CN220604689U

CN220604689U - Novel double-color temperature LED patch lamp bead structure

Info

Publication number: CN220604689U
Application number: CN202322309615.XU
Authority: CN
Inventors: 沈金山
Original assignee: Individual
Current assignee: Individual
Priority date: 2023-08-25
Filing date: 2023-08-25
Publication date: 2024-03-15
Anticipated expiration: 2033-08-25

Abstract

The utility model discloses a novel double-color temperature LED patch lamp bead structure, which relates to the technical field of LED packaging, and comprises a patch bracket, and a first color temperature chip and a second color temperature chip which are fixed on the patch bracket, wherein at least one group of the first color temperature chips are arranged at the center of the patch bracket and form a central luminous area, each group of the first color temperature chips are electrically connected to form a first color temperature circuit, at least two groups of the second color temperature chips are respectively arranged at the upper and lower positions or the left and right positions of the first color temperature chips, and the groups of the first color temperature chips and the groups of the second color temperature chips form a three-layer sandwich-shaped small-size double-color temperature patch lamp bead arrangement structure; according to the technical scheme provided by the utility model, the structure cost of the double-color temperature LED patch lamp bead is low, the production is convenient, the double-color light mixing is relatively uniform, the light mixing effect is improved, the production is simplified, the production cost is reduced, and the use experience of a customer on the intelligent lamp is improved.

Description

Novel double-color temperature LED patch lamp bead structure

Technical Field

The utility model relates to the technical field of LED packaging, in particular to a novel double-color-temperature LED patch lamp bead structure.

Background

LED packages are a technology that involves multiple disciplines such as optics, thermal, mechanical, electrical, mechanical, materials, and semiconductors. The choice of LED packaging methods, materials, structures and processes is largely determined by factors such as chip structure, opto-electronic/mechanical properties, specific applications and costs. Along with the development of intellectualization, the demand for adjusting the brightness and the color temperature of the lamplight is more and more, the demand for using the double-color temperature lamplight as intelligent lighting basic hardware is more and more, the demand is more and more, the double-color temperature lamplight is also required to be higher and higher, and the double-color temperature lamplight starts to develop from the simple single-color function experience of 'having' and 'not having', and the pursuit of bringing better customer experience feeling to customers is that! Not only higher light efficiency, higher color rendering index, better light color quality and other functional parameters are required. Meanwhile, the light spot is required to be regular, the light mixing is even, the color temperature is excessive and natural in the color mixing process, and good experience feeling caused by silky and the like is as follows!

At present, 4mm is a small-sized double-color patch product series with the following size, and the main mode is to package different color temperatures in a double-color temperature patch bracket with two bowl cups. In another mode, in a bowl cup of the patch bracket, generally 4 chips are divided into 2 color temperature groups, the two color temperature chips are diagonally distributed, and two color temperatures are packaged in the same bowl cup.

The two color temperatures are respectively in the two bowl cups, and are limited by the size of the bracket, and the two bowl cups are divided into bowl cups, so that the die bonding center position is smaller, the chip size is limited, and the improvement of the power of the lamp beads is affected to a certain extent. Secondly, when the lamp is in light mixing unevenness after being matched with the optical lens reflecting cup, the negative and positive colors are obvious.

The two color temperatures are in the same bowl cup, are firstly limited by diagonal arrangement of double-color-temperature chips, when the chip powder coating process is adopted for preparing the low color temperature, the secondary process is needed for preparing the color temperature, the production process cost is increased, meanwhile, a factor affecting the consistency of the color temperature is increased, the mixing effect is poor when the lens or the reflecting cup type lamp is additionally arranged, the colors of the object to be irradiated are negative and positive, and the experience of the intelligent lamp is poor.

Disclosure of Invention

The utility model aims to solve the technical problems of irregular light spots, uneven light mixing during double-color illumination, non-forming of the light spots and flexible and deficient color temperature customization in the prior art.

In view of the above, the utility model provides a novel dual-color temperature LED patch lamp bead structure, which comprises a patch bracket, and a first color temperature chip and a second color temperature chip which are fixed on the patch bracket, wherein at least one group of the first color temperature chips are arranged at the central position of the patch bracket and form a central luminous area, each group of the first color temperature chips are electrically connected to form a first color temperature circuit, at least two groups of the second color temperature chips are respectively arranged at the upper and lower positions or the left and right positions of the first color temperature chips, each group of the second color temperature chips are electrically connected to form a second color temperature circuit, and the groups of the first color temperature chips and the groups of the second color temperature chips form a three-layer sandwich-shaped small-size dual-color temperature patch lamp bead arrangement structure.

