WO2022133804A1 - 显示面板及其制作方法 - Google Patents

显示面板及其制作方法 Download PDF

Info

Publication number
WO2022133804A1
WO2022133804A1 PCT/CN2020/138624 CN2020138624W WO2022133804A1 WO 2022133804 A1 WO2022133804 A1 WO 2022133804A1 CN 2020138624 W CN2020138624 W CN 2020138624W WO 2022133804 A1 WO2022133804 A1 WO 2022133804A1
Authority
WO
WIPO (PCT)
Prior art keywords
curved portion
protective layer
edge
functional film
array substrate
Prior art date
Application number
PCT/CN2020/138624
Other languages
English (en)
French (fr)
Inventor
王青松
陈立强
石佳凡
王作家
杨阳
Original Assignee
京东方科技集团股份有限公司
成都京东方光电科技有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 京东方科技集团股份有限公司, 成都京东方光电科技有限公司 filed Critical 京东方科技集团股份有限公司
Priority to PCT/CN2020/138624 priority Critical patent/WO2022133804A1/zh
Priority to US17/601,133 priority patent/US20220399375A1/en
Priority to CN202080003556.XA priority patent/CN115244699A/zh
Publication of WO2022133804A1 publication Critical patent/WO2022133804A1/zh

Links

Images

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/82—Interconnections, e.g. terminals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
    • H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
    • H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
    • H01L27/1218—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs with a particular composition or structure of the substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
    • H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
    • H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
    • H01L27/1259—Multistep manufacturing methods
    • H01L27/1262—Multistep manufacturing methods with a particular formation, treatment or coating of the substrate
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/40—OLEDs integrated with touch screens
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/873—Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/8794—Arrangements for heating and cooling

