CN115206953A - Chip-level packaged LED light source device and manufacturing method thereof - Google Patents
Chip-level packaged LED light source device and manufacturing method thereof Download PDFInfo
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- CN115206953A CN115206953A CN202210945915.4A CN202210945915A CN115206953A CN 115206953 A CN115206953 A CN 115206953A CN 202210945915 A CN202210945915 A CN 202210945915A CN 115206953 A CN115206953 A CN 115206953A
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- 239000000084 colloidal system Substances 0.000 claims abstract description 134
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- 238000004806 packaging method and process Methods 0.000 claims description 15
- 238000000034 method Methods 0.000 claims description 13
- 239000000499 gel Substances 0.000 claims description 9
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims 6
- 239000000843 powder Substances 0.000 abstract description 22
- 238000005507 spraying Methods 0.000 abstract description 12
- 239000002699 waste material Substances 0.000 abstract description 7
- 238000009434 installation Methods 0.000 abstract description 5
- 238000004544 sputter deposition Methods 0.000 abstract description 4
- 238000005286 illumination Methods 0.000 abstract 1
- 230000003287 optical effect Effects 0.000 description 4
- 238000005538 encapsulation Methods 0.000 description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 3
- 239000010931 gold Substances 0.000 description 3
- 229910052737 gold Inorganic materials 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 3
- 229910000831 Steel Inorganic materials 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
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- 239000000741 silica gel Substances 0.000 description 2
- 229910002027 silica gel Inorganic materials 0.000 description 2
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- 238000010586 diagram Methods 0.000 description 1
- 239000008393 encapsulating agent Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/005—Processes
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/505—Wavelength conversion elements characterised by the shape, e.g. plate or foil
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
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- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
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Abstract
The application discloses a chip-level packaged LED light source device and a manufacturing method thereof, which relate to the field of illumination and comprise the following steps: an LED support; the LED chip group is fixedly connected to the LED bracket and comprises at least one normally-installed LED chip; the conducting wires are used for electrically connecting the normally installed LED chips and the LED bracket; and the fluorescent colloid is arranged on the surface of the normally-installed LED chip. The LED light source device is a chip in a normal installation mode, light is directly emitted upwards, and the light parameter efficiency and the brightness of the LED light source device can be improved; the surface of the normally installed LED chip is coated with the fluorescent colloid, so that sputtering waste and multiple spraying caused by spraying of fluorescent powder can be avoided, the manufacturing cost is reduced, and the consistency of light is improved; fluorescent colloid can be avoided between the adjacent positively-mounted LED chips, so that the manufacturing cost is reduced; this application realizes just installing chip scale package of LED chip.
Description
Technical Field
The application relates to the technical field of lighting, in particular to a chip-scale packaging LED light source device and a manufacturing method thereof.
Background
Light-Emitting Diode (LED) Light source devices are widely used in the fields of backlights, color screens, indoor lighting, and the like.
Currently, an LED chip in an LED light source device has two packaging forms, one is a front-mounted package, and the other is a flip-chip package. When the LED chip adopts a flip-chip mode, emitted light is emitted downwards and then is reflected to be emitted upwards, and a part of light is lost, so that the optical parameter efficiency and the brightness of an LED light source device are low; when the LED chips are glued in the flip chip, the LED chips in a row are glued in a whole mode, the glue dispensing equipment moves from the first LED chip to the last LED chip all the time, fluorescent glue flows out of the glue dispensing equipment all the time in the moving process, and therefore gaps among the LED chips can also be filled with the fluorescent glue, and waste of the fluorescent glue is caused. When the LED chip is in a normal installation form, only powder can be sprayed on the LED chip, the steel sheet provided with the through hole is placed above the LED chip, the through hole corresponds to the LED chip, fluorescent powder is sprayed by high-pressure spraying equipment, the whole surface is sprayed during spraying, the using amount of the fluorescent powder is large, and meanwhile, when the fluorescent powder passes through the through hole in the steel sheet, part of the fluorescent powder can be sputtered and fall into an area between adjacent LED chips, and the manufacturing cost of a device is increased due to the high price of the fluorescent powder; in addition, when the fluorescent powder is sprayed, multiple times of spraying are needed, and the light consistency ratio is poor.
Therefore, how to solve the above technical problems should be a great concern to those skilled in the art.
Disclosure of Invention
The application aims to provide a chip-scale packaging LED light source device and a manufacturing method thereof, so that optical parameter efficiency and brightness are improved, and manufacturing cost is reduced.
