M432222 五、新型說明： 【新型所屬之技術領域】 本創作是有關於一種電路板，且特別是有關於一種多 層可抗性電路板（multilayer flexible circuit board )。 【先前技術】 現今多層可撓性電路板大多是利用内層電路軟板、軟 性基板以及二面具有黏性的膠片（又可稱為純膠）來製造 而成其中軟性基板通常包括軟性介電層與金屬層。一般 而^内層電路軟板會透過膠片來與軟性介電層黏合，而 金屬層會經過微影（photolithography)與軸（etching) 而形成電路層。 在現有多層可撓性電路板的製造過程中，多個内居帝 路軟板會先從大片電路板材（panel)裁切下來，以至= 性基板的尺寸會大於内層電路軟板的 ' \ 經:壓合一 ng)而黏合内層電路軟板犧= 層電路軟板邊緣處的表面會產生二: Uecess)，¥致軟性基板的表面不平整。 心 承上述，在微影與触刻的過程中，、二 基板表面會造成具感光性的乾膜，種*平整的款性 附在金屬層上，以至於可能會發生lm)不易平整地貝占 足）的情形。這會造錢續_而成=良（例如曝光不 路（short)或斷路（break) 人电路層出現例如翅 【新型内容】 的問題。 3/13 M432222 、本創作的目的是提供—種多層可撓性電路板，以解決 上述因軟性基板的表面不平整所造成的問題。 、 本創作提出-種多層可撓性電路板，包括一内 軟板、二軟性簡層、二.連接層以及二外層電路層。曰内芦 電路軟板具有—上表面一下表面以及H其中^ 側面彼此相對，而各面側面連接在上表面與下表面之間了 内層電路軟板配置在這錄性絕緣層之間，而這些連· 分別配置於上表面與下表面，其中各層連接層連接在内^ 電路軟板與其中—層軟性絕緣層之間，並且凸出於1中I 面側面。這錄性絕料皆配置在這些外層電路層之'間。 本創作能促使乾膜平整地貼附，以解決習知因軟性基 板的表面不平整所造成的問題。 為讓本創作之上述特徵和優點能更明顯易懂，下文特 舉實施例，並配合所附圖式，作詳細說明如下。 【實施方式】 圖1疋本創作一貫施例之多層可撓性電路板的剖面示 思圖。請參閱目1，多層可撓性電路板1〇〇包括一内層電 路軟板110、二軟性絕緣層12〇、二連接層13〇以及二外層 電路層140。内層電路軟板110具有-上表面T1 ' -下表 :B1以及二側面，其中這二面側面分別是一第一側面w 與一第二側面S2。第一側面S1與第二側面幻彼此相對， 而第一側面si與第二侧面S2皆連接在上表面T1與下表 面B1之間。 4/13 M432222 “電路軟板110配置在這些軟性絕緣層i 而廷些軟性_層I2G皆 3 pm ,, --r臂電路層】40夕 曰1。此外，各層軟性絕緣層12 第二側面S2。例如，在θ】所出於弟-側面S】或 性W m-r在圖1所不的貫施例中，其中一層軟 心彖層120可以凸出於第—側面si μ ]〇η ϊγ ,ν π , 向另—層軟性絕緣 曰2〇 了以凸出於第二側面S2。麸 層】2〇並不限定如圖！所示。本旬作的軟性絕緣 妾層130分別配置於上表面Τ】與下表面則， =中各層連接層130連接在内層電路軟板⑽錄 軟性絕緣層Ι2Θ之間，且读接屉，、/、 層 且連接層130可以是膠片（即純膠）。 =人性_2。具有一内表面122與—相對内表面122 Θ内=124其中内表面122是各層軟性絕緣層120面 2層電路軟板110的表面，而在本實施例中，外表面124 可為供外層電路層]4〇所配置的表面。 承上述，這些連接層130分別黏著於這些軟性絕緣層 120的内表面122’並局部覆蓋内表面122,即各面内表面 】22具有部分未被連接層13()所覆蓋的區域。利用連接層 130與軟性絕緣層120之間的黏合，這些軟性絕緣層⑶ 與内層電路軟板1〗0得以結合。 各層連接層130凸出於第一側面S1與第二側面S2二 2其中-面。在本實施例中’其中一層連接層13〇凸出於 第-側面S1’而另一層連接層13〇凸出於第二側面s2，即 這二層連接層130分別凸出第—側面S1與第二側面S2。 5/13 M432222 此外，各層連接層130凸出於第一側面S1或第二側面S2 的長度L1可以在0.3公厘至0.5公厘。 多層可撓性電路板100可以更包括至少一根導電柱 150,而導電柱150貫穿這些軟性絕緣層120與内層電路軟 板110，並電性連接這些外層電路層140與内層電路軟板 110的電路層112。如此，内層電路軟板110與這些外層電 路層140可以經由導電柱150而彼此電性導通。 另外，多層可撓性電路板100可以更包括二保護層 160，而保護層160可為覆蓋層（cover layer )。這些外層電 ^ 路層140位在這些保護層160之間，而這些保護層160分 別覆蓋這些外層電路層140與這些軟性絕緣層120，以保 護外層電路層140避免被外物到傷。 各層軟性絕緣層120具有一邊緣E1，而這些邊緣E1 分別切齊於第一側面S1與第二側面S2，其中第一側面S1 與第二側面S2二者與這些邊緣E1之間的切齊是實質上的 切齊。詳細而言，上述切齊的意思涵蓋第一側面S1與第二 鲁 側面S2二者在可容許的誤差範圍下與這些邊緣E1不切齊 的情形。這些保護層160皆未覆蓋這些邊緣E1，且各個邊 緣E1凸出於保護層的長度L2可在0.2公厘至0.3公厘。 以上僅介紹本創作多層可撓性電路板100的結構。接 下來，將配合圖2 A至圖2D來詳細介紹多層可撓性電路板 100的製造流程。 圖2A至圖2D是製造圖1中的多層可撓性電路板的流 6/13M432222 V. New description: [New technical field] This creation is related to a circuit board, and in particular to a multilayer flexible circuit board. [Prior Art] Today, multi-layer flexible circuit boards are mostly fabricated by using an inner layer circuit board, a flexible substrate, and a two-sided adhesive film (also referred to as pure glue). The flexible substrate usually includes a soft dielectric layer. With a metal layer. Generally, the inner layer of the circuit board is bonded to the flexible dielectric layer through the film, and the metal layer is subjected to photolithography and etching to form a circuit layer. In the manufacturing process of the existing multilayer flexible circuit board, a plurality of inner soft boards will be cut from a large number of circuit boards, so that the size of the substrate will be larger than that of the inner circuit board. : Pressing a ng) and bonding the inner layer of the circuit board to