CN115298244B - 聚酯、膜及粘接剂组合物、以及粘接片材、层叠体及印刷线路板 - Google Patents
聚酯、膜及粘接剂组合物、以及粘接片材、层叠体及印刷线路板 Download PDFInfo
- Publication number
- CN115298244B CN115298244B CN202180022537.6A CN202180022537A CN115298244B CN 115298244 B CN115298244 B CN 115298244B CN 202180022537 A CN202180022537 A CN 202180022537A CN 115298244 B CN115298244 B CN 115298244B
- Authority
- CN
- China
- Prior art keywords
- polyester
- monomer
- mol
- adhesive
- film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/36—Layered products comprising a layer of synthetic resin comprising polyesters
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/04—Interconnection of layers
- B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G63/00—Macromolecular compounds obtained by reactions forming a carboxylic ester link in the main chain of the macromolecule
- C08G63/02—Polyesters derived from hydroxycarboxylic acids or from polycarboxylic acids and polyhydroxy compounds
- C08G63/12—Polyesters derived from hydroxycarboxylic acids or from polycarboxylic acids and polyhydroxy compounds derived from polycarboxylic acids and polyhydroxy compounds
- C08G63/16—Dicarboxylic acids and dihydroxy compounds
- C08G63/18—Dicarboxylic acids and dihydroxy compounds the acids or hydroxy compounds containing carbocyclic rings
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G63/00—Macromolecular compounds obtained by reactions forming a carboxylic ester link in the main chain of the macromolecule
- C08G63/02—Polyesters derived from hydroxycarboxylic acids or from polycarboxylic acids and polyhydroxy compounds
- C08G63/12—Polyesters derived from hydroxycarboxylic acids or from polycarboxylic acids and polyhydroxy compounds derived from polycarboxylic acids and polyhydroxy compounds
- C08G63/16—Dicarboxylic acids and dihydroxy compounds
- C08G63/18—Dicarboxylic acids and dihydroxy compounds the acids or hydroxy compounds containing carbocyclic rings
- C08G63/181—Acids containing aromatic rings
- C08G63/185—Acids containing aromatic rings containing two or more aromatic rings
- C08G63/187—Acids containing aromatic rings containing two or more aromatic rings containing condensed aromatic rings
- C08G63/189—Acids containing aromatic rings containing two or more aromatic rings containing condensed aromatic rings containing a naphthalene ring
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/18—Manufacture of films or sheets
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J167/00—Adhesives based on polyesters obtained by reactions forming a carboxylic ester link in the main chain; Adhesives based on derivatives of such polymers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J167/00—Adhesives based on polyesters obtained by reactions forming a carboxylic ester link in the main chain; Adhesives based on derivatives of such polymers
- C09J167/02—Polyesters derived from dicarboxylic acids and dihydroxy compounds
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
- B32B2457/08—PCBs, i.e. printed circuit boards
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2367/00—Characterised by the use of polyesters obtained by reactions forming a carboxylic ester link in the main chain; Derivatives of such polymers
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Polymers & Plastics (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Materials Engineering (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Laminated Bodies (AREA)
- Adhesive Tapes (AREA)
- Polyesters Or Polycarbonates (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2020060687 | 2020-03-30 | ||
| JP2020-060687 | 2020-03-30 | ||
| PCT/JP2021/013041 WO2021200715A1 (ja) | 2020-03-30 | 2021-03-26 | ポリエステル、フィルムおよび接着剤組成物、ならびに接着シート、積層体およびプリント配線板 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN115298244A CN115298244A (zh) | 2022-11-04 |
| CN115298244B true CN115298244B (zh) | 2024-10-11 |
Family
ID=77929980
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202180022537.6A Active CN115298244B (zh) | 2020-03-30 | 2021-03-26 | 聚酯、膜及粘接剂组合物、以及粘接片材、层叠体及印刷线路板 |