In order to solve the above technical problem, the present application provides a chip-scale package LED light source device, including:
an LED support;
the LED chip group is fixedly connected to the LED bracket and comprises at least one normally-installed LED chip;
the wires are used for electrically connecting the normally installed LED chips and the LED bracket;
and the fluorescent colloid is arranged on the surface of the normally-installed LED chip.
Optionally, the number of the upright LED chips is multiple, and the upright LED chips are uniformly distributed on the LED support in an array form.
Optionally, the fluorescent colloid comprises at least two fluorescent colloids with different color temperatures.
Optionally, the fluorescent colloids with different color temperatures are arranged on the forward-mounted LED chip;
correspondingly, the method also comprises the following steps:
and the transparent packaging body is arranged on the whole luminous surface of the LED support.
Optionally, the color temperature of the fluorescent colloid on each forward-mounted LED chip is different from the color temperature of the fluorescent colloid on the adjacent forward-mounted LED chip.
Optionally, the color temperature of the fluorescent colloid on the forward-mounted LED chip in the same row is the same, and is different from the color temperature of the fluorescent colloid on the forward-mounted LED chip in the adjacent row;
or the color temperature of the fluorescent colloid on the upright LED chips in the same row is the same and is different from that of the fluorescent colloid on the upright LED chips in the adjacent row.
Optionally, the fluorescent colloid except for the fluorescent colloid with the highest color temperature is arranged on the forward-mounted LED chip, and the fluorescent colloid with the highest color temperature is arranged on the whole light-emitting surface of the LED support.
Optionally, when the fluorescent colloid includes two kinds of fluorescent colloids with different color temperatures, the fluorescent colloids with low color temperatures are arranged on the normal LED chips in the same row or the same column.
Optionally, when the fluorescent colloid comprises two kinds of fluorescent colloids with different color temperatures, the fluorescent colloid is provided with a low color temperature, and the LED chips which are normally installed are distributed at intervals with the LED chips which are not provided with the low color temperature.
The application also provides a manufacturing method of the chip-scale packaging LED light source device, which comprises the following steps:
all normally-installed LED chips in the LED chip group are fixed on the LED bracket; the LED chip group comprises at least one upright LED chip;
electrically connecting the normally installed LED chips and the LED bracket by using wires;
and dispensing on the surface of the normally-installed LED chip to form a fluorescent colloid.
The application provides a chip level encapsulation LED light source device, includes: an LED support; the LED chip group is fixedly connected to the LED bracket and comprises at least one normally-installed LED chip; the conducting wires are used for electrically connecting the normally installed LED chips and the LED bracket; and the fluorescent colloid is arranged on the surface of the normally installed LED chip.
Therefore, the LED chip in the LED light source device is a chip in a normal installation mode, when light is emitted, the light is directly emitted upwards without being reflected, and the light parameter efficiency and the brightness of the LED light source device can be improved. The surface of the normally-installed LED chip is coated with the fluorescent powder instead of the fluorescent powder, and the fluorescent colloid is formed by dispensing on the surface of the normally-installed LED chip, so that the waste of fluorescent powder sputtering and multiple spraying caused by spraying the fluorescent powder can be avoided, the manufacturing cost is reduced, the consistency of light is improved, and meanwhile, the method is different from the dispensing of the flip LED chip in the prior art; in addition, the fluorescent colloid is arranged on the surface of the normally installed LED chip, so that the chip-level packaging of the normally installed LED chip is realized.
In addition, the application also provides a manufacturing method with the advantages.
Drawings
For a clearer explanation of the embodiments or technical solutions of the prior art of the present application, the drawings needed for the description of the embodiments or prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present application, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.
Fig. 1 is a schematic structural diagram of a chip-scale package LED light source device according to an embodiment of the present disclosure;
fig. 2 is a top view of a chip scale package LED light source device provided in an embodiment of the present application;
FIG. 3 is a top view of another chip scale package LED light source device provided by the embodiments of the present application;
FIG. 4 is a top view of another chip scale package LED light source device provided by the embodiments of the present application;
FIG. 5 is a top view of another chip scale package LED light source device provided by the embodiments of the present application;
fig. 6 is a flowchart of a method for manufacturing a chip scale package LED light source device according to an embodiment of the present disclosure;
in the figure, 1 is an LED bracket, 2 is a front-mounted LED chip, 3 is a fluorescent colloid, 4 is an electrode, 5 is a lead, 31 is a first color temperature fluorescent colloid, and 32 is a second color temperature fluorescent colloid.