Definitions

  • the present disclosure relates to the field of display technology, and in particular, to a display panel and a manufacturing method thereof.
  • the flexible array substrate generally includes a display part, a binding part, and a bending part connected between the display part and the binding part.
  • the display part is provided with a functional film layer, and a protective layer needs to be set on the binding part to protect the binding part. integrated circuit.
  • a protective layer is usually coated on the curved part first and then the functional film layer is pasted on the display part.
  • the coating tolerance of the protective layer and the functional film A certain gap needs to be reserved between the functional film layer and the protective layer during design, so the display panel in the prior art has a larger frame.
  • a display panel includes: an array substrate, a functional film layer, a protective layer, and a cover plate.
  • the array substrate includes a display part and a bending part, and the bending part is connected to one side of the display part; the functional film layer is arranged on one side of the display part, and the functional film layer includes a filter layer and a touch layer.
  • At least one of: a protective layer covering the curved portion, and the protective layer and the functional film layer are located on the same side of the array substrate, and the protective layer includes: a first curved portion, a second curved portion .
  • the first curved portion is disposed adjacent to the functional film layer; the second curved portion is connected to the side of the first curved portion away from the functional film layer, and the second curved portion includes a portion away from the first curved portion
  • the distance between the second edge and the functional film layer in the first direction is the largest, wherein the first direction is perpendicular to the display part and the curved part The interface; wherein, the difference between the maximum thickness of the first curved portion and the minimum thickness of the second curved portion is less than or equal to 0.05 mm.
  • the cover plate is located on the side of the functional film layer away from the array substrate.
  • the maximum thickness of the first curved portion is greater than or equal to 0.13 mm and less than or equal to 0.15 mm, and the minimum thickness of the second curved portion is greater than or equal to 0.08 mm and less than or equal to 0.1 mm.
  • the array substrate further includes a binding portion, the bending portion is connected between the display portion and the binding portion, and the display panel further includes: a chip, a first bottom film , the second base film, the chip is bound to the binding part, and the chip and the functional film layer are located on the same side of the array substrate; the first base film is located in the display part away from the functional film layer The second bottom film is located on the side of the binding part away from the chip; the first curved part includes a first edge connected with the second curved part; wherein, on the first side upward, the first edge is located between the first bottom film and the second edge, the first edge is located between the second bottom film and the second edge; and the first edge The distance from the first base film in the first direction is less than or equal to the distance between the first edge and the second base film in the first direction.
  • the distance between the edge of the first base film facing the first edge and the edge of the second base film facing the first edge in the first direction is greater than or equal to 0 mm and less than or equal to 0.2 mm.
  • the distance between the first edge and the first base film in the first direction is greater than or equal to 0.125 mm and less than or equal to 0.225 mm;
  • the distance between the two bottom films in the first direction is greater than or equal to 0.125 mm and less than or equal to 0.425 mm.
  • the arc length of the first curved portion is greater than or equal to 0.188 mm and less than or equal to 0.235 mm.
  • the arc length of the second curved portion is greater than or equal to 0.235 mm and less than or equal to 0.285 mm.
  • the binding part is parallel to the display part; in the second direction, the distance from the second edge to the binding part is greater than the distance from the second edge to the The distance of the display part, the second direction is perpendicular to the plane where the display part is located, and the distance from the binding part to the display part is 0.3-0.7 mm.
  • the display panel further includes: a heat dissipation layer and an adhesive layer, the heat dissipation layer is located on a side of the first base film away from the display part; the adhesive layer is located on the second bottom film between the bottom film and the heat dissipation layer.
  • a distance between the heat dissipation layer and the first edge in the first direction is smaller than a distance between the adhesive layer and the first edge in the first direction .
  • the thickness of the first curved portion gradually decreases from the edge close to the functional film layer to the side away from the functional film layer; the thickness of the second curved portion The edge on the side close to the first curved portion gradually decreases toward the edge on the side away from the first curved portion.
  • the protective layer further includes a third curved portion connected to a side of the second curved portion away from the first curved portion, the third curved portion The thickness gradually increases from a side edge close to the second curved portion to a side edge away from the second curved portion.
  • a display panel wherein the display panel includes: an array substrate, a functional film layer, a protective layer, and a cover plate, the array substrate includes a display part and a bending part, and the bending part is connected to the one side of the display part; the functional film layer is arranged on one side of the display part, the functional film layer includes at least one of a filter layer and a touch layer; a protective layer covers the curved part , and the protective layer and the functional film layer are located on the same side of the array substrate, the protective layer includes: a first curved part and a second curved part, the first curved part is arranged adjacent to the functional film layer ; The second curved portion is connected to the side of the first curved portion away from the functional film layer, the second curved portion includes a second edge away from the first curved portion, and in the protective layer, the The distance between the second edge and the functional film layer in the first direction is the largest, wherein the first direction is perpendicular to the
  • a method for fabricating a display panel comprising:
  • a flexible array substrate is provided, the array substrate is a flat plate structure, and the array substrate includes a display part, a binding part and a bending part connected between the display part and the binding part;
  • the protective layer and the functional film layer are located on the same side of the array substrate, and the orthographic projection of the protective layer on the array substrate is located on the curved portion;
  • the protective layer includes a first curved portion on a side close to the functional film layer, and a second curved portion on a side of the first curved portion away from the functional film layer, and the first curved portion
  • the stiffness is less than the stiffness of the second bending portion
  • the bent portion is bent so that the binding portion is located on the side of the display portion away from the display side thereof.
  • the thickness of the first curved portion is smaller than the thickness of the second curved portion.
  • forming a protective layer on the array substrate includes:
  • a protective layer material with uniform thickness is formed on the array substrate for many times, and multiple layers of the protective layer material are used to form the protective layer;
  • the number of times of forming the protective layer material on the first curved portion is less than the number of times of forming the protective layer material on the second curved portion.
  • forming a protective layer on the array substrate includes:
  • the first curved portion is located in the climbing area of the protective layer material.
  • the elastic modulus of the first curved portion is smaller than the elastic modulus of the second curved portion.
  • forming a protective layer on the array substrate includes:
  • the protective layer material is cured, wherein the degree of curing of the first curved portion is smaller than that of the second curved portion.
  • forming a protective layer on the array substrate includes:
  • the first curved portion is softened.
  • FIG. 1 is a schematic structural diagram of a semi-finished product of a display panel in the related art
  • FIG. 2 is a schematic structural diagram of a finished display panel in the related art
  • 3 and 4 are process flow diagrams of an exemplary embodiment of a method for fabricating a display panel of the present disclosure
  • FIG. 5 is a process flow diagram of an exemplary embodiment of a method for fabricating a display panel of the present disclosure
  • FIG. 6 is a process flow diagram of an exemplary embodiment of a method for fabricating a display panel of the present disclosure
  • FIG. 7 is a process flow diagram of an exemplary embodiment of a method for fabricating a display panel of the present disclosure
  • FIGS. 8 and 9 are process flow diagrams of another exemplary embodiment of the method for fabricating a display panel of the present disclosure.
  • FIG. 10 is a schematic structural diagram of an exemplary embodiment of a display panel of the present disclosure.
  • FIG. 11 is a schematic structural diagram of another exemplary embodiment of a display panel of the present disclosure.
  • Example embodiments will now be described more fully with reference to the accompanying drawings.
  • Example embodiments can be embodied in various forms and should not be construed as limited to the examples set forth herein; rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the concept of example embodiments to those skilled in the art.
  • the same reference numerals in the drawings denote the same or similar structures, and thus their detailed descriptions will be omitted.
  • FIG. 1 is a schematic structural diagram of a semi-finished display panel in the related art
  • FIG. 2 is a structural schematic diagram of a finished display panel in the related art
  • the display panel may include a flexible array substrate, a functional film layer 04, and a protective layer 02 (MCL, Metal Coating Layer).
  • the flexible array substrate may include a display part 011 , a bending part 012 , and a binding part 013 .
  • the protective layer 02 can cover the curved part 012
  • the functional film layer 04 can be attached to the display part 011 .
  • the binding part 013 can be used to bind the chip 03 .
  • the display panel may further include a first base film 071, a second base film 072, a heat dissipation layer 08, an adhesive layer 09, a cover plate 06, an adhesive layer 05 bonded between the cover plate 06 and the functional film layer 04,
  • the functional film layer 04 may include at least one of a filter layer or a touch control layer, for example, the functional film layer 04 may be a polarizer.
  • the protective layer 02 can adjust the position of the neutral layer of the bending part, so that the neutral layer is located at the position of the metal wiring layer of the bending part, so as to reduce the breakage of the metal wiring layer of the bending part during the bending process possibility.
  • the material of the cover plate 06 may be polyimide (PI), glass, or the like.
  • the protective layer 02 is usually coated on the curved portion 012 first, and then the functional film layer 04 is pasted on the display portion 011.
  • the functional film layer 04 it is necessary to pre-set between the functional film layer 04 and the protective layer 02 during design. A certain gap is left so that the display panel will have a wider lower bezel.
  • the functional film layer 04 may be attached to the display portion 011 first, and then the protective layer 02 may be coated on the curved portion 012 .
  • the functional film layer 04 has a siphon effect on the colloidal material used to form the protective layer 02, the protective layer 02 will locally thicken in the region C close to the functional film layer, and the protective layer 02 is far from the functional film layer in the region C. There will be a thickness difference at the edge 021 position of . As shown in FIG.
  • the protective layer 02 after the protective layer 02 is bent with the bending portion 012, due to the different bending stress of the protective layer 02 at different positions, the protective layer 02 will move from its arc top edge 023 (the rightmost position of the arc formed by the protective layer) to the Both sides are thinned, so that the thickness difference of the protective layer at the position of the edge 021 is further increased.
  • the protective layer because the position of the edge 021 is close to the more stable cover 06, in the display panel reliability test, the protective layer is prone to occur at the position of the edge 021. Folding along the edge 021 , that is, the protective layer is easily bent with a smaller bending angle at the position of the edge 021 .
  • the protective layer may further include an edge 024 close to the side of the functional film layer 04 .
  • the reliability test of the binding area may include: pressing the edge 023 to the left through a pressure plate until the circuit breakage occurs on the display panel, recording the moving distance of the pressure plate to the left when the circuit breakage occurs on the display panel, and the display panel
  • the moving distance of the pressing plate to the left when the line breaks can be defined as the reliability value of the reliability test. The larger the reliability value is, the higher the reliability of the display panel is.
  • FIGS. 3 and 4 are flowcharts of an exemplary embodiment of the method for manufacturing a display panel of the present disclosure.
  • Can include:
  • step S1 providing a flexible array substrate, the array substrate can be a flat plate structure, and the array substrate includes a display part 11 , a binding part 13 , and a flexible array substrate connected to the display part 11 and the binding part 13 .
  • Step S2 forming a functional film layer 4 on the array substrate, the orthographic projection of the functional film layer 4 on the array substrate is located on the display portion 11 , wherein the functional film layer 4 may include a filter layer, a touch One or more of the layers, for example, the functional film layer 4 can be a polarizer;
  • Step S3 forming a protective layer on the array substrate, the protective layer and the functional film layer 4 are located on the same side of the array substrate, and the orthographic projection of the protective layer on the array substrate is located on the curved surface part 12; wherein, the orthographic projection of the protective layer on the array substrate may overlap with the curved part 12, that is, the part of the array substrate covered by the orthographic projection of the protective layer forms the curved part 12, and the part of the array not covered by the orthographic projection of the protective layer forms the curved part 12
  • the substrate forms the display portion 11 and the binding portion 13 .
  • the display part 11 and the binding part 13 are respectively connected to opposite sides of the bending part 12 .
  • the protective layer may include a first curved portion 21 on the side close to the functional film layer 4, and a second curved portion 22 on the side of the first curved portion 21 away from the functional film layer.
  • the stiffness of the first curved portion 21 is less than the stiffness of the second curved portion 22;
