CN116154083A - LED manufacturing method and LED - Google Patents
LED manufacturing method and LED Download PDFInfo
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- CN116154083A CN116154083A CN202310239431.2A CN202310239431A CN116154083A CN 116154083 A CN116154083 A CN 116154083A CN 202310239431 A CN202310239431 A CN 202310239431A CN 116154083 A CN116154083 A CN 116154083A
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 47
- 239000003292 glue Substances 0.000 claims abstract description 74
- 238000000034 method Methods 0.000 claims abstract description 38
- 239000000758 substrate Substances 0.000 claims description 38
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 claims description 8
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 7
- 239000000203 mixture Substances 0.000 claims description 7
- 239000000741 silica gel Substances 0.000 claims description 6
- 229910002027 silica gel Inorganic materials 0.000 claims description 6
- 238000003491 array Methods 0.000 claims description 4
- 230000005496 eutectics Effects 0.000 claims description 4
- 239000004408 titanium dioxide Substances 0.000 claims description 4
- 238000004806 packaging method and process Methods 0.000 abstract description 5
- 238000000605 extraction Methods 0.000 abstract description 4
- 230000009286 beneficial effect Effects 0.000 abstract description 3
- 238000005286 illumination Methods 0.000 abstract description 3
- 239000002699 waste material Substances 0.000 abstract description 3
- 239000000843 powder Substances 0.000 description 10
- 238000005507 spraying Methods 0.000 description 7
- 229910045601 alloy Inorganic materials 0.000 description 3
- 239000000956 alloy Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical compound [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 229910001128 Sn alloy Inorganic materials 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 2
- 238000005520 cutting process Methods 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- JVPLOXQKFGYFMN-UHFFFAOYSA-N gold tin Chemical compound [Sn].[Au] JVPLOXQKFGYFMN-UHFFFAOYSA-N 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 238000004026 adhesive bonding Methods 0.000 description 1
- -1 and for example Substances 0.000 description 1
- 238000009954 braiding Methods 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 230000000750 progressive effect Effects 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 230000001502 supplementing effect Effects 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/505—Wavelength conversion elements characterised by the shape, e.g. plate or foil
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/0041—Processes relating to semiconductor body packages relating to wavelength conversion elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/0058—Processes relating to semiconductor body packages relating to optical field-shaping elements
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Led Device Packages (AREA)
Abstract
The application discloses a manufacturing method of an LED and the LED, which belong to the technical field of LED packaging, wherein arc fluorescent glue is dispensed on the surface of a chip to form a convex lens, and light is more concentrated through the convex lens, namely, the generated ineffective light-emitting area is very few, so that the light-emitting type of a light source is good; the extraction of light can be effectively improved through the convex lens, the brightness is improved, and the central illumination of the device is improved; the fluorescent glue only covers the surface of the chip, so that the waste of the fluorescent glue is avoided, and the cost can be reduced; the micro lens is formed on the surface of the chip in a one-time dispensing mode, so that the operation process is simple, the process cost can be reduced on one hand, and the production efficiency can be effectively improved on the other hand. Compared with the prior art, the LED prepared by the LED manufacturing method has the beneficial effects of good light type and high brightness.
Description
Technical Field
The application relates to the technical field of LED packaging, in particular to an LED manufacturing method and an LED.
Background
Almost all existing automotive LED (Light Emitting Diode ) packaging products use a method of dispensing fluorescent glue, spraying fluorescent powder, attaching a fluorescent sheet or CSP (Chip Scale Package ) to obtain the LED product. No matter any packaging mode, the purpose of emitting white light is achieved by utilizing the blue light LED chip and coating the yellow-green fluorescent powder outside.
