TWI885109B - 聚酯、薄膜、黏接劑組成物、黏接片、疊層體、以及印刷配線板 - Google Patents

聚酯、薄膜、黏接劑組成物、黏接片、疊層體、以及印刷配線板 Download PDF

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Publication number
TWI885109B
TWI885109B TW110111336A TW110111336A TWI885109B TW I885109 B TWI885109 B TW I885109B TW 110111336 A TW110111336 A TW 110111336A TW 110111336 A TW110111336 A TW 110111336A TW I885109 B TWI885109 B TW I885109B
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Taiwan
Prior art keywords
polyester
mol
monomer
adhesive
adhesive composition
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Application number
TW110111336A
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English (en)
Chinese (zh)
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TW202146514A (zh
Inventor
坂本晃一
三浦航
川楠哲生
Original Assignee
日商東洋紡Mc股份有限公司
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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00Layered products comprising a layer of synthetic resin
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00Layered products comprising a layer of synthetic resin
    • B32B27/36Layered products comprising a layer of synthetic resin comprising polyesters
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04Interconnection of layers
    • B32B7/12Interconnection of layers using interposed adhesives or interposed materials with bonding properties
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G63/00Macromolecular compounds obtained by reactions forming a carboxylic ester link in the main chain of the macromolecule
    • C08G63/02Polyesters derived from hydroxycarboxylic acids or from polycarboxylic acids and polyhydroxy compounds
    • C08G63/12Polyesters derived from hydroxycarboxylic acids or from polycarboxylic acids and polyhydroxy compounds derived from polycarboxylic acids and polyhydroxy compounds
    • C08G63/16Dicarboxylic acids and dihydroxy compounds
    • C08G63/18Dicarboxylic acids and dihydroxy compounds the acids or hydroxy compounds containing carbocyclic rings
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G63/00Macromolecular compounds obtained by reactions forming a carboxylic ester link in the main chain of the macromolecule
    • C08G63/02Polyesters derived from hydroxycarboxylic acids or from polycarboxylic acids and polyhydroxy compounds
    • C08G63/12Polyesters derived from hydroxycarboxylic acids or from polycarboxylic acids and polyhydroxy compounds derived from polycarboxylic acids and polyhydroxy compounds
    • C08G63/16Dicarboxylic acids and dihydroxy compounds
    • C08G63/18Dicarboxylic acids and dihydroxy compounds the acids or hydroxy compounds containing carbocyclic rings
    • C08G63/181Acids containing aromatic rings
    • C08G63/185Acids containing aromatic rings containing two or more aromatic rings
    • C08G63/187Acids containing aromatic rings containing two or more aromatic rings containing condensed aromatic rings
    • C08G63/189Acids containing aromatic rings containing two or more aromatic rings containing condensed aromatic rings containing a naphthalene ring
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08JWORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18Manufacture of films or sheets
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J167/00Adhesives based on polyesters obtained by reactions forming a carboxylic ester link in the main chain; Adhesives based on derivatives of such polymers
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J167/00Adhesives based on polyesters obtained by reactions forming a carboxylic ester link in the main chain; Adhesives based on derivatives of such polymers
    • C09J167/02Polyesters derived from dicarboxylic acids and dihydroxy compounds
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00Adhesives in the form of films or foils
    • C09J7/30Adhesives in the form of films or foils characterised by the adhesive composition
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/03Use of materials for the substrate
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00Electrical equipment
    • B32B2457/08PCBs, i.e. printed circuit boards
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08JWORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2367/00Characterised by the use of polyesters obtained by reactions forming a carboxylic ester link in the main chain; Derivatives of such polymers

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Polymers & Plastics (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Materials Engineering (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Laminated Bodies (AREA)
  • Adhesive Tapes (AREA)
  • Polyesters Or Polycarbonates (AREA)
TW110111336A 2020-03-30 2021-03-29 聚酯、薄膜、黏接劑組成物、黏接片、疊層體、以及印刷配線板 TWI885109B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2020060687 2020-03-30
JP2020-060687 2020-03-30

Publications (2)

Publication Number Publication Date
TW202146514A TW202146514A (zh) 2021-12-16
TWI885109B true TWI885109B (zh) 2025-06-01

Family

ID=77929980

Family Applications (1)

Application Number Title Priority Date Filing Date
TW110111336A TWI885109B (zh) 2020-03-30 2021-03-29 聚酯、薄膜、黏接劑組成物、黏接片、疊層體、以及印刷配線板

Country Status (5)

Country Link
JP (4) JP7001208B1 (enExample)
KR (1) KR20220161323A (enExample)
CN (1) CN115298244B (enExample)
TW (1) TWI885109B (enExample)
WO (1) WO2021200715A1 (enExample)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7223300B2 (ja) * 2020-09-18 2023-02-16 三菱ケミカル株式会社 ポリエステル系樹脂、接着剤組成物及び接着剤
JP7173252B2 (ja) * 2020-09-24 2022-11-16 三菱ケミカル株式会社 粘着剤組成物、粘着剤及び粘着剤層

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012207207A (ja) * 2011-03-16 2012-10-25 Toyobo Co Ltd バイオマスプラスチック塗料
CN110891620A (zh) * 2017-05-30 2020-03-17 赢创加拿大公司 具有改性表面的人工瓣膜

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01221469A (ja) * 1988-02-29 1989-09-04 Nippon Paint Co Ltd 粉体塗料用樹脂組成物
JPH06104813A (ja) 1992-09-18 1994-04-15 Canon Inc 無線電話機
JP3324159B2 (ja) * 1992-10-16 2002-09-17 東洋紡績株式会社 熱可塑性ポリエステルエラストマー
JP2011048926A (ja) * 2009-08-25 2011-03-10 Teijin Fibers Ltd 電線被覆材
JP5443099B2 (ja) * 2009-08-25 2014-03-19 帝人株式会社 ポリエステル樹脂組成物およびその製造方法ならびに成形体
JP5657990B2 (ja) * 2009-10-14 2015-01-21 三井化学株式会社 ラミネート用接着剤
CN107075335B (zh) 2014-09-24 2020-02-14 东亚合成株式会社 粘接剂组合物和使用了其的带有粘接剂层的层叠体
CA3064294A1 (en) * 2017-05-30 2018-12-06 Evonik Canada Inc. Vascular grafts having a modified surface
KR102860051B1 (ko) * 2019-10-23 2025-09-16 미쯔비시 케미컬 주식회사 플렉시블 프린트 배선판용 접착제 조성물, 플렉시블 프린트 배선판용 접착제 및 플렉시블 프린트 배선판

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012207207A (ja) * 2011-03-16 2012-10-25 Toyobo Co Ltd バイオマスプラスチック塗料
CN110891620A (zh) * 2017-05-30 2020-03-17 赢创加拿大公司 具有改性表面的人工瓣膜

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Publication number Publication date
JP7405298B2 (ja) 2023-12-26
JP2022050434A (ja) 2022-03-30
JP7001208B1 (ja) 2022-01-19
JPWO2021200715A1 (enExample) 2021-10-07
TW202146514A (zh) 2021-12-16
CN115298244B (zh) 2024-10-11
JP2023107770A (ja) 2023-08-03
CN115298244A (zh) 2022-11-04
JP2023107771A (ja) 2023-08-03
JP7405297B2 (ja) 2023-12-26
KR20220161323A (ko) 2022-12-06
JP7326417B2 (ja) 2023-08-15
WO2021200715A1 (ja) 2021-10-07

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