  • step S4 bending the bending portion 12 so that the binding portion 13 is located on the side of the display portion 11 away from the display side thereof.
  • the stiffness of the first curved portion 21 is smaller than the stiffness of the second curved portion 12 .
  • the present exemplary embodiment reduces the rigidity of the first curved portion 21 . Therefore, in the reliability test, when the moving distance of the baffle is the reliability value shown in FIG. 2 , since the first bending part 21 has higher bending performance, under the bending action of the first bending part 21 , the first bending part 21 will Folding along the first edge 211 does not occur near the first edge 211 of the second curved portion 22 . Therefore, the trust value of the display panel will also increase accordingly.
  • the first edge 211 can be understood as the interface between the first curved portion 21 and the second curved portion 22 .
  • the first curved portion 21 and the second curved portion 22 may be distributed along the first direction X.
  • the protective layer may be formed by coating a protective layer colloidal material on the array substrate, and then curing the colloidal material to form the protective layer.
  • the colloidal material of the protective layer when the colloidal material of the protective layer is coated on the array substrate, since the colloidal material of the protective layer has fluidity, a climbing portion 24 will appear on the edge of the cured protective layer.
  • the second curved portion 22 may be connected between the first curved portion 21 and the climbing portion 24 . As shown in FIG.
  • the protective layer may further include a third curved portion 23 , and the third curved portion 23 may be connected between the second curved portion 22 and the climbing portion 24 .
  • the first curved portion 21 may include a third edge 213 adjacent to the functional film layer 4
  • the second curved portion 22 may include a second edge 222 on a side away from the first curved portion 21 .
  • the third curved portion 23 may include a fourth edge 234 remote from the second curved portion 22 . As shown in FIG.
  • the second edge 222 of the second curved portion 22 may be located at the top of the arc formed by the protective layer, that is, in the protective layer, the second edge 222 and the functional film layer 4
  • the distance in the first direction X is the largest.
  • the second edge 222 can be understood as the interface between the second curved portion 22 and the third curved portion 23
  • the third edge 213 can be understood as the interface between the first curved portion 21 and the functional film layer 4 .
  • the dimension of the first curved portion 21 in the first direction X may be equal to the arc distance between the position of the edge 024 and the edge 021 in FIG. 2 . That is, after the protective layer is bent, the first edge 211 of the first curved portion 21 may be located at the position where the protective layer should be folded. Since the stiffness of the first curved portion 21 is smaller than that of the second curved portion 22 before the first curved portion 21 is curved, after the first curved portion 21 is curved, the difference in stiffness of the protective layer on both sides of the first edge 211 is compared to Fig.
  • the stiffness difference of the protective layer on both sides of the edge 021 is small, so in the reliability test, the first edge 211 is not easily folded, and the folded position will move toward the third edge 213. Because the third edge 213 is close to the display The structure of the display part 11 side is relatively stable, so the display panel manufactured by the display panel manufacturing method is more reliable.
  • the size of the first curved portion 21 in the first direction X may also be slightly larger than the arc distance between the edge 021 and the edge 024 of the protective layer in FIG. 2 , or slightly smaller than The arc distance between the edge 021 and the edge 024 of the protective layer in FIG. 2 belongs to the protection scope of the present disclosure.
  • the method for obtaining the size of the first bending portion 21 in the first direction X may be: performing reliability detection on a plurality of display panels respectively, and obtaining the positions where the lines of the array substrate are broken in each display panel, Observe the protective layer near the location where the trace breaks on the array substrate, obtain the position with the larger thickness difference of the protective layer near the line break, measure the arc length from the position with the larger thickness difference on the protective layer to the side close to the functional film layer, and Calculate the average of each of the above arc lengths.
  • the average value may be the dimension of the first curved portion 21 in the first direction X. Wherein, the position where the traces of the array substrate are broken can be obtained through the detection circuit.
  • the curved part 12 in the array substrate can be glued and sliced (injected epoxy resin and cured with a curing agent, and then polished the cross-section), and then the cross-section of the curved part 12 can be observed through a microscope , in order to obtain the position where the thickness difference of the protective layer is large near the position where the trace is broken.
  • the number of display panels for reliability detection may be 16, 32, or the like.
  • FIGS. 5 and 6 it is a process flow diagram of an exemplary embodiment of a method for manufacturing a display panel of the present disclosure.
  • One way to realize that the stiffness of the first curved portion 21 is smaller than the stiffness of the second curved portion 22 may be that the thickness of the first curved portion 21 is smaller than the thickness of the second curved portion 22 .
  • the thickness of the first curved portion 21 may be 70%-90% of the thickness of the second curved portion 22, for example, 70%, 80%, 90%, and the like.
  • the thickness of the first curved portion 21 may be 105 ⁇ 30um
  • the thickness of the second curved portion 22 may be 120 ⁇ 30um. As shown in FIG.
  • FIG. 6 it is a process flow diagram of an exemplary embodiment of a method for fabricating a display panel of the present disclosure.
  • the thickness of the first curved portion 21 is smaller than the thickness of the second curved portion 22 , it can be understood that the average thickness of the first curved portion 21 is smaller than the average thickness of the second curved portion 22 , or the minimum thickness of the first curved portion 21 less than the minimum thickness of the second curved portion 22 .
  • the functional film layer 4 in FIG. 5 also produces a siphon effect on the protective layer adhesive used to form the first curved portion 21 .
  • the thickness of the side of the first curved portion 21 close to the functional film layer 4 may be greater than or equal to or less than the thickness of the second curved portion 22 .
  • the thickness at the third edge 213 may be greater than or equal to or less than the thickness at the fourth edge 234 .
  • the thickness of the first bending portion 21 may gradually decrease from the third edge 213 to the first edge 211 ; the The thickness of the second curved portion 22 may gradually decrease from the side close to the first curved portion 21 to the side away from the first curved portion 21 .
  • the thickness of the third curved portion 23 may gradually increase from the edge close to the second curved portion 22 to the side away from the second curved portion 22 .
  • the difference between the maximum thickness of the first bending portion and the minimum thickness of the second bending portion may be less than or equal to 0.05 mm, for example, the difference between Values can be 0.01mm, 0.02mm, 0.03mm, 0.04mm, 0.05mm.
  • the maximum thickness of the first curved portion 21 may be the thickness at the position of the third edge 213 of the first curved portion 21 .
  • the minimum thickness of the second curved portion may be the thickness at the position of the second edge 222 in the second curved portion 22 .
  • the maximum thickness of the first curved portion may be greater than the minimum thickness of the second curved portion.
  • the arc length of the first curved portion may be greater than or equal to 0.188 mm and less than or equal to 0.235 mm, for example, 0.188 mm, 0.200 mm, and 0.235 mm.
  • the arc length of the second curved portion may be greater than or equal to 0.235 mm and less than or equal to 0.285 mm, for example, 0.235 mm, 0.255 mm, 0.285 mm.
  • the maximum thickness of the first curved portion may be greater than or equal to 0.13 mm and less than or equal to 0.15 mm, for example, the maximum thickness of the first curved portion may be 0.13 mm, 0.135 mm, 0.14 mm, 0.15 mm.
  • the minimum thickness of the second curved portion may be greater than or equal to 0.08 mm and less than or equal to 0.1 mm.
  • the minimum thickness of the second curved portion may be 0.08 mm, 0.09 mm, 0.1 mm.
  • the protective layer may be an MCL adhesive layer.
  • the distance from the binding portion 13 to the display portion 11 may be 0.3-0.7 mm, for example, 0.3 mm, 0.4 mm, 0.5 mm, 0.6 mm, 0.7 mm.
  • the distance from the binding part 13 to the display part 11 can be understood as the distance from the side of the binding part 13 facing the display part 11 to the side of the display part 11 facing the binding part 13 .
  • one way to realize that the thickness of the first curved portion is smaller than the thickness of the second curved portion may be to form a protective layer material with uniform thickness on the array substrate for multiple times, and the protective layer is multi-layered. Materials can be used to form the protective layer. Wherein, the number of times of forming the protective layer material on the first curved portion 21 may be less than the number of times of forming the protective layer material on the second curved portion 22 .
  • the thickness of the first curved portion is smaller than that of the second curved portion, for example, a coating process is used to form a protective layer, and when the coating component is displaced to the first When the first curved portion 21 is located, the thickness of the first curved portion 21 can be reduced by reducing the discharge amount of the coating component.
  • the size of the protective layer climbing area in the first direction is generally about 400um.
  • the size of the first curved portion 21 in each display panel in the first direction is smaller than the size of the climbing area in the first direction .
  • FIG. 7 a process flow diagram of an exemplary embodiment of a method for manufacturing a display panel of the present disclosure is shown.
  • Forming the protective layer on the array substrate may include: forming a colloidal protective layer material on the array substrate, where the protective layer material is used to form the protective layer.
  • the first curved portion 21 may be located in the climbing area of the protective layer material.
  • the coating position can be controlled so that the first curved portion 21 is located in the climbing area of the protective layer material, while ensuring that the protective layer material flows to the functional film layer 4 .
  • the functional film layer 4 in FIG. 7 also produces a siphon effect on the protective layer adhesive used to form the first curved portion 21 .
  • the thickness of the side of the first curved portion 21 close to the functional film layer 4 may be greater than or equal to or less than the thickness of the second curved portion 22 .
  • the thickness at the third edge 213 may be greater than or equal to or less than the thickness at the fourth edge 234 .
  • FIG. 9 there are other ways to realize that the stiffness of the first curved portion is smaller than that of the second curved portion.
  • Figures 8 and 9 are process flow diagrams of another exemplary embodiment of the method for manufacturing a display panel of the present disclosure.
  • the way to realize that the stiffness of the first curved portion 21 is lower than the stiffness of the second curved portion 22 may also be that the elastic modulus of the first curved portion 21 is smaller than that of the second curved portion 22 .
  • FIG. 9 after the protective layer is bent, although a large thickness difference still occurs at the first edge 211 , the elastic modulus of the first curved portion 21 is smaller than that of the second curved portion 22 .
  • the first edge 211 is not easily folded. At the same time, the folded position will move to the direction of the third edge 213. Since the third edge 213 is close to the side of the display part 11, and the structure of the side of the display part 11 is more stable, the display panel manufactured by the display panel manufacturing method is reliable Sex is higher.
  • one way to realize that the elastic modulus of the first bending portion 21 is smaller than the elastic modulus of the second bending portion 22 may be to form a colloidal protective layer material on the array substrate ; Perform curing treatment on the protective layer material, wherein the curing degree of the first curved portion 21 is less than that of the second curved portion 22 .
  • the protective layer material may be a resin material, and the resin material may contain a photoinitiator or a photosensitizer. After absorbing ultraviolet (UV) light irradiation, the protective layer material will generate active free radicals, thereby triggering the Polymerization, cross-linking, and grafting reactions, in turn, convert the resin from a colloid to a solid state in seconds.
  • UV ultraviolet
  • the method of curing the protective layer material may be to irradiate the protective layer material with an ultraviolet lamp.
  • the curing degree of the protective layer material is positively correlated with the power and irradiation time of the ultraviolet lamp. Therefore, by adjusting the power and/or irradiation time of the ultraviolet lamp, different curing degrees of the first curved portion 21 and the second curved portion 22 can be achieved.
  • the present exemplary embodiment can reduce the degree of curing of the first curved portion 21 by reducing the duration of ultraviolet irradiation of the first curved portion 21 or reducing the ultraviolet irradiation power of the first curved portion 21 to reduce the first curved portion 21 . Modulus of elasticity of 21.
  • the elastic modulus of the first bending portion 21 is smaller than the elastic modulus of the second bending portion 22 .
  • a catalyst can be coated on the first curved portion 21, and the catalyst can destroy the molecular chain structure in the first curved portion 21, thereby realizing the first curved portion 21. Softening effect of the curved portion 21 .
  • the display panel manufacturing method may further include: forming the display portion 11 on the first bottom film 71 , binding the The cover 13 is formed on the second base film 72; the cover plate 6 is bonded on the side of the functional film layer 4 away from the array substrate through the adhesive layer 5; the heat dissipation layer is formed on the side of the first base film 71 away from the array substrate 8; forming an adhesive layer 9 on the side of the heat dissipation layer 8 away from the base substrate; forming a chip 3 on the binding portion 13 .
  • the material of the cover plate 6 may be polyimide (PI), glass, or the like.
  • the stiffness of the first curved portion can also be adjusted by simultaneously adjusting the thickness and the elastic modulus of the first curved portion.
  • the exemplary embodiment also provides a display panel, as shown in FIG. 10 , which is a schematic structural diagram of an exemplary embodiment of the display panel of the present disclosure.
  • the display panel may include: an array substrate, a functional film layer 4, and a protective layer.
  • the array substrate may include a display portion 11 and a curved portion 12, the curved portion 12 is connected to one side of the display portion 11; the functional film layer 4 is arranged on one side of the display portion 11; a protective layer covers the curved portion