sacrifice = the surface of the layer circuit soft board will produce two: Uecess), the surface of the soft substrate is not flat. In the above process, in the process of lithography and engraving, the surface of the two substrates will cause a photosensitive dry film, and the kind of flatness is attached to the metal layer, so that lm) may not be flattened. The situation of occupying the foot. This will make money _ _ = = good (such as exposure or break), the circuit layer appears for example, the problem of [new content]. 3/13 M432222, the purpose of this creation is to provide a multi-layer A flexible circuit board to solve the above-mentioned problems caused by surface unevenness of a flexible substrate. The present invention proposes a multilayer flexible circuit board including an inner flexible board, a two-soft flexible layer, two connection layers, and two The outer circuit layer has a lower surface of the upper surface and a side surface of the upper surface of each other, and the side surfaces of the inner surface are connected to each other, and the side surfaces of the respective sides are connected between the upper surface and the lower surface, and the inner layer circuit board is disposed in the recording insulating layer. And these are respectively disposed on the upper surface and the lower surface, wherein the connection layers of the respective layers are connected between the inner circuit board and the soft insulating layer of the layer, and protrude from the side of the I surface of the one side. The materials are disposed between these outer circuit layers. This creation can promote the dry film to be attached flatly to solve the problems caused by the surface unevenness of the soft substrate. To make the above features and advantages of the creation more The following is a detailed description of the embodiments and the following description of the drawings. [Embodiment] FIG. 1 is a cross-sectional view of a multilayer flexible circuit board consistently applied to the present invention. 1. The multilayer flexible circuit board 1 includes an inner layer circuit board 110, two soft insulating layers 12A, two connection layers 13A, and two outer circuit layers 140. The inner layer circuit board 110 has an upper surface T1' - The following table: B1 and two sides, wherein the two sides are respectively a first side w and a second side S2. The first side S1 and the second side are opposite to each other, and the first side si and the second side S2 are both Connected between the upper surface T1 and the lower surface B1. 4/13 M432222 "The circuit board 110 is disposed in these soft insulating layers i and the soft _ layer I2G is 3 pm, --r arm circuit layer] 40 曰1. In addition, each layer of the soft insulating layer 12 has a second side S2. For example, in the embodiment where θ is the same as the side S or the W rm is in the embodiment of FIG. 1, one layer of the soft core layer 120 may be Protruding from the first side - side si μ ]〇η ϊγ , ν π , to the other layer of soft insulating 曰2 The second side surface S2. The bran layer 2 is not limited to the one shown in Fig.! The soft insulating layer 130 of the present invention is disposed on the upper surface, respectively, and the lower layer is connected to