Country Status (5)
| Country | Link |
|---|---|
| JP (4) | JP7001208B1 (enExample) |
| KR (1) | KR20220161323A (enExample) |
| CN (1) | CN115298244B (enExample) |
| TW (1) | TWI885109B (enExample) |
| WO (1) | WO2021200715A1 (enExample) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP7223300B2 (ja) * | 2020-09-18 | 2023-02-16 | 三菱ケミカル株式会社 | ポリエステル系樹脂、接着剤組成物及び接着剤 |
| JP7173252B2 (ja) * | 2020-09-24 | 2022-11-16 | 三菱ケミカル株式会社 | 粘着剤組成物、粘着剤及び粘着剤層 |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2012207207A (ja) * | 2011-03-16 | 2012-10-25 | Toyobo Co Ltd | バイオマスプラスチック塗料 |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01221469A (ja) * | 1988-02-29 | 1989-09-04 | Nippon Paint Co Ltd | 粉体塗料用樹脂組成物 |
| JPH06104813A (ja) | 1992-09-18 | 1994-04-15 | Canon Inc | 無線電話機 |
| JP3324159B2 (ja) * | 1992-10-16 | 2002-09-17 | 東洋紡績株式会社 | 熱可塑性ポリエステルエラストマー |
| JP2011048926A (ja) * | 2009-08-25 | 2011-03-10 | Teijin Fibers Ltd | 電線被覆材 |
| JP5443099B2 (ja) * | 2009-08-25 | 2014-03-19 | 帝人株式会社 | ポリエステル樹脂組成物およびその製造方法ならびに成形体 |
| JP5657990B2 (ja) * | 2009-10-14 | 2015-01-21 | 三井化学株式会社 | ラミネート用接着剤 |
| CN107075335B (zh) | 2014-09-24 | 2020-02-14 | 东亚合成株式会社 | 粘接剂组合物和使用了其的带有粘接剂层的层叠体 |
| US20200188096A1 (en) * | 2017-05-30 | 2020-06-18 | Evonik Canada Inc. | Prosthetic valves having a modified surface |
| CA3064294A1 (en) * | 2017-05-30 | 2018-12-06 | Evonik Canada Inc. | Vascular grafts having a modified surface |
| KR102860051B1 (ko) * | 2019-10-23 | 2025-09-16 | 미쯔비시 케미컬 주식회사 | 플렉시블 프린트 배선판용 접착제 조성물, 플렉시블 프린트 배선판용 접착제 및 플렉시블 프린트 배선판 |
-
2021
- 2021-03-26 CN CN202180022537.6A patent/CN115298244B/zh active Active
- 2021-03-26 WO PCT/JP2021/013041 patent/WO2021200715A1/ja not_active Ceased
- 2021-03-26 KR KR1020227033597A patent/KR20220161323A/ko active Pending
- 2021-03-26 JP JP2021538819A patent/JP7001208B1/ja active Active
- 2021-03-29 TW TW110111336A patent/TWI885109B/zh active
- 2021-12-20 JP JP2021205735A patent/JP7326417B2/ja active Active
-
2023
- 2023-05-12 JP JP2023079622A patent/JP7405298B2/ja active Active
- 2023-05-12 JP JP2023079621A patent/JP7405297B2/ja active Active
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2012207207A (ja) * | 2011-03-16 | 2012-10-25 | Toyobo Co Ltd | バイオマスプラスチック塗料 |
Also Published As
| Publication number | Publication date |
|---|---|
| JP7405298B2 (ja) | 2023-12-26 |
| JP2022050434A (ja) | 2022-03-30 |
| JP7001208B1 (ja) | 2022-01-19 |
| JPWO2021200715A1 (enExample) | 2021-10-07 |
| TW202146514A (zh) | 2021-12-16 |
| TWI885109B (zh) | 2025-06-01 |
| JP2023107770A (ja) | 2023-08-03 |
| CN115298244A (zh) | 2022-11-04 |
| JP2023107771A (ja) | 2023-08-03 |
| JP7405297B2 (ja) | 2023-12-26 |
| KR20220161323A (ko) | 2022-12-06 |
| JP7326417B2 (ja) | 2023-08-15 |
| WO2021200715A1 (ja) | 2021-10-07 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP7780353B2 (ja) | ポリエステル、フィルムおよび接着剤組成物、ならびに接着シート、積層体およびプリント配線板 | |
| TWI864265B (zh) | 黏接劑組成物、以及黏接片、疊層體、及印刷配線板 | |
| TWI885110B (zh) | 黏接劑組成物、及黏接片、疊層體及印刷配線板 | |
| JP7405297B2 (ja) | ポリエステル、フィルムおよび接着剤組成物、ならびに接着シート、積層体およびプリント配線板 | |
| JP7120498B1 (ja) | 接着剤組成物、ならびにこれを含有する接着シート、積層体およびプリント配線板 | |
| TWI905160B (zh) | 聚酯、薄膜、黏接劑組成物、黏接片、疊層體、以及印刷配線板 | |
| JP7127757B1 (ja) | 接着剤組成物、ならびにこれを含有する接着シート、積層体およびプリント配線板 | |
| JP7318838B2 (ja) | 接着剤組成物、接着シート、積層体およびプリント配線板 | |
| TW202248392A (zh) | 黏接劑組成物、及含有此黏接劑之黏接片、疊層體及印刷配線板 | |
| TW202523809A (zh) | 接著劑組成物、以及含有其之接著薄片、積層體及印刷配線板 | |
| TW202509174A (zh) | 黏接劑組成物、以及含有其之黏接片、疊層體及印刷配線板 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| TA01 | Transfer of patent application right | ||
| TA01 | Transfer of patent application right |
Effective date of registration: 20230602 Address after: South Building, Meitian Twin Towers, No. 13-1, Meitian 1-chome, Kita ku, Osaka City, Osaka Prefecture, Japan Applicant after: Dongyang Textile MC Co.,Ltd. Address before: No. 1, No. 13, meitian-1, Shibei District, Osaka, Osaka, Japan Applicant before: TOYOBO Co.,Ltd. |
|
| GR01 | Patent grant | ||
| GR01 | Patent grant |