  • the protective layer and the functional film layer 4 are located on the same side of the array substrate.
  • the protective layer may include: a first curved portion 21 and a second curved portion 22 .
  • the first curved portion 21 is disposed adjacent to the functional film layer 4; the second curved portion 22 is connected to the side of the first curved portion 21 away from the functional film layer 4, and the second curved portion 22 may include The second edge 222 away from the first curved portion, in the protective layer, the second edge 222 of the second curved portion 22 away from the first curved portion 21 and the functional film layer 4 are located in the protective layer.
  • the distance in the first direction X is the largest, wherein the first direction is perpendicular to the interface between the display part and the bending part, that is, the first direction is parallel to the plane where the display part 11 is located.
  • the array substrate may be a flexible array substrate, and the functional film layer 4 may include one or more of a filter layer and a touch control layer.
  • the functional film layer 4 may be a polarizer.
  • the display panel provided by this exemplary embodiment can be obtained by the manufacturing method shown in FIG. 5 , 6 or FIG. 7 .
  • the thickness of the first bent portion is smaller than the thickness of the second bent portion.
  • the maximum thickness of the first bent portion will decrease accordingly, and the second The maximum thickness of the bend is substantially unchanged.
  • the difference between the maximum thickness of the first curved portion and the minimum thickness of the second curved portion may be less than or equal to 0.05 mm, for example, the difference may be 0.01 mm, 0.02 mm, 0.03 mm, 0.04 mm, 0.05 mm mm.
  • the maximum thickness of the first curved portion 21 may be the thickness at the position of the third edge 213 of the first curved portion 21 .
  • the minimum thickness of the second curved portion may be the thickness at the position of the second edge 222 in the second curved portion 22 .
  • the maximum thickness of the first curved portion may be greater than the minimum thickness of the second curved portion.
  • the protective layer and the functional film layer 4 are located on the same side of the array substrate. It can be understood that the protective layer and the functional film layer 4 are located on the same side of the array substrate.
  • the functional film layer 4 is disposed on one side of the display portion 11 , and it can be understood that the orthographic projection of the functional film layer 4 on the array substrate is located on the display portion 11 .
  • the first curved portion 21 may include a first edge 211 connected to the second curved portion 22 and a third edge 213 adjacent to the functional film layer 4 .
  • the protective layer has a smaller thickness step at the first edge 211 of the first curved portion 21 .
  • the first edge 211 is not easily folded, and the folded position will move to the third edge 213. Since the third edge 213 is close to the display part 11 side, the structure of the display part 11 side is more stable. Therefore, The display panel manufactured by the display panel manufacturing method has higher reliability.
  • the first edge 211 can be understood as the interface between the first curved part 21 and the second curved part 22
  • the third edge can be understood as the interface between the first curved part 21 and the functional film layer 4 .
  • the maximum thickness of the first curved portion may be greater than or equal to 0.12 mm and less than or equal to 0.135 mm, for example, 0.12 mm, 0.13 mm, and 0.135 mm.
  • the maximum thickness of the second curved portion may be greater than or equal to 0.09 mm and less than or equal to 0.105 mm, for example, 0.09 mm, 0.1 mm, 0.105 mm.
  • the protective layer may be an MCL adhesive layer.
  • the thickness of the first curved portion 21 can be from the third edge 213 on the side close to the functional film layer to the first curved portion 21 on the side away from the functional film layer.
  • the edge 211 gradually decreases; the thickness of the second curved portion 22 gradually decreases from the edge on the side close to the first curved portion 21 to the edge 222 on the side away from the first curved portion 21 .
  • the protective layer may further include a third curved portion 23 and a climbing portion 24 , and the third curved portion 23 may be connected to the second curved portion 22 away from the first curved portion 23 .
  • the climbing portion 24 can be connected to the side of the third curved portion 23 away from the second curved portion 22 .
  • the third curved portion 23 may include a fourth edge 234 away from the second curved portion 22 , and the thickness of the third curved portion 23 may gradually increase from a side edge close to the second curved portion 22 to the fourth edge 234 . big.
  • the thickness at the third edge 213 may be greater than equal to or less than the thickness at the location of the fourth edge 234 .
  • the second edge 222 can be understood as the interface between the second curved portion 22 and the third curved portion 23 .
  • the fourth edge 234 is understood as the interface between the third curved portion 23 and the climbing portion 24 .
  • the array substrate may further include a binding portion 13 , and the binding portion 13 may be parallel to the display portion 11 .
  • the bending part 12 is connected between the display part 11 and the binding part 13
  • the display panel may further include: a chip 3 , a first bottom film 71 , and a second bottom film 72 , and the chip 3 can be bound to the the binding part 13, and the chip 3 and the functional film layer 4 can be located on the same side of the array substrate; the first bottom film 71 can be located on the side of the display part away from the functional film layer 4;
  • the second bottom film 72 may be located on the side of the binding portion 13 away from the chip 3 .
  • the first edge 211 may be located between the first base film 71 and the second edge 222, and the first edge 211 may be located at the second base film 72 and the second edge 222; and the distance S1 between the first edge 211 and the first bottom film 71 in the first direction X is less than or equal to the first edge 211 and the second The distance S2 of the bottom film 72 in the first direction X.
  • the distance S4 between the second edge 222 and the binding portion 13 in the second direction Y is greater than the distance S4 between the second edge 222 and the display portion 11 in the second direction Y distance S5, the second direction Y may be perpendicular to the plane where the display part 11 is located.
  • the second edge 222 is located at the midpoint of the third edge 213 and the fourth edge 234 and is offset to the side of the third edge 213, so that the position of the first edge 211 can have a larger bending radius, that is, during the reliability test, the first edge The position of the edge 211 is less prone to folding.
  • the first edge 211 may include a position point 2111 in contact with the curved portion 12
  • the second edge 222 may include a position point 2221 in contact with the curved portion 12
  • the edge of the first bottom film 71 facing the first edge 211 includes a position point 711, which is in contact with the flexible array substrate
  • the edge of the second bottom film 72 facing the first edge 211 includes a position point 721, which is connected to the flexible array substrate.
  • the binding portion 13 includes a side surface 131 facing the side of the second base film 72
  • the display portion 11 includes a side surface 111 facing the side of the first base film 71 .
  • the distance between the first edge 211 and the first bottom film 71 in the first direction X can be understood as the distance from the position point 2111 to the first plane where the position point 711 is located. One direction is vertical.
  • the distance between the first edge 211 and the second bottom film 72 in the first direction X can be understood as the distance from the position point 2111 to the second plane where the position point 721 is located, and the second plane is perpendicular to the first direction X .
  • the distance between the second edge 222 and the binding portion 13 in the second direction Y can be understood as the distance between the position point 2221 and the plane where the side surface 131 is located.
  • the distance between the second edge 222 and the display portion 11 in the second direction Y can be understood as the distance between the position point 2221 and the plane where the side surface 111 is located.
  • the edge of the first bottom film 71 facing the first edge 211 and the edge of the second bottom film 72 facing the first edge 211 are in the first
  • the distance S3 in one direction may be greater than or equal to 0 mm and less than or equal to 0.2 mm, for example, 0 mm, 0.1 mm, 0.2 mm.
  • the distance between the first edge 211 and the first bottom film 71 in the first direction may be greater than or equal to 0.125 mm and less than or equal to 0.225 mm, for example, 0.125 mm, 0.155 mm, and 0.225 mm.
  • the distance between the first edge 211 and the second bottom film 72 in the first direction may be greater than or equal to 0.125 mm and less than or equal to 0.425 mm, for example, 0.125 mm, 0.225 mm, 0.325 mm, 0.425 mm.
  • the distance in the first direction between the edge of the first bottom film 71 facing the first edge 211 and the edge of the second bottom film 72 facing the first edge 211 in the first direction can be understood is the distance between the first plane where the position point 711 is located and the second plane where the position point 721 is located, wherein the first plane and the second plane are both perpendicular to the first direction.
  • the arc length of the first curved portion 21 may be greater than or equal to 0.188 mm and less than or equal to 0.235 mm, for example, 0.188 mm, 0.215 mm, and 0.235 mm.
  • the arc length of the second curved portion 22 may be greater than or equal to 0.235 mm and less than or equal to 0.285 mm, for example, 0.235 mm, 0.255 mm, and 0.285 mm.
  • the distance from the binding portion 13 to the display portion 11 may be 0.3-0.7 mm, for example, 0.3 mm, 0.4 mm, 0.5 mm, 0.6 mm, 0.7 mm.
  • the distance from the binding part 13 to the display part 11 can be understood as the distance from the side of the binding part 13 facing the display part 11 to the side of the display part 11 facing the binding part 13 .
  • the reliability value of the display panel can reach 215um ⁇ 225um in the reliability test.
  • the display panel further includes: a heat dissipation layer 8 and an adhesive layer 9 , and the heat dissipation layer 8 may be located on the side of the first bottom film 71 away from the display portion 11 . ;
  • the adhesive layer 9 may be located between the second bottom film 72 and the heat dissipation layer 8 .
  • the heat dissipation layer 8 may have certain elasticity, which may be used to improve the shock resistance of the display panel, and the material of the heat dissipation layer 8 may be ultra-clean foam.
  • the heat dissipation layer 8 can also adjust the distance between the binding part 13 and the display part 11 through its own thickness, so as to adjust the bending radius of the bending part 12 .
  • the adhesive layer 9 can be used to fix the heat dissipation layer 8 and the second base film 72 .
  • the adhesive layer 9 needs to be completely attached to the heat dissipation layer 8 in order to achieve a better supporting effect and provide the reliability of the display panel.
  • This design enables the adhesive layer 9 to be completely attached to the heat dissipation layer 8 in the presence of attachment tolerances.
  • the exemplary embodiment further provides a display panel, as shown in FIG. 11 , which is a schematic structural diagram of another exemplary embodiment of the display panel of the present disclosure.
  • the display panel can be manufactured by the manufacturing method of the display panel shown in FIGS. 8 and 9 above.
  • the display panel may include: an array substrate, a functional film layer 4, and a protective layer.
  • the array substrate may include a display portion 11 and a curved portion 12, and the curved portion 12 is connected to one side of the display portion 11; the functional film layer 4 is arranged on one side of the display part 11; a protective layer covers the curved part, and the protective layer and the functional film layer 4 are located on the same side of the array substrate; the protective layer includes: a first Bending part 21 and second bending part 22, the first bending part 21 is arranged adjacent to the functional film layer 4; the second bending part 22 is connected to the side of the first bending part 21 away from the functional film layer 4 , the edge of the second curved portion 22 away from the first curved portion 21 is located at the top of the arc formed by the protective layer, that is, in the protective layer, the second curved portion 22 is far away from the first curved portion 21.
  • the distance between the second edge 222 of a curved portion 21 and the functional film layer 4 in the first direction X is the largest, wherein the first direction is perpendicular to the interface between the display portion and the curved portion, That is, the first direction is parallel to the plane where the display portion 11 is located; wherein, the elastic modulus of the first curved portion 21 may be smaller than the elastic modulus of the second curved portion 22 .
  • the first curved part 21 includes a first edge 211 adjacent to the second curved part 22 and a third edge 213 adjacent to the functional film layer.
  • the protective layer may further include a third curved portion 23 and a climbing portion 24 , and the third curved portion 23 may be connected to the second curved portion 22 away from the first curved portion 23 .
  • the climbing portion 24 can be connected to the side of the third curved portion 23 away from the second curved portion 22 .
  • the third curved portion 23 may include a fourth edge 234 away from the second curved portion 22 , and the thickness of the third curved portion 23 may gradually increase from a side edge close to the second curved portion 22 to the fourth edge 234 . big.
  • the functional film layer 4 has a siphon effect on the colloidal material used to form the protective layer, and the thickness of the third edge 213 before the protective layer is bent is greater than the thickness of the fourth edge 234. Therefore, after the protective layer is bent, The thickness at the third edge 213 is also correspondingly larger than the thickness at the fourth edge 234 .
  • the second edge 222 can be understood as the interface between the second curved portion 22 and the third curved portion 23 .
  • the fourth edge 234 is understood as the interface between the third curved portion 23 and the climbing portion 24 .
  • the first edge 211 can be understood as the interface between the first curved portion 21 and the second curved portion 22
  • the third edge can be understood as the interface between the first curved portion 21 and the functional film layer 4 .
  • the first curved portion 21 is bent by itself. Under the action, the first edge 211 is not easily folded. At the same time, the folded position will move to the direction of the third edge 213. Since the third edge 213 is close to the display portion 11 side, the structure of the display portion 11 side is more stable. Therefore, the display panel manufactured by the display panel manufacturing method is reliable. higher.
  • the display panel may further include a first base film 71 , a second base film 72 , a cover plate 6 , an adhesive layer 5 , a heat dissipation layer 8 , an adhesive layer 9 , and a chip 3 .
  • the first base film 71 , the second base film 72 , the cover plate 6 , the adhesive layer 5 , the heat dissipation layer 8 , the adhesive layer 9 , and the chip 3 may have the same structure and positional relationship as the display panel in FIG. 10 .