The method of dispensing fluorescent glue is adopted: spot coating is needed in a large area, the upper surface of the whole LED is coated with glue, most fluorescent glue areas are chipless, the fluorescent glue is seriously wasted, and the cost is high; the problem that the fluorescent powder carried in the gluing process is uneven causes too many invalid luminous areas, so that light is difficult to effectively control during light distribution or secondary optical design, and therefore the light type is poor and the brightness is low. The mode of spraying the fluorescent powder is adopted (the structure of the sprayed fluorescent powder is shown in fig. 2): multiple spraying is needed, and the cost is high; the spraying needs to be overlapped by fluorescent glue for many times, the actions of spraying and baking are repeated for 5-10 times (the color temperature is determined), the operation process is complicated, and the generation efficiency is low; the accuracy of the powder spraying is not high, the uniformity of the fluorescent powder is affected, so that the ineffective light-emitting area is too much, and the light type and the brightness are affected. The fluorescence patch pasting method (the structure of the fluorescence patch is shown in fig. 3) is adopted: firstly prefabricating a fluorescent film, then pasting the fluorescent film with glue, and then baking, wherein the prefabricating process of the fluorescent film is complex, so that the generating efficiency is low; the sticking process has extremely high requirements on equipment precision, otherwise, the film cannot be effectively overlapped, and the defects of film rotation, incomplete chip coverage and the like occur, so that the light type and the brightness are affected; silica gel is needed for bonding, and the heat resistance of the bonding layer between the fluorescent sheet and the chip is large, so that the heat dissipation is not facilitated. Manner of CSP (CSP structure see fig. 4): the manufacturing process is complex, and the patch processing mode is adopted, so that the problems of low production efficiency and high cost are caused.
Therefore, how to ensure good light pattern, high brightness, low cost and high production efficiency of the LED is a technical problem that needs to be solved by those skilled in the art at present.
Disclosure of Invention
The purpose of this application is to provide a LED manufacturing method and LED to guarantee that the light type of LED is good, luminance is high, with low costs and production efficiency is high.
In order to achieve the above object, the present application provides a method for manufacturing an LED, including:
manufacturing a white wall on a substrate so that the white wall surrounds the periphery of a chip; the chip and the electrode are preset on the substrate;
dispensing fluorescent glue with preset viscosity on the middle area of the upper surface of the chip through a dispensing head so that the fluorescent glue covers the whole upper surface of the chip and forms fluorescent glue to be solidified with an arc-shaped surface, and obtaining an LED after dispensing;
and curing the LED after dispensing through baking, and forming a cured convex lens on the upper surface of the chip to obtain the target LED.
Optionally, the dispensing the fluorescent glue with the preset viscosity on the middle area of the upper surface of the chip through the dispensing head includes:
and dispensing fluorescent glue with preset viscosity on the middle area of the upper surface of the chip by adopting a dispensing head with the size smaller than or equal to the chip.
Optionally, the dispensing head is used for dispensing fluorescent glue with preset viscosity on a middle area of the upper surface of the chip, so that the fluorescent glue covers the whole upper surface of the chip and forms fluorescent glue to be cured with an arc surface, and the LED after dispensing is obtained, and the method includes:
the method comprises the steps that a fluorescent glue with preset viscosity is dispensed on the middle area of the upper surface of each chip in an LED chip array through a dispensing head, so that the fluorescent glue covers the whole upper surface of the chip and forms fluorescent glue to be solidified with an arc-shaped surface, and the LED array after dispensing is obtained;
correspondingly, the step of curing the LED after dispensing by baking, forming a cured convex lens on the upper surface of the chip to obtain a target LED, comprises the following steps:
and curing the LED arrays after dispensing through baking, and forming cured convex lenses on the upper surfaces of the chips to obtain the target LED arrays.
Optionally, the dispensing the fluorescent glue with the preset viscosity on the middle area of the upper surface of the chip through the dispensing head includes:
and dispensing fluorescent glue with preset viscosity on the central point of the upper surface of the chip through a dispensing head.
Optionally, the height of the white wall is the same as the height of the chip.
Optionally, the manufacturing a white wall on the substrate includes:
manufacturing a white wall on a substrate through dispensing equipment or piezoelectric valve equipment; the white wall is a mixture of silica gel and titanium dioxide.
Optionally, the manufacturing a white wall on the substrate, before the white wall surrounds the periphery of the chip, further includes:
the surface of the substrate is treated so that the roughness of the substrate is less than 0.3 μm.
Alternatively, the chip is a flip chip or a vertical chip with a eutectic structure.
