基苯羧酸甲酯、20g乙酸丁酯,在40℃反应30min,加入0.2g二月桂酸二丁基锡、0.2g辛酸亚锡,再升温至75℃反应1.5h;
(2)加入1.5g吡咯烷酮羧酸钠、1g粒径50nm的石墨烯,75℃保温反应1.2h后,降温至45℃加入2.5g BI7960(德国朗盛)、5gBL3370(科思创),得分子量为15万的OLED保护膜用胶黏剂。
将该胶黏剂涂布于厚度为50μm光学级的聚酯薄膜表面,将聚酯薄膜放入120℃的烘箱中烘1min,取出聚酯薄膜,在胶层表面覆上一层离型膜,得到胶黏层厚度为12μm的OLED保护膜。评估结果列于表1中。
实施例2
(1)在反应器中加入20g苯酐聚酯多元醇、8g甲苯二异氰酸酯、3g 1,4丁二醇、2.5g2-乙酰氨基-5-氯-2-羟基苯羧酸乙酯、20g乙酸乙酯、20g乙酸丁酯,在45℃反应25min,加入0.5g二月桂酸二丁基锡,再升温至70℃反应1h;
(2)加入1g吡咯烷酮羧酸钠、1g粒径125nm的石墨烯、1g粒径200nm的石墨烯,70℃保温反应1h后,降温至42℃,加入1g BI7960(德国朗盛)、1.5g BL3370(科思创)、1.5gBL3379(德国拜耳)、1g HI100(德国巴斯夫),得分子量为18万的OLED保护膜用胶黏剂。
将该胶黏剂涂布于厚度为50μm光学级的聚酯薄膜表面,将聚酯薄膜放入120℃的烘箱中烘1min,取出聚酯薄膜,在胶层表面覆上一层离型膜,得到胶黏层厚度为10μm的OLED保护膜。评估结果列于表1中。
实施例3
(1)在反应器中加入8g苯酐聚酯多元醇、10g聚碳酸酯多元醇、6g对苯二异氰酸酯、3g甲苯二异氰酸酯、2g二羟甲基丁酸、1.5g 4-溴-2-羟基苯羧酸甲酯、2.5g 2-乙酰氨基-5-氯-2-羟基苯羧酸乙酯、35g乙酸乙酯,在42℃反应20min,加入0.3g二月桂酸二丁基锡,再升温至80℃反应1.2h;
(2)加入1.5g吡咯烷酮羧酸钠、1g粒径50nm的石墨烯、1g粒径150nm的石墨烯,80℃保温反应1h后,降温至40℃加入3g BI7674(德国朗盛)、4g BI7960(德国朗盛),得分子量为12万的OLED保护膜用胶黏剂。
将该胶黏剂涂布于厚度为50μm光学级的聚酯薄膜表面,将聚酯薄膜放入120℃的烘箱中烘1min,取出聚酯薄膜,在胶层表面覆上一层离型膜,得到胶黏层厚度为9μm的OLED保护膜。评估结果列于表1中。
实施例4
(1)在反应器中加入10g聚碳酸酯多元醇、11g对苯二异氰酸酯、0.5g二羟甲基丁酸、0.5g 1,4丁二醇、3.5g 4-溴-2-羟基苯羧酸甲酯、25g乙酸丁酯,在50℃反应35min,加入0.3g二月桂酸二丁基锡、0.3g辛酸亚锡,再升温至90℃反应1.7h;
(2)加入1g吡咯烷酮羧酸钠、1g粒径200nm的石墨烯,90℃保温反应1.6h后,降温至48℃加入2g BI7674(德国朗盛)、3g BL3379(德国拜耳)、3g HI100(德国巴斯夫),得分子量为20万的OLED保护膜用胶黏剂。
将该胶黏剂涂布于厚度为50μm光学级的聚酯薄膜表面,将聚酯薄膜放入120℃的烘箱中烘1min,取出聚酯薄膜,在胶层表面覆上一层离型膜,得到胶黏层厚度为8μm的OLED保护膜。评估结果列于表1中。
实施例5
(1)在反应器中加入4g苯酐聚酯多元醇、8g聚碳酸酯多元醇、6g对苯二异氰酸酯、6g甲苯二异氰酸酯、2.5g二羟甲基丁酸、1g 4-溴-2-羟基苯羧酸甲酯、1g 2-乙酰氨基-5-氯-2-羟基苯羧酸乙酯、10g乙酸乙酯、20g乙酸丁酯,在48℃反应40min,加入0.45g辛酸亚锡,再升温至85℃反应2h;
(2)加入2.6g吡咯烷酮羧酸钠、1g粒径100nm的石墨烯、0.3g粒径150nm的石墨烯,85℃保温反应2h后,降温至50℃加入4g BL3370(科思创)、6g BL3379(德国拜耳),得分子量为10万的OLED保护膜用胶黏剂。
将该胶黏剂涂布于厚度为50μm光学级的聚酯薄膜表面,将聚酯薄膜放入120℃的烘箱中烘1min,取出聚酯薄膜,在胶层表面覆上一层离型膜,得到胶黏层厚度为11μm的OLED保护膜。评估结果列于表1中。