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Electroluminescent Light Sources (AREA)

Abstract

一种显示面板及其制作方法，该显示面板包括：阵列基板、功能膜层（4）、保护层（02），阵列基板包括显示部（11）、弯曲部（12），弯曲部（12）连接于显示部（11）的一侧；功能膜层（4）设置于显示部（11）的一侧；保护层（02）覆盖于弯曲部（12）上，且保护层（02）和功能膜层（4）位于阵列基板的同一侧面，保护层（02）包括：第一弯曲部（21）、第二弯曲部（22），第一弯曲部（21）与功能膜层（4）相邻设置；第二弯曲部（22）连接于第一弯曲部（21）远离功能膜层（4）的一侧，在保护层（02）中，第二弯曲部（22）远离第一弯曲部（21）的边沿（222）与功能膜层（4）在第一方向（X）上的距离最大，其中，所述第一方向（X）垂直于所述显示部（11）和所述弯曲部（12）的交界面；其中，所述第一弯曲部（21）的最大厚度与所述第二弯曲部（22）的最小厚度的差值小于等于0.05毫米。

Description

显示面板及其制作方法 技术领域
本公开涉及显示技术领域，尤其涉及一种显示面板及其制作方法。
背景技术
柔性阵列基板一般包括有显示部、绑定部和连接于显示部和绑定部之间的弯曲部，显示部上设置有功能膜层，绑定部上需要设置保护层以保护绑定部上集成的线路。现有技术中，通常先在弯曲部涂覆保护层然后再在显示部上贴合功能膜层，为避免功能膜层贴附于保护层上，考虑到保护层的涂布公差和功能膜层的贴合公差，在设计时需要在功能膜层和保护层之间预留一定的间隙，从而现有技术中的显示面板具有较大的边框。
需要说明的是，在上述背景技术部分公开的信息仅用于加强对本公开的背景的理解，因此可以包括不构成对本领域普通技术人员已知的现有技术的信息。
公开内容
根据本公开的一个方面，提供一种显示面板，其中，所述显示面板包括：阵列基板、功能膜层、保护层、盖板。阵列基板包括显示部、弯曲部，所述弯曲部连接于所述显示部的一侧；功能膜层设置于所述显示部的一侧，所述功能膜层包括滤光层、触控层中的至少一种；保护层覆盖于所述弯曲部上，且所述保护层和所述功能膜层位于所述阵列基板的同一侧面，所述保护层包括：第一弯曲部、第二弯曲部。第一弯曲部与所述功能膜层相邻设置；第二弯曲部连接于所述第一弯曲部远离所述功能膜层的一侧，所述第二弯曲部包括远离所述第一弯曲部的第二边沿，在所述保护层中，所述第二边沿与所述功能膜层在第一方向上的距离最大，其中，所述第一方向垂直于所述显示部和所述弯曲部的交界面；其中，所述第一弯曲部的最大厚度与所述第二弯曲部的最小厚度的差值小于等于0.05毫米。所述盖板位于所述功能膜层远离所述阵列基板的一侧。
本公开一种示例性实施例中，所述第一弯曲部的最大厚度大于等于0.13毫米且小于等于0.15毫米，所述第二弯曲部的最小厚度大于等于0.08毫米且小于等于0.1毫米。
本公开一种示例性实施例中，所述阵列基板还包括绑定部，所述弯曲部连接于所述显示部和绑定部之间，所述显示面板还包括：芯片、第一底膜、第二底膜，芯片绑定于所述绑定部，且所述芯片与所述功能膜层位于所述阵列基板的同一侧面；第一底膜位于所述显示部背离所述功能膜层的一侧；第二底膜位于所述绑定部背离所述芯片的一侧；所述第一弯曲部包括与所述第二弯曲部连接的第一边沿；其中，在所述第一方向上，所述第一边沿位于所述第一底膜和所述第二边沿之间，所述第一边沿位于所述第二底膜和所述第二边沿之间；且所述第一边沿与所述第一底膜在所述第一方向上的距离小于等于所述第一边沿与所述第二底膜在所述第一方向上的距离。
本公开一种示例性实施例中，所述第一底膜面向所述第一边沿的边沿与所述第二底膜面向所述第一边沿的边沿在所述第一方向上的距离大于等于0毫米且小于等于0.2毫米。
本公开一种示例性实施例中，所述第一边沿与所述第一底膜在所述第一方向上的距离大于等于0.125毫米且小于等于0.225毫米；所述第一边沿与所述第二底膜在所述第一方向上的距离大于等于0.125毫米且小于等于0.425毫米。
本公开一种示例性实施例中，所述第一弯曲部的弧长大于等于0.188毫米且小于等于0.235毫米。
本公开一种示例性实施例中，所述第二弯曲部的弧长大于等于0.235毫米且小于等于0.285毫米。
本公开一种示例性实施例中，所述绑定部与所述显示部平行；在第二方向上，所述第二边沿到所述绑定部的距离大于所述第二边沿到所述显示部的距离，所述第二方向与所述显示部所在平面垂直，所述绑定部到所述显示部的距离为0.3-0.7毫米。
本公开一种示例性实施例中，所述显示面板还包括：散热层、粘结层，散热层位于所述第一底膜背离所述显示部的一侧；粘结层位于所述第二底膜和所述散热层之间。
本公开一种示例性实施例中，所述散热层与所述第一边沿在所述第一方向上的距离小于所述粘结层与所述第一边沿在所述第一方向上的距离。
本公开一种示例性实施例中，所述第一弯曲部的厚度自靠近所述功能膜层一侧边沿向远离所述功能膜层一侧逐渐减小；所述第二弯曲部的厚度自靠近所述第一弯曲部一侧的边沿向远离所述第一弯曲部一侧的边沿逐渐减小。
本公开一种示例性实施例中，所述保护层还包括第三弯曲部，第三弯曲部连接于所述第二弯曲部远离所述第一弯曲部的一侧，所述第三弯曲部的厚度自靠近所述第二弯曲部一侧边沿向远离所述第二弯曲部一侧边沿逐渐增大。
根据本公开的一个方面，提供一种显示面板，其中，所述显示面板包括：阵列基板、功能膜层、保护层、盖板，阵列基板包括显示部、弯曲部，所述弯曲部连接于所述显示部的一侧；所述功能膜层设置于所述显示部的一侧，所述功能膜层包括滤光层、触控层中的至少一种；保护层覆盖于所述弯曲部上，且所述保护层和所述功能膜层位于所述阵列基板的同一侧面，所述保护层包括：第一弯曲部、第二弯曲部，第一弯曲部与所述功能膜层相邻设置；第二弯曲部连接于所述第一弯曲部远离所述功能膜层的一侧，所述第二弯曲部包括远离所述第一弯曲部的第二边沿，在所述保护层中，所述第二边沿与所述功能膜层在第一方向上的距离最大，其中，所述第一方向垂直于所述显示部和所述弯曲部的交界面；其中，所述第一弯曲部的弹性模量小于所述第二弯曲部的弹性模量；盖板，所述盖板位于所述功能膜层远离所述阵列基板的一侧。
根据本公开的一个方面，提供一种显示面板制作方法，该制作方法包括：
提供一柔性阵列基板，所述阵列基板为平板结构，且所述阵列基板包括显示部、绑定部以及连接于所述显示部和所述绑定部之间的弯曲部；
在所述阵列基板上形成功能膜层，所述功能膜层在所述阵列基板的正投影位于所述显示部；
在所述阵列基板上形成保护层，所述保护层和所述功能膜层位于所述阵列基板的同一侧，且所述保护层在所述阵列基板的正投影位于所述弯曲部；
其中，所述保护层包括靠近所述功能膜层一侧的第一弯曲部，以及位于所述第一弯曲部远离所述功能膜层一侧的第二弯曲部，且所述第一弯曲部的刚度小于所述第二弯曲部的刚度；
弯曲所述弯曲部，以使所述绑定部位于所述显示部背离其显示侧的一侧。
本公开一种示例性实施例中，所述第一弯曲部的厚度小于第二弯曲部的厚度。
本公开一种示例性实施例中，在所述阵列基板上形成保护层，包括：
在所述阵列基板上多次形成厚度均匀的保护层材料，多层所述保护层材料用于形成所述保护层；
其中，在所述第一弯曲部上形成所述保护层材料的次数小于在所述第二弯曲部上形成所述保护层材料的次数。
本公开一种示例性实施例中，在所述阵列基板上形成保护层，包括：
在所述阵列基板上形成胶体的保护层材料，所述保护层材料用于形成所述保护层；
其中，所述第一弯曲部位于所述保护层材料的爬坡区。
本公开一种示例性实施例中，所述第一弯曲部的弹性模量小于所述第二弯曲部的弹性模量。
本公开一种示例性实施例中，在所述阵列基板上形成保护层，包括：
在所述阵列基板上形成胶体的保护层材料；
对所述保护层材料进行固化处理，其中所述第一弯曲部的固化程度小于第二弯曲部的固化程度。
本公开一种示例性实施例中，在所述阵列基板上形成保护层，包括：
在所述阵列基板上形成胶体的保护层材料；
对所述保护层材料整体进行固化处理；
对所述第一弯曲部进行软化处理。
应当理解的是，以上的一般描述和后文的细节描述仅是示例性和解释性的，并不能限制本公开。
附图说明
此处的附图被并入说明书中并构成本说明书的一部分，示出了符合本公开的实施例，并与说明书一起用于解释本公开的原理。显而易见地，下面描述中的附图仅仅是本公开的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据 这些附图获得其他的附图。
图1为相关技术中一种显示面板半成品的结构示意图；
图2为相关技术中一种显示面板成品的结构示意图；
图3、4为本公开显示面板制作方法一种示例性实施例的流程工艺图；
图5为本公开显示面板制作方法一种示例性实施例的流程工艺图；
图6为本公开显示面板制作方法一种示例性实施例的流程工艺图；
图7为本公开显示面板制作方法一种示例性实施例的流程工艺图；
图8、9为本公开显示面板制作方法另一种示例性实施例的流程工艺图；
图10为本公开显示面板一种示例性实施例的结构示意图；
图11为本公开显示面板另一种示例性实施例的结构示意图。
具体实施方式
现在将参考附图更全面地描述示例实施例。然而，示例实施例能够以多种形式实施，且不应被理解为限于在此阐述的范例；相反，提供这些实施例使得本公开将更加全面和完整，并将示例实施例的构思全面地传达给本领域的技术人员。图中相同的附图标记表示相同或类似的结构，因而将省略它们的详细描述。
虽然本说明书中使用相对性的用语，例如“上”“下”来描述图标的一个组件对于另一组件的相对关系，但是这些术语用于本说明书中仅出于方便，例如根据附图中所述的示例的方向。能理解的是，如果将图标的装置翻转使其上下颠倒，则所叙述在“上”的组件将会成为在“下”的组件。其他相对性的用语，例如“高”“低”“顶”“底”“左”“右”等也作具有类似含义。当某结构在其它结构“上”时，有可能是指某结构一体形成于其它结构上，或指某结构“直接”设置在其它结构上，或指某结构通过另一结构“间接”设置在其它结构上。
用语“一个”、“一”、“所述”用以表示存在一个或多个要素/组成部分/等；用语“包括”和“具有”用以表示开放式的包括在内的意思并且是指除了列出的要素/组成部分/等之外还可存在另外的要素/组成部分/等。
如图1、2所示，图1为相关技术中一种显示面板半成品的结构示意图，图2为相关技术中一种显示面板成品的结构示意图。相关技术中，显示面板可以包括柔性阵列基板、功能膜层04、保护层02(MCL，Metal Coating Layer)。柔性阵列基板可以包括显示部011、弯曲部012、绑定部013。保护层02可以覆盖于弯曲部012，功能膜层04可以贴合于显示部011。绑定部013可以用于绑定芯片03。该显示面板还可以包括第一底膜071、第二底膜072、散热层08、粘结层09、盖板06、粘结于盖板06和功能膜层04之间的粘结层05，功能膜层04可以包括滤光层或者触控层的至少一种，例如，功能膜层04可以为偏光片。保护层02可以对弯曲部的中性层位置进行调节，以使中性层位于弯曲部的金属走线层的位置，从而减小在弯折过程中，该弯曲部的金属走线层发生断裂的可能性。其中，盖板06的材料可以为聚酰亚胺(PI)、玻璃等。
现有技术中，通常先在弯曲部012涂覆保护层02，然后再在显示部011上贴合功 能膜层04。为了避免功能膜层04贴附于保护层02上，同时考虑到保护层02的涂布公差和功能膜层04的贴合公差，在设计时需要在功能膜层04和保护层02之间预留一定的间隙，从而显示面板会具有较宽的下边框。
相关技术中，如图1所示，为了减小显示面板的边框，可以首先在显示部011上贴附功能膜层04，然后再在弯曲部012上涂覆保护层02。然而，由于功能膜层04对用于形成保护层02的胶体材料具有虹吸效应，保护层02会在靠近功能膜层的区域C处出现局部增厚现象，保护层02在区域C远离功能膜层的边沿021位置会出现厚度段差。如图2所示，保护层02随弯曲部012弯曲后，由于保护层02不同位置的弯曲应力不同，保护层02会从其弧顶边沿023(保护层所形成弧形最右侧位置)向两侧减薄，从而保护层位于边沿021位置处的厚度段差进一步增大，同时由于边沿021位置靠近更为稳固的盖板06，在显示面板信赖性测试中，保护层容易在边沿021位置发生沿边沿021的折叠，即保护层容易在边沿021位置发生弯曲角度较小的弯折。从而保护层的边沿021位置附近容易发现线路断裂。其中，保护层还可以包括靠近功能膜层04一侧的边沿024。如图2所示，绑定区信赖性测试可以包括：通过一压板向左侧挤压边沿023，直到显示面板出现线路断裂，记录显示面板出现线路断裂时压板向左侧的移动距离，显示面板出现线路断裂时压板向左侧的移动距离可以定义为信赖测试的信赖值，信赖值越大，说明该显示面板的信赖性越高。