Optionally, curing the LED after dispensing by baking, and forming a cured convex lens on the upper surface of the chip, so as to obtain the target LED, where before obtaining the target LED, the method further includes:
when the color temperature of the LED after dispensing before curing is detected to be lower than the target color temperature, the arc fluorescent glue is supplemented through the needle head, so that the color temperature of the LED after dispensing reaches the target color temperature.
To achieve the above object, the present application further provides an LED, including: the LED is prepared by the LED manufacturing method.
The LED manufacturing method provided by the application comprises the following steps: manufacturing a white wall on a substrate so that the white wall surrounds the periphery of a chip; the chip and the electrode are preset on the substrate; dispensing fluorescent glue with preset viscosity on the middle area of the upper surface of the chip through a dispensing head so that the fluorescent glue covers the whole upper surface of the chip and forms fluorescent glue to be solidified with an arc-shaped surface, and obtaining an LED after dispensing; and curing the LED after dispensing through baking, and forming a cured convex lens on the upper surface of the chip to obtain the target LED.
Obviously, the arc fluorescent glue is dotted on the surface of the chip to form the convex lens, and the convex lens is used for enabling light to be more concentrated, namely, the generated ineffective light-emitting area is very few, so that the light-emitting type of the light source is good; the extraction of light can be effectively improved through the convex lens, the brightness is improved, and the central illumination of the device is improved; the fluorescent glue only covers the surface of the chip, so that the waste of the fluorescent glue is avoided, and the cost can be reduced; the micro lens is formed on the surface of the chip in a one-time dispensing mode, so that the operation process is simple, the process cost can be reduced on one hand, and the production efficiency can be effectively improved on the other hand. The application also provides an LED, compares prior art and has the beneficial effect that light type is good, luminance is high.
Drawings
In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings that are required to be used in the embodiments or the description of the prior art will be briefly described below, and it is obvious that the drawings in the following description are only embodiments of the present application, and that other drawings may be obtained according to the provided drawings without inventive effort to a person skilled in the art.
Fig. 1 is a flowchart of a method for manufacturing an LED according to an embodiment of the present application;
FIG. 2 is a schematic diagram of a spray-coated phosphor according to an embodiment of the present disclosure;
FIG. 3 is a block diagram of a fluorescent patch according to an embodiment of the present disclosure;
fig. 4 is a CSP structure diagram provided in an embodiment of the present application;
fig. 5 is a fluorescent glue composition of a microlens according to an embodiment of the present application.
Detailed Description
For the purposes of making the objects, technical solutions and advantages of the embodiments of the present application more clear, the technical solutions of the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is apparent that the described embodiments are some embodiments of the present application, but not all embodiments. All other embodiments, which can be made by one of ordinary skill in the art without undue burden from the present disclosure, are within the scope of the present disclosure.
Referring to fig. 1, fig. 1 is a flowchart of a method for manufacturing an LED according to an embodiment of the present application, where the method may include:
s101: manufacturing a white wall on the substrate so that the white wall surrounds the periphery of the chip; the substrate is provided with a chip and an electrode in advance.
The embodiment is not limited to a specific manner of manufacturing the white wall, and for example, the white wall can be manufactured on the substrate through a dispensing device or a piezoelectric valve device; white walls are a mixture of silica gel and titanium dioxide. The embodiment does not limit the specific height of the white wall, and only the periphery of the chip can be surrounded, so that only the upper surface of the chip is ensured to emit light. The height of the white wall in this embodiment may be the same as the height of the chip.
The present embodiment is not limited to a specific kind of chip, and for example, a flip chip or a vertical chip of a eutectic structure may be used as the chip. The present embodiment is not limited to the specific kind of electrode, and for example, gold-tin alloy or other alloy may be used as the electrode.