Detailed Description
In order that those skilled in the art will better understand the disclosure, the following detailed description will be given with reference to the accompanying drawings. It is to be understood that the embodiments described are only a few embodiments of the present application and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention, but the present invention may be practiced in other ways than those specifically described and will be readily apparent to those of ordinary skill in the art without departing from the spirit of the present invention, and therefore the present invention is not limited to the specific embodiments disclosed below.
As described in the background section, when the flip LED chip is adopted in the current LED light source device, there are disadvantages of low optical parameter efficiency and low brightness, and during dispensing, the gap between the flip LED chips also has fluorescent glue, which causes waste of the fluorescent glue. When the LED chip is inverted, powder can be sprayed only on the LED chip, and the problems of waste of fluorescent powder and poor light consistency exist.
In view of the above, the present application provides a chip-scale package LED light source device, please refer to fig. 1, which includes:
an LED support 1;
the LED chip group is fixedly connected to the LED bracket 1 and comprises at least one normally installed LED chip 2;
the lead 5 is used for electrically connecting the normally installed LED chips 2 and the LED bracket 1;
and the fluorescent colloid 3 is arranged on the surface of the upright LED chip 2.
It should be noted that the chip scale package LED light source device further includes a dam disposed at the periphery of the LED chip set, and an area within the dam is a light emitting surface.
The number of the front-mounted LED chips 2 may be one, or may be plural (two or more), as the case may be. When just adorning LED chip 2's quantity is a plurality of, in order to promote chip level encapsulation LED light source device when the light-emitting, the homogeneity of different irradiation area light intensity, a plurality of just adorning LED chip 2 are array form evenly distributed on LED support 1.
When the number of the normally installed LED chips 2 is two or more, the lead 5 is connected to the electrode 4 of the normally installed LED chip 2 to realize the electrical connection between the normally installed LED chips 2; the electrode 4 of the normally installed LED chip 2 is connected with the bonding pad of the LED bracket 1 through a wire 5, so that the electrical connection is realized. The wires 5 may be gold wires or wires 5 made of other materials.
In the present application, the light emitting type of the front-mounted LED chip 2 is not limited, as the case may be. For example, the front-mounted LED chip 2 may be a blue chip, a red chip, or the like.
The fluorescent colloid 3 can be set according to the color temperature adjustment requirement of the chip-scale packaged LED light source device, for example, when multiple color temperature adjustments are not required, the fluorescent colloid 3 is a single kind of fluorescent colloid 3; when it is desired to achieve phase modulation between a plurality of color temperatures, the fluorescent gel 3 includes a plurality of fluorescent gels 3 having different color temperatures.
At present, the mode of spraying fluorescent powder can only be adopted for the normally-installed LED chips, the flip LED chips can be subjected to glue dispensing, but the glue dispensing of the flip LED chips is simultaneously carried out on one row or one row of flip LED chips, the glue dispensing equipment moves from the first LED chip to the last LED chip, fluorescent glue flows out of the glue dispensing equipment all the time in the moving process, the macro glue dispensing belongs to the macro glue dispensing, and the fluorescent glue can also be distributed in gaps between the adjacent flip LED chips. In the application, the normally-installed LED chips 2 are subjected to dispensing, and it should be emphasized that the fluorescent colloid 3 is disposed on the surface of the normally-installed LED chips 2, so that dispensing is performed on a single chip, and for chip-scale packaging, the fluorescent colloid 3 may not be present between adjacent normally-installed LED chips 2.
The LED chip is the chip of formal dress form among this application LED light source device, and when the light-emitting, light directly upwards launches, need not pass through the reflection, can increase LED light source device optical parameter efficiency and luminance. In the application, the surface of the normally-installed LED chip 2 is coated with not fluorescent powder, but the surface of the normally-installed LED chip 2 is dispensed with the fluorescent powder to form a fluorescent colloid 3, so that the waste of fluorescent powder sputtering and multiple spraying caused by spraying the fluorescent powder can be avoided, the manufacturing cost is reduced, the light consistency is improved, and meanwhile, the method is different from the dispensing of the flip LED chip in the prior art, the fluorescent colloid 3 does not exist between the adjacent normally-installed LED chips 2 in the application, the using amount of the fluorescent colloid 3 can be reduced, and the manufacturing cost is reduced; in addition, the fluorescent colloid 3 is arranged on the surface of the normally installed LED chip 2, so that the chip-level packaging of the normally installed LED chip 2 is realized.