基于此，本示例性实施例首先提供一种显示面板制作方法，如图3、4所示，图3、4为本公开显示面板制作方法一种示例性实施例的流程工艺图，该制作方法可以包括：
如图3所示，步骤S1：提供一柔性阵列基板，所述阵列基板可以为平板结构，且所述阵列基板包括显示部11、绑定部13以及连接于所述显示部11和所述绑定部13之间的弯曲部12；
步骤S2：在所述阵列基板上形成功能膜层4，所述功能膜层4在所述阵列基板的正投影位于所述显示部11，其中，功能膜层4可以包括滤光层、触控层中一种或多种，例如，功能膜层4可以为偏光片；
步骤S3：在所述阵列基板上形成保护层，所述保护层和所述功能膜层4位于所述阵列基板的同一侧，且所述保护层在所述阵列基板的正投影位于所述弯曲部12；其中，所述保护层在所述阵列基板的正投影可以与弯曲部12重合，即被保护层正投影覆盖的部分阵列基板形成弯曲部12，未被保护层正投影覆盖的部分阵列基板形成显示部11和绑定部13。显示部11和绑定部13分别连接于弯曲部12的相对两侧。
其中，所述保护层可以包括靠近所述功能膜层4一侧的第一弯曲部21，以及位于所述第一弯曲部21远离所述功能膜层一侧的第二弯曲部22，且所述第一弯曲部21的刚度小于所述第二弯曲部22的刚度；
如图4所示，步骤S4：弯曲所述弯曲部12，以使所述绑定部13位于所述显示部11背离其显示侧的一侧。
本示例性实施例中，所述第一弯曲部21的刚度小于所述第二弯曲部12的刚度。与相关技术中图2比较，本示例性实施例减小了第一弯曲部21的刚度。从而在信赖性测试中，当挡板移动距离为图2中的信赖值时，由于第一弯曲部21具有更高的弯曲性能，在第一弯曲部21自身弯曲作用下，第一弯曲部21靠近第二弯曲部22的第一边沿211位置不会出现沿第一边沿211的折叠。因而，显示面板的信赖值也会相应增大。其中，第一边沿211可以理解为第一弯曲部21和第二弯曲部22的交界面。
本示例性实施例中，如图3所示，第一弯曲部21和第二弯曲部22可以沿第一方向X分布。形成保护层的方式可以是在阵列基板上涂覆保护层胶体材料，然后通过固化该胶体材料以形成保护层。如图3所示，在阵列基板上涂覆保护层胶体材料时，由于保护层胶体材料具有流动性，固化后的保护层在其边沿位置会出现爬坡部24。本示例性实施例中，第二弯曲部22可以连接于第一弯曲部21和爬坡部24之间。如图3所示，保护层还可以包括第三弯曲部23，第三弯曲部23可以了连接于第二弯曲部22和爬坡部24之间。如图4所示，所述第一弯曲部21可以包括与所述功能膜层4相邻的第三边沿213，第二弯曲部22可以包括远离第一弯曲部21一侧的第二边沿222。所述第三弯曲部23可以包括远离第二弯曲部22的第四边沿234。如图4所示，保护层弯曲后，第二弯曲部22的第二边沿222可以位于保护层所形成弧形的弧顶，即在所述保护层中，第二边沿222与功能膜层4在所述第一方向X上的距离最大。其中，第二边沿222可以理解为第二弯曲部22和第三弯曲部23的交界面，第三边沿213可以理解为第一弯曲部21和功能膜层4的交界面。
本示例性实施例中，如图3所示，第一弯曲部21在第一方向X上的尺寸可以等于图2中边沿024位置到边沿021之间的弧线距离。即保护层弯曲后，第一弯曲部21的第一边沿211可以位于保护层本该发生折叠的位置。由于第一弯曲部21在弯曲前，第一弯曲部21的刚度小于第二弯曲部22的刚度，第一弯曲部21在弯曲后，保护层在第一边沿211两侧的刚度差相比图2中保护层在边沿021两侧的刚度差较小，从而在信赖性测试中，第一边沿211处不易发生折叠，且折叠位置会向第三边沿213方向移动，由于第三边沿213靠近显示部11一侧，且显示部11一侧的结构相对稳固，因此，该由显示面板制作方法制成的显示面板可靠性更高。
应该理解的是，在其他示例性实施例中，第一弯曲部21在第一方向X上的尺寸还可以略大于图2中保护层边沿021到边沿024之间的弧线距离，或略小于图2中保护层边沿021到边沿024之间的弧线距离，这些都属于本公开的保护范围。
本示例性实施例中，第一弯曲部21在第一方向X上尺寸的获取方法可以为：对多个显示面板分别进行信赖性检测，获取各个显示面板中阵列基板发生走线断裂的位置，观察阵列基板发生走线断裂位置附近的保护层，获取走线断裂位置附近的保护层厚度段差较大的位置，测量保护层上厚度段差较大位置到靠近功能膜层一侧的弧长，并计算上述各个弧长的平均值。该平均值即可以为第一弯曲部21在第一方向X上的 尺寸。其中，阵列基板发生走线断裂的位置可以通过检测电路获取。获取阵列基板走线断裂位置后，可以对阵列基板中弯曲部12进行灌胶切片(注入环氧树脂并使用固化剂进行固化，然后对截面抛光处理)，然后可以通过显微镜观察弯曲部12的截面，以获取走线断裂位置附近的保护层厚度段差较大的位置。其中，进行信赖性检测的显示面板的个数可以为16个、32个等。
本示例性实施例中，如图5、6所示，为本公开显示面板制作方法一种示例性实施例的流程工艺图。实现所述第一弯曲部21刚度小于所述第二弯曲部22刚度的一种方式可以为，第一弯曲部21的厚度小于第二弯曲部22的厚度。其中，第一弯曲部21的厚度可以是第二弯曲部22厚度的70％-90％，例如，70％、80％、90％等。具体的，第一弯曲部21的厚度可以为105±30um，第二弯曲部22的厚度可以为120±30um。如图6所示，为本公开显示面板制作方法一种示例性实施例的流程工艺图。保护层弯曲后，在弯曲应力作用下，第一弯曲部21与第二弯曲部22的厚度差相较弯曲前有所减小，相应的，第一边沿211位置处的厚度段差会相应减小。从而，在信赖性测试中，第一边沿211处不易发生折叠现象，同时发生折叠的位置会向第三边沿213移动，由于第三边沿213靠近显示部11一侧，且显示部11一侧的结构更加稳固，因此，该由显示面板制作方法制成的显示面板可靠性更高。需要说明的是，第一弯曲部21的厚度小于第二弯曲部22的厚度可以理解为第一弯曲部21的平均厚度小于第二弯曲部22的平均厚度，或第一弯曲部21的最小厚度小于第二弯曲部22的最小厚度。在形成保护层时，图5中功能膜层4同样会对用于形成第一弯曲部21的保护层胶材产生虹吸效应。第一弯曲部21靠近功能膜层4的侧边的厚度可以大于等于或小于第二弯曲部22的厚度。相应的，如图6所示，保护层弯曲后，第三边沿213处的厚度可以大于等于或小于第四边沿234位置处的厚度。
本示例性实施例中，如图6所示，保护层弯曲后，在弯曲应力作用下，所述第一弯曲部21的厚度可以自第三边沿213向第一边沿211逐渐减小；所述第二弯曲部22的厚度可以自靠近所述第一弯曲部21一侧向远离所述第一弯曲部21一侧逐渐减小。第三弯曲部23的厚度可以自靠近所述第二弯曲部22一侧边沿向远离所述第二弯曲部22一侧逐渐增大。
本示例性实施例中，如图6所示，保护层弯曲后，所述第一弯曲部的最大厚度与所述第二弯曲部的最小厚度的差值可以小于等于0.05毫米，例如，其差值可以为0.01毫米、0.02毫米、0.03毫米、0.04毫米、0.05毫米。其中，第一弯曲部21的最大厚度可以为第一弯曲部21中第三边沿213位置处的厚度。第二弯曲部的最小厚度可以为第二弯曲部22中第二边沿222位置处的厚度。所述第一弯曲部的最大厚度可以大于第二弯曲部的最小厚度。
本示例性实施例中，如图6所示，所述第一弯曲部的弧长可以大于等于0.188毫米且小于等于0.235毫米，例如，0.188毫米、0.200毫米、0.235毫米。所述第二弯曲部的 弧长可以大于等于0.235毫米且小于等于0.285毫米，例如，0.235毫米、0.255毫米、0.285毫米。
所述第一弯曲部的最大厚度可以大于等于0.13毫米且小于等于0.15毫米，例如，第一弯曲部的最大厚度可以为0.13毫米、0.135毫米、0.14毫米、0.15毫米。所述第二弯曲部的最小厚度可以大于等于0.08毫米且小于等于0.1毫米。例如，所述第二弯曲部的最小厚度可以为0.08毫米、0.09毫米、0.1毫米。保护层可以为MCL胶层。
所述绑定部13到所述显示部11的距离可以为0.3-0.7毫米，例如，0.3毫米、0.4毫米、0.5毫米、0.6毫米、0.7毫米。其中，所述绑定部13到所述显示部11的距离可以理解为绑定部13面向显示部11一侧的侧面到显示部11面向绑定部13一侧侧面的距离。
本示例性实施例中，实现第一弯曲部的厚度小于第二弯曲部的厚度的一种方式可以为，在所述阵列基板上多次形成厚度均匀的保护层材料，多层所述保护层材料可以用于形成所述保护层。其中，在所述第一弯曲部21上形成所述保护层材料的次数可以小于在所述第二弯曲部22上形成所述保护层材料的次数。应该理解的是，在其他示例性实施例中，实现第一弯曲部的厚度小于第二弯曲部的厚度还有其他方式，例如，利用涂覆工艺形成保护层，当涂覆部件移位到第一弯曲部21所在位置时，可以通过减小涂覆部件的出料量，减小第一弯曲部21的厚度。
本示例性实施例中，保护层爬坡区在第一方向上的尺寸一般约400um。而上述的获取第一弯曲部21在第一方向X上尺寸的具体方法中，每个显示面板中第一弯曲部21在第一方向上的尺寸均小于爬坡区在第一方向上的尺寸。本示例性实施例中，如图7所示，为本公开显示面板制作方法一种示例性实施例的流程工艺图。在所述阵列基板上形成保护层可以包括：在所述阵列基板上形成胶体的保护层材料，所述保护层材料用于形成所述保护层。其中，所述第一弯曲部21可以位于所述保护层材料的爬坡区。具体的，涂布保护层材料时，可以通过控制涂布位置使得第一弯曲部21位于所述保护层材料的爬坡区，同时确保保护层材料流至功能膜层4。在产线设备中，保护层材料的涂布有两种对位方式：通过标记(MARK)为基准对位和通过功能膜层为基准对位。由于需要让保护层材料流至功能膜层4边缘，因此本示例性实施例可以采用功能膜层基准对位方式，即以功能膜层贴附位置为基准，抓取功能膜层边缘进行对位以补正涂覆材料位置。
需要说明的是，在形成保护层时，图7中功能膜层4同样会对用于形成第一弯曲部21的保护层胶材产生虹吸效应。第一弯曲部21靠近功能膜层4的侧边的厚度可以大于等于或小于第二弯曲部22的厚度。相应的，保护层弯曲后，第三边沿213处的厚度可以大于等于或小于第四边沿234位置处的厚度。
本示例性实施例中，实现所述第一弯曲部的刚度小于所述第二弯曲部的刚度还有其他方式。如图8、9所示，图8、9为本公开显示面板制作方法另一种示例性实施例 的流程工艺图。实现所述第一弯曲部21的刚度小于所述第二弯曲部22的刚度的方式还可以为，所述第一弯曲部21的弹性模量小于所述第二弯曲部22的弹性模量。如图9所示，保护层弯曲后，虽然在第一边沿211处依然会出现较大的厚度段差，但是由于第一弯曲部21的弹性模量小于所述第二弯曲部22的弹性模量，在信赖性测试中，在第一弯曲部21自身弯曲作用下，第一边沿211处不易发生折叠。同时，折叠位置会向第三边沿213方向移动，由于第三边沿213靠近显示部11一侧，且显示部11一侧的结构更加稳固，因此，该由显示面板制作方法制成的显示面板可靠性更高。
本示例性实施例中，实现所述第一弯曲部21的弹性模量小于所述第二弯曲部22的弹性模量的一种方式可以为，在所述阵列基板上形成胶体的保护层材料；对所述保护层材料进行固化处理，其中，所述第一弯曲部21的固化程度小于第二弯曲部22的固化程度。本示例性实施例中，保护层材料可以为树脂材料，该树脂材料中可以包含有光引发剂或光敏剂，保护层材料经过吸收紫外线(UV)光照射后，会产生活性自由基，从而引发聚合、交联和接枝反应，进而使得树脂在数秒内由胶体转化为固态。本示例性实施例中，对所述保护层材料进行固化处理的方式可以为，通过紫外线灯对保护层材料进行照射。其中，保护层材料的固化程度与紫外线灯的功率、照射时间成正相关，因此，通过调节紫外线灯的功率和/或照射时间，可以实现第一弯曲部21、第二弯曲部22不同的固化程度。例如，本示例性实施例可以通过减小第一弯曲部21的紫外线照射时长或减小第一弯曲部21的紫外线照射功率减小第一弯曲部21的固化程度，以减小第一弯曲部21的弹性模量。
应该理解的是，实现所述第一弯曲部21的弹性模量小于所述第二弯曲部22的弹性模量还有其他方式。例如，在对第一弯曲部21和第二弯曲部22完成固化后，可以在第一弯曲部21上涂覆催化剂，该催化剂可以破坏第一弯曲部21中的分子链结构，从而实现第一弯曲部21的软化效果。
本示例性实施例中，如图3-9所示，在对所述弯曲部进行弯曲之前，该显示面板制作方法还可以包括：将显示部11形成于第一底膜71上，将绑定部13形成于第二底膜72上；通过粘结层5在所述功能膜层4背离阵列基板的一侧粘结盖板6；在第一底膜71背离阵列基板的一侧形成散热层8；在散热层8背离衬底基板的一侧形成粘结层9；在绑定部13上形成芯片3。其中，盖板6的材料可以为聚酰亚胺(PI)、玻璃等。