The present embodiment is not limited to a specific kind of substrate, and for example, an alumina ceramic substrate or an aluminum nitride ceramic substrate may be used as the substrate. The embodiment is not limited to the specific manner of manufacturing the substrate, and the specific manner of manufacturing the substrate may be determined according to the specific type of the substrate, for example, DPC (Direct plating copper, direct copper plating) process may be used for the substrate. Furthermore, in order to ensure better performance of the substrate, the embodiment can manufacture the white wall on the substrate, so that before the white wall surrounds the periphery of the chip, the surface of the substrate can be further processed, and the roughness of the substrate is smaller than 0.3 μm. The embodiment is not limited to a specific manner of treating the surface of the substrate, and for example, gold or silver may be used to treat the surface of the substrate so that the roughness of the substrate is less than 0.3 μm.
S102: and dispensing fluorescent glue with preset viscosity on the middle area of the upper surface of the chip through the dispensing head, so that the fluorescent glue covers the upper surface of the whole chip and forms fluorescent glue to be solidified with an arc-shaped surface, and the LED after dispensing is obtained.
The specific size of the dispensing head is not limited, and the dispensing head can be used to cover the entire upper surface of the chip, for example, a dispensing head with a size smaller than or equal to the chip size can be used to dispense the fluorescent glue with a preset viscosity in the middle area of the upper surface of the chip, that is, a high-precision dispensing head with a chip level is used. The embodiment does not limit the specific range of the middle area, so long as the dispensing at the position is ensured to enable the fluorescent glue to cover the upper surface of the whole chip. In order to ensure that the light emitted by the light source is focused at the central position, the embodiment can be used for dispensing fluorescent glue with preset viscosity at the central point of the upper surface of the chip through the dispensing head. The specific viscosity of the fluorescent glue is not limited in this embodiment, and the fluorescent glue to be cured with an arc surface can be formed only by ensuring that the fluorescent glue does not collapse or deform after being dispensed, for example, a molding glue with higher viscosity can be selected.
Further, in order to obtain an LED array, in this embodiment, a fluorescent glue with preset viscosity may be dispensed on a middle area of an upper surface of each chip in the LED chip array by using a dispensing head, so that the fluorescent glue covers an upper surface of the whole chip and forms a fluorescent glue to be cured with an arc surface, thereby obtaining an LED array after dispensing; correspondingly, curing the LED after dispensing by baking, forming a cured convex lens on the upper surface of the chip, and obtaining a target LED, wherein the method comprises the following steps: and curing the LED array after dispensing by baking, and forming a cured convex lens on the upper surface of each chip to obtain the target LED array.
S103: and curing the LED after dispensing by baking, and forming a cured convex lens on the upper surface of the chip to obtain the target LED.
The specific temperature of baking is not limited in this embodiment, as long as the LED after dispensing can be cured. The embodiment does not limit the specific baking time, so long as the curing of the LED after dispensing is ensured.
The fluorescent glue is dot-coated in a large area, so that the problem of uneven carried fluorescent powder is generated in the glue coating process, and the yield is low; the fluorescent powder is sprayed for many times, so that the spraying precision is low, and the product yield is low; the fluorescent film is required to be prefabricated firstly by adopting a fluorescent sheet pasting mode, then baked after glue pasting, the prefabricated film is complex in process and low in yield; the pasting process has extremely high requirements on equipment precision, otherwise, the films cannot be effectively overlapped, and the defects of film rotation, incomplete chip coverage and the like occur. In order to ensure the product quality, in the embodiment, after curing the LED after dispensing by baking, before forming a cured convex lens on the upper surface of the chip to obtain the target LED, when detecting that the color temperature of the LED after dispensing before curing is lower than the target color temperature, the arc fluorescent glue is supplemented by the needle head, so that the color temperature of the LED after dispensing reaches the target color temperature. The specific value of the target color temperature is not limited in this embodiment, and may be determined according to actual situations. It should be noted that, this example can adjust the product before solidification, guarantees to accomplish concentratedly with the colour temperature uniformity in earlier stage to the product yield has been improved.
Based on the embodiment, the arc fluorescent glue is dotted on the surface of the chip to form the convex lens, and the convex lens is used for enabling light to be more concentrated, namely, the generated invalid luminous area is very few, so that the light-emitting type of the light source is good; the extraction of light can be effectively improved through the convex lens, the brightness is improved, and the central illumination of the device is improved; the fluorescent glue only covers the surface of the chip, so that the waste of the fluorescent glue is avoided, and the cost can be reduced; the micro lens is formed on the surface of the chip in a one-time dispensing mode, so that the operation process is simple, the process cost can be reduced on one hand, and the production efficiency can be effectively improved on the other hand.
