CN1155066C - 利用注入和横向扩散制造碳化硅功率器件的自对准方法 - Google Patents

利用注入和横向扩散制造碳化硅功率器件的自对准方法 Download PDF

Info

Publication number
CN1155066C
CN1155066C CNB998071021A CN99807102A CN1155066C CN 1155066 C CN1155066 C CN 1155066C CN B998071021 A CNB998071021 A CN B998071021A CN 99807102 A CN99807102 A CN 99807102A CN 1155066 C CN1155066 C CN 1155066C
Authority
CN
China
Prior art keywords
type
silicon carbide
injecting
inject
carbide substrates
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
CNB998071021A
Other languages
English (en)
Chinese (zh)
Other versions
CN1304551A (zh
Inventor
Av
A·V·苏沃罗夫
J·W·帕尔穆尔
R·辛格
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Wolfspeed Inc
Original Assignee
Cree Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Cree Inc filed Critical Cree Inc
Publication of CN1304551A publication Critical patent/CN1304551A/zh
Application granted granted Critical
Publication of CN1155066C publication Critical patent/CN1155066C/zh
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/26—Bombardment with radiation
    • H01L21/263—Bombardment with radiation with high-energy radiation
    • H01L21/265—Bombardment with radiation with high-energy radiation producing ion implantation
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00—Field-effect transistors [FET]
    • H10D30/60—Insulated-gate field-effect transistors [IGFET]
    • H10D30/64—Double-diffused metal-oxide semiconductor [DMOS] FETs
    • H10D30/65—Lateral DMOS [LDMOS] FETs
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/0445—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising crystalline silicon carbide
    • H01L21/0455—Making n or p doped regions or layers, e.g. using diffusion
    • H01L21/046—Making n or p doped regions or layers, e.g. using diffusion using ion implantation
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D12/00—Bipolar devices controlled by the field effect, e.g. insulated-gate bipolar transistors [IGBT]
    • H10D12/01—Manufacture or treatment
    • H10D12/031—Manufacture or treatment of IGBTs
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00—Field-effect transistors [FET]
    • H10D30/60—Insulated-gate field-effect transistors [IGFET]
    • H10D30/64—Double-diffused metal-oxide semiconductor [DMOS] FETs
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00—Field-effect transistors [FET]
    • H10D30/60—Insulated-gate field-effect transistors [IGFET]
    • H10D30/64—Double-diffused metal-oxide semiconductor [DMOS] FETs
    • H10D30/66—Vertical DMOS [VDMOS] FETs
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/80—Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials
    • H10D62/83—Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials being Group IV materials, e.g. B-doped Si or undoped Ge
    • H10D62/832—Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials being Group IV materials, e.g. B-doped Si or undoped Ge being Group IV materials comprising two or more elements, e.g. SiGe
    • H10D62/8325—Silicon carbide
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S438/00—Semiconductor device manufacturing: process
    • Y10S438/931—Silicon carbide semiconductor

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • High Energy & Nuclear Physics (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Insulated Gate Type Field-Effect Transistor (AREA)
  • Recrystallisation Techniques (AREA)
  • Electrodes Of Semiconductors (AREA)
CNB998071021A 1998-06-08 1999-06-07 利用注入和横向扩散制造碳化硅功率器件的自对准方法 Expired - Lifetime CN1155066C (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US09/093,207 1998-06-08
US09/093207 1998-06-08
US09/093,207 US6107142A (en) 1998-06-08 1998-06-08 Self-aligned methods of fabricating silicon carbide power devices by implantation and lateral diffusion

Publications (2)

Publication Number Publication Date
CN1304551A CN1304551A (zh) 2001-07-18
CN1155066C true CN1155066C (zh) 2004-06-23

Family

ID=22237747

Family Applications (1)

Application Number Title Priority Date Filing Date
CNB998071021A Expired - Lifetime CN1155066C (zh) 1998-06-08 1999-06-07 利用注入和横向扩散制造碳化硅功率器件的自对准方法

Country Status (8)

Country Link
US (1) US6107142A (enExample)
EP (2) EP1086491A1 (enExample)
JP (2) JP5184724B2 (enExample)
KR (1) KR100596061B1 (enExample)
CN (1) CN1155066C (enExample)
AU (1) AU4550399A (enExample)
CA (1) CA2333579C (enExample)
WO (1) WO1999065073A1 (enExample)