应该理解的是，在其他示例性实施例中，还可以通过同时调节第一弯曲部的厚度和弹性模量以调节第一弯曲部的刚度。
本示例性实施例还提供一种显示面板，如图10所示，为本公开显示面板一种示例性实施例的结构示意图。其中，所述显示面板可以包括：阵列基板、功能膜层4、保护层。阵列基板可以包括显示部11、弯曲部12，所述弯曲部12连接于所述显示部11的一侧；功能膜层4设置于所述显示部11的一侧；保护层覆盖于所述弯曲部12上，且所述保护层和所述功能膜层4位于所述阵列基板的同一侧面，所述保护层可以包括： 第一弯曲部21、第二弯曲部22。第一弯曲部21与所述功能膜层4相邻设置；第二弯曲部22连接于所述第一弯曲部21远离所述功能膜层4的一侧，所述第二弯曲部22可以包括远离所述第一弯曲部的第二边沿222，在所述保护层中，所述第二弯曲部22远离所述第一弯曲部21的第二边沿222与所述功能膜层4在所述第一方向X上的距离最大，其中，所述第一方向垂直于所述显示部和所述弯曲部的交界面，即第一方向与显示部11所在平面平行。阵列基板可以为柔性阵列基板，功能膜层4可以包括滤光层、触控层中一种或多种，例如，功能膜层4可以为偏光片。本示例性实施例提供的显示面板可以通过图5、6或图7所示的制作方法获取。保护层弯曲前，第一弯曲部的厚度小于第二弯曲部的厚度，相比于图2所示的现有技术，保护层弯曲后，第一弯曲部的最大厚度会相应减小，第二弯曲部的最大厚度基本不变。其中，所述第一弯曲部的最大厚度与所述第二弯曲部的最小厚度的差值可以小于等于0.05毫米，例如，其差值可以为0.01毫米、0.02毫米、0.03毫米、0.04毫米、0.05毫米。其中，第一弯曲部21的最大厚度可以为第一弯曲部21中第三边沿213位置处的厚度。第二弯曲部的最小厚度可以为第二弯曲部22中第二边沿222位置处的厚度。所述第一弯曲部的最大厚度可以大于第二弯曲部的最小厚度。
需要说明的是，所述保护层和所述功能膜层4位于所述阵列基板的同一侧面，可以理解为，所述保护层和所述功能膜层4位于阵列基板同一表面的一侧。功能膜层4设置于所述显示部11的一侧，可以理解为，功能膜层4在阵列基板的正投影位于显示部11上。
如图10所示，所述第一弯曲部21可以包括与所述第二弯曲部22连接的第一边沿211以及与功能膜层4相邻的第三边沿213。该显示面板相比于图2中相关技术的显示面板，保护层在第一弯曲部21的第一边沿211处具有较小的厚度段差。在信赖性测试中，第一边沿211处不易发生折叠，且折叠位置会向第三边沿213移动，由于第三边沿213靠近显示部11一侧，显示部11一侧的结构更加稳固，因此，该由显示面板制作方法制成的显示面板可靠性更高。其中，第一边沿211可以理解为第一弯曲部21和第二弯曲部22的交界面，第三边沿可以理解为第一弯曲部21和功能膜层4的交界面。本示例性实施例中，所述第一弯曲部的最大厚度可以大于等于0.12毫米且小于等于0.135毫米，例如，0.12毫米、0.13毫米、0.135毫米。所述第二弯曲部的最大厚度可以大于等于0.09毫米且小于等于0.105毫米，例如，0.09毫米、0.1毫米、0.105毫米。保护层可以为MCL胶层。
本示例性实施例中，如图10所示，所述第一弯曲部21的厚度可以自其靠近所述功能膜层一侧的第三边沿213向远离所述功能膜层一侧的第一边沿211逐渐减小；所述第二弯曲部22的厚度自靠近所述第一弯曲部21一侧的边沿向远离所述第一弯曲部21一侧的边沿222逐渐减小。
本示例性实施例中，如图10所示，所述保护层还可以包括第三弯曲部23、爬坡 部24，第三弯曲部23可以连接于所述第二弯曲部22远离所述第一弯曲部21的一侧，爬坡部24可以连接于所述第三弯曲部23远离所述第二弯曲部22的一侧。所述第三弯曲部23可以包括远离第二弯曲部22的第四边沿234，所述第三弯曲部23的厚度可以自靠近所述第二弯曲部22一侧边沿向第四边沿234逐渐增大。第三边沿213处的厚度可以大于等于或小于第四边沿234位置处的厚度。第二边沿222可以理解为第二弯曲部22和第三弯曲部23的交界面。第四边沿234以理解为第三弯曲部23和爬坡部24的交界面。
本示例性实施例中，如图10所示，所述阵列基板还可以包括绑定部13，所述绑定部13可以与所述显示部11平行。所述弯曲部12连接于所述显示部11和绑定部13之间，所述显示面板还可以包括：芯片3、第一底膜71、第二底膜72，芯片3可以绑定于所述绑定部13，且所述芯片3与所述功能膜层4可以位于所述阵列基板的同一侧面；第一底膜71可以位于所述显示部背离所述功能膜层4的一侧；第二底膜72可以位于所述绑定部13背离所述芯片3的一侧。其中，在所述第一方向X上，所述第一边沿211可以位于所述第一底膜71和所述第二边沿222之间，所述第一边沿211可以位于所述第二底膜72和所述第二边沿222之间；且所述第一边沿211与所述第一底膜71在所述第一方向X上的距离S1小于等于所述第一边沿211与所述第二底膜72在所述第一方向X上的距离S2。该设置可以使得保护层弯曲后，所述第二边沿222与所述绑定部13在第二方向Y上的距离S4大于所述第二边沿222与所述显示部11在第二方向Y上的距离S5，所述第二方向Y可以与所述显示部11所在平面垂直。即第二边沿222位于第三边沿213和第四边沿234中点偏向第三边沿213的一侧，从而第一边沿211位置处可以具有较大的弯曲半径，即在信赖性测试时，第一边沿211位置更加不易发生折叠。
需要说明的是，如图10所示，为该显示面板在任一剖切面的剖视图，该剖切面与弯曲部12的弯曲轴向垂直。在该剖视图中，第一边沿211可以包括与弯曲部12相接触的位置点2111，第二边沿222包括与弯曲部12相接触的位置点2221。第一底膜71面向第一边沿211的边沿包括位置点711，该位置点711与柔性阵列基板接触，第二底膜72面向第一边沿211的边沿包括位置点721，该位置点721与柔性阵列基板接触。绑定部13包括面向第二底膜72一侧的侧面131，显示部11包括面向第一底膜71一侧的侧面111。所述第一边沿211与所述第一底膜71在所述第一方向X上的距离，可以理解为，位置点2111到位置点711所在第一平面的距离，其中，第一平面与第一方向垂直。第一边沿211与所述第二底膜72在所述第一方向X上的距离，可以理解为，位置点2111到位置点721所在第二平面的距离，第二平面与第一方向X垂直。所述第二边沿222与所述绑定部13在第二方向Y上的距离，可以理解为，位置点2221与侧面131所在平面之间的距离。所述第二边沿222与所述显示部11在第二方向Y上的距离，可以理解为，位置点2221与侧面111所在平面之间的距离。
本示例性实施例中，如图10所示，所述第一底膜71面向所述第一边沿211的边沿与所述第二底膜72面向所述第一边沿211的边沿在所述第一方向上的距离S3可以大于等于0毫米且小于等于0.2毫米，例如，0毫米、0.1毫米、0.2毫米。所述第一边沿211与所述第一底膜71在所述第一方向上的距离可以大于等于0.125毫米且小于等于0.225毫米，例如，0.125毫米、0.155毫米、0.225毫米。所述第一边沿211与所述第二底膜72在所述第一方向上的距离可以大于等于0.125毫米且小于等于0.425毫米，例如，0.125毫米、0.225毫米、0.325毫米、0.425毫米。
需要说明的是，所述第一底膜71面向所述第一边沿211的边沿与所述第二底膜72面向所述第一边沿211的边沿在所述第一方向上的距离，可以理解为，位置点711所在第一平面与位置点721所在第二平面之间的距离，其中，第一平面和第二平面均与第一方向垂直。
本示例性实施例中，如图10所示，所述第一弯曲部21的弧长可以大于等于0.188毫米且小于等于0.235毫米，例如，0.188毫米、0.215毫米、0.235毫米。所述第二弯曲部22的弧长可以大于等于0.235毫米且小于等于0.285毫米，例如，0.235毫米、0.255毫米、0.285毫米。
本示例性实施例中，所述绑定部13到所述显示部11的距离可以为0.3-0.7毫米，例如，0.3毫米、0.4毫米、0.5毫米、0.6毫米、0.7毫米。其中，所述绑定部13到所述显示部11的距离可以理解为绑定部13面向显示部11一侧的侧面到显示部11面向绑定部13一侧侧面的距离。该显示面板在信赖性测试中信赖值可以达到215um～225um。
本示例性实施例中，如图10所示，所述显示面板还包括：散热层8、粘结层9，散热层8可以位于所述第一底膜71背离所述显示部11的一侧；粘结层9可以位于所述第二底膜72和所述散热层8之间。散热层8可以具有一定的弹性，可以用于提高显示面板的抗震性能，散热层8的材料可以为超净泡棉。散热层8还可以通过自身的厚度调节绑定部13和显示部11之间的距离，从而调节弯曲部12的弯曲半径。粘结层9可以用于固定散热层8和第二底膜72。
本示例性实施例中，如图10所示，粘结层9需要完全贴附于散热层8上，才能实现较好的支撑作用，以提供显示面板的信赖性。然而，粘结层9与散热层8贴附时存在贴附公差。因此，在设计时需要将粘结层9相对散热层8向左缩进，即所述散热层8与所述第一边沿211在所述第一方向X上的距离小于所述粘结层9与所述第一边沿211在所述第一方向X上的距离。该设计可以使得在存在贴附公差的情况下，粘结层9能够完全贴附于散热层8上。
本示例性实施例还提供一种显示面板，如图11所示，为本公开显示面板另一种示例性实施例的结构示意图。该显示面板可以通过上述图8、9所示的显示面板制作方法制成。所述显示面板可以包括：阵列基板、功能膜层4、保护层，阵列基板可以包括显示部11、弯曲部12，所述弯曲部12连接于所述显示部11的一侧；功能膜层4设置于 所述显示部11的一侧；保护层覆盖于所述弯曲部上，且所述保护层和所述功能膜层4位于所述阵列基板的同一侧面，所述保护层包括：第一弯曲部21、第二弯曲部22，第一弯曲部21与所述功能膜层4相邻设置；第二弯曲部22连接于所述第一弯曲部21远离所述功能膜层4的一侧，所述第二弯曲部22远离所述第一弯曲部21的边沿位于所述保护层所成弧形的弧顶，即在所述保护层中，所述第二弯曲部22远离所述第一弯曲部21的第二边沿222与所述功能膜层4在所述第一方向X上的距离最大，其中，所述第一方向垂直于所述显示部和所述弯曲部的交界面，即第一方向与显示部11所在平面平行；其中，所述第一弯曲部21的弹性模量可以小于所述第二弯曲部22的弹性模量。第一弯曲部21包括与第二弯曲部22相邻的第一边沿211和与功能膜层相邻的第三边沿213。
本示例性实施例中，如图11所示，所述保护层还可以包括第三弯曲部23、爬坡部24，第三弯曲部23可以连接于所述第二弯曲部22远离所述第一弯曲部21的一侧，爬坡部24可以连接于所述第三弯曲部23远离所述第二弯曲部22的一侧。所述第三弯曲部23可以包括远离第二弯曲部22的第四边沿234，所述第三弯曲部23的厚度可以自靠近所述第二弯曲部22一侧边沿向第四边沿234逐渐增大。由于形成保护层时，功能膜层4对用于形成保护层的胶体材料具有虹吸效应，保护层弯曲前第三边沿213处的厚度大于第四边沿234处的厚度，因此，保护层弯曲后，第三边沿213处的厚度也会相应大于第四边沿234位置处的厚度。其中，第二边沿222可以理解为第二弯曲部22和第三弯曲部23的交界面。第四边沿234以理解为第三弯曲部23和爬坡部24的交界面。第一边沿211可以理解为第一弯曲部21和第二弯曲部22的交界面，第三边沿可以理解为第一弯曲部21和功能膜层4的交界面。
本示例性实施例中，如图11所示，由于第一弯曲部21的弹性模量小于所述第二弯曲部22的弹性模量，在信赖性测试中，在第一弯曲部21自身弯曲作用下，第一边沿211处不易发生折叠。同时，折叠位置会向第三边沿213方向移动，由于第三边沿213靠近显示部11一侧，显示部11一侧的结构更加稳固，因此，该由显示面板制作方法制成的显示面板可靠性更高。
如图11所示，该显示面板还可以包括第一底膜71、第二底膜72、盖板6、粘结层5、散热层8、粘结层9、芯片3。第一底膜71、第二底膜72、盖板6、粘结层5、散热层8、粘结层9、芯片3可以与图10中的显示面板具有相同的结构和位置关系。
本领域技术人员在考虑说明书及实践这里公开的内容后，将容易想到本公开的其他实施例。本申请旨在涵盖本公开的任何变型、用途或者适应性变化，这些变型、用途或者适应性变化遵循本公开的一般性原理并包括本公开未公开的本技术领域中的公知常识或惯用技术手段。说明书和实施例仅被视为示例性的，本公开的真正范围和精神由权利要求指出。
应当理解的是，本公开并不局限于上面已经描述并在附图中示出的精确结构，并且可 以在不脱离其范围进行各种修改和改变。本公开的范围仅由所附的权利要求来限定。