When just adorning LED chip 2 with array form evenly distributed on LED support 1, can adjust between the colour temperature of difference in order to realize chip level encapsulation LED light source device, satisfy user diversified demand, fluorescent colloid 3 includes the fluorescent colloid of at least two kinds of different colour temperatures.
Further, when the fluorescent colloid 3 includes at least two kinds of fluorescent colloids with different color temperatures, the distribution mode of the fluorescent colloid 3 is not limited in the present application, and the fluorescent colloid can be set by itself.
As an implementation mode, the fluorescent colloids 3 with different color temperatures are arranged on the front-mounted LED chip 2; correspondingly, the chip scale package LED light source device further comprises: and the transparent packaging body is arranged on the whole light emitting surface of the LED bracket 1. The transparent encapsulant may be a silicone gel.
It should be noted that, when the fluorescent colloids 3 with different color temperatures are all disposed on the front-mounted LED chip 2, the distribution manner of the fluorescent colloids 3 with different color temperatures is not limited in this application.
The color temperature of the fluorescent colloid 3 on the forward LED chip 2 on the same row is the same, and is different from that of the fluorescent colloid 3 on the forward LED chip 2 on the adjacent row, or the color temperature of the fluorescent colloid 3 on the forward LED chip 2 on the same row is the same, and is different from that of the fluorescent colloid 3 on the forward LED chip 2 on the adjacent row.
Taking two kinds of fluorescent colloids 3 with different color temperatures as an example, the fluorescent colloids 3 with two color temperatures are respectively referred to as a first color temperature fluorescent colloid 31 and a second color temperature fluorescent colloid 32. Two adjacent rows of LED chips 2 are arranged in a positive mode, a first color temperature fluorescent colloid 31 is arranged on one row of LED chips 2 in the positive mode, and a second color temperature fluorescent colloid 32 is arranged on the other row of LED chips 2 in the positive mode; alternatively, referring to fig. 2, two adjacent columns of LED chips 2 are normally mounted, a first color temperature fluorescent colloid 31 is disposed on one column of LED chips 2, and a second color temperature fluorescent colloid 32 is disposed on the other column of LED chips 2. The uniformity of the light emitted under the same color temperature can be ensured. However, this is not limited in the present application, and the fluorescent colloids 3 on each row of the LED chips 2 in the left half part may be the first color temperature fluorescent colloids 31, and the fluorescent colloids 3 on each row of the LED chips 2 in the right half part may be the second color temperature fluorescent colloids 32; or, the fluorescent colloid 3 on each row of the LED chips 2 in the upper half portion is the first color temperature fluorescent colloid 31, and the fluorescent colloid 3 on each row of the LED chips 2 in the lower half portion is the second color temperature fluorescent colloid 32, and so on.
The color temperature of the fluorescent colloid 3 on each forward-mounted LED chip 2 is different from the color temperature of the fluorescent colloid 3 on the adjacent forward-mounted LED chip 2. When there are two color temperatures, please refer to fig. 3, the fluorescent colloid on any one of the normally mounted LED chips 2 is the first color temperature fluorescent colloid 31, and the fluorescent colloids on the adjacent normally mounted LED chips 2 are the second color temperature fluorescent colloids 32. The uniformity of the light emission at the same color temperature can be ensured.
As for the fluorescent colloid 3 in fig. 2 and 3, both are disposed on the forward-mounted LED chips 2, and the fluorescent colloid 3 is not distributed in the gap between adjacent forward-mounted LED chips 2.
As another possible implementation manner, the fluorescent colloids 3 except the highest color temperature are all disposed on the front-mounted LED chip 2, and the fluorescent colloid 3 with the highest color temperature is disposed on the entire light emitting surface of the LED support 1.
It should be noted that, in this embodiment, the distribution manner of the fluorescent colloids 3 with different color temperatures is not limited. Which are separately described below.
When the fluorescent colloid 3 comprises two kinds of fluorescent colloids with different color temperatures, the fluorescent colloid with a low color temperature is arranged on the normal LED chip 2 in the same row or the same column, and the fluorescent colloid with a high color temperature is arranged on the whole light-emitting surface.
For convenience of description, for the two color temperature fluorescent colloids 3, the low color temperature fluorescent colloid is referred to as a first color temperature fluorescent colloid 31, and the high color temperature fluorescent colloid is referred to as a second color temperature fluorescent colloid 32.
