CN115244699A - 显示面板及其制作方法 - Google Patents
显示面板及其制作方法 Download PDFInfo
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- CN115244699A CN115244699A CN202080003556.XA CN202080003556A CN115244699A CN 115244699 A CN115244699 A CN 115244699A CN 202080003556 A CN202080003556 A CN 202080003556A CN 115244699 A CN115244699 A CN 115244699A
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- edge
- protective layer
- display panel
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- bending part
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 30
- 238000005452 bending Methods 0.000 claims abstract description 188
- 239000010410 layer Substances 0.000 claims abstract description 159
- 239000011241 protective layer Substances 0.000 claims abstract description 159
- 239000000758 substrate Substances 0.000 claims abstract description 92
- 238000000034 method Methods 0.000 claims abstract description 20
- 239000000463 material Substances 0.000 claims description 52
- 230000017525 heat dissipation Effects 0.000 claims description 22
- 239000000084 colloidal system Substances 0.000 claims description 15
- 239000012790 adhesive layer Substances 0.000 claims description 14
- 230000009194 climbing Effects 0.000 claims description 11
- 230000003247 decreasing effect Effects 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 11
- 238000000576 coating method Methods 0.000 description 7
- 239000011248 coating agent Substances 0.000 description 6
- 230000000694 effects Effects 0.000 description 5
- 239000004642 Polyimide Substances 0.000 description 4
- 230000007423 decrease Effects 0.000 description 4
- 229920001721 polyimide Polymers 0.000 description 4
- 238000001514 detection method Methods 0.000 description 3
- 239000003292 glue Substances 0.000 description 3
- 238000003825 pressing Methods 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 239000003054 catalyst Substances 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 230000007935 neutral effect Effects 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 230000006978 adaptation Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000004132 cross linking Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000006260 foam Substances 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000003504 photosensitizing agent Substances 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 239000000047 product Substances 0.000 description 1
- 239000011265 semifinished product Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 230000008093 supporting effect Effects 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/82—Interconnections, e.g. terminals
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
- H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
- H01L27/1218—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs with a particular composition or structure of the substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
- H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
- H01L27/1259—Multistep manufacturing methods
- H01L27/1262—Multistep manufacturing methods with a particular formation, treatment or coating of the substrate
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/40—OLEDs integrated with touch screens
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/87—Passivation; Containers; Encapsulations
- H10K59/873—Encapsulations
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/8794—Arrangements for heating and cooling
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Electroluminescent Light Sources (AREA)
Abstract
一种显示面板及其制作方法，该显示面板包括：阵列基板、功能膜层(4)、保护层(02)，阵列基板包括显示部(11)、弯曲部(12)，弯曲部(12)连接于显示部(11)的一侧；功能膜层(4)设置于显示部(11)的一侧；保护层(02)覆盖于弯曲部(12)上，且保护层(02)和功能膜层(4)位于阵列基板的同一侧面，保护层(02)包括：第一弯曲部(21)、第二弯曲部(22)，第一弯曲部(21)与功能膜层(4)相邻设置；第二弯曲部(22)连接于第一弯曲部(21)远离功能膜层(4)的一侧，在保护层(02)中，第二弯曲部(22)远离第一弯曲部(21)的边沿(222)与功能膜层(4)在第一方向(X)上的距离最大，其中，所述第一方向(X)垂直于所述显示部(11)和所述弯曲部(12)的交界面；其中，所述第一弯曲部(21)的最大厚度与所述第二弯曲部(22)的最小厚度的差值小于等于0.05毫米。
Description
PCT国内申请，说明书已公开。
Claims (20)
- PCT国内申请，权利要求书已公开。
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/CN2020/138624 WO2022133804A1 (zh) | 2020-12-23 | 2020-12-23 | 显示面板及其制作方法 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN115244699A true CN115244699A (zh) | 2022-10-25 |
Family
ID=82157100
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202080003556.XA Pending CN115244699A (zh) | 2020-12-23 | 2020-12-23 | 显示面板及其制作方法 |
Country Status (3)
| Country | Link |
|---|---|
| US (1) | US20220399375A1 (zh) |
| CN (1) | CN115244699A (zh) |
| WO (1) | WO2022133804A1 (zh) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116092378A (zh) * | 2022-11-28 | 2023-05-09 | 上海天马微电子有限公司 | 显示模组及其制备方法、显示装置 |
Family Cites Families (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR102399568B1 (ko) * | 2015-09-23 | 2022-05-19 | 삼성디스플레이 주식회사 | 폴딩 가능한 디스플레이 장치 및 그 제조방법 |
| CN105976718B (zh) * | 2016-07-20 | 2019-11-26 | 武汉华星光电技术有限公司 | 显示面板及其显示器 |
| CN105977400B (zh) * | 2016-07-21 | 2018-01-26 | 京东方科技集团股份有限公司 | 一种显示面板及其制备方法、显示装置 |
| US10321562B2 (en) * | 2016-07-22 | 2019-06-11 | Lg Innotek Co., Ltd | Flexible circuit board, COF module and electronic device comprising the same |
| US10522783B2 (en) * | 2016-09-30 | 2019-12-31 | Lg Display Co., Ltd. | Flexible display including protective coating layer having different thickness in bend section |
| JP2019060906A (ja) * | 2017-09-22 | 2019-04-18 | 株式会社ジャパンディスプレイ | 表示装置 |
| KR102508668B1 (ko) * | 2017-11-24 | 2023-03-13 | 삼성디스플레이 주식회사 | 표시장치 및 이의 제조방법 |
| CN108052233B (zh) * | 2018-01-03 | 2021-03-19 | 上海天马微电子有限公司 | 一种显示面板和显示装置 |
| KR102545660B1 (ko) * | 2018-03-09 | 2023-06-22 | 삼성디스플레이 주식회사 | 표시장치 및 그의 제조방법 |
| KR20200110494A (ko) * | 2019-03-13 | 2020-09-24 | 삼성디스플레이 주식회사 | 표시 장치 및 표시 장치 제조 방법 |
| CN111509017B (zh) * | 2020-04-28 | 2024-04-16 | 京东方科技集团股份有限公司 | 柔性显示基板及其制备方法、柔性显示面板 |
-
2020
- 2020-12-23 CN CN202080003556.XA patent/CN115244699A/zh active Pending
- 2020-12-23 WO PCT/CN2020/138624 patent/WO2022133804A1/zh unknown
- 2020-12-23 US US17/601,133 patent/US20220399375A1/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116092378A (zh) * | 2022-11-28 | 2023-05-09 | 上海天马微电子有限公司 | 显示模组及其制备方法、显示装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2022133804A1 (zh) | 2022-06-30 |
| US20220399375A1 (en) | 2022-12-15 |
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