The embodiment of the application also provides an LED, which comprises: the LED is prepared by the LED manufacturing method.
Based on the embodiment, the arc fluorescent glue is dotted on the surface of the chip to form the convex lens, and the convex lens is used for enabling light to be more concentrated, namely, the generated invalid luminous area is very few, so that the light-emitting type of the light source is good; the convex lens can effectively improve light extraction, brightness and central illuminance of the device. Compared with the prior art, the LED prepared by the LED manufacturing method has the beneficial effects of good light type and high brightness.
The following describes the above LED manufacturing process with reference to fig. 5, and fig. 5 is a fluorescent glue composition of a microlens according to an embodiment of the present application, where the process is specifically as follows:
1. arranging a chip and an electrode, adopting a flip chip (or a vertical chip) with a eutectic structure, adopting gold-tin alloy (or other alloys) as an alloy layer, adopting an alumina ceramic substrate (or an aluminum nitride ceramic substrate) as a substrate, adopting a DPC (direct current) process for the substrate, adopting gold (or silver) for surface treatment, and enabling the roughness to be less than 0.3 mu m;
2. manufacturing a white wall, namely manufacturing a layer of white wall glue around a chip by using dispensing equipment (or piezoelectric valve equipment), wherein the white wall glue is a mixture of silica gel and titanium dioxide, and the height of the white wall is flush with the edge of the chip;
3. dispensing the micro-lenses, namely dispensing an arc fluorescent glue on the surface of each LED chip by using a high-precision chip-level dispensing head to form convex lenses, wherein the fluorescent glue is a mixture of silica gel and one or more fluorescent powders, and the fluorescent glue uniformly covers the upper surfaces of the chips to obtain an LED chip array with micro-lenses, as shown in fig. 4;
4. testing, namely arranging and measuring the product with the dispensed glue, correcting the product outside the grade (namely the product with the color temperature lower than the target color temperature) into the grade (namely the product with the color temperature reaching the target color temperature) through the needle glue supplementing, and ensuring the yield;
5. baking, namely baking and curing the products in the shelves at 150 ℃ for 2 hours;
6. cutting, namely cutting the connected light source into single finished products;
7. and testing braiding, packaging and warehousing the finished products in sequence.
The principles and embodiments of the present application are described herein by applying specific examples, and the examples are in progressive relationship, and each example mainly illustrates differences from other examples, where the same similar parts of the examples are mutually referred to. For the LEDs disclosed in the embodiments, reference is made to the corresponding method section. The above description of embodiments is only for aiding in the understanding of the method of the present application and its core ideas. It will be apparent to those skilled in the art that various changes and modifications can be made herein without departing from the principles of the application, which are intended to be covered by the appended claims.
It should also be noted that in this specification, relational terms such as first and second, and the like are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Moreover, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising one … …" does not exclude the presence of other like elements in a process, method, article, or apparatus that comprises an element.
Claims (10)
1. A method of making an LED comprising:
manufacturing a white wall on a substrate so that the white wall surrounds the periphery of a chip; the chip and the electrode are preset on the substrate;
dispensing fluorescent glue with preset viscosity on the middle area of the upper surface of the chip through a dispensing head so that the fluorescent glue covers the whole upper surface of the chip and forms fluorescent glue to be solidified with an arc-shaped surface, and obtaining an LED after dispensing;
and curing the LED after dispensing through baking, and forming a cured convex lens on the upper surface of the chip to obtain the target LED.
2. The method of manufacturing an LED of claim 1, wherein the dispensing fluorescent glue of a predetermined viscosity through the dispensing head onto the middle area of the upper surface of the chip comprises:
and dispensing fluorescent glue with preset viscosity on the middle area of the upper surface of the chip by adopting a dispensing head with the size smaller than or equal to the chip.