对比例1,区别于实施例1
(1)在反应器中加入10g苯酐聚酯多元醇、5g聚碳酸酯多元醇、5g对苯二异氰酸酯、5g甲苯二异氰酸酯、1g二羟甲基丁酸、0.5g1,4丁二醇、20g乙酸丁酯,在40℃反应30min,加入0.2g二月桂酸二丁基锡、0.2g辛酸亚锡,再升温至75℃反应1.5h;
(2)加入1.5g吡咯烷酮羧酸钠,75℃保温反应1.2h后,降温至45℃加入2.5gBI7960(德国朗盛)、5g BL3370(科思创),得分子量为15万的OLED保护膜用胶黏剂。
将该胶黏剂涂布于厚度为50μm光学级的聚酯薄膜表面,将聚酯薄膜放入120℃的烘箱中烘1min,取出聚酯薄膜,在胶层表面覆上一层离型膜,得到胶黏层厚度为10μm的OLED保护膜。评估结果列于表1中。
对比例2,区别于实施例2
(1)在反应器中加入20g苯酐聚酯多元醇、8g甲苯二异氰酸酯、3g 1,4丁二醇、20g乙酸乙酯、20g乙酸丁酯,在45℃反应25min,加入0.5g二月桂酸二丁基锡,再升温至70℃反应1h;
(2)加入2g粒径500nm石墨烯,70℃保温反应1h后,降温至42℃,加入1g BI7960(德国朗盛)、1.5g BL3370(科思创)、1.5g BL3379(德国拜耳)、1g HI100(德国巴斯夫),得分子量为19万的OLED保护膜用胶黏剂。
将该胶黏剂涂布于厚度为50μm光学级的聚酯薄膜表面,将聚酯薄膜放入120℃的烘箱中烘1min,取出聚酯薄膜,在胶层表面覆上一层离型膜,得到胶黏层厚度为12μm的OLED保护膜。评估结果列于表1中。
对比例3,区别于实施例3
(1)在反应器中加入8g苯酐聚酯多元醇、10g聚碳酸酯多元醇、6g对苯二异氰酸酯、3g甲苯二异氰酸酯、3g二羟甲基丁酸、35g乙酸乙酯,在42℃反应20min,加入0.3g二月桂酸二丁基锡,再升温至80℃反应1.2h;
(2)加入2.5g粒径200nm炭黑、80℃保温反应1h后,降温至40℃加入3g BI7674(德国朗盛)、4g BI7960(德国朗盛),得分子量为15万的OLED保护膜用胶黏剂。
将该胶黏剂涂布于厚度为50μm光学级的聚酯薄膜表面,将聚酯薄膜放入120℃的烘箱中烘1min,取出聚酯薄膜,在胶层表面覆上一层离型膜,得到胶黏层厚度为8μm的OLED保护膜。评估结果列于表1中。
对比例4,区别于实施例4
(1)在反应器中加入10g聚碳酸酯多元醇、11g对苯二异氰酸酯、0.5g二羟甲基丁酸、0.5g 1,4丁二醇、3.5g 4-溴-2-羟基苯羧酸甲酯、25g乙酸丁酯,在50℃反应35min,加入0.3g二月桂酸二丁基锡、0.3g辛酸亚锡,再升温至90℃反应1.7h;
(2)降温至48℃加入2g BI7674(德国朗盛)、3g BL3379(德国拜耳)、3g HI100(德国巴斯夫),得分子量为15万的OLED保护膜用胶黏剂。
将该胶黏剂涂布于厚度为50μm光学级的聚酯薄膜表面,将聚酯薄膜放入120℃的烘箱中烘1min,取出聚酯薄膜,在胶层表面覆上一层离型膜,得到胶黏层厚度为10μm的OLED保护膜。评估结果列于表1中。
对比例5,区别于实施例5
(1)在反应器中加入15g苯酐聚醚多元醇、6g对苯二异氰酸酯、6g六亚甲基二异氰酸酯、2.5g二羟甲基丁酸、1g 4-溴-2-羟基苯羧酸甲酯、1g 2-乙酰氨基-5-氯-2-羟基苯羧酸乙酯、10g乙酸乙酯、20g乙酸丁酯,在48℃反应40min,加入0.45g辛酸亚锡,再升温至85℃反应2h;
(2)加入2.6g吡咯烷酮羧酸钠,85℃保温反应2h后,降温至50℃加入4g BL3370(科思创)、6g BL3379(德国拜耳),得分子量为23万的OLED保护膜用胶黏剂。
将该胶黏剂涂布于厚度为50μm光学级的聚酯薄膜表面,将聚酯薄膜放入120℃的烘箱中烘1min,取出聚酯薄膜,在胶层表面覆上一层离型膜,得到胶黏层厚度为12μm的OLED保护膜。评估结果列于表1中。
表1性能数据表
表中各项性能的测试方法如下:
(1)透光率、雾度测试