Families Citing this family (60)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3988262B2 (ja) * 1998-07-24 2007-10-10 富士電機デバイステクノロジー株式会社 縦型超接合半導体素子およびその製造方法
US6972436B2 (en) * 1998-08-28 2005-12-06 Cree, Inc. High voltage, high temperature capacitor and interconnection structures
EP1058303A1 (en) * 1999-05-31 2000-12-06 STMicroelectronics S.r.l. Fabrication of VDMOS structure with reduced parasitic effects
US6504176B2 (en) * 2000-04-06 2003-01-07 Matshushita Electric Industrial Co., Ltd. Field effect transistor and method of manufacturing the same
US6429041B1 (en) 2000-07-13 2002-08-06 Cree, Inc. Methods of fabricating silicon carbide inversion channel devices without the need to utilize P-type implantation
US6956238B2 (en) 2000-10-03 2005-10-18 Cree, Inc. Silicon carbide power metal-oxide semiconductor field effect transistors having a shorting channel and methods of fabricating silicon carbide metal-oxide semiconductor field effect transistors having a shorting channel
US7067176B2 (en) 2000-10-03 2006-06-27 Cree, Inc. Method of fabricating an oxide layer on a silicon carbide layer utilizing an anneal in a hydrogen environment
US6767843B2 (en) 2000-10-03 2004-07-27 Cree, Inc. Method of N2O growth of an oxide layer on a silicon carbide layer
US6610366B2 (en) 2000-10-03 2003-08-26 Cree, Inc. Method of N2O annealing an oxide layer on a silicon carbide layer
KR100393201B1 (ko) * 2001-04-16 2003-07-31 페어차일드코리아반도체 주식회사 낮은 온 저항과 높은 브레이크다운 전압을 갖는 고전압수평형 디모스 트랜지스터
US6507046B2 (en) 2001-05-11 2003-01-14 Cree, Inc. High-resistivity silicon carbide substrate for semiconductor devices with high break down voltage
JP3939195B2 (ja) * 2002-05-13 2007-07-04 ローム株式会社 半導体装置の製造方法および半導体装置
US7022378B2 (en) * 2002-08-30 2006-04-04 Cree, Inc. Nitrogen passivation of interface states in SiO2/SiC structures
US7221010B2 (en) * 2002-12-20 2007-05-22 Cree, Inc. Vertical JFET limited silicon carbide power metal-oxide semiconductor field effect transistors
US6979863B2 (en) * 2003-04-24 2005-12-27 Cree, Inc. Silicon carbide MOSFETs with integrated antiparallel junction barrier Schottky free wheeling diodes and methods of fabricating the same
US7074643B2 (en) * 2003-04-24 2006-07-11 Cree, Inc. Silicon carbide power devices with self-aligned source and well regions and methods of fabricating same
US7118970B2 (en) * 2004-06-22 2006-10-10 Cree, Inc. Methods of fabricating silicon carbide devices with hybrid well regions
US7391057B2 (en) * 2005-05-18 2008-06-24 Cree, Inc. High voltage silicon carbide devices having bi-directional blocking capabilities
US7414268B2 (en) 2005-05-18 2008-08-19 Cree, Inc. High voltage silicon carbide MOS-bipolar devices having bi-directional blocking capabilities
US7615801B2 (en) * 2005-05-18 2009-11-10 Cree, Inc. High voltage silicon carbide devices having bi-directional blocking capabilities
US20060261346A1 (en) * 2005-05-18 2006-11-23 Sei-Hyung Ryu High voltage silicon carbide devices having bi-directional blocking capabilities and methods of fabricating the same
US7528040B2 (en) 2005-05-24 2009-05-05 Cree, Inc. Methods of fabricating silicon carbide devices having smooth channels
US7727904B2 (en) * 2005-09-16 2010-06-01 Cree, Inc. Methods of forming SiC MOSFETs with high inversion layer mobility
US7728402B2 (en) 2006-08-01 2010-06-01 Cree, Inc. Semiconductor devices including schottky diodes with controlled breakdown
US8432012B2 (en) 2006-08-01 2013-04-30 Cree, Inc. Semiconductor devices including schottky diodes having overlapping doped regions and methods of fabricating same
EP2631951B1 (en) 2006-08-17 2017-10-11 Cree, Inc. High power insulated gate bipolar transistors
US8835987B2 (en) 2007-02-27 2014-09-16 Cree, Inc. Insulated gate bipolar transistors including current suppressing layers
JP4442698B2 (ja) * 2007-07-25 2010-03-31 三菱電機株式会社 炭化珪素半導体装置の製造方法
US8232558B2 (en) 2008-05-21 2012-07-31 Cree, Inc. Junction barrier Schottky diodes with current surge capability
US8796809B2 (en) 2008-09-08 2014-08-05 Cree, Inc. Varactor diode with doped voltage blocking layer
US7829402B2 (en) * 2009-02-10 2010-11-09 General Electric Company MOSFET devices and methods of making
US8288220B2 (en) 2009-03-27 2012-10-16 Cree, Inc. Methods of forming semiconductor devices including epitaxial layers and related structures
US8294507B2 (en) 2009-05-08 2012-10-23 Cree, Inc. Wide bandgap bipolar turn-off thyristor having non-negative temperature coefficient and related control circuits
US8193848B2 (en) 2009-06-02 2012-06-05 Cree, Inc. Power switching devices having controllable surge current capabilities
US8629509B2 (en) 2009-06-02 2014-01-14 Cree, Inc. High voltage insulated gate bipolar transistors with minority carrier diverter
US8541787B2 (en) 2009-07-15 2013-09-24 Cree, Inc. High breakdown voltage wide band-gap MOS-gated bipolar junction transistors with avalanche capability
US8354690B2 (en) 2009-08-31 2013-01-15 Cree, Inc. Solid-state pinch off thyristor circuits
US9117739B2 (en) 2010-03-08 2015-08-25 Cree, Inc. Semiconductor devices with heterojunction barrier regions and methods of fabricating same
US8415671B2 (en) 2010-04-16 2013-04-09 Cree, Inc. Wide band-gap MOSFETs having a heterojunction under gate trenches thereof and related methods of forming such devices
DE102011002468A1 (de) 2011-01-05 2012-07-05 Robert Bosch Gmbh Verfahren zur Herstellung einer Siliziumkarbid-Halbleiterstruktur sowie eine verfahrensgemäß hergestellte Halbleiterstruktur
US9142662B2 (en) 2011-05-06 2015-09-22 Cree, Inc. Field effect transistor devices with low source resistance
US9029945B2 (en) 2011-05-06 2015-05-12 Cree, Inc. Field effect transistor devices with low source resistance
US9984894B2 (en) 2011-08-03 2018-05-29 Cree, Inc. Forming SiC MOSFETs with high channel mobility by treating the oxide interface with cesium ions
US8680587B2 (en) 2011-09-11 2014-03-25 Cree, Inc. Schottky diode
US8664665B2 (en) 2011-09-11 2014-03-04 Cree, Inc. Schottky diode employing recesses for elements of junction barrier array
US9373617B2 (en) 2011-09-11 2016-06-21 Cree, Inc. High current, low switching loss SiC power module
WO2013036370A1 (en) 2011-09-11 2013-03-14 Cree, Inc. High current density power module comprising transistors with improved layout
US8618582B2 (en) 2011-09-11 2013-12-31 Cree, Inc. Edge termination structure employing recesses for edge termination elements
US9640617B2 (en) 2011-09-11 2017-05-02 Cree, Inc. High performance power module
US8941188B2 (en) * 2012-03-26 2015-01-27 Infineon Technologies Austria Ag Semiconductor arrangement with a superjunction transistor and a further device integrated in a common semiconductor body
US9018048B2 (en) * 2012-09-27 2015-04-28 Stmicroelectronics S.R.L. Process for manufactuirng super-barrier rectifiers
RU2528554C1 (ru) * 2013-04-25 2014-09-20 федеральное государственное автономное образовательное учреждение высшего профессионального образования "Национальный исследовательский ядерный университет МИФИ" (НИЯУ МИФИ) Способ формирования высоковольтного карбидокремниевого диода на основе ионно-легированных p-n-структур
US9768259B2 (en) * 2013-07-26 2017-09-19 Cree, Inc. Controlled ion implantation into silicon carbide using channeling and devices fabricated using controlled ion implantation into silicon carbide using channeling
JP6206012B2 (ja) * 2013-09-06 2017-10-04 住友電気工業株式会社 炭化珪素半導体装置
US9673315B2 (en) 2015-03-24 2017-06-06 Kabushiki Kaisha Toshiba Semiconductor device, inverter circuit, driving device, vehicle, and elevator
KR102704347B1 (ko) * 2016-10-14 2024-09-06 한국전기연구원 SiC 금속 산화물 반도체 소자의 제조 방법
JP6988216B2 (ja) 2017-07-12 2022-01-05 富士電機株式会社 半導体装置の製造方法
WO2019166576A1 (en) 2018-02-28 2019-09-06 Abb Schweiz Ag Method for p-type doping of silicon carbide by al/be co-implantation
JP6862381B2 (ja) 2018-03-02 2021-04-21 株式会社東芝 半導体装置
US10636660B2 (en) 2018-09-28 2020-04-28 General Electric Company Super-junction semiconductor device fabrication