3. The method of manufacturing an LED of claim 1, wherein the dispensing a fluorescent glue of a predetermined viscosity on the middle area of the upper surface of the chip by the dispensing head, so that the fluorescent glue covers the entire upper surface of the chip and forms a fluorescent glue to be cured having an arc surface, to obtain the dispensed LED, comprising:
the method comprises the steps that a fluorescent glue with preset viscosity is dispensed on the middle area of the upper surface of each chip in an LED chip array through a dispensing head, so that the fluorescent glue covers the whole upper surface of the chip and forms fluorescent glue to be solidified with an arc-shaped surface, and the LED array after dispensing is obtained;
correspondingly, the step of curing the LED after dispensing by baking, forming a cured convex lens on the upper surface of the chip to obtain a target LED, comprises the following steps:
and curing the LED arrays after dispensing through baking, and forming cured convex lenses on the upper surfaces of the chips to obtain the target LED arrays.
4. The method of manufacturing an LED of claim 1, wherein the dispensing fluorescent glue of a predetermined viscosity through the dispensing head onto the middle area of the upper surface of the chip comprises:
and dispensing fluorescent glue with preset viscosity on the central point of the upper surface of the chip through a dispensing head.
5. The LED fabrication method of claim 1, wherein the height of the white wall is the same as the height of the chip.
6. The method of manufacturing a LED of claim 1, wherein said manufacturing a white wall on a substrate comprises:
manufacturing a white wall on a substrate through dispensing equipment or piezoelectric valve equipment; the white wall is a mixture of silica gel and titanium dioxide.
7. The method of manufacturing an LED of claim 1, wherein before manufacturing a white wall on the substrate so that the white wall surrounds the periphery of the chip, further comprising:
the surface of the substrate is treated so that the roughness of the substrate is less than 0.3 μm.
8. The method of manufacturing an LED of claim 1, wherein said chip is a flip chip or a vertical chip of eutectic structure.
9. The method for manufacturing an LED according to any one of claims 1 to 8, wherein curing the LED after dispensing by baking, and forming a cured convex lens on the upper surface of the chip, before obtaining the target LED, further comprises:
when the color temperature of the LED after dispensing before curing is detected to be lower than the target color temperature, the arc fluorescent glue is supplemented through the needle head, so that the color temperature of the LED after dispensing reaches the target color temperature.
10. An LED, comprising: an LED prepared by the LED fabrication method of any one of claims 1 to 9.
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| Application Number | Priority Date | Filing Date | Title |
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| CN202310239431.2A CN116154083A (en) | 2023-03-07 | 2023-03-07 | LED manufacturing method and LED |
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| CN202310239431.2A CN116154083A (en) | 2023-03-07 | 2023-03-07 | LED manufacturing method and LED |
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| CN102148299A (en) * | 2011-01-27 | 2011-08-10 | 复旦大学 | Method of dispensing fluorescent glue on LED (light-emitting diode) based on COB (Chip On Board) technology |
| CN111106219A (en) * | 2018-10-25 | 2020-05-05 | 江苏罗化新材料有限公司 | High-color-gamut CSP LED and manufacturing process thereof |
| CN113629176A (en) * | 2021-09-06 | 2021-11-09 | 宁波升谱光电股份有限公司 | LED lamp and manufacturing method thereof |
| CN115206953A (en) * | 2022-08-08 | 2022-10-18 | 宁波升谱光电股份有限公司 | Chip-level packaged LED light source device and manufacturing method thereof |
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- 2023-03-07 CN CN202310239431.2A patent/CN116154083A/en active Pending
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| CN102148299A (en) * | 2011-01-27 | 2011-08-10 | 复旦大学 | Method of dispensing fluorescent glue on LED (light-emitting diode) based on COB (Chip On Board) technology |
| CN111106219A (en) * | 2018-10-25 | 2020-05-05 | 江苏罗化新材料有限公司 | High-color-gamut CSP LED and manufacturing process thereof |
| CN113629176A (en) * | 2021-09-06 | 2021-11-09 | 宁波升谱光电股份有限公司 | LED lamp and manufacturing method thereof |
| CN115206953A (en) * | 2022-08-08 | 2022-10-18 | 宁波升谱光电股份有限公司 | Chip-level packaged LED light source device and manufacturing method thereof |
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