参照标准GB/T2410-2008,利用雾度计(型号:“U3000”),撕去离型膜,测量透光率(T)和雾度(H)。
(2)剥离力测试
将保护膜裁成300*25mm尺寸,撕去离型膜,将保护膜贴合在偏光片表面,使用电子万能试验机(型号:AGS-X),在角度180°、拉伸速度300mm/min的条件下进行剥离测试。
(3)胶层电阻测试
将保护膜裁成12*12mm尺寸,撕去离型膜,在高阻计(型号:SME-8310)上测试胶面电阻。
(4)撕膜电压
将保护膜裁成150*50mm尺寸,撕去离型膜,将保护膜胶层贴合在玻璃表面,以30m/min的拉伸速度,180度将保护膜从玻璃表面撕除,用静电场测试仪(型号:SIMCO FMX-003)测试玻璃表面的静电电压。
(5)高温试验
将保护膜裁成150*25mm尺寸,撕去离型膜,将保护膜胶层贴合在玻璃表面,放入可程式恒温恒湿试验箱,经80℃120h后,观察保护膜在玻璃表面有无折皱、脱离、气泡产生,若无,则判断为合格,若有,则判断为不合格。
虽然本发明已以较佳实施例揭露如上,然其并非用以限定本发明。本发明所属技术领域中具有通常知识者,在不脱离本发明的精神和范围内,当可作各种的更动与润饰。因此,本发明的保护范围当视权利要求书所界定者为准。

Claims (6)

1.一种OLED保护膜用胶黏剂,其特征在于:所述胶黏剂包括如下重量份的各物质:
聚酯多元醇 10-20份
二异氰酸酯 8-12份
扩链剂1-3份
耐热单体 2-4份
复合抗静电剂2-4份
溶剂 20-40份
催化剂 0.3-0.6份
封闭型异氰酸酯 5-10份;
所述胶黏剂的分子量为10万-20万的聚合物;所述耐热单体为含有苯环的单体;所述二异氰酸酯为对苯二异氰酸酯、甲苯二异氰酸酯中的一种或任意重量比的两种;所述含有苯环的单体为4-溴-2-羟基苯羧酸甲酯;所述复合抗静电剂为吡咯烷酮羧酸钠与纳米石墨烯中两种组合;当为两种组合时,所述吡咯烷酮羧酸钠与纳米石墨烯的重量比例为1:2-2:1;所述聚酯多元醇为苯酐聚酯多元醇、聚碳酸酯多元醇中一种或任意重量比的两种。
2.根据权利要求1所述的一种OLED保护膜用胶黏剂,其特征在于:所述扩链剂为二羟甲基丁酸、1,4丁二醇中的一种或任意重量比的两种。
3.根据权利要求1所述的一种OLED保护膜用胶黏剂,其特征在于:所述溶剂为乙酸乙酯、乙酸丁酯中的一种或任意重量比的两种。
4.根据权利要求1所述的一种OLED保护膜用胶黏剂,其特征在于:所述催化剂为二月桂酸二丁基锡、辛酸亚锡中的一种或任意重量比的两种。
5.根据权利要求1-4任一所述的一种OLED保护膜用胶黏剂制备方法,其特征在于,所述胶黏剂采用如下步骤制备而成:
在反应器中加入配比量的聚酯多元醇、二异氰酸酯、扩链剂、耐热单体与溶剂,在40℃-50℃反应20min-40min;
加入配比量的催化剂,再升温至70℃-90℃反应1h-3h;
加入配比量的复合抗静电剂,70℃-90℃保温反应1h-2h后,降温至40℃-50℃加入配比量的封闭型异氰酸酯,得OLED保护膜用胶黏剂。
6.一种OLED保护膜,其特征在于,所述OLED保护膜的两面涂布有权利要求1-4任一所述的OLED保护膜用胶黏剂,并在胶黏层上再贴合一层离型膜。
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KR20220033844A (ko) * 2020-09-10 2022-03-17 주식회사 엘지화학 대전방지제를 포함하는 점착제 조성물 및 표면 보호 필름

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JP2018159054A (ja) * 2017-03-22 2018-10-11 日東電工株式会社 表面保護フィルム
CN108794704A (zh) * 2018-04-01 2018-11-13 安徽弘泰精密机械科技有限公司 一种3d打印用高分子粉末材料的制备方法
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