In order to ensure the uniformity of light emission at the same color temperature, please refer to fig. 4, in any two adjacent rows, the first color temperature fluorescent colloid 31 is disposed on one row of the normally mounted LED chips 2, the other row of the normally mounted LED chips 2 is not disposed with the fluorescent colloid 3, and the second color temperature fluorescent colloid 32 is disposed on the whole light emitting surface. Or alternatively. In any two adjacent rows, the first color temperature fluorescent colloid 31 is arranged on one row of the normally installed LED chips 2, the fluorescent colloid 3 is not arranged on the other row of the normally installed LED chips 2, and the second color temperature fluorescent colloid 32 is arranged on the whole light-emitting surface.
When the fluorescent colloid 3 comprises two kinds of fluorescent colloids with different color temperatures, a low color temperature is arranged on the fluorescent colloid, the LED chips 2 are installed on the LED chip, the low color temperature is not arranged on the fluorescent colloid, the LED chips 2 are installed on the LED chip at intervals, and the fluorescent colloid with the high color temperature is arranged on the whole light-emitting surface. Referring to fig. 5, the front LED chip 2 with the first color temperature fluorescent colloid 31 and the front LED chip 2 without the first color temperature fluorescent colloid 31 are distributed at intervals, and the second color temperature fluorescent colloid 32 is disposed on the whole light emitting surface.
The present application further provides a method for manufacturing a chip-scale package LED light source device, please refer to fig. 6, which includes:
step S101: all normally-installed LED chips in the LED chip group are fixed on the LED bracket; the LED chip group comprises at least one upright LED chip.
Step S102: and the upright LED chips and the LED bracket are electrically connected by using wires.
Step S103: and dispensing on the surface of the normally installed LED chip to form a fluorescent colloid.
Before the surface dispensing of the LED chip is carried out, the method further comprises the following steps:
and carrying out dam enclosing on the periphery of the LED chip group which is normally installed by using a dam enclosing machine to form a luminous surface.
When only one color temperature fluorescent colloid is needed, glue is dispensed on the surface of each normally-installed LED chip, and then a transparent packaging body is filled in the whole light-emitting area, wherein the transparent packaging body can be silica gel. When a plurality of color temperatures need to be adjusted, the fluorescent colloid comprises at least two fluorescent colloids with different color temperatures, and the surface dispensing method of the LED chip can be various, which is described below.
Optionally, as an implementation manner, the dispensing on the surface of the LED chip, and the forming of the fluorescent colloid includes:
respectively pointing fluorescent colloids with the same color temperature on the positively-mounted LED chips positioned on the same row, wherein the fluorescent colloids on any two adjacent rows of positively-mounted LED chips have different color temperatures; or fluorescent colloids with the same color temperature are respectively spotted on the normally installed LED chips positioned in the same column, and the color temperatures of the fluorescent colloids on any two adjacent columns of the normally installed LED chips are different;
and filling the transparent packaging body in the whole luminous surface range.
Optionally, as another possible implementation manner, the dispensing on the surface of the LED chip, and the forming of the fluorescent colloid includes:
fluorescent colloid with different color temperatures is dispensed on the surfaces of two adjacent upright LED chips until dispensing of all the upright LED chips is completed;
and filling the transparent packaging body in the whole luminous surface range.
Optionally, as another possible implementation manner, the dispensing on the surface where the LED chip is normally mounted to form the fluorescent colloid includes:
uniformly dropping the fluorescent colloid except for the fluorescent colloid with the highest color temperature on the positively-mounted LED chip;
and filling the fluorescent colloid with the highest color temperature in the whole light emitting surface range of the LED bracket.
Optionally, as another possible implementation manner, when the fluorescent colloid includes two kinds of fluorescent colloids with different color temperatures, dispensing on the surface of the normal LED chip to form the fluorescent colloid includes:
fluorescent colloid with low color temperature is uniformly distributed on the LED chips which are arranged in the same row or the same column;
and filling the fluorescent colloid with high color temperature in the whole light emitting surface range of the LED bracket.
In the manufacturing method in the embodiment, the LED chip is fixed on the LED bracket in a normal mounting mode, and when light is emitted, the light is directly emitted upwards without being reflected, so that the light parameter efficiency and the brightness of the LED light source device can be improved. In addition, the surface of the normally-installed LED chip is coated with not fluorescent powder, but is coated with glue to form fluorescent glue, so that fluorescent powder sputtering waste and multiple spraying caused by fluorescent powder spraying can be avoided, the manufacturing cost is reduced, the light consistency is improved, and meanwhile, the method is different from the glue dispensing of the flip LED chip in the prior art; in addition, the fluorescent colloid is arranged on the surface of the normally installed LED chip, so that the chip-level packaging of the normally installed LED chip is realized.