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3629011A (en) * 1967-09-11 1971-12-21 Matsushita Electric Industrial Co Ltd Method for diffusing an impurity substance into silicon carbide
US5242841A (en) * 1992-03-25 1993-09-07 Texas Instruments Incorporated Method of making LDMOS transistor with self-aligned source/backgate and photo-aligned gate
JP3146694B2 (ja) * 1992-11-12 2001-03-19 富士電機株式会社 炭化けい素ｍｏｓｆｅｔおよび炭化けい素ｍｏｓｆｅｔの製造方法
US5444002A (en) * 1993-12-22 1995-08-22 United Microelectronics Corp. Method of fabricating a short-channel DMOS transistor with removable sidewall spacers
US5399883A (en) * 1994-05-04 1995-03-21 North Carolina State University At Raleigh High voltage silicon carbide MESFETs and methods of fabricating same
TW286435B (enExample) * 1994-07-27 1996-09-21 Siemens Ag
US5510281A (en) * 1995-03-20 1996-04-23 General Electric Company Method of fabricating a self-aligned DMOS transistor device using SiC and spacers
SE9501310D0 (sv) * 1995-04-10 1995-04-10 Abb Research Ltd A method for introduction of an impurity dopant in SiC, a semiconductor device formed by the mehtod and a use of a highly doped amorphous layer as a source for dopant diffusion into SiC
US5849620A (en) * 1995-10-18 1998-12-15 Abb Research Ltd. Method for producing a semiconductor device comprising an implantation step
SE9601174D0 (sv) * 1996-03-27 1996-03-27 Abb Research Ltd A method for producing a semiconductor device having a semiconductor layer of SiC and such a device
JP4629809B2 (ja) * 1996-03-27 2011-02-09 クリー，インコーポレイテッド ＳｉＣの半導体層を有する半導体素子を製造する方法
SE9602745D0 (sv) * 1996-07-11 1996-07-11 Abb Research Ltd A method for producing a channel region layer in a SiC-layer for a voltage controlled semiconductor device
US5841166A (en) * 1996-09-10 1998-11-24 Spectrian, Inc. Lateral DMOS transistor for RF/microwave applications
US5837572A (en) * 1997-01-10 1998-11-17 Advanced Micro Devices, Inc. CMOS integrated circuit formed by using removable spacers to produce asymmetrical NMOS junctions before asymmetrical PMOS junctions for optimizing thermal diffusivity of dopants implanted therein
US5877041A (en) * 1997-06-30 1999-03-02 Harris Corporation Self-aligned power field effect transistor in silicon carbide