Optionally, a fluorescent glue layer covers the outer side of the first color temperature chip, and a packaging glue layer is arranged on the fluorescent glue layer in an external application mode.

Optionally, a plurality of bonding pads are disposed on the patch support, and the first color temperature circuit and the second color temperature circuit are electrically connected to the bonding pads.

Optionally, the first color temperature chip is one of an LED flip chip, an LED front-mounted chip, and a mixture of an LED flip chip and an LED front-mounted chip.

Optionally, the second color temperature chip is one of an LED flip chip, an LED front-mounted chip, and a mixture of an LED flip chip and an LED front-mounted chip.

Optionally, the patch lamp beads are three-four-wire double-color lamp beads or two-wire electrodeless double-color lamps.

Optionally, a small bowl cup is arranged in the middle of one end of the patch support, and the small bowl cup is used for placing the first color temperature chip.

From the above technical solutions, the embodiment of the present utility model has the following advantages:

according to the novel double-color-temperature LED patch lamp bead structure, at least one first color temperature chip is arranged at the center of the bracket to form a central light emitting area, at least two second color temperature chips are respectively arranged at the upper and lower or left and right positions of the first color temperature chips, and the first color temperature chips and the second color temperature chips form a three-layer sandwich-type small-size double-color-temperature patch lamp bead arrangement structure, so that the double-color-temperature LED patch lamp bead structure is low in cost and convenient to produce, double-color light mixing is relatively uniform, and the cost problems of irregular light spots, uneven light mixing during double-color illumination, non-molding of the light spots and flexible and deficient color temperature customization in the prior art are solved. Finally, the light mixing effect is improved, the production is simplified, the production cost is reduced, and the use experience of customers on the intelligent lamp is improved.

These features and advantages of the present utility model will be disclosed in detail in the following detailed description and the accompanying drawings.

Drawings

The utility model is further described with reference to the accompanying drawings:

FIG. 1 is a schematic diagram of the structure of the present utility model;

fig. 2 is a schematic diagram of a series of lamp beads of the dual-color LED patch module of the present utility model.

Reference numerals illustrate: 1. a patch support; 2. a bonding pad; 3. a first color temperature circuit; 4. a first color temperature chip; 5. a fluorescent glue layer; 6. a second color temperature circuit; 7. a second color temperature chip; 8. and (5) packaging the adhesive layer.

Detailed Description

The technical solutions of the embodiments of the present utility model will be explained and illustrated below with reference to the drawings of the embodiments of the present utility model, but the following embodiments are only preferred embodiments of the present utility model, and not all embodiments. Based on the examples in the implementation manner, other examples obtained by a person skilled in the art without making creative efforts fall within the protection scope of the present utility model.

The following specifically describes a novel dual-color temperature LED patch lamp bead structure according to an embodiment of the present utility model with reference to the accompanying drawings.

Examples

In order to facilitate understanding, referring to fig. 1 to 2, an embodiment of a novel dual-color temperature LED patch lamp bead structure provided by the utility model includes a patch bracket 1, and a first color temperature chip 4 and a second color temperature chip 7 fixed on the patch bracket 1, at least one of the first color temperature chips 4 is arranged at the center of the patch bracket 1 and forms a central light emitting area, each of the first color temperature chips 4 is electrically connected to form a first color temperature circuit 3, at least two of the second color temperature chips 7 are respectively arranged at the upper and lower positions or the left and right positions of the first color temperature chip 4, each of the second color temperature chips 7 is electrically connected to form a second color temperature circuit 6, and the first color temperature chips 4 and the second color temperature chips 7 are arranged in groups to form a three-layer sandwich-shaped dual-color temperature patch lamp bead structure.

It should be noted that, at least one is a set of first color temperature chip 4 to arrange and form central luminous district in support central point put, and at least two is a set of second color temperature chip 7 is respectively laid in first color temperature chip 4 upper and lower or left and right positions department, and this kind of structure finally forms three-layer sandwich form small-size double-colored temperature paster lamp pearl arrangement structure.