The following describes the manufacturing method of the present application by taking a fluorescent colloid including two color temperatures as an example.
For the chip scale package LED light source device shown in fig. 2 and 3, the manufacturing method includes:
step 3, performing circuit connection between the normally installed LED chips by using gold wires;
step 5, coating first color temperature fluorescent glue and second color temperature fluorescent glue on the surface of the normally-installed LED chip corresponding to the required color temperature to realize the first color temperature and the second color temperature;
and 6, filling another transparent silica gel in the whole light-emitting area.
For the chip scale package LED light source device shown in fig. 4 and 5, the manufacturing method includes:
step 3, performing circuit connection between the normally installed LED chips by using gold wires;
step 5, coating a layer of fluorescent glue on the surface of the normally-installed LED chip corresponding to one color temperature to realize a first color temperature;
and 6, filling fluorescent glue with another color temperature in the whole light-emitting area to realize a second color temperature.
The embodiments are described in a progressive manner, each embodiment focuses on differences from other embodiments, and the same or similar parts among the embodiments are referred to each other.
The chip scale package LED light source device and the manufacturing method thereof provided by the present application are described in detail above. The principles and embodiments of the present application are explained herein using specific examples, which are provided only to help understand the method and the core idea of the present application. It should be noted that, for those skilled in the art, without departing from the principle of the present application, the present application can also make several improvements and modifications, and those improvements and modifications also fall into the protection scope of the claims of the present application.
Claims (10)
1. A chip scale package LED light source device, comprising:
an LED support;
the LED chip group is fixedly connected to the LED bracket and comprises at least one normally-installed LED chip;
the wires are used for electrically connecting the normally installed LED chips and the LED bracket;
and the fluorescent colloid is arranged on the surface of the normally-installed LED chip.
2. The chip scale packaged LED light source device of claim 1, wherein the number of the front-mounted LED chips is plural and is uniformly distributed on the LED support in an array.
3. The chip scale packaged LED light source device of claim 2, wherein the phosphor paste comprises at least two phosphor pastes of different color temperatures.
4. The chip scale package LED light source device of claim 3, wherein the fluorescent colloids of different color temperatures are disposed on the front-mounted LED chip;
correspondingly, the method also comprises the following steps:
and the transparent packaging body is arranged on the whole luminous surface of the LED support.
5. The chip scale packaged LED light source device of claim 4, wherein the color temperature of the fluorescent gel on each of the forward mounted LED chips is different from the color temperature of the fluorescent gel on an adjacent forward mounted LED chip.
6. The chip scale packaged LED light source device of claim 4, wherein the color temperature of the fluorescent glue on the same row of the front-mounted LED chips is the same and different from the color temperature of the fluorescent glue on the adjacent row of the front-mounted LED chips;
or the color temperature of the fluorescent colloid on the upright LED chips in the same row is the same and is different from that of the fluorescent colloid on the upright LED chips in the adjacent row.
7. The chip scale package LED light source device of claim 3, wherein the fluorescent colloids except for the highest color temperature are disposed on the front-mounted LED chip, and the fluorescent colloids with the highest color temperature are disposed on the whole light emitting surface of the LED support.
8. The chip scale package LED light source device of claim 7, wherein when the fluorescent colloid comprises two kinds of fluorescent colloids with different color temperatures, the fluorescent colloids with low color temperatures are disposed on the same row or column of the normal LED chips.
9. The chip scale package LED light source device of claim 7, wherein when the phosphor gel comprises two different color temperature phosphor gels, the front-mounted LED chip with the low color temperature phosphor gel is spaced apart from the front-mounted LED chip without the low color temperature phosphor gel.
10. A method for manufacturing a chip-scale package LED light source device is characterized by comprising the following steps:
all normally installed LED chips in the LED chip group are fixed on the LED bracket; the LED chip group comprises at least one upright LED chip;
electrically connecting the normally installed LED chips and the LED bracket by using wires;
and dispensing on the surface of the normally-installed LED chip to form a fluorescent colloid.
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN116154083A (en) * | 2023-03-07 | 2023-05-23 | 宁波升谱光电股份有限公司 | LED manufacturing method and LED |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN116154083A (en) * | 2023-03-07 | 2023-05-23 | 宁波升谱光电股份有限公司 | LED manufacturing method and LED |
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