the inner layer circuit. The flexible board (10) is recorded between the soft insulating layers ,2Θ, and the read tray, /, layer and the connecting layer 130 may be film (ie, pure glue). = Humanity_2. There is an inner surface 122 and an inner surface 122. The inner surface 122 is the surface of each layer of the soft insulating layer 120 and the second layer of the circuit soft board 110. In the present embodiment, the outer surface 124 may be a surface for the outer circuit layer. In the above, these connecting layers 130 are adhered to the inner surfaces 122' of the soft insulating layers 120, respectively, and partially cover the inner surface 122, i.e., the inner surfaces of the respective surfaces 22 have portions which are not covered by the connecting layer 13 (). These soft insulating layers (3) are bonded to the inner layer circuit board 1 by the bonding between the connecting layer 130 and the soft insulating layer 120. Each of the connection layers 130 protrudes from the first side S1 and the second side S2. In the present embodiment, 'one of the connecting layers 13 〇 protrudes from the first side S1 ′ and the other connecting layer 13 〇 protrudes from the second side s2 , that is, the two connecting layers 130 respectively protrude from the first side S1 and Second side S2. 5/13 M432222 Further, the length L1 of each of the connection layers 130 protruding from the first side S1 or the second side S2 may be from 0.3 mm to 0.5 mm. The multilayer flexible circuit board 100 may further include at least one conductive pillar 150, and the conductive pillars 150 penetrate the soft insulating layer 120 and the inner layer circuit board 110, and electrically connect the outer circuit layer 140 and the inner layer circuit board 110. Circuit layer 112. As such, the inner layer circuit board 110 and the outer layer circuit layers 140 can be electrically connected to each other via the conductive posts 150. In addition, the multilayer flexible circuit board 100 may further include two protective layers 160, and the protective layer 160 may be a cover layer. The outer circuit layers 140 are positioned between the protective layers 160, and the protective layers 160 cover the outer circuit layers 140 and the soft insulating layers 120, respectively, to protect the outer circuit layer 140 from foreign objects. Each layer of the flexible insulating layer 120 has an edge E1, and the edges E1 are respectively aligned with the first side S1 and the second side S2, wherein the first side S1 and the second side S2 are aligned with the edges E1. Substantially aligned. In detail, the above-described alignment means that both the first side S1 and the second side S2 are out of alignment with the edges E1 within an allowable error range. None of these protective layers 160 cover the edges E1, and each of the edges E1 may protrude from the protective layer by a length L2 of from 0.2 mm to 0.3 mm. Only the structure of the multilayer flexible circuit board 100 of the present invention will be described above. Next, the manufacturing process of the multilayer flexible circuit board 100 will be described in detail in conjunction with Figs. 2A to 2D. 2A to 2D are flows for manufacturing the multilayer flexible circuit board of Fig. 1 6/13