Also Published As

Publication number Publication date
EP1701377A2 (en) 2006-09-13
KR100596061B1 (ko) 2006-07-03
CA2333579A1 (en) 1999-12-16
KR20010052492A (ko) 2001-06-25
JP2011097093A (ja) 2011-05-12
CA2333579C (en) 2009-09-08
JP5295274B2 (ja) 2013-09-18
JP2002518828A (ja) 2002-06-25
US6107142A (en) 2000-08-22
EP1086491A1 (en) 2001-03-28
WO1999065073A1 (en) 1999-12-16
EP1701377A3 (en) 2008-08-06
AU4550399A (en) 1999-12-30
JP5184724B2 (ja) 2013-04-17
CN1304551A (zh) 2001-07-18

Similar Documents

Publication Publication Date Title
CN1155066C (zh) 利用注入和横向扩散制造碳化硅功率器件的自对准方法
CN1132225C (zh) 通过受控退火制造碳化硅功率器件的方法
CN100555663C (zh) 碳化硅器件及其制造方法
EP2052414B1 (en) High power insulated gate bipolar transistors
CN1251330C (zh) 半导体装置及其制造方法
CN1079996C (zh) 高压金属氧化物硅场效应晶体管结构
JP5732253B2 (ja) 絶縁ゲートバイポーラ導電トランジスタ（ｉｂｃｔ）および関連する製作方法
CN1096107C (zh) 用改进的小型区抑制短沟道的mos晶体管及其制造方法
CN1505170A (zh) SiC-MISFET及其制造方法
CN1992337A (zh) 具有碳化硅钝化层的碳化硅双极结型晶体管及其制造方法
US5893736A (en) Methods of forming insulated gate semiconductor devices having spaced epitaxial JFET regions therein
CN1717811A (zh) 源极区下面具有隐埋p型层的晶体管及其制造方法
CN1260068A (zh) 免闭锁功率金属氧化物半导体一双极型晶体管
Vathulya et al. A novel 6H-SiC power DMOSFET with implanted p-well spacer
CN1518123A (zh) 电力半导体器件
JP2000332239A (ja) 電界効果トランジスタ
CN1525575A (zh) 高耐电压场效应型半导体设备
CN116705859A (zh) 碳化硅金属氧化物半导体场效应晶体管结构及其制备方法
WO2023095363A1 (ja) 半導体装置とその製造方法
EP4246591B1 (en) Manufacturing method and power semiconductor device
CN117317026B (zh) 一种半导体器件及其制造方法
JPH0974192A (ja) 炭化珪素半導体装置
Ng et al. A novel planar power MOSFET with laterally uniform body and ion-implanted JFET region
Okada Fabrication of a Silicon MOSFET Device with a Biopolar Transistor Source
CN1964068A (zh) 可降低导通电阻的功率半导体结构及其制造方法

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant
CX01 Expiry of patent term
CX01 Expiry of patent term

Granted publication date: 20040623