Claims (20)

  1. 一种显示面板，其中，所述显示面板包括：
    阵列基板，包括显示部、弯曲部，所述弯曲部连接于所述显示部的一侧；
    功能膜层，所述功能膜层设置于所述显示部的一侧，所述功能膜层包括滤光层、触控层中的至少一种；
    保护层，覆盖于所述弯曲部上，且所述保护层和所述功能膜层位于所述阵列基板的同一侧面，所述保护层包括：
    第一弯曲部，与所述功能膜层相邻设置；
    第二弯曲部，连接于所述第一弯曲部远离所述功能膜层的一侧，所述第二弯曲部包括远离所述第一弯曲部的第二边沿，在所述保护层中，所述第二边沿与所述功能膜层在第一方向上的距离最大，所述第一方向垂直于所述显示部和所述弯曲部的交界面；
    其中，所述第一弯曲部的最大厚度与所述第二弯曲部的最小厚度的差值小于等于0.05毫米；
    盖板，所述盖板位于所述功能膜层远离所述阵列基板的一侧。
  2. 根据权利要求1所述的显示面板，其中，所述第一弯曲部的最大厚度大于等于0.13毫米且小于等于0.15毫米，所述第二弯曲部的最小厚度大于等于0.08毫米且小于等于0.1毫米。
  3. 根据权利要求1所述的显示面板，其中，所述阵列基板还包括绑定部，所述弯曲部连接于所述显示部和绑定部之间，所述显示面板还包括：
    芯片，绑定于所述绑定部，且所述芯片与所述功能膜层位于所述阵列基板的同一侧面；
    第一底膜，位于所述显示部背离所述功能膜层的一侧；
    第二底膜，位于所述绑定部背离所述芯片的一侧；
    所述第一弯曲部包括与所述第二弯曲部连接的第一边沿；
    其中，在所述第一方向上，所述第一边沿位于所述第一底膜和所述第二边沿之间，所述第一边沿位于所述第二底膜和所述第二边沿之间；
    且所述第一边沿与所述第一底膜在所述第一方向上的距离小于等于所述第一边沿与所述第二底膜在所述第一方向上的距离。
  4. 根据权利要求3所述的显示面板，其中，所述第一底膜面向所述第一边沿的边沿与所述第二底膜面向所述第一边沿的边沿在所述第一方向上的距离大于等于0毫米且小于等于0.2毫米。
  5. 根据权利要求4所述的显示面板，其中，所述第一边沿与所述第一底膜在所述第一方向上的距离大于等于0.125毫米且小于等于0.225毫米；
    所述第一边沿与所述第二底膜在所述第一方向上的距离大于等于0.125毫米且小 于等于0.425毫米。
  6. 根据权利要求1所述的显示面板，其中，所述第一弯曲部的弧长大于等于0.188毫米且小于等于0.235毫米。
  7. 根据权利要求6所述的显示面板，其中，所述第二弯曲部的弧长大于等于0.235毫米且小于等于0.285毫米。
  8. 根据权利要求3所述的显示面板，其中，所述绑定部与所述显示部平行；
    在第二方向上，所述第二边沿到所述绑定部的距离大于所述第二边沿到所述显示部的距离，所述第二方向与所述显示部所在平面垂直；
    所述绑定部到所述显示部的距离为0.3-0.7毫米。
  9. 根据权利要求3所述的显示面板，其中，所述显示面板还包括：
    散热层，位于所述第一底膜背离所述显示部的一侧；
    粘结层，位于所述第二底膜和所述散热层之间。
  10. 根据权利要求9所述的显示面板，其中，所述散热层与所述第一边沿在所述第一方向上的距离小于所述粘结层与所述第一边沿在所述第一方向上的距离。
  11. 根据权利要求1所述的显示面板，其中，所述第一弯曲部的厚度自靠近所述功能膜层一侧边沿向远离所述功能膜层一侧逐渐减小；
    所述第二弯曲部的厚度自靠近所述第一弯曲部一侧的边沿向远离所述第一弯曲部一侧的边沿逐渐减小。
  12. 根据权利要求1所述的显示面板，其中，所述保护层还包括：
    第三弯曲部，连接于所述第二弯曲部远离所述第一弯曲部的一侧，所述第三弯曲部的厚度自靠近所述第二弯曲部一侧边沿向远离所述第二弯曲部一侧边沿逐渐增大。
  13. 一种显示面板，其中，所述显示面板包括：
    阵列基板，包括显示部、弯曲部，所述弯曲部连接于所述显示部的一侧；
    功能膜层，所述功能膜层设置于所述显示部的一侧，所述功能膜层包括滤光层、触控层中的至少一种；
    保护层，覆盖于所述弯曲部上，且所述保护层和所述功能膜层位于所述阵列基板的同一侧面，所述保护层包括：
    第一弯曲部，与所述功能膜层相邻设置；
    第二弯曲部，连接于所述第一弯曲部远离所述功能膜层的一侧，所述第二弯曲部包括远离所述第一弯曲部的第二边沿，在所述保护层中，所述第二边沿与所述功能膜层在第一方向上的距离最大，所述第一方向垂直于所述显示部和所述弯曲部的交界面；
    其中，所述第一弯曲部的弹性模量小于所述第二弯曲部的弹性模量；
    盖板，所述盖板位于所述功能膜层远离所述阵列基板的一侧。
  14. 一种显示面板制作方法，其中，包括：
    提供一柔性阵列基板，所述阵列基板为平板结构，且所述阵列基板包括显示部、绑定部以及连接于所述显示部和所述绑定部之间的弯曲部；
    在所述阵列基板上形成功能膜层，所述功能膜层在所述阵列基板的正投影位于所述显示部；
    在所述阵列基板上形成保护层，所述保护层和所述功能膜层位于所述阵列基板的同一侧，且所述保护层在所述阵列基板的正投影位于所述弯曲部；
    其中，所述保护层包括靠近所述功能膜层一侧的第一弯曲部，以及位于所述第一弯曲部远离所述功能膜层一侧的第二弯曲部，且所述第一弯曲部的刚度小于所述第二弯曲部的刚度；
    弯曲所述弯曲部，以使所述绑定部位于所述显示部背离其显示侧的一侧。
  15. 根据权利要求14所述的显示面板制作方法，其中，所述第一弯曲部的厚度小于第二弯曲部的厚度。
  16. 根据权利要求15所述的显示面板制作方法，其中，在所述阵列基板上形成保护层，包括：
    在所述阵列基板上多次形成厚度均匀的保护层材料，多层所述保护层材料用于形成所述保护层；
    其中，在所述第一弯曲部上形成所述保护层材料的次数小于在所述第二弯曲部上形成所述保护层材料的次数。
  17. 根据权利要求15所述的显示面板制作方法，其中，在所述阵列基板上形成保护层，包括：
    在所述阵列基板上形成胶体的保护层材料，所述保护层材料用于形成所述保护层；
    其中，所述第一弯曲部位于所述保护层材料的爬坡区。
  18. 根据权利要求14所述的显示面板制作方法，其中，所述第一弯曲部的弹性模量小于所述第二弯曲部的弹性模量。
  19. 根据权利要求18所述的显示面板制作方法，其中，在所述阵列基板上形成保护层，包括：
    在所述阵列基板上形成胶体的保护层材料；
    对所述保护层材料进行固化处理，其中所述第一弯曲部的固化程度小于第二弯曲部的固化程度。
  20. 根据权利要求18所述的显示面板制作方法，其中，在所述阵列基板上形成保护层，包括：
    在所述阵列基板上形成胶体的保护层材料；
    对所述保护层材料整体进行固化处理；
    对所述第一弯曲部进行软化处理。
PCT/CN2020/138624 2020-12-23 2020-12-23 显示面板及其制作方法 WO2022133804A1 (zh)

Priority Applications (3)

Application Number Priority Date Filing Date Title
PCT/CN2020/138624 WO2022133804A1 (zh) 2020-12-23 2020-12-23 显示面板及其制作方法
US17/601,133 US20220399375A1 (en) 2020-12-23 2020-12-23 Display panel and fabrication method thereof
CN202080003556.XA CN115244699A (zh) 2020-12-23 2020-12-23 显示面板及其制作方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/CN2020/138624 WO2022133804A1 (zh) 2020-12-23 2020-12-23 显示面板及其制作方法

Publications (1)

Publication Number Publication Date
WO2022133804A1 true WO2022133804A1 (zh) 2022-06-30

Family

ID=82157100

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CN2020/138624 WO2022133804A1 (zh) 2020-12-23 2020-12-23 显示面板及其制作方法

Country Status (3)

Country Link
US (1) US20220399375A1 (zh)
CN (1) CN115244699A (zh)
WO (1) WO2022133804A1 (zh)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN116092378B (zh) * 2022-11-28 2024-07-09 上海天马微电子有限公司 显示模组及其制备方法、显示装置

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105976718A (zh) * 2016-07-20 2016-09-28 武汉华星光电技术有限公司 显示面板及其显示器
CN108052233A (zh) * 2018-01-03 2018-05-18 上海天马微电子有限公司 一种显示面板和显示装置
US20190094610A1 (en) * 2017-09-22 2019-03-28 Japan Display Inc. Display device
US20190280248A1 (en) * 2018-03-09 2019-09-12 Samsung Display Co., Ltd. Display device and manufacturing method for the same
CN111509017A (zh) * 2020-04-28 2020-08-07 京东方科技集团股份有限公司 柔性显示基板及其制备方法、柔性显示面板

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102399568B1 (ko) * 2015-09-23 2022-05-19 삼성디스플레이 주식회사 폴딩 가능한 디스플레이 장치 및 그 제조방법
CN105977400B (zh) * 2016-07-21 2018-01-26 京东方科技集团股份有限公司 一种显示面板及其制备方法、显示装置
CN115066085B (zh) * 2016-07-22 2023-06-23 Lg伊诺特有限公司 柔性电路板、柔性电路板封装芯片和包括柔性电路板的电子设备
US10522783B2 (en) * 2016-09-30 2019-12-31 Lg Display Co., Ltd. Flexible display including protective coating layer having different thickness in bend section
KR102508668B1 (ko) * 2017-11-24 2023-03-13 삼성디스플레이 주식회사 표시장치 및 이의 제조방법
KR20200110494A (ko) * 2019-03-13 2020-09-24 삼성디스플레이 주식회사 표시 장치 및 표시 장치 제조 방법

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105976718A (zh) * 2016-07-20 2016-09-28 武汉华星光电技术有限公司 显示面板及其显示器
US20190094610A1 (en) * 2017-09-22 2019-03-28 Japan Display Inc. Display device
CN108052233A (zh) * 2018-01-03 2018-05-18 上海天马微电子有限公司 一种显示面板和显示装置
US20190280248A1 (en) * 2018-03-09 2019-09-12 Samsung Display Co., Ltd. Display device and manufacturing method for the same
CN111509017A (zh) * 2020-04-28 2020-08-07 京东方科技集团股份有限公司 柔性显示基板及其制备方法、柔性显示面板

Also Published As

Publication number Publication date
US20220399375A1 (en) 2022-12-15
CN115244699A (zh) 2022-10-25

Similar Documents

Publication Publication Date Title
WO2019206245A1 (zh) 柔性基板及其制作方法、显示装置
WO2022088457A1 (zh) 显示模组
JP5191920B2 (ja) 液晶表示装置
WO2022057005A1 (zh) 柔性显示模组及其制作方法
WO2021109364A1 (zh) 盖板、盖板的制备方法和显示装置
WO2019228342A1 (zh) 柔性显示装置和异形双面胶带
US11404663B2 (en) Flexible display panel structure having optical clear resin in space formed by quadrilateral anti-flow barrier and cover plate and fabricating method thereof
TWI623785B (zh) Photoelectric hybrid substrate
CN111063256A (zh) 一种柔性显示模组及其制备方法
TWI737243B (zh) 顯示裝置
WO2022133804A1 (zh) 显示面板及其制作方法
TWI765365B (zh) 顯示裝置與導光板
CN114143673A (zh) 一种屏幕定向发声装置及其制备方法
CN113436530A (zh) 显示模组及其制作方法、显示装置
JP4091936B2 (ja) 光学デバイス，その製造方法，キャップ部品及びその製造方法
WO2022213418A1 (zh) 封装盖板和显示装置
CN113539093A (zh) 显示面板及显示装置
CN110782788B (zh) 柔性显示面板及显示装置
CN216901261U (zh) 显示装置
WO2021258827A1 (zh) 触控模组、其制备方法及显示装置
TWM432222U (en) Multilayer flexible circuit board
TW201250297A (en) Optical composite substrate
TWM383131U (en) Liquid crystal panel
KR20050111961A (ko) 내장형 카메라 모듈 및 그에 사용되는 회로 기판
CN115273663B (zh) 显示面板及显示装置

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 20966382

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

32PN Ep: public notification in the ep bulletin as address of the adressee cannot be established

Free format text: NOTING OF LOSS OF RIGHTS PURSUANT TO RULE 112(1) EPC (EPO FORM 1205A DATED 24/10/2023)

122 Ep: pct application non-entry in european phase

Ref document number: 20966382

Country of ref document: EP

Kind code of ref document: A1