Wherein, the patch lamp pearl of small-size double-colored temperature, this small-size represents its bowl cup bottom area scope is less than or equal to 16 square millimeters.

In some embodiments, the outer side of the first color temperature chip 4 is covered with a fluorescent glue layer 5, and the fluorescent glue layer 5 is externally provided with a packaging glue layer 8.

It should be noted that, the fluorescent glue layer 5 mainly performs color and energy conversion on the light emitted by the first color temperature chip in the package, and performs sample color and energy conversion on the light emitted by the second color temperature chip by setting the package glue layer 8. Meanwhile, the sealing and packaging glue layer 8 can play roles of water proofing, moisture proofing, vibration proofing, dust proofing, heat dissipation, confidentiality and the like.

In some embodiments, a plurality of bonding pads 2 are disposed on the patch support 1, and the first color temperature circuit 3 and the second color temperature circuit 6 are electrically connected to the bonding pads 2.

The bonding pad 2 is used for placing soldering tin and connecting copper film wires and pins of components.

In some embodiments, the first color temperature chip 4 is one of an LED flip chip, an LED front-mounted chip, and a combination of an LED flip chip and an LED front-mounted chip; the second color temperature chip 7 is one of an LED flip chip, an LED forward mounting chip and a mixed use of the LED flip chip and the LED forward mounting chip; the patch lamp beads are three-four-wire double-color lamp beads or two-wire electrodeless double-color lamps.

It should be noted that the options of the first color temperature chip 4 and the second color temperature chip 7 are increased, so that the patch lamp bead structure is convenient for production.

In some embodiments, a small bowl is disposed in the middle of one end of the patch support 1, and the small bowl is used for placing the first color temperature chip 4.

It should be noted that, further can prepare a little bowl cup with paster support 1 central point put, and then place in wherein first color temperature chip 4, make things convenient for first color temperature chip 4 to be equipped with, the colour temperature is more concentrated, improves colour temperature concentration degree.

The above embodiments are merely for illustrating the technical solution of the present application, and not for limiting the same; although the present application has been described in detail with reference to the foregoing embodiments, it should be understood by those of ordinary skill in the art that: the technical scheme described in the foregoing embodiments can be modified or some technical features thereof can be replaced by equivalents; such modifications and substitutions do not depart from the spirit and scope of the corresponding technical solutions.

Claims

1. Novel double-color temperature LED paster lamp pearl structure, its characterized in that: including paster support (1) and fix first colour temperature chip (4) and second colour temperature chip (7) on paster support (1), at least one is a set of first colour temperature chip (4) are arranged in paster support (1) central point put, and form central luminous district, every group first colour temperature chip (4) electrical connection constitutes first colour temperature circuit (3), and at least two are a set of second colour temperature chip (7) are laid respectively in first colour temperature chip (4) upper and lower or left and right sides position department, every group second colour temperature chip (7) electrical connection constitutes second colour temperature circuit (6), and first colour temperature chip (4) of group and second colour temperature chip (7) of group form the chip lamp pearl arrangement structure of three-layer sandwich form small-size double colour temperature.

2. The novel dual-color temperature LED patch lamp bead structure according to claim 1, wherein: the outer side of the first color temperature chip (4) is covered with a fluorescent glue layer (5), and the fluorescent glue layer (5) is externally provided with a packaging glue layer (8).

3. The novel dual-color temperature LED patch lamp bead structure according to claim 1, wherein: be equipped with a plurality of pad (2) on paster support (1), just first colour temperature circuit (3) with second colour temperature circuit (6) electrical connection to pad (2).

4. The novel dual-color temperature LED patch lamp bead structure according to claim 1, wherein: the first color temperature chip (4) is one of an LED flip chip, an LED forward-mounted chip and a mixed use of the LED flip chip and the LED forward-mounted chip.

5. The novel dual-color temperature LED patch lamp bead structure according to claim 1, wherein: the second color temperature chip (7) is one of an LED flip chip, an LED forward-mounted chip and a mixed use of the LED flip chip and the LED forward-mounted chip.

6. The novel dual-color temperature LED patch lamp bead structure according to claim 1, wherein: the patch lamp beads are three-four-wire double-color lamp beads or two-wire electrodeless double-color lamps.

7. The novel dual-color temperature LED patch lamp bead structure according to claim 1, wherein: a small bowl cup is arranged in the middle of one end of the patch support (1) and used for placing a